CN217929938U - Double-layer nanometer phase change material heat shield - Google Patents
Double-layer nanometer phase change material heat shield Download PDFInfo
- Publication number
- CN217929938U CN217929938U CN202222308097.5U CN202222308097U CN217929938U CN 217929938 U CN217929938 U CN 217929938U CN 202222308097 U CN202222308097 U CN 202222308097U CN 217929938 U CN217929938 U CN 217929938U
- Authority
- CN
- China
- Prior art keywords
- cylindrical container
- change material
- outer cylindrical
- layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of heat abstractor, specifically be a double-deck nanometer phase change material separates heat exchanger, it includes: water-cooling board, heat conduction elastic component, outer cylindrical container, inlayer cylindrical container, aluminium system heating panel, field effect transistor, PCB board and phase change material filling opening, water-cooling board below sets up heat conduction elastic component, outer cylindrical container is connected to heat conduction elastic component bottom, the inside cylindrical container of inlayer that sets up of outer cylindrical container, outer cylindrical container bottom sets up the PCB board, connect aluminium system heating panel between water-cooling board and the PCB board, outer cylindrical container lateral wall left and right sides bottom all sets up field effect transistor, the phase change material filling opening is all seted up with inlayer cylindrical container top to outer cylindrical container, utilizes the phase change material of two kinds of melting points differences to come the heat that absorbing element gived off, and isolated outside heat simultaneously makes the space among the heat-proof device keep a relatively stable temperature.
Description
Technical Field
The utility model relates to a heat abstractor technical field specifically is a double-deck nanometer phase change material separates heat exchanger.
Background
Water cooling is a method of removing heat from components and industrial equipment. Evaporative cooling using water is generally more efficient than air cooling. Water is cheap and non-toxic; however, it may contain impurities and cause corrosion. Water cooling is commonly used to cool automotive internal combustion engines and power stations. Inside high-end personal computers, water coolers using convective heat transfer are used to reduce the temperature of the CPU. Other uses include cooling lubricating oil in pumps; for cooling in a heat exchanger; for cooling buildings in HVAC and chillers.
The traditional water-cooling heat dissipation device is generally characterized in that an aluminum heat dissipation plate is used for connecting a PCB (printed circuit board) and a water cooling plate, and heat is dissipated through cooling liquid, but the temperature uniformity of the device is poor, heat transfer of a high-temperature component to a low-temperature component cannot be isolated, and the working reliability of the device is reduced.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made in view of the above and/or other problems occurring in the conventional heat dissipating apparatus.
Therefore, the utility model aims at providing a double-deck nanometer phase change material separates heat exchanger absorbs the heat that gives off around with the component and spreads into the PCB board and carry out the heat transfer through aluminium system heating panel between the two and water-cooling board, utilizes the phase change material of two kinds of melting points differences to absorb the heat that the component gave off, and isolated outside heat makes the space among the heat-proof device keep a relatively stable temperature simultaneously.
In order to solve the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
a two-layer nano phase change material heat shield, comprising:
water-cooling board, heat conduction elastomeric element, outer cylindrical container, inlayer cylindrical container, aluminium system heating panel, field effect transistor, PCB board and phase change material filling opening, water-cooling board below sets up heat conduction elastomeric element, outer cylindrical container is connected to heat conduction elastomeric element bottom, the inside cylindrical container of inlayer that sets up of outer cylindrical container, outer cylindrical container bottom sets up the PCB board, connect aluminium system heating panel between water-cooling board and the PCB board, outer cylindrical container lateral wall left and right sides bottom all sets up field effect transistor, the phase change material filling opening is all seted up with inlayer cylindrical container top to outer cylindrical container.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: and a pin of the field effect transistor is connected with the PCB.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the water cooling plate and the PCB are arranged in parallel,
as a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the top of the outer layer cylindrical container is sealed by a heat-conducting elastic material and is separated from the water cooling plate 1 by a distance of 1 cm.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the outer layer cylindrical container is filled with a phase change material PCM1 with a higher melting point, and the inner layer cylindrical container is filled with a phase change material PCM2 with a lower melting point.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the cylindrical height of the outer layer cylindrical container is higher than that of the inner layer cylindrical container.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the outer cylindrical container and the inner cylindrical container both adopt hollow cylinders, and the outer cylindrical container and the inner cylindrical container are hollow walls.
As a preferred scheme of double-deck nanometer phase change material heat exchanger that separates, wherein: the outer cylindrical container and the inner cylindrical container are mutually attached, and heat-conducting silicone grease is filled at the attachment position between the outer cylindrical container and the inner cylindrical container.
Compared with the prior art: the utility model discloses absorb the heat that the component gived off around and spread into the PCB board and carry out the heat transfer through aluminium system heating panel between the two and water-cooling board, utilize the phase change material of two kinds of melting points differences to absorb the heat that the component gived off, isolated outside heat simultaneously, space among the messenger heat-proof device keeps a relatively stable temperature, compare with traditional water-cooled heat abstractor, the temperature influence of high temperature component to the low temperature original paper can effectively be isolated in the interpolation of this device, it all has the suitability to make the device to different temperature conditions, hoisting device's radiating efficiency and temperature homogeneity, the device installation is simple, only need to fill phase change material and can move.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
FIG. 1 is a front view of the cross-sectional structure of the present invention;
FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;
fig. 3 is a schematic view of the top view structure of the present invention.
In the figure: 1 water-cooling board, 2 heat conduction elastic parts, 3 outer cylindrical containers, 4 inner cylindrical containers, 5 aluminum heat dissipation boards, 6 field effect transistors, 7PCB boards and 8 phase-change material injection ports.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be enlarged partially according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The utility model provides a double-deck nanometer phase change material separates heat exchanger absorbs the heat that gives off around the component and spreads into the PCB board and carry out the heat transfer through aluminium system heating panel and water-cooling board between the two, utilizes the phase change material of two kinds of melting points differences to absorb the heat that the component gived off, and isolated outside heat simultaneously makes the space among the heat-proof device keep a relatively stable temperature, please refer to and draw together fig. 1-3, include: the heat dissipation device comprises a water cooling plate 1, a heat conduction elastic part 2, an outer layer cylindrical container 3, an inner layer cylindrical container 4, an aluminum heat dissipation plate 5, a field effect tube 6, a PCB 7 and a phase change material injection port 8.
Set up heat conduction elastic component 2 below the water-cooling board 1, outer cylindrical container 3 is connected to heat conduction elastic component 2 bottom, the inside inner cylindrical container 4 that sets up of outer cylindrical container 3, outer cylindrical container 3 bottom sets up PCB board 7, connect aluminium system heating panel 5 between water-cooling board 1 and the PCB board 7, 3 lateral wall left and right sides bottoms of outer cylindrical container all set up field effect transistor 6, phase change material filling opening 8 is all seted up with 4 tops of inner cylindrical container to outer cylindrical container 3, the stitch of field effect transistor 6 is connected with PCB board 7.
Parallel arrangement between water-cooling board 1 and PCB board 7, 3 tops of outer cylindrical container are through heat conduction elastic material 2 capping and with 1 distance that separate 1cm of water-cooling board, the cylinder height of outer cylindrical container 3 is higher than the cylinder height of inlayer cylindrical container 4, outer cylindrical container 3 all adopts hollow cylinder with inlayer cylindrical container 4, the cylinder outer wall of outer cylindrical container 3 and inlayer cylindrical container 4 is hollow wall, fill phase change material in the outer wall hollow department of outer cylindrical container 3 and inlayer cylindrical container 4 through phase change material filling opening 8, it forms hollow cylinder to make phase change material fill, it has higher phase change material PCM1 (candle) of fusing point to fill in outer cylindrical container 3, it has lower phase change material PCM2 (water) of fusing point to fill in the inlayer cylindrical container 4.
Outer cylindrical container 3 and the mutual laminating of inlayer cylindrical container 4, the position of laminating has filled the heat conduction silicone grease between outer cylindrical container 3 and the inlayer cylindrical container 4, connects outer cylindrical container 3 and the cylindrical container 4 of inlayer through the heat conduction silicone grease, makes things convenient for to carry out heat transfer between outer cylindrical container 3 and the cylindrical container 4 of inlayer, improves the heat transfer efficiency between outer cylindrical container 3 and the cylindrical container 4 of inlayer.
In specific use, when the electronic device works, heat is generated, the PCM2 in the inner cylindrical container 4 melts when reaching a melting point, the heat emitted to the surrounding environment by the element is absorbed, and the PCM1 in the outer cylindrical container 3 absorbs the heat conducted by the PCM2, so that the PCM2 can continuously work; when the temperature rises again, PCM1 begins to melt, absorbs a large amount of heat and reduces the temperature of the device, and simultaneously, the heat is transmitted to PCB 7 through field effect tube 6, and then the heat exchange is carried out by the cooling liquid in water cooling plate 1 through aluminum heat dissipation plate 5 between PCB 7 and water cooling plate 1. If the temperature continues to rise, the volume is increased due to the melting of the PCM1, and the heat-conducting elastic component 2 is extruded to be in contact with the water cooling plate 1 for direct heat exchange.
The design of two layers of phase-change materials with different melting point temperatures is adopted: since the inner PCM2 has a low melting point, it begins to melt and absorb a large amount of heat when the element reaches the melting point of the PCM2, and the PCM1 insulates external heat and absorbs heat conducted from the PCM2, maintaining the element at a low temperature.
The device is a system similar to a 'series network' formed by a PCM1, a PCM2, a PCB and a water cooling plate, the heat is 'current' of the network, when the temperature is lower, 'current' only enables the temperature of the PCM2 to rise, melt and absorb heat, when the temperature reaches the melting point of an outer-layer phase-change material, 'current' is transmitted to the PCM1 through the PCM2 to enable the PCM1 to melt and absorb heat, and then the 'current' is transmitted to the PCB and then is connected with the water cooling plate for heat exchange; when the temperature is too high, the melting volume of the phase-change material is increased, the elastic material at the top of the extrusion part directly contacts with the water cooling plate to directly exchange heat and rapidly cool, and the device has applicability to different temperature conditions.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the description of these combinations not exhaustive in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. A double-layer nanometer phase change material heat shield, comprising: water-cooling board (1), heat conduction elastic component (2), outer cylindrical container (3), inlayer cylindrical container (4), aluminium system heating panel (5), field effect transistor (6), PCB board (7) and phase change material filling opening (8), water-cooling board (1) below sets up heat conduction elastic component (2), outer cylindrical container (3) is connected to heat conduction elastic component (2) bottom, outer cylindrical container (3) inside sets up inlayer cylindrical container (4), outer cylindrical container (3) bottom sets up PCB board (7), be connected aluminium system heating panel (5) between water-cooling board (1) and PCB board (7), outer cylindrical container (3) lateral wall left and right sides bottom all sets up field effect transistor (6), phase change material filling opening (8) are all seted up with inlayer cylindrical container (4) top in outer cylindrical container (3).
2. The double-layer nanometer phase change material heat shield as claimed in claim 1, wherein pins of the field effect transistor (6) are connected with a PCB (7).
3. The double-layer nanometer phase-change material heat shield as claimed in claim 1, wherein the water-cooling plate (1) and the PCB (7) are arranged in parallel.
4. The double-layer nanometer phase-change material heat shield as claimed in claim 1, wherein the top of the outer cylindrical container (3) is capped by the heat-conducting elastic component (2) and is separated from the water-cooling plate (1) by a distance of 1 cm.
5. The double-layer nanometer phase-change material heat shield according to claim 1, wherein a phase-change material (PCM 1) with a higher melting point is injected into the outer-layer cylindrical container (3), and a phase-change material (PCM 2) with a lower melting point is injected into the inner-layer cylindrical container (4).
6. The double-layer nano phase change material heat shield as claimed in claim 1, wherein the cylindrical height of the outer layer cylindrical container (3) is higher than that of the inner layer cylindrical container (4).
7. The double-layer nanometer phase-change material heat shield as claimed in claim 1, wherein the outer cylindrical container (3) and the inner cylindrical container (4) are hollow cylinders, and the outer cylindrical walls of the outer cylindrical container (3) and the inner cylindrical container (4) are hollow walls.
8. The double-layer nanometer phase-change material heat shield according to claim 1, wherein the outer-layer cylindrical container (3) and the inner-layer cylindrical container (4) are attached to each other, and heat-conducting silicone grease is filled at the attachment position between the outer-layer cylindrical container (3) and the inner-layer cylindrical container (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222308097.5U CN217929938U (en) | 2022-08-30 | 2022-08-30 | Double-layer nanometer phase change material heat shield |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222308097.5U CN217929938U (en) | 2022-08-30 | 2022-08-30 | Double-layer nanometer phase change material heat shield |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217929938U true CN217929938U (en) | 2022-11-29 |
Family
ID=84172179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222308097.5U Active CN217929938U (en) | 2022-08-30 | 2022-08-30 | Double-layer nanometer phase change material heat shield |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217929938U (en) |
-
2022
- 2022-08-30 CN CN202222308097.5U patent/CN217929938U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180294452A1 (en) | Tray, power battery pack and electric vehicle | |
| US6702003B2 (en) | Three-phase heat transfer structure | |
| CN103838334A (en) | Heat dissipation base of notebook computer | |
| CN101510533A (en) | Novel microelectronic device radiator | |
| CN104235800A (en) | Phase change temperature control device for intermittent high-power LED (light-emitting diode) | |
| CN212034657U (en) | Integrated uniform temperature plate radiator | |
| CN217929938U (en) | Double-layer nanometer phase change material heat shield | |
| CN210014475U (en) | Radiator, air condensing units and air conditioner | |
| CN210014477U (en) | Radiator, air condensing units and air conditioner | |
| GB2342152A (en) | Plate type heat pipe and its installation structure | |
| CN115265252A (en) | Double-layer nanometer phase-change material heat shield | |
| CN210014478U (en) | Radiator, air condensing units and air conditioner | |
| WO2023005205A1 (en) | Heat dissipation apparatus and electronic device | |
| CN103179843B (en) | A kind of radiator structure of high power density variable-frequency converter | |
| CN113163672B (en) | Phase change heat storage type radiator utilizing thermal expansion of phase change material | |
| CN216357863U (en) | Immersion cooling system and electronic equipment | |
| CN215177187U (en) | Adopt 3D heat dissipation module of samming plate structure | |
| CN210781900U (en) | Continuous cooling and thermal shock resistant cooling combined integrated radiator | |
| CN112713128A (en) | Intelligent controller heat dissipation method and device | |
| CN113784583A (en) | Heat radiation structure, power driver and electric servo device | |
| CN210663105U (en) | Air condensing units and air conditioner | |
| CN210272335U (en) | Chip heat radiation structure | |
| CN206449610U (en) | A kind of wiring board for carrying cooling system | |
| CN219756297U (en) | LED lamp with multiple heat conduction structures | |
| CN1624991A (en) | Phase-change energy-storage laser head cooler |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |