CN217904768U

CN217904768U - Reflow soldering device for SMT (surface mount technology) patch

Info

Publication number: CN217904768U
Application number: CN202221655275.5U
Authority: CN
Inventors: 周会荣; 黄首跃; 唐生柱; 张斌
Original assignee: Jiangsu Chengtai Intelligent Technology Co ltd
Current assignee: Jiangsu Chengtai Intelligent Technology Co ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2022-11-25
Anticipated expiration: 2032-06-29

Abstract

The utility model relates to a SMT paster welding technology field, and discloses a reflow soldering device for SMT paster, including the under casing, the top of under casing is fixed and is equipped with the protection casing, the top of protection casing is fixed and is equipped with the heating cabinet, the top inner wall of heating cabinet is fixed and is equipped with electric heating plate, the lateral wall of heating cabinet is fixed and is inlayed and be equipped with the fan, the bottom of heating cabinet is fixed and is equipped with the tuber pipe that stretches into to the protection casing inside, and the lower extreme of tuber pipe is fixed and is equipped with the aerofoil, the bottom of aerofoil is seted up a plurality of evenly distributed exhaust vents; the top of under casing is equipped with the standing groove, and the inside of standing groove is equipped with loads the board, loads the inside of board and is equipped with the circuit board, loads the both sides of board and all is equipped with fixture, and the lateral wall of under casing is equipped with the fluting, and grooved inside is equipped with the closing plate. The utility model discloses can keep apart circuit board and SMT paster and place, avoid the pollutant to cause the phenomenon of pollution to SMT paster and circuit board to product quality has been improved.

Description

Reflow soldering device for SMT (surface mount technology) patch

Technical Field

The utility model relates to a SMT paster welds technical field, especially relates to a reflow soldering device for SMT paster.

Background

SMT paster refers to and carries out the short for of a series of process flow of processing on PCB basis, and PCB is printed circuit board, and current SMT paster is at the welded in-process, through reflow soldering device, can make things convenient for and quick completion work.

The patent number is CN216532005U, which discloses a reflow soldering device for SMT paster, comprising an upright post, a connecting rod, a working bin, a clapboard, a wind guide machine, a wind guide pipe, a heating box, an electric heating sheet, a side supporting plate, a conveying wheel, a speed reducer, a conveying fan, an adjusting and limiting plate structure, a wind direction adjusting cylinder structure and a conveying mesh belt, wherein the upright posts are all welded around the lower surface of the working bin, and the connecting rod is welded between the upright post and the upright post; a partition plate is arranged on a bolt on the left side of the inner wall of the working bin; the air guide machines are all arranged at the upper part and the lower part on the left side of the inner wall of the working bin through bolts; the air guide pipes are embedded into the upper side and the lower side of the inside of the partition plate, one end of each air guide pipe is embedded into the front end of the air guide machine, and the other end of each air guide pipe is inserted into the left side of the inside of the heating box.

When the SMT paster is subjected to reflow soldering in the scheme, the circuit board and the SMT paster cannot be well isolated and protected, and the phenomenon of soldering pollution is easily caused, so that the product quality of the SMT paster is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving among the prior art when to SMT paster reflow soldering, circuit board and SMT paster can not obtain better isolation protection, cause the problem of the phenomenon of welding pollution easily, and the reflow soldering device who is used for SMT paster that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a reflow soldering device for SMT patches comprises a bottom case, wherein a protective cover is fixedly arranged at the top of the bottom case, a heating case is fixedly arranged at the top of the protective cover, an electric heating sheet is fixedly arranged on the inner wall of the top of the heating case, a fan is fixedly embedded in the side wall of the heating case, an air outlet pipe extending into the protective cover is fixedly arranged at the bottom of the heating case, an air plate is fixedly arranged at the lower end of the air outlet pipe, and a plurality of air outlet holes which are uniformly distributed are formed in the bottom of the air plate;

the improved structure of the electric connector box comprises a bottom box, and is characterized in that a placing groove is formed in the top of the bottom box, a loading plate is arranged inside the placing groove, a circuit board is arranged inside the loading plate, clamping mechanisms are arranged on two sides of the loading plate, a groove is formed in the side wall of the bottom box, a sealing plate is arranged inside the groove, the side face of the sealing plate is fixedly connected with the side face of the loading plate, and a positioning mechanism is arranged between the side face of the sealing plate and the side wall of the bottom box.

Preferably, the clamping mechanism comprises a spring and a clamping block, one end of the spring is fixedly arranged on the inner side wall of the loading plate, and the other end of the spring is fixedly connected with the clamping block.

Preferably, the top of the clamping block is arranged by adopting an inclined plane, and the top of the clamping block is a guide part.

Preferably, the positioning mechanism comprises two positioning rings and a plug pin, the two positioning rings are respectively and fixedly arranged on the side wall of the bottom box and the side wall of the sealing plate, and the plug pin is inserted into the two positioning rings.

Preferably, the top both sides of aerofoil all are fixed and are equipped with the jib, two the upper end of jib all with the top inner wall fixed connection of protection casing.

Preferably, the protective cover is a transparent high-temperature-resistant glass cover.

Preferably, the ventilation openings are formed in the two sides of the protective cover, and the dustproof nets are fixedly arranged inside the ventilation openings.

Compared with the prior art, the utility model provides a reflow soldering device for SMT paster possesses following beneficial effect:

1. this a reflow soldering device for SMT paster, through loading board and the closing plate that is equipped with, can put into the circuit board in the inside of loading the board, put into the top at the circuit board with the SMT paster, then will load inside the protection casing of board insertion at the under casing top, because the top of under casing is provided with the protection casing, can keep apart the protection with circuit board and SMT paster, avoid causing the phenomenon of pollution in welding process.

2. This a reflow soldering device for SMT paster, through setting up spring and the clamp splice in loading inboard, the spring can apply elasticity for the clamp splice presss from both sides the both sides of circuit board tightly, thereby can improve the circuit board at the inside steadiness of loading the board.

The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model discloses can keep apart circuit board and SMT paster and place, avoid the pollutant to cause the phenomenon of pollution to SMT paster and circuit board to product quality has been improved.

Drawings

Fig. 1 is a schematic structural diagram of a reflow soldering apparatus for SMT mounting;

FIG. 2 is a front view of the bottom box and protective cover of FIG. 1;

FIG. 3 is a schematic view showing an internal structure of the heating tank of FIG. 1;

fig. 4 is an enlarged view of a portion a of fig. 1.

In the figure: 1. a bottom box; 2. a protective cover; 3. a heating box; 4. an electrical heating sheet; 5. a fan; 6. an air outlet pipe; 7. a wind plate; 8. an air outlet; 9. a loading plate; 10. a circuit board; 11. a sealing plate; 12. a spring; 13. a clamping block; 14. a positioning ring; 15. a bolt; 16. a boom; 17. a vent; 18. a dust screen.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example 1

Referring to fig. 1-3, a reflow soldering device for SMT patches, which comprises a bottom case 1, wherein a protective cover 2 is fixedly arranged at the top of the bottom case 1, a heating case 3 is fixedly arranged at the top of the protective cover 2, an electric heating sheet 4 is fixedly arranged on the inner wall of the top of the heating case 3, a fan 5 is fixedly embedded in the side wall of the heating case 3, an air outlet pipe 6 extending into the protective cover 2 is fixedly arranged at the bottom of the heating case 3, an air plate 7 is fixedly arranged at the lower end of the air outlet pipe 6, suspenders 16 are fixedly arranged on both sides of the top of the air plate 7, the upper ends of the two suspenders 16 are fixedly connected with the inner wall of the top of the protective cover 2, a plurality of air outlet holes 8 which are uniformly distributed are formed in the bottom of the air plate 7, and the protective cover 2 is made of transparent high-temperature resistant glass, so that the welding process of the protective cover 2 by workers is facilitated; vent 17 has all been seted up to the both sides of protection casing 2, and vent 17's inside is fixed and is equipped with dust screen 18, can guarantee the inside gas outgoing of protection casing 2, reduces the inside pollutant entering to protection casing 2 simultaneously. The top of under casing 1 is equipped with the standing groove, and the inside of standing groove is equipped with load board 9, and the inside of load board 9 is equipped with circuit board 10, and the both sides of load board 9 all are equipped with fixture, and the lateral wall of under casing 1 is equipped with the fluting, and the inside of fluting is equipped with closing plate 11, and the side of closing plate 11 and the side fixed connection of load board 9 are equipped with positioning mechanism between the side of closing plate 11 and the lateral wall of under casing 1.

Example 2

Referring to fig. 4, the clamping mechanism includes a spring 12 and a clamping block 13, one end of the spring 12 is fixedly disposed on the inner side wall of the loading plate 9, the other end of the spring 12 is fixedly connected with the clamping block 13, the top of the clamping block 13 is disposed on an inclined plane, and the top of the clamping block 13 is a guide portion, the spring 12 can apply an elastic force to the clamping block 13, so that the circuit board 10 is stably clamped inside the loading plate 9.

Example 3

Referring to fig. 2, the positioning mechanism includes two positioning rings 14 and a plug 15, the two positioning rings 14 are respectively fixed on the side wall of the bottom case 1 and the side wall of the sealing plate 11, the plug 15 is inserted into the two positioning rings 14, and the loading plate 9 can be stably inserted into the placing groove at the top of the bottom case 1.

The utility model discloses in, during the use, the staff takes bolt 15 from the inside of two holding rings 14, then outside pulling closing plate 11, make loading plate 9 take out from the standing groove inside at under casing 1 top, put into the inside at loading plate 9 with circuit board 10 this moment, through the spring 12 effect in loading plate 9 both sides, spring 12 can exert elasticity for clamp splice 13, make the centre gripping that stabilizes circuit board 10 in the inside of loading plate 9, put into the surface at circuit board 10 with the SMT paster simultaneously, insert loading plate 9 at the top of under casing 1 again, then connect the power of electric heating piece 4 and fan 5, fan 5 can blow in the heat that electric heating piece 4 produced to the inside of tuber pipe 6, blow in to tuber plate 7 and through even the blowing to circuit board and SMT paster of exhaust vent 8 again, thereby can accomplish paster action to SMT, in this in-process, circuit board and SMT paster all are located the inside of protection casing 2, and welding process also is located the inside of protection casing 2, welding pollution's phenomenon can not appear, welding quality is improved.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A reflow soldering device for SMT patches comprises a bottom case (1) and is characterized in that a protective cover (2) is fixedly arranged at the top of the bottom case (1), a heating case (3) is fixedly arranged at the top of the protective cover (2), an electric heating sheet (4) is fixedly arranged on the inner wall of the top of the heating case (3), a fan (5) is fixedly embedded in the side wall of the heating case (3), an air outlet pipe (6) extending into the protective cover (2) is fixedly arranged at the bottom of the heating case (3), an air plate (7) is fixedly arranged at the lower end of the air outlet pipe (6), and a plurality of air outlet holes (8) which are uniformly distributed are formed in the bottom of the air plate (7);

the improved structure of the electric connector box is characterized in that a placing groove is formed in the top of the bottom box (1), a loading plate (9) is arranged inside the placing groove, a circuit board (10) is arranged inside the loading plate (9), clamping mechanisms are arranged on the two sides of the loading plate (9), a groove is formed in the side wall of the bottom box (1), a sealing plate (11) is arranged inside the groove, the side face of the sealing plate (11) is fixedly connected with the side face of the loading plate (9), and a positioning mechanism is arranged between the side face of the sealing plate (11) and the side wall of the bottom box (1).

2. A reflow soldering apparatus for an SMT patch according to claim 1, wherein said clamping mechanism comprises a spring (12) and a clamping block (13), one end of said spring (12) is fixedly arranged on the inner side wall of the loading plate (9), and the other end of said spring (12) is fixedly connected with the clamping block (13).

3. A reflow soldering apparatus for an SMT patch according to claim 2, wherein the top of the clamping block (13) is provided with an inclined surface, and the top of the clamping block (13) is a guide portion.

4. A reflow soldering apparatus for an SMT patch according to claim 1, wherein said positioning mechanism comprises two positioning rings (14) and a latch (15), said two positioning rings (14) are fixedly disposed on the side wall of the bottom case (1) and the side wall of the sealing plate (11), respectively, and said latch (15) is inserted into the two positioning rings (14).

5. A reflow soldering device for an SMT patch according to claim 1, wherein a hanger bar (16) is fixedly arranged on each side of the top of the air plate (7), and the upper ends of the two hanger bars (16) are fixedly connected with the inner wall of the top of the shield (2).

6. A reflow soldering apparatus for an SMT patch according to claim 1, wherein the protective enclosure (2) is a transparent high temperature resistant glass enclosure.

7. A reflow soldering apparatus for an SMT patch according to claim 1, wherein ventilation openings (17) are formed in both sides of the protective cover (2), and a dust screen (18) is fixed inside the ventilation openings (17).