CN115113494A - Integrated semiconductor laser direct imaging device with micro-lens array and capable of focusing - Google Patents
Integrated semiconductor laser direct imaging device with micro-lens array and capable of focusing Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
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Abstract
The invention discloses a focusing integrated semiconductor laser direct imaging device with a micro-lens array, which comprises: the laser device comprises a substrate, wherein a control circuit for controlling the on and off of a plurality of laser light sources is integrated in the substrate, and the plurality of laser light sources distributed in an array are attached to the substrate; the micro lens array component is provided with a plurality of focusing lenses with the same quantity and array mode as the laser light sources, each laser light source emits light beams with preset light output power, the light beams are focused by the corresponding focusing lens and then converged on a common imaging surface, and the photosensitive coating on the imaging surface is exposed. Each laser light source is positioned on the main optical axis of the corresponding focusing lens, and the micro lens array component can integrally move along the main optical axis of any focusing lens through control. The invention can meet the exposure requirements of photosensitive coatings with different thicknesses, and has the advantages of high laser source density, high laser source utilization rate, high exposure precision, low cost and convenient assembly.
Description
Technical Field
The invention belongs to the field of laser direct imaging, and particularly relates to a semiconductor laser direct imaging device with a micro-lens array and capable of focusing.
Background
Referring to fig. 1, a conventional Laser Direct writing (Laser Direct imaging) technology employs several groups of imaging modules 20 mounted on a base 10, where each group of imaging modules 20 includes a Laser light source 41, a focusing lens 22, and a lens barrel 23. The laser light source 41 is enclosed in a transparent casing 24 and then mounted in the barrel 23 together with the focusing lens 22. The light beam 25 emitted from the laser source 41 firstly passes through the transparent casing 24 and is transmitted by the focusing lens 22, and finally the image point 26 is obtained on the imaging surface 30. It is understood that in each of the constituent image modules 20, the laser light source 41 and the focusing lens 22 are disposed within the lens barrel 23. Since the lens barrel 23 has a certain diameter d, it occupies the arrangement space of the laser light sources 41 on the base 10, so that the number of the laser light sources 41 that can be installed on the base 10 is reduced, resulting in a relatively low density of the distribution of the laser light sources 41 on the base 10, which wastes the space of the base 10, which is the first disadvantage. Meanwhile, each laser light source 41 and the corresponding focusing lens 22 need to be installed in the lens barrel 23, so that a plurality of laser light sources 41 and focusing lenses 22 need a corresponding number of lens barrels 23, and if all the imaging modules 20 need to be assembled on the base 10, a lot of time is needed, thereby reducing the working efficiency, which is a second disadvantage. Finally, the laser source 41 is enclosed in the transparent casing 24, and since the transparent casing 24 has a certain thickness k, the optical path of the laser source 41 is lengthened, which results in a decrease in the energy of the image point 26, and thus a portion of the laser power is wasted. In addition, since the object distance from the focusing lens 22 to the laser light source 41 is a fixed value, the focal length f of the focusing lens is a fixed value, and the image distance from the focusing lens 22 to the photosensitive coating 31 on the imaging surface 30 is also a fixed value, the thickness of the photosensitive coating 31 on the imaging surface 30 can only be a value.
Disclosure of Invention
The invention discloses a semiconductor laser direct imaging device with a micro-lens array component, and mainly aims to solve the problem of exposure of photosensitive coatings with different thicknesses.
The scheme of the invention is as follows:
an integrated semiconductor laser direct imaging device with microlens array that is tunable, comprising:
the laser device comprises a substrate, a control circuit and a plurality of laser light sources, wherein the control circuit is integrated in the substrate and used for controlling the plurality of laser light sources to be on or off, and the plurality of laser light sources are attached to the substrate and distributed in an array manner;
the micro lens array component is provided with a plurality of focusing lenses with the same quantity and array mode as the laser light sources, each laser light source is controlled by the control circuit to emit light beams with preset light emitting power, and the light beams are focused by the corresponding focusing lens and then converged on the photosensitive coating of the common imaging surface;
each laser light source is located on the main optical axis of the corresponding focusing lens, and the micro-lens array assembly can integrally move along the main optical axis of any focusing lens through control so as to realize exposure of photosensitive coatings with different thicknesses.
Further, the micro lens array component is controlled by a voice coil motor arranged on the substrate to realize integral movement.
Further, the laser device further comprises a cooling module, wherein the cooling module is arranged on one side of the substrate opposite to the plurality of laser light sources.
Further, the focusing lens is one of an aspherical lens, a self-focusing lens and a conical mirror.
Further, the images of the laser light source arrays are any one of rectangles, circles, diamonds and regular polygons.
Further, when the focusing lens is an aspherical lens, several aspherical lenses are pressed by a mold.
Furthermore, the cooling module is a copper block which is detachably connected to the plane opposite to the plurality of laser light sources on the substrate.
Furthermore, a plurality of grooves are formed in the end face, opposite to the substrate, of the copper block.
Further, the laser light source is a crystal diode.
The invention has the beneficial technical effects that:
1. the photosensitive coating with different thicknesses can be exposed, and the distribution density of the laser light source is improved. Because all the focusing lenses are integrated on the micro lens array component, the micro lens array component can move back and forth along the main optical axis of any one focusing lens (the main optical axes of all the focusing lenses are vertical to the plane where the micro lens array component is located) through control, so that a plurality of laser light sources distributed in an array can expose photosensitive ink layers with different thicknesses t. Because all focusing lenses are integrated on the micro-lens array component, each focusing lens does not need a separate lens barrel, and the space occupied by the lens barrels is saved, so that the distance d1 between the two focusing lenses can be designed to be smaller than the distance d3 between the two focusing lenses in the prior art, more focusing lenses can be placed in the same area, the distribution of the focusing lenses is more dense, the light-emitting density of a laser light source is improved, and the exposure power of the device is improved in unit time.
2. The optical path loss is reduced, and the utilization rate of laser is improved. In this application, because a plurality of laser source arrays paste the dress on the base plate, each laser source no longer needs the transparent shell in figure 1, because transparent shell has certain thickness k, can understand, after removing transparent shell, the light path of laser source to the imaging surface has shortened the distance of thickness k to reduce the loss of laser source light energy, improved laser source's utilization ratio.
3. The exposure precision is higher. In this application, because a plurality of laser light source arrays paste the dress on the base plate, a plurality of microlenses are integrated on microlens array subassembly, as long as with base plate and microlens array subassembly accurate but counterpoint installation together, then the homoenergetic guarantees that each laser light source all is in on the primary optical axis with its focusing lens that corresponds to make the image point more accurate in the position of imaging on the imaging surface. In the background art, each laser light source and the corresponding focusing lens are first mounted in a lens barrel and then mounted on a mounting seat, so that a certain deviation exists between an imaging position of each laser light source on an imaging surface and a theoretical design position due to processing errors of the lens barrel and unavoidable mounting errors of the laser light source and the focusing lens on the lens barrel.
4. The cost is low. In the application, the lens barrel and the transparent shell are not needed any more, so that the cost is greatly saved.
5. The assembly is simple and efficient. In the application, only the micro-lens array assembly and the substrate (the plurality of laser light sources are attached to the substrate through the bonding process) need to be aligned and installed accurately, the trouble that the laser light sources and the focusing lens are needed to be installed on the lens barrel firstly and then the lens barrel is installed on the installation base in the background technology is eliminated, and the assembling is simple and the assembling efficiency is high. The trouble of mounting the laser light source and the focusing lens on the lens barrel and then mounting the lens barrel on the mounting seat in the background technology is eliminated.
Drawings
FIG. 1 is a schematic view illustrating an installation of a laser light source and a focusing lens in a conventional laser direct imaging technique;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic diagram of an optical imaging of a laser source and a focusing lens according to the present invention;
FIG. 4 is an exploded view of the cooling module added to FIG. 2;
FIG. 5 is a schematic view of an optical imaging system with the cooling module added to the system of FIG. 3;
fig. 6 is an optical imaging schematic diagram of adding a voice coil motor to the optical imaging schematic diagram of fig. 5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used merely to describe differences and are not intended to indicate or imply relative importance, and moreover, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 2 and 3, the present invention discloses a semiconductor laser direct imaging device with a microlens array assembly, comprising: the substrate 40 and the microlens array assembly 50 are integrated with a control circuit (not shown) for controlling the on/off of the plurality of laser light sources 41 on the substrate 40, the plurality of laser light sources 41 are arranged on the panel of the substrate 40 in an array distribution, each laser light source 41 is not encapsulated in the transparent shell 24, not only is the cost of the transparent shell 24 saved, but also the optical path emitted by each laser light source 41 is shortened, and the optical path is the distance between the laser light source 41 and the photosensitive coating 31 in fig. 3. The array distribution mentioned herein may be, for example, an array image composed of a plurality of laser light sources 41 is any one of a rectangle (see fig. 2), a circle, a diamond, and a regular polygon, and may also be designed to be distributed in other array shapes according to needs, for example, the array may be a triangle or an ellipse, which is not exhaustive and limited herein. Specifically, the control of the on/off of the plurality of laser light sources is determined by a program written by a computer according to the graphic features of the image to be exposed, if some parts of the image to be exposed need exposure, the control circuit controls the corresponding laser light sources to be on, and if some parts do not need exposure, the control circuit controls the corresponding laser light sources not to be on (in an off state), if some parts need exposure with higher intensity, the control circuit controls the corresponding laser light sources to emit light with higher power, and if some parts need exposure with lower intensity, the control circuit controls the corresponding laser light sources to emit light with lower power.
Referring to fig. 2 and 3, the microlens array assembly 50 is provided with a plurality of focusing lenses 22 having the same number and array manner as the laser light sources 41, each laser light source 41 is located on the optical axis of the corresponding focusing lens 22, and each laser light source 41 is controlled by the control circuit to focus the light beam emitted with the preset light output power through the corresponding focusing lens 22, and then converge on the common imaging surface 30 to expose the photosensitive coating 31 coated on the imaging surface 30. In the present application, the microlens array assembly 50 can be moved along the main optical axis of any focusing lens 22 to meet the requirement of focusing exposure on photosensitive coatings 31 with different thicknesses t. That is, the distance that each of the focusing lenses 22 on the microlens array assembly 50 moves on the optical axis is the same because the thickness of the photosensitive coating 31 on the imaging surface 30 is theoretically uniform throughout. The distance between the focusing lens 22 and the laser light source 41 corresponding to the focusing lens 22 is adjusted to meet the requirement of exposing photosensitive coatings 31 with different thicknesses, so that light emitted by the laser light source 41 can be focused on the photosensitive coatings 31 on the imaging surface 30 after being transmitted through the focusing lens 22, and the photosensitive coatings 31 are exposed. Generally speaking, since the plurality of laser sources 41 are mounted on the substrate 40 by a mounting process array, the substrate has various gold wires thereon, and the substrate 40 is usually fixed in the integrated semiconductor laser direct imaging device with microlens array, which is referred to herein as a focusing device, the plurality of laser sources 41 mounted on the substrate 40 are fixed, and therefore, the exposure requirements of the photosensitive coatings 31 with different thicknesses t on the imaging surface 30 can only be met by integrally translating the microlens array assembly 50. Referring to fig. 6, as an alternative embodiment, the movement of the microlens array assembly 50 is achieved by controlling the movement of the microlens array assembly 50 by a voice coil motor 70 disposed on the substrate 40, so that the voice coil motor 70 achieves the simultaneous translation of the same displacement of all the focusing lenses 22 on the microlens array assembly 50 by controlling the overall movement of the microlens array assembly 50.
The array mode mentioned in the present application is the same, which means that the shape of the microlens array assembly is the same as that of the laser light source array assembly, and the distance between the centers of every two adjacent focusing lenses is equal to the distance between every two adjacent laser light sources 41 in the laser light source array assembly 50, only in this way, it can be ensured that the light beams emitted by each laser light source are focused on the common imaging surface 30 after being transmitted by the focusing lens corresponding to the laser light source, and the photosensitive coating 31 coated on the imaging surface 30 is exposed. Specifically, referring to fig. 2 and 3, for example, when the array of the laser light sources 41 on the laser light source array assembly 50 is rectangular, the array of the plurality of focusing lenses 22 on the microlens array assembly 60 and the rectangular array of the plurality of laser light sources 41 are identical, and the distance d1 between each two adjacent laser light sources 41 is identical to the distance d2 between the centers of each two adjacent corresponding focusing lenses 22; moreover, each laser light source 41 is located on the primary optical axis of its corresponding focusing lens 22, so that it is ensured that the light beam 25 emitted from each laser light source 41 is transmitted through its corresponding focusing lens 22 and focused on the image point 26. It can be understood that, since all the laser light sources 41 constituting the array have the same specification and are all located on the substrate 40, and all the focusing lenses 22 constituting the same array have the same specification and are all located in the same plane, all the laser light sources 41 converge to obtain the image point 26 on the same image plane 30 after being transmitted by the corresponding focusing lens 22.
Because the control circuit for controlling the on-off of the plurality of laser light sources is integrated on the substrate, the integrated semiconductor laser direct imaging device with the micro-lens array, which can be focused, can control the on-off of each laser light source and the light output power according to the characteristics of an image to be exposed by using a preset program.
Referring to fig. 4 and 5, in order to remove heat generated by the plurality of laser light sources 41 integrated in the laser light source array assembly 50, a cooling module 60 is connected to the other end surface of the substrate 40 opposite to the surface on which the plurality of laser light sources 41 are mounted. The cooling module 60 may be any device for air cooling, water cooling or natural cooling, such as a fan, a cavity filled with cold water, or a metal cooling block. As an embodiment of the present application, the cooling module 60 is preferably a copper block, because the copper block dissipates heat quickly and can take away heat generated by the laser light sources 41 in time.
As a further optimization, in fig. 4, 5 and 6, when the cooling module 60 is a copper block, a plurality of grooves 61 are formed on an end surface of the copper block opposite to the substrate 40 (i.e., a lower end surface of the copper block), and the grooves 61 are designed to increase a heat dissipation area of the copper block and accelerate volatilization of heat generated by the laser source 41.
In the present application, the focusing lens 22 is preferably any one of an aspherical lens, a self-focusing lens, and a conical mirror. The aspheric lens, the self-focusing lens and the conical lens are selected, so that the occupied space of the aspheric lens, the self-focusing lens and the conical lens can be reduced, and the distribution density of the laser light source is improved. It should be noted that, when the focusing lens 22 is an aspheric lens, several aspheric lenses can be integrally formed by pressing a mold, and the aspheric lens can be made of any one of PMMA (acrylic), PC (polycarbonate) and organic glass with excellent light transmittance.
Preferably, in the present application, the laser light source is preferably a crystal diode which is easy to purchase and has good light extraction performance. When the crystal diode is applied to the integrated semiconductor laser direct imaging device with the micro-lens array and capable of focusing, the crystal diode does not need to be arranged in the transparent shell 24 in the prior art mentioned in the figure 1.
In the present application, the substrate is preferably a PCB (Printed circuit board) board. The microlens array module in the present application refers to a module formed by a plurality of miniaturized focusing lens arrays.
The invention discloses a focusing integrated semiconductor laser direct imaging device with a micro-lens array, which has the following technical effects:
1. the photosensitive coating with different thicknesses can be exposed, and the distribution density of the laser light source is improved. Because all the focusing lenses are integrated on the micro lens array component, the micro lens array component can move back and forth along the main optical axis of any one focusing lens (the main optical axes of all the focusing lenses are vertical to the plane where the micro lens array component is located) through control, so that a plurality of laser light sources distributed in an array can expose photosensitive ink layers with different thicknesses t. Because all the focusing lenses are integrated on the micro-lens array component, each focusing lens does not need a separate lens barrel, and the space occupied by the lens barrels is saved, so that the distance d1 (shown in figure 3) between the two focusing lenses can be designed to be smaller than the distance d3 (shown in figure 1) between the two focusing lenses in the prior art, more focusing lenses can be placed in the same area, the distribution of the focusing lenses is denser, the light-emitting density of a laser light source is improved, and the exposure power of the device is improved in unit time.
2. The optical path loss is reduced, and the utilization rate of laser is improved. In this application, because a plurality of laser source arrays paste the dress on the base plate, each laser source no longer needs the transparent shell in figure 1, because transparent shell has certain thickness k, can understand, after removing transparent shell, the light path of laser source to the imaging surface has shortened the distance of thickness k to reduce the loss of laser source light energy, improved laser source's utilization ratio.
3. The exposure precision is higher. In this application, because a plurality of laser light source arrays paste the dress on the base plate, a plurality of microlenses are integrated on microlens array subassembly, as long as with base plate and microlens array subassembly accurate but counterpoint installation together, then the homoenergetic guarantees that each laser light source all is in on the primary optical axis with its focusing lens that corresponds to make the image point more accurate in the position of imaging on the imaging surface. In the background art, each laser light source and the corresponding focusing lens are first mounted in a lens barrel and then mounted on a mounting seat, so that a certain deviation exists between an imaging position of each laser light source on an imaging surface and a theoretical design position due to processing errors of the lens barrel and unavoidable mounting errors of the laser light source and the focusing lens on the lens barrel.
4. The cost is low. In the application, the lens barrel and the transparent shell are not needed any more, so that the cost is greatly saved.
5. The assembly is simple and efficient. In the application, the micro-lens array assembly and the substrate (the plurality of laser light sources are attached to the substrate through the bonding process) are aligned and mounted accurately, so that the trouble that the laser light sources and the focusing lens are mounted on the lens cone firstly and then the lens cone is mounted on the mounting seat in the background technology is eliminated, and the assembling is simple and high in assembling efficiency. The trouble of mounting the laser light source and the focusing lens on the lens barrel and then mounting the lens barrel on the mounting seat in the background technology is eliminated.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. A focusing integrated semiconductor laser direct imaging device with a micro-lens array is characterized by comprising:
the laser device comprises a substrate, a control circuit and a plurality of laser light sources, wherein the control circuit for controlling the on and off of the plurality of laser light sources is integrated in the substrate, and the plurality of laser light sources distributed in an array mode are attached to the substrate;
the micro lens array component is provided with a plurality of focusing lenses with the same quantity and array mode as the laser light sources, each laser light source is controlled by the control circuit to emit light beams with preset light emitting power, and the light beams are focused by the focusing lens corresponding to the laser light source and then converged on the photosensitive coating of the common imaging surface;
each laser light source is located on the main optical axis of the corresponding focusing lens, and the micro-lens array assembly can integrally move along the main optical axis of any focusing lens through control so as to expose photosensitive coatings with different thicknesses.
2. The integrated semiconductor laser direct imaging apparatus with microlens array that is adjustable in focus of claim 1, wherein the microlens array assembly is moved in its entirety by voice coil motor control provided on the substrate.
3. The integrated semiconductor laser direct imaging apparatus with microlens array that is adjustable in focus of claim 1, further comprising a cooling module disposed on a plane of the substrate opposite the plurality of laser light sources.
4. The integrated semiconductor laser direct imaging apparatus with microlens array that is adjustable in focus of claim 1, wherein the focusing lens is one of an aspheric lens, a self-focusing lens or a conical mirror.
5. The integrated semiconductor laser direct imaging apparatus with microlens array that can focus according to claim 1, wherein the image of the plurality of laser light source arrays is any one of rectangle, circle, diamond, regular polygon.
6. The integrated semiconductor laser direct imaging apparatus with microlens array that is adjustable in focus of claim 4, wherein when said focusing lens is an aspheric lens, a number of said aspheric lenses are pressed by a die.
7. The integrated semiconductor laser direct imaging apparatus with microlens array that is focused as recited in claim 3 wherein said cooling module is a copper block removably attached to a plane on said substrate opposite a plurality of said laser light sources.
8. The integrated, semiconductor laser direct imaging apparatus with microlens array that is focused as recited in claim 7, wherein grooves are formed on the end surface of the copper block opposite the substrate.
9. The integrated, semiconductor laser direct imaging apparatus with microlens array that is focusable according to any of claims 1 to 8, wherein the laser light source is a crystal diode.
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| CN202211024070.1A CN115113494A (en) | 2022-08-25 | 2022-08-25 | Integrated semiconductor laser direct imaging device with micro-lens array and capable of focusing |
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Application publication date: 20220927 |