CN217903134U - Display panel and electronic device - Google Patents
Display panel and electronic device Download PDFInfo
- Publication number
- CN217903134U CN217903134U CN202222200548.3U CN202222200548U CN217903134U CN 217903134 U CN217903134 U CN 217903134U CN 202222200548 U CN202222200548 U CN 202222200548U CN 217903134 U CN217903134 U CN 217903134U
- Authority
- CN
- China
- Prior art keywords
- back plate
- display panel
- bonding
- opening
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The application relates to the technical field of display equipment manufacturing, and provides a display panel and electronic equipment, wherein the display panel comprises a driving board and a light-emitting device; the driving board comprises a back board, a glue layer positioned on one side of the back board, an opening used for accommodating the light-emitting device and a bonding electrode positioned in the opening are arranged on the glue layer, and the light-emitting device is electrically connected with the bonding electrode; the distance from one side of the adhesive layer far away from the back plate to the surface of the back plate is greater than the distance from one side of the bonding electrode far away from the back plate to the surface of the back plate. The electronic equipment comprises the display panel. The flow of the contained adhesive material is restricted by the opening, so that the light emitting device and the bonding electrode can be prevented from being misaligned during bonding.
Description
Technical Field
The application relates to the technical field of display equipment manufacturing, in particular to a display panel and electronic equipment using the same.
Background
The Mini LED or Micro-LED display technology has the advantages of high brightness, high response speed, low power consumption, long service life and the like, and becomes a research hotspot in pursuing a new generation of display technology in the field of display equipment manufacturing. A bulk transfer process is generally required in the process of preparing a Mini LED or a Micro-LED screen body, and the bulk transfer process is a key process for transferring at least hundreds of thousands of light-emitting devices to a back plate with high efficiency and high yield, and includes key technologies such as temporary Bonding, laser lift-off, transfer, bonding (Bonding), and the like. The bonding process is to realize bonding of the LED electrode and the bonding electrode on the back plate by using a thermal bonding mode.
However, in the conventional display panel, since the bonding material for pre-positioning the light emitting device and the bonding electrode is easily squeezed and flows before the electrodes (cathode and anode) of the light emitting device and the bonding electrode on the back plate are bonded, a phenomenon that the light emitting device and the bonding electrode are misaligned during bonding is easily generated.
Disclosure of Invention
In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a display panel, including: a driving board and a light emitting device;
the drive plate includes:
a back plate;
the adhesive layer is positioned on one side of the back plate, and an opening for accommodating the light-emitting device is formed in the adhesive layer;
a bonding electrode located in the opening;
the light emitting device is electrically connected with the bonding electrode;
the distance from one side of the adhesive layer far away from the back plate to the surface of the back plate is larger than the distance from one side of the bonding electrode far away from the back plate to the surface of the back plate.
In a possible implementation manner, the distance from one side of the glue layer away from the back plate to the surface of the back plate is less than or equal to the distance from one side of the light-emitting device away from the back plate to the surface of the back plate.
In a possible implementation manner, an area of an orthographic projection of one side of the opening, which is far away from the back plate, on the back plate is larger than an area of an orthographic projection of one side of the opening, which is close to the back plate, on the back plate.
In one possible implementation, an area of an orthographic projection of the opening on the surface of the back plate is larger than an area of an orthographic projection of the light emitting device on the surface of the back plate.
In a possible implementation manner, the back plate further includes a black glue layer, the black glue layer is at least disposed on the surface of the back plate located in the opening, and the bonding electrode penetrates through the black glue layer and is electrically connected with the back plate.
In one possible implementation manner, the distance from the side of the black glue layer far away from the back plate to the surface of the back plate is smaller than the distance from the side of the bonding electrode far away from the back plate to the surface of the back plate.
In a possible implementation manner, the adhesive layer includes a plurality of retaining wall structures, each retaining wall structure includes a plurality of retaining walls, and the plurality of retaining walls are connected end to define the opening; and a gap is formed between the adjacent retaining wall structures, and the surface of the back plate exposed by the gap is provided with the black glue layer.
In one possible implementation manner, the bonding electrode comprises a bonding portion, and an area of an orthographic projection of a side of the bonding portion far away from the back plate on the surface of the back plate is smaller than an area of an orthographic projection of a side of the bonding portion near the back plate on the surface of the back plate.
In one possible implementation, the bonding electrode further includes a connecting portion, the connecting portion is located in the opening, and the connecting portion is located between the bonding portion and the back plate.
The embodiment of the application further provides an electronic device, which comprises the display panel provided by the embodiment.
Compared with the prior art, the method has the following beneficial effects:
according to the display panel and the electronic device provided by the embodiment, the glue layer is arranged on the back plate, the opening is formed in the glue layer, and the flow of the contained bonding material is limited through the opening, so that the light-emitting device and the bonding electrode are staggered during bonding.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a partial enlarged view of a display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram illustrating a state in which bonding electrodes of a display panel are overflowed by an adhesive material according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of an opening provided in an embodiment of the present application;
fig. 5 is a schematic diagram illustrating a state where a light emitting device is removed by laser in a display panel repair process according to an embodiment of the present application;
fig. 6 is a schematic view illustrating a state of an adhesive layer formed by inkjet printing in a display panel repairing process according to an embodiment of the present disclosure;
fig. 7 is a schematic view illustrating a state in which a repair head transfers a new light emitting device into an opening in a display panel repair process according to an embodiment of the present disclosure;
fig. 8 is a schematic structural view of a display panel provided with a black matrix layer in an opening according to an embodiment of the present disclosure;
fig. 9 is a partially enlarged view of a structure of a display panel provided with a black matrix layer in an opening according to an embodiment of the present disclosure;
fig. 10 is a schematic structural view of a display panel provided with a black glue layer on a back plate between openings according to an embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a bonding electrode according to an embodiment of the present disclosure;
fig. 12 is a schematic view illustrating a state after a negative photoresist and a positive photoresist are disposed in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 13 is a schematic diagram illustrating a state after metal deposition in a manufacturing process of a display panel according to an embodiment of the present application;
fig. 14 is a schematic diagram illustrating a state of forming a bonding electrode in a manufacturing process of a display panel according to an embodiment of the present disclosure.
Reference numerals: 1-a back plate; 11-a bonding electrode; 111-a bonding portion; 112-a connecting portion; 2-a light emitting device; 3-glue layer; 31-an opening; 4-a black glue layer; 5-bonding material; 6-positive photoresist layer; 61-a first containing cavity; 7-negative photoresist layer; 71-a second receiving chamber; 8-a metal layer; 9-repair head.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the application usually place when using, are only used for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.
It should be noted that, in case of conflict, different features in the embodiments of the present application may be combined with each other.
In order to solve the technical problem in the foregoing background art, first, as shown in fig. 1, an embodiment of the present application provides a display panel including a driving board and a light emitting device 2.
The driving board may include a back plate 1, a paste layer 3, and a bonding electrode 11.
The back plate 1 is used for laying electronic devices such as electrodes, chips, capacitors and the like, and the back plate 1 can be a rigid back plate such as a glass back plate, a sapphire back plate or a silicon carbide back plate; it may also be a flexible backplane, such as a Polyimide (PI) backplane. In this embodiment, the back plate 1 may include a plurality of metal traces for transmitting signals or electrical energy.
The adhesive layer 3 may be disposed on one side of the back plate 1, and an opening 31 for accommodating the light emitting device 2 is disposed on the adhesive layer 3. For example, the glue layer 3 may be a photoresist layer, and the opening 31 may be formed by a process of exposure, development, or the like. The shape of the opening 31 may conform to the shape of the light emitting device 2 required to be disposed on the driving board, for example, the orthographic projection shape of the opening 31 on the back plate may be a shape having a closed structure such as a circle, an ellipse, a rectangle or a triangle.
The bonding electrode 11 is located in the opening 31. The bonding electrodes 11 can be electrically connected with metal traces in the back plate 1.
In a possible implementation manner, only one pair of bonding electrodes 11 for connecting with one of the light emitting devices 2 (for example, two bonding electrodes respectively connected with the positive electrode and the negative electrode of one light emitting device 2) may be provided in one of the openings 31; in a possible implementation, a plurality of pairs of bonding electrodes 11 for connecting to a plurality of light emitting devices 2 may also be provided in one of the openings 31.
The light emitting device 2 may be disposed in the opening 31 and electrically connected to the bonding electrode 11. For example, the light emitting device 2 may be bonded to the bonding electrode 11 through a thermal compression bonding process or the like to achieve electrical connection.
Based on the above design, in the manufacturing process of the display panel provided in this embodiment, when performing a bulk transfer of the light emitting device 2, as shown in fig. 3, the bonding material 5 for bonding the bonding electrode 11 and the light emitting device 2 may be first disposed in the opening 31, then the light emitting device 2 may be disposed in the opening 31, the bonding electrode 11 and the light emitting device 2 are bonded by the bonding material 5, the bonding electrode 11 and the light emitting device 2 are pre-positioned before bonding, and then the light emitting device 2 and the bonding electrode 11 are electrically connected by, for example, this pressure bonding.
As shown in fig. 2, a distance L1 from one side of the adhesive layer 3 away from the back plate 1 to the surface of the back plate is greater than a distance L2 from one side of the bonding electrode 11 away from the back plate 1 to the surface of the back plate 1. Because the distance L1 from the side of the adhesive layer 3 away from the backplane 1 to the surface of the backplane 1 is greater than the distance L2 from the side of the bonding electrode 11 away from the backplane 1 to the surface of the backplane 1, the bonding material 5 that can be accommodated by the opening 31 can overflow the bonding electrode 11, so that a certain bonding material 5 can be ensured to realize bonding fixation between the bonding electrode 11 and the light-emitting device 2 in the pre-positioning process. During the pre-positioning and the subsequent pressure bonding, when the adhesive material 5 between the light emitting device 2 and the bonding electrode 11 is squeezed to flow away from the bonding electrode 11, the adhesive layer 3 can limit the adhesive material to flow only within the range of the opening 31, and the flow range of the adhesive material 5 is controlled, so that the light emitting device 2 is prevented from being shifted or rotated due to the flow of the adhesive material 5. At the same time, the openings 31 of the glue layer 3 can also limit the movement of the light emitting device 2 itself to a certain extent. Thus, the leads of the light-emitting device 2 can be ensured to be accurately electrically connected with the bonding electrodes 11 in the bonding process.
In a possible implementation, a plurality of the openings 31 may be formed on a unitary glue layer 3 by etching, and adjacent openings 31 are spaced from each other by the glue layer 3. In another possible implementation manner, the glue layer 3 may include a plurality of retaining wall structures, each retaining wall structure includes a plurality of retaining walls, and the plurality of retaining walls enclose the opening 31 in an end-to-end manner.
In a possible implementation manner, in order to avoid that the adhesive layer 3 obstructs light rays emitted from the light emitting device 2, as shown in fig. 2, a distance L1 from a side of the adhesive layer 3 away from the back plate to the surface of the back plate 1 is less than or equal to a distance L3 from a side of the light emitting device 2 away from the back plate 1 to the surface of the back plate 1. So, can avoid glue film 3 to exceed the play plain noodles of emitting device 2 to avoid glue film 3 shelters from emitting device 2's play plain noodles, also can avoid bonding material will be whole emitting device 2 with glue film 3 bonds.
Since the adhesive material 5 in the opening 31 needs to be heated in the foregoing manufacturing process of the display panel, in order to enable rapid adhesion between the bonding electrode 11 and the light emitting device 2, it is necessary to enable rapid cooling of the adhesive material 5. As a possible example, as shown in fig. 4, an area of an orthographic projection of a side of the opening 31 away from the backboard 1 on the backboard 1 is larger than an area of an orthographic projection of a side of the opening 31 close to the backboard 1 on the backboard 1. In this embodiment, the area of the side of the opening 31 far from the back plate 1 is larger than the area of the side of the opening 31 near the back plate 1, so that the opening 31 with a large top and a small bottom is formed, which is beneficial to heat dissipation of the heated organic adhesive material.
Since the light emitting device 2 needs to be transferred onto the bonding electrode 11 in the opening 31 during the manufacturing process of the display panel. In order to facilitate the bonding of the light emitting device 2 with the bonding electrode 11 located in the opening 31, in one possible embodiment, as shown in fig. 1, an area of an orthographic projection of the opening 31 on the surface of the rear plate 1 is larger than an area of an orthographic projection of the light emitting device 2 on the surface of the rear plate 1. This embodiment allows the entrance area of the opening 31 to be larger than the area of the light emitting device 2, so that the light emitting device 2 can smoothly enter the opening 31 and connect with the bonding electrode 11 therein, and the opening 31 has a certain redundant space with respect to the light emitting device 2, which facilitates fine adjustment of the position of the light emitting device 2 with respect to the bonding electrode 11.
When the light emitting device 2 on the display panel is damaged, the display panel needs to be repaired through a repair process. The repair process includes the following steps S100-S400, which are described in detail below.
Step S100, as shown in fig. 5, removing the damaged light emitting device 2 using laser;
step S200, as shown in fig. 6, forming an adhesive layer on the corresponding bonding metal 11 by inkjet printing;
step S300, as shown in fig. 7, transferring the intact light emitting device 2 to the bonding metal 11 for pairing using the repair head 9;
step S400, bonding the light emitting device 2 and the bonding metal 11 through a thermocompression bonding process.
In the above repair process, the damaged light emitting device 2 is removed by using a laser. In order to avoid laser damage to the back plate 1, in one possible embodiment, as shown in fig. 8, the display panel further includes a black glue layer 4. The black glue layer 4 is at least arranged on the surface of the back plate 1 in the opening 31, and the bonding electrode 11 penetrates through the black glue layer 4 and is electrically connected with the back plate 1. The black adhesive layer 4 can protect the covered back plate 1 from being damaged by laser, so that the repair quality of the display panel is ensured; in addition, the black glue layer 4 can also avoid the reflection of the back plate 1 to external light, and can effectively improve the contrast of the display panel.
So that the black glue layer 4 does not affect the conductivity between the bonding electrode 11 and the light emitting device 2. In one possible embodiment, as shown in fig. 9, a distance L4 from a side of the black glue layer 4 away from the back plate 1 to the surface of the back plate 1 is smaller than a distance L2 from a side of the bonding electrode 11 away from the back plate 1 to the surface of the back plate 1. This embodiment can avoid the existence of the black glue layer 4 on the side of the bonding electrode 11 far away from the back plate 1.
In order to further improve the contrast ratio of the display panel, please refer to fig. 10, the glue layer 3 includes a plurality of retaining wall structures, each of which includes a plurality of retaining walls, the retaining walls are enclosed by the opening 31 in an end-to-end manner, and are adjacent to each other, a gap is formed between the retaining wall structures, and the back plate 1 exposed from the gap is provided with the black glue layer 4 on the surface. Therefore, the coverage area of the black glue layer 4 can be increased, the reflection of the display panel to external light is further reduced, and the contrast of the display panel is further improved.
In one possible embodiment, to facilitate bonding of the light emitting device 2 to the bonding electrode 11, an adhesive material flows from above the bonding electrode 11 into the opening 31 and away from the bonding electrode 11. As a possible example, referring to fig. 11, the bonding electrode 11 includes a bonding portion 111, and an area of an orthographic projection of a side of the bonding portion 111 far from the back plate 1 on the surface of the back plate 1 is smaller than an area of an orthographic projection of a side of the bonding portion near the back plate 1 on the surface of the back plate 1. This embodiment forms a slope between the side of the bonding portion 111 away from the back plate 1 and the side close to the back plate 1, which facilitates the adhesive material to flow into the opening 31 along the slope when being pressed by the light emitting device 2.
Further, the bonding electrode 11 is typically formed by a Lift-Off process in which a metal layer is sputtered onto a patterned photoresist and then the photoresist is removed or stripped to strip the metal layer overlying the photoresist. However, the positive photoresist is difficult to form an opening with a small top and a large bottom when patterned, and thus, as a possible example, the manufacturing process of the display panel may include steps S100 to S300 described below, which will be described in detail below.
Step S100, providing the back plate 1.
In step S200, referring to fig. 12, a positive photoresist 6 is disposed on one side of the back plate 1, and a first receiving cavity 61 is formed on the positive photoresist 6 through an exposure and development process. The first accommodating cavity 61 can expose the routing structure on the backplane.
Step 300, arranging a negative photoresist 7 on one side of the positive photoresist 6 away from the back plate 1, and forming a second accommodating cavity 71 at a position corresponding to the first accommodating cavity 61 through an exposure and development process, wherein an area of an orthographic projection of one side of the second accommodating cavity 71 away from the back plate 1 on the surface of the back plate 1 is smaller than an area of an orthographic projection of one side of the second accommodating cavity 71 close to the back plate 1 on the surface of the back plate 1, as shown in fig. 12.
Step S400, metal is evaporated on the back plate 1 to form a metal layer 8.
Referring to fig. 13, the metal layer 8 includes a first portion deposited in the first receiving chamber 61 and the second receiving chamber 71 and a second portion deposited on the negative photoresist 7. The metal layer 8 deposited in the first accommodating cavity 61 and the second accommodating cavity 71 is electrically contacted with the exposed routing structure on the backplane 1.
Step S500, the positive photoresist 6 is stripped.
In this embodiment, positive photoresist 6 may be stripped or removed by exposure and development, so that negative photoresist 7 and metal layer 8 on positive photoresist 6 are stripped together, and bonding electrode 11 is formed as shown in fig. 14.
Based on the above process, the bonding electrode 11 formed in this embodiment includes the connecting portion 112 and the bonding portion 111, the connecting portion 112 is located between the bonding portion 111 and the back plate 1, the connecting portion 112 is formed by the metal layer 8 deposited in the first accommodating cavity 61, and the bonding portion 111 of the bonding electrode 11 is formed by the metal layer 8 deposited in the second accommodating cavity 71. In this way, based on the shape of the second receiving cavity 71, as shown in fig. 11, the area of the orthographic projection of the side of the bonding portion 111 away from the rear plate 1 on the surface of the rear plate 1 is smaller than the area of the orthographic projection of the side close to the rear plate 1 on the surface of the rear plate 1.
In addition, referring to fig. 12 again, since a bevel undercut (undercut) structure is formed between the side of the negative photoresist 7 away from the positive photoresist 6 and the side of the negative photoresist 7 close to the positive photoresist 6, when metal evaporation is performed in step S400, the metal layer 8 deposited on the negative photoresist 7 and the metal layer 8 deposited in the first receiving cavity 61 and the second receiving cavity 71 can be effectively disconnected, so that adhesion is not generated. Furthermore, in step S500, when the positive photoresist 6 is stripped, since there is no adhesion between the metal layer 8 of the negative photoresist 7 on the side away from the positive photoresist 6 and the metal layer 8 in the accommodating cavity, the process yield of stripping the negative photoresist 7 and the metal layer on the negative photoresist 7 can be improved.
The application further provides an electronic device, and the electronic device comprises the display panel provided by the embodiment. The electronic device may be, but is not limited to, a television, a tiled display screen, a display, a mobile phone, a watch, a vehicle-mounted display screen, and the like, and the electronic device uses the display panel to transmit images to a user.
To sum up, this application is through be equipped with on the backplate the glue film, be equipped with on the glue film the opening, through the flow of the bonding material that the opening restriction was held to can avoid when the bonding light emitting device with bonding electrode takes place the dislocation.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A display panel, comprising: a driving board and a light emitting device;
the drive plate includes:
a back plate;
the adhesive layer is positioned on one side of the back plate, and an opening for accommodating the light-emitting device is formed in the adhesive layer;
a bonding electrode located in the opening;
the light emitting device is electrically connected with the bonding electrode;
the distance from one side of the adhesive layer far away from the back plate to the surface of the back plate is larger than the distance from one side of the bonding electrode far away from the back plate to the surface of the back plate.
2. The display panel according to claim 1, wherein the distance from the side of the adhesive layer away from the back plate to the surface of the back plate is less than or equal to the distance from the side of the light emitting device away from the back plate to the surface of the back plate.
3. The display panel according to claim 1, wherein an area of an orthographic projection of a side of the opening far from the rear plate on the rear plate is larger than an area of an orthographic projection of a side of the opening near the rear plate on the rear plate.
4. The display panel according to claim 1, wherein an area of an orthogonal projection of the opening on the surface of the rear plate is larger than an area of an orthogonal projection of the light-emitting device on the surface of the rear plate.
5. The display panel according to claim 1, further comprising a black glue layer disposed at least on the surface of the back plate located in the opening, wherein the bonding electrode penetrates the black glue layer and is electrically connected to the back plate.
6. The display panel according to claim 5, wherein the distance from the side of the black glue layer away from the back plate to the surface of the back plate is smaller than the distance from the side of the bonding electrode away from the back plate to the surface of the back plate.
7. The display panel according to claim 5, wherein the adhesive layer comprises a plurality of retaining wall structures, each retaining wall structure comprises a plurality of retaining walls, and the plurality of retaining walls are connected end to form the opening; and a gap is formed between the adjacent retaining wall structures, and the surface of the back plate exposed by the gap is provided with the black glue layer.
8. The display panel according to claim 1, wherein the bonding electrode comprises a bonding portion, and an area of an orthographic projection of a side of the bonding portion away from the rear plate on the surface of the rear plate is smaller than an area of an orthographic projection of a side of the bonding portion close to the rear plate on the surface of the rear plate.
9. The display panel of claim 8, wherein the bonding electrode further comprises a connecting portion located in the opening, the connecting portion being located between the bonding portion and the backplane.
10. An electronic device characterized by comprising the display panel according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222200548.3U CN217903134U (en) | 2022-08-19 | 2022-08-19 | Display panel and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222200548.3U CN217903134U (en) | 2022-08-19 | 2022-08-19 | Display panel and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217903134U true CN217903134U (en) | 2022-11-25 |
Family
ID=84142985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222200548.3U Active CN217903134U (en) | 2022-08-19 | 2022-08-19 | Display panel and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217903134U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053387A (en) * | 2023-03-07 | 2023-05-02 | 惠科股份有限公司 | Display panel manufacturing method and display panel |
| TWI839205B (en) | 2023-05-05 | 2024-04-11 | 友達光電股份有限公司 | Display panel and fabrication method thereof |
-
2022
- 2022-08-19 CN CN202222200548.3U patent/CN217903134U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116053387A (en) * | 2023-03-07 | 2023-05-02 | 惠科股份有限公司 | Display panel manufacturing method and display panel |
| TWI839205B (en) | 2023-05-05 | 2024-04-11 | 友達光電股份有限公司 | Display panel and fabrication method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102237478B (en) | The method of installing device, the board structure being provided with device and electronic installation in a substrate | |
| CN108987412B (en) | Display device and method of forming the same | |
| JP4044078B2 (en) | High power light emitting diode package and manufacturing method | |
| US11239214B2 (en) | Display panel and manufacturing method thereof, and display device | |
| US11362075B2 (en) | Micro light emitting diode display substrate, device and fabrication method thereof | |
| CN217903134U (en) | Display panel and electronic device | |
| CN112164326B (en) | Display circuit board, manufacturing method thereof and LED display screen | |
| CN111599284A (en) | Manufacturing method of spliced display screen and spliced display screen | |
| CN111489991B (en) | Display panel and manufacturing method | |
| CN113380779A (en) | Driving substrate, light emitting device and manufacturing method thereof | |
| CN113658518B (en) | Display panel, preparation method thereof and display device | |
| JP2008118161A (en) | Element transferring method | |
| CN114156395A (en) | Array substrate, preparation method thereof, display panel and backlight module | |
| CN115116925A (en) | Preparation method of Micro-LED repairing support plate and Micro-LED repairing method of display device | |
| CN112562524B (en) | Display panel and display panel manufacturing method | |
| CN114220828A (en) | Mass transfer method and mass transfer carrier for Micro-LED chip | |
| CN212783455U (en) | Light emitting element array structure | |
| CN114067694A (en) | Display mother board and preparation method thereof | |
| CN217562201U (en) | Splicing display assembly and display device | |
| CN113571539B (en) | Display panel and manufacturing method thereof | |
| CN114868077B (en) | Driving backboard, manufacturing method thereof and display module | |
| CN210052445U (en) | Substrate structure, display panel and display device | |
| WO2023137713A1 (en) | Micro led chip detection structure and preparation method therefor | |
| CN116565105B (en) | Light-emitting chip transfer method, light-emitting structure and display panel | |
| WO2021102742A1 (en) | Multi-surface light-emitting circuit board and fabrication method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |