CN217932411U - Integrated semiconductor laser imaging device of microlens array convenient to clean - Google Patents

Abstract

The utility model discloses a convenient clear microlens array integrate semiconductor laser imaging device, include: the laser device comprises a substrate, a control circuit and a plurality of laser light sources, wherein the control circuit is integrated in the substrate and used for controlling the plurality of laser light sources to be on or off, and the plurality of laser light sources are attached to the substrate and distributed in an array manner; the micro lens array component comprises a flat plate and a plurality of focusing lenses which are arranged on the flat plate and are integrally formed with the flat plate, wherein the focusing lenses correspond to the laser light sources in quantity and array mode, the upper end of each focusing lens is a horizontal plane and is flush with a substrate, the lower end of each focusing lens is a smooth convex spherical surface, light beams emitted by each laser light source are emitted to the smooth convex spherical surface and then are emitted out through the horizontal plane at the upper end, the light beams are focused on corresponding image points on a common imaging surface, and a photosensitive coating on the imaging surface is exposed and a barrel is exposed. The utility model has the advantages of focusing lens wash convenience, laser light source density is high, the laser light source high-usage, the exposure precision is high, with low costs, convenient assembling.

Description

Integrated semiconductor laser imaging device of microlens array convenient to clean

Technical Field

The utility model belongs to the direct formation of image field of laser especially involves a convenient clear microlens array's semiconductor laser imaging device that integrates.

Background

Referring to fig. 1, a conventional Laser Direct writing (Laser Direct imaging) technology employs a plurality of imaging modules 20 mounted on a base 10, and each imaging module 20 of a simplified version includes a Laser light source 41, an imaging lens 22, and a lens barrel 23. The laser light source 41 is enclosed in a transparent casing 24 and then mounted in the lens barrel 23 together with the imaging lens 22. The light beam 25 emitted from the laser light source 41 firstly passes through the transparent casing 24 and is transmitted through the imaging lens 22, and finally an image point (exposure point) 26 is obtained on the photosensitive coating 31 on the imaging surface 30. It is understood that in each of the constituent imaging modules 20, the laser light source 41 and the imaging lens 22 are mounted within the lens barrel 23. The above structure has the following disadvantages: the upper end of each imaging lens 22 is a convex spherical structure with a high middle part and a low edge part, and the imaging lens 22 is not easy to clean at the junction of the imaging lens 22 and the lens barrel 23. Secondly, since the lens barrel 23 has a certain outer diameter d, it occupies the arrangement space of the laser light sources 41 on the base 10, so that the number of the laser light sources 41 that can be installed on the base 10 is reduced, the distribution density of the laser light sources 41 on the base 10 is relatively low, and the space of the base 10 is wasted. Thirdly, each laser source 41 and the corresponding imaging lens 22 need to be installed in the lens barrel 23, so that a plurality of laser sources 41 and imaging lenses 22 need a corresponding number of lens barrels 23, and a lot of time is needed to assemble all the imaging modules 20 on the base 10, thereby reducing the working efficiency. Fourthly, the laser source 41 is enclosed in the transparent casing 24, and since the transparent casing 24 has a certain thickness k, the optical path from the laser source 41 to the image point 26 is lengthened, so that the energy of the image point 26 is reduced, and a part of the laser power is wasted.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a convenient clear microlens array integrate semiconductor laser image device, a plurality of focusing lens among its main aim at solution prior art laser direct imaging device wash inconvenient problem.

The scheme of the utility model is as follows:

an integrated semiconductor laser imaging device of a microlens array convenient for cleaning, comprising:

the laser device comprises a substrate, a control circuit and a plurality of laser light sources, wherein the control circuit is integrated in the substrate and used for controlling the plurality of laser light sources to be on or off, and the plurality of laser light sources are attached to the substrate and distributed in an array manner;

the micro lens array component comprises a flat plate and a plurality of focusing lenses which are arranged on the flat plate and are integrally formed with the flat plate, the number and the array mode of the plurality of focusing lenses correspond to those of the laser light sources, the upper end of each focusing lens is a horizontal plane and is flush with the flat plate, the lower end of each focusing lens is a smooth convex spherical surface, and light beams emitted by each laser light source are emitted out of the horizontal plane at the upper end after being incident to the smooth convex spherical surface, focused on corresponding image points on a common imaging surface and exposed on a photosensitive coating on the imaging surface;

the upper end and the lower end of the cylinder are communicated, the periphery of the cylinder is closed, the lower end of the cylinder is pressed on the peripheral edge of the substrate, and the upper end of the cylinder is covered by the peripheral edge of the flat plate;

each laser light source is positioned on the main optical axis of the corresponding focusing lens.

Further, the cooling module is arranged on one side of the base plate opposite to the cylinder.

Further, the image of the plurality of laser light source arrays is any one of a rectangle, a circle, a diamond or a regular polygon.

Further, the distance between every two adjacent laser light sources is equal to the distance between the centers of every two corresponding adjacent focusing lenses in the micro-lens array assembly;

furthermore, the focusing lens is made of glass or transparent plastic.

Furthermore, the cooling module is a copper block which is detachably connected to the plane opposite to the laser light sources on the substrate.

Furthermore, a plurality of grooves are formed in the end face, opposite to the substrate, of the copper block.

Further, the laser light source is a crystal diode.

The utility model has the advantages of that:

1. because the upper end face of the micro lens array component is of a horizontal structure, the lower end face of the micro lens array component is of a plurality of smooth convex spherical structures, the micro lens array component is reversely buckled on the cylinder (namely, the smooth convex spherical surfaces of a plurality of focusing lenses face downwards), the micro lens array component, the cylinder and the substrate form a closed cavity, and the smooth convex spherical surfaces of the focusing lenses can not contact with dust.

2. The density of the laser light source is improved. Because all focusing lenses integrate the micro-lens array, each focusing lens does not need a separate lens barrel, and the space occupied by the lens barrels is saved, so that the distance d1 between the two focusing lenses can be designed to be smaller than the distance d3 between the two focusing lenses mentioned in the background technology, more focusing lenses can be placed on the mounting seat with the same area size, the distribution of the focusing lenses is denser, the light-emitting density of a laser light source is improved, and the exposure power of the device is improved in unit time.

3. The optical path loss is reduced, and the utilization rate of laser is improved. In this application, because a plurality of laser source are integrated on laser source subassembly, each laser source no longer needs transparent housing, because transparent housing has certain thickness k, after removing transparent housing, the light path that laser source arrived the imaging surface shortens to reduce the loss of laser source light energy, improved laser source's utilization ratio.

4. The exposure precision is higher. In this application, because a plurality of laser source are integrated on laser source array subassembly, a plurality of microlens integration are on microlens array subassembly, as long as with base plate and microlens array subassembly accurate but the counterpoint installation together to guarantee that each laser source all is in on the primary optical axis with its focusing lens that corresponds, thereby make the image point more accurate on the imaging surface position of formation of image. In the background art, each laser light source and the corresponding focusing lens are firstly installed in a lens barrel and then installed on an installation seat, and due to the fact that machining errors exist in the lens barrel and installation errors of the laser light sources and the focusing lenses on the lens barrel are unavoidable, certain deviation exists between an imaging focus of each laser light source on an imaging surface and a theoretical design position.

5. The cost is low. In the application, the lens barrel and the transparent shell are not needed any more, so that the cost is greatly saved.

6. The assembly is simple and efficient. In the application, the micro-lens array assembly and the substrate (the laser light sources of the arrays are attached to the substrate through the bonding process) are accurately aligned and mounted, so that the trouble of mounting the laser light sources and the focusing lens on the lens barrel firstly and then mounting the lens barrel on the mounting base in the background art is eliminated.

Drawings

FIG. 1 is a schematic view illustrating an installation of a laser light source and a focusing lens in a conventional laser direct imaging technique;

FIG. 2 is an exploded view of the present invention;

fig. 3 is a schematic perspective view of a substrate 40 of the present invention, on which a plurality of light sources 41 are arranged;

FIG. 4 is a schematic structural view of the cartridge;

FIG. 5 is a schematic perspective view of a microlens array assembly;

FIG. 6 is a front view of FIG. 5;

fig. 7 is a schematic optical imaging diagram of fig. 2 with the cooling module added.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used merely to describe differences and are not intended to indicate or imply relative importance, and moreover, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 2, the utility model discloses a convenient clear microlens array's semiconductor laser image device integrates, include: a substrate 40, a microlens array assembly 50, and a barrel 60. A control circuit (not shown) for controlling the on/off of the plurality of laser light sources is integrated in the substrate 40, and a plurality of laser light sources 41 (see fig. 2 and 3) are mounted on the end surface of the substrate 40 in an array. The laser light sources 41 described in the present application are distributed in an array, for example, the laser light sources 41 may be distributed in any one of a rectangular array (as shown in fig. 3), a circular array, a rhombic array, and a regular polygonal array, and may also be distributed in other array shapes as required, for example, distributed in a triangular array, and distributed in an elliptical sphere, which is not exhaustive and limited herein. The control of the on/off of the plurality of laser light sources 41 is realized by a program written by a computer according to the graphic features of the image to be exposed, if some parts of the image to be exposed need exposure, the control circuit controls the corresponding laser light sources to be turned on, and some parts do not need exposure, the control circuit controls the corresponding laser light sources not to be turned on (in an off state), if some parts need exposure with higher intensity, the control circuit controls the corresponding laser light sources to emit light with higher power, and if some parts need exposure with lower intensity, the control circuit controls the corresponding laser light sources to emit light with lower power. In the present application, each laser light source 41 will no longer be enclosed within the transparent housing 24.

Referring to fig. 3, the microlens array assembly 50 includes a flat plate 51, and a plurality of focusing lenses 52 disposed on the flat plate 51 and integrally formed with the substrate, the number of the focusing lenses 52 being the same as the number of the laser light sources 41, the array pattern of the plurality of focusing lenses 52 being the same as the array pattern of the same number of the laser light sources 41. In addition, as can be seen from fig. 2, 5 and 6, the upper end of each focusing lens 52 is a plane structure, and the lower end is a smooth convex spherical surface, and the smooth convex spherical surface is opposite to the laser light source 41; in addition, the horizontal plane of each focusing lens 52 is flush with the flat plate 51, i.e., the horizontal plane of each focusing lens 52 is coplanar with the flat plate 51. Referring to fig. 2, the smooth convex spherical surface of each focusing lens 52 is opposite to the laser light source 41, so that when one (for example, the leftmost) laser light source 41 emits light, the emitted light beam 25 enters through the corresponding smooth convex spherical surface of the focusing lens 52 and then exits from the upper horizontal surface, and is focused on the corresponding image point (for example, the image point 26) on the common imaging surface 30, so as to expose the photosensitive coating 31 on the imaging surface 30. Similarly, the same is true for the optical paths of the other laser light sources, that is, the light beam emitted by each laser light source is focused by the corresponding focusing lens, and then focused at the corresponding image point on the common imaging surface 30, and exposes the photosensitive coating 31. Since the focal lengths of all the focusing lenses are the same, and the object distance from each laser source to the corresponding focusing lens is also the same, the image distance of each laser source after being focused by the corresponding focusing lens is also the same, so that they can be focused on the common image plane 30. It will be appreciated that to ensure that each laser source can be focused for imaging, each laser source needs to be on the primary optical axis of its corresponding focusing lens.

Referring to fig. 2 and 4, the cylinder 60 has a structure with two through-going upper and lower ends and a closed periphery, the lower end of the cylinder 60 is pressed against the peripheral edge of the substrate 40, and the upper end of the cylinder 60 is covered with the peripheral edge of the microlens array assembly 50, i.e., the cylinder 60, the substrate 40, and the microlens array assembly 50 enclose a closed space, and the peripheral edge of the plate 51 of the microlens array assembly 50 is covered with the cylinder 60. The laser light sources and the focusing lenses are all arranged in the closed space. When the substrate 40 is illustrated as a rectangular structure, the cylinder 60 is also illustrated as a rectangular structure, and if the images of the laser light source arrays are circular, the substrate 40 and the microlens array assembly 50 are also circular in shape, and the cylinder 60 is a cylindrical shape penetrating up and down.

As can be seen from fig. 2, the smooth convex spherical surfaces of the focusing lenses 52 in the microlens array assembly 50 face downward, which is beneficial in that:

1. because the upper end face of the micro lens array component 50 is of a horizontal structure, the lower end face is of a plurality of smooth convex spherical structures, and the micro lens array component is reversely buckled on the cylinder 60 (namely, the smooth convex spherical surfaces of a plurality of focusing lenses 52 face downwards), the micro lens array component, the cylinder and the substrate form a closed cavity, and the smooth convex spherical surfaces of the focusing lenses 52 can not contact with dust, only the upper end plane of the micro lens array component needs to be cleaned when the micro lens array component is cleaned, the smooth convex spherical surfaces of the focusing lenses and the gaps between two adjacent focusing lenses do not need to be cleaned, and the problem that the cleaning of the focusing lenses is inconvenient is avoided.

2. And ensuring that light beams emitted by each laser light source with preset light emitting power are focused by the corresponding focusing lens, converged on a common imaging surface and exposed to the photosensitive coating on the imaging surface. The array mode is the same, which means that the array shape of the micro-lenses is the same as the array shape of the laser light sources, and the distance between the centers of every two adjacent focusing lenses is equal to the distance between every two corresponding adjacent laser light sources, so that the light beams emitted by each laser light source can be ensured to be focused on a common imaging surface after being transmitted by the focusing lens corresponding to the laser light source, and the photosensitive coating coated on the imaging surface is exposed. Specifically, referring to fig. 2 and 3, for example, when the array of the laser light sources 41 is a rectangular array, the array of the focusing lenses 52 on the microlens array assembly 50 and the rectangular array of the laser light sources 41 are identical, and the distance d1 between each two adjacent laser light sources 41 and the distance d2 between the centers of each two corresponding adjacent focusing lenses 52 are identical (see fig. 2). Moreover, each laser light source 41 is located on the primary optical axis of its corresponding focusing lens 52. Only in this way, it is ensured that the light beam 25 emitted from each laser light source 41 is transmitted through the corresponding focusing lens 52 and focused on the image point 26. It can be understood that, since all the laser light sources 41 constituting the matrix have the same specification and are in the same plane, and all the focusing lenses 52 constituting the same matrix have the same specification and are in the same plane, all the laser light sources 41 converge to obtain an image point on the same image plane 30 after being transmitted through the corresponding focusing lens 52. It should be noted that the laser light sources 41 in fig. 2 and 3 are mounted on the substrate 40 by a bonding process array. Because the control circuit for controlling the on-off of the plurality of laser light sources is integrated in the substrate, the integrated semiconductor laser direct imaging device with the micro-lens array can control the on-off of each laser light source and the size of the light output power by using a preset program according to the characteristics of an image to be exposed.

Referring to fig. 7, in order to remove heat generated from the plurality of integrated laser light sources 41 in the laser light source array assembly 50, a cooling module 70 is connected to the other surface of the substrate 40 opposite to the laser light sources 41. The cooling module can be a device with any one implementation mode of air cooling, water cooling or natural cooling, such as a fan, a cavity filled with cold water or a metal cooling block. As an embodiment of the present application, the cooling module 70 is preferably a copper block, because the copper block dissipates heat quickly and can timely take away heat generated by the laser source 41. The copper block is detachably attached to the base plate 40. As a further optimization, in fig. 7, when the cooling module 70 is a copper block, a plurality of grooves 71 are formed on a side of the copper block opposite to the substrate (i.e., a lower end surface of the copper block), and the grooves are designed to increase a heat dissipation area of the copper block and accelerate volatilization of heat generated by the laser source 41.

In the present application, the focusing lens 52 is preferably any one of an aspherical lens, a self-focusing lens, and a conical mirror. The aspheric lens, the self-focusing lens and the conical lens are selected, so that the occupied space of the aspheric lens, the self-focusing lens and the conical lens can be reduced, and the distribution density of the laser light source is improved. It should be noted that the microlens array 50 (including the flat plate 51 and the focusing lenses 52) in fig. 2, 5 and 6 is formed by injection molding, and the injection molded material may be, for example, light-transmitting plastic or glass, and the light-transmitting plastic may be, for example, PMMA (acrylic) and PC (polycarbonate) with excellent light-transmitting performance.

In the application, the laser light source is preferably a crystal diode which is easy to purchase and has good light emitting performance. When the crystal diode is applied to the integrated semiconductor laser direct imaging device with the micro-lens array, the crystal diode does not need to be arranged in the transparent shell 24 in the prior art mentioned in the figure 1.

Description of the invention: the imaging lens 22 mentioned in the background of the present application and the focusing lens of the claims, the focusing lens 52 mentioned in the embodiments of the specification are essentially the same, and their names are named differently only for the sake of distinction. The microlens array in this application is essentially an array of focusing lenses. The microlens means a miniaturized focusing lens. In the present application, the substrate is preferably a PCB.

The utility model discloses a take microlens array's integrated semiconductor laser direct imaging device has following technological effect:

1. because the upper end face of the micro lens array component 50 is of a horizontal structure, the lower end face is of a plurality of smooth convex spherical structures, and the micro lens array component is reversely buckled on the cylinder 60 (namely, the smooth convex spherical surfaces of a plurality of focusing lenses 52 face downwards), the micro lens array component, the cylinder and the substrate form a closed cavity, and the smooth convex spherical surfaces of the focusing lenses 52 can not contact with dust, only the upper end plane of the micro lens array component needs to be cleaned when the micro lens array component is cleaned, the smooth convex spherical surfaces of the focusing lenses and the gaps between two adjacent focusing lenses do not need to be cleaned, and the problem that the cleaning of the focusing lenses is inconvenient is avoided.

2. The density of the laser light source is improved. Because all the focusing lenses are integrated into the micro lens array, each focusing lens does not need a separate lens barrel, and the space occupied by the lens barrels is saved, so that the distance d1 between the two focusing lenses shown in fig. 2 can be designed to be smaller than the distance d3 between the two focusing lenses in fig. 1, more focusing lenses can be placed on the mounting seat with the same area size, the distribution of the focusing lenses is denser, the light-emitting density of the laser light source is improved, and the exposure power of the device is improved in unit time.

3. The optical path loss is reduced, and the utilization rate of laser is improved. In this application, because a plurality of laser source arrays are on the base plate, the transparent shell in figure 1 is no longer required to each laser source, because transparent shell has certain thickness k, removes transparent shell after, the light path of laser source to the imaging surface shortens to reduce the loss of laser source light energy, improved laser source's utilization ratio.

4. The exposure precision is higher. In this application, because a plurality of laser light source arrays are on the base plate, a plurality of focusing lens array sets up on microlens array subassembly, as long as with base plate and microlens array subassembly accurate but counterpoint installation together to guarantee that each laser light source all is in on the primary optical axis with its focusing lens who corresponds, thereby make the image point position of imaging on the imaging surface more accurate. In the background art, each laser light source and the corresponding focusing lens are first installed in a lens barrel and then installed on a mounting seat, and due to the processing error of the lens barrel and the unavoidable installation error of the laser light source and the focusing lens on the lens barrel, a certain deviation exists between the imaging focus of each laser light source on the imaging surface and the theoretical design position.

5. The cost is low. In the application, the lens barrel and the transparent shell are not needed any more, so that the cost is greatly saved.

6. The assembly is simple and efficient. In the application, the micro-lens array assembly and the substrate (a plurality of laser light sources are attached to the substrate through a bonding process) are accurately aligned and mounted, so that the trouble of mounting the laser light sources and the focusing lens on the lens barrel firstly and then mounting the lens barrel on the mounting base in the background art is eliminated.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the principles of the present invention.

Claims (8)

1. An integrated semiconductor laser imaging device of a microlens array convenient for cleaning, comprising:

the laser device comprises a substrate, a control circuit and a plurality of laser light sources, wherein the control circuit for controlling the on and off of the plurality of laser light sources is integrated in the substrate, and the plurality of laser light sources distributed in an array mode are attached to the substrate;

the micro lens array assembly comprises a flat plate and a plurality of focusing lenses which are arranged on the flat plate and are integrally formed with the flat plate, the number and the array mode of the plurality of focusing lenses correspond to those of the laser light sources, the upper end of each focusing lens is a horizontal plane and is flush with the flat plate, the lower end of each focusing lens is a smooth convex spherical surface, and light beams emitted by each laser light source are emitted out through the horizontal plane at the upper end after being incident to the smooth convex spherical surface, are focused on corresponding image points on a common imaging surface, and expose a photosensitive coating on the imaging surface;

the upper end and the lower end of the cylinder are communicated, the periphery of the cylinder is closed, the lower end of the cylinder is pressed on the peripheral edge of the substrate, and the upper end of the cylinder is covered by the peripheral side of the flat plate;

each laser light source is positioned on the main optical axis of the corresponding focusing lens.

2. The integrated semiconductor laser imaging apparatus with microlens array for easy cleaning according to claim 1, further comprising a cooling module disposed at a side of the substrate opposite to the barrel.

3. The integrated semiconductor laser imaging apparatus of conveniently cleaned microlens array as claimed in claim 1, wherein the image of a plurality of said laser light source arrays is any one of a rectangle, a circle, a diamond or a regular polygon.

4. An integrated semiconductor laser imaging device with conveniently cleaned microlens array as claimed in claim 1, wherein the distance between every two adjacent laser light sources is equal to the distance between the centers of every two adjacent focusing lenses in the microlens array assembly.

5. The integrated semiconductor laser imaging apparatus with microlens array for easy cleaning as claimed in claim 1, wherein the focusing lens is made of glass or transparent plastic.

6. An integrated semiconductor laser imaging device with microlens arrays for easy cleaning as claimed in claim 2 wherein said cooling module is a copper block removably attached to said substrate at a plane opposite to said plurality of laser light sources.

7. An integrated semiconductor laser imaging device with microlens arrays for easy cleaning as claimed in claim 6, wherein a plurality of grooves are formed on the end face of said copper block opposite to said substrate.

8. The integrated semiconductor laser imaging device with microlens array for easy cleaning as claimed in any one of claims 1 to 7, wherein the laser source is a crystal diode.

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