CN217881851U - Radiating surface heat dissipation device of phased array antenna - Google Patents
Radiating surface heat dissipation device of phased array antenna Download PDFInfo
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- CN217881851U CN217881851U CN202221922067.7U CN202221922067U CN217881851U CN 217881851 U CN217881851 U CN 217881851U CN 202221922067 U CN202221922067 U CN 202221922067U CN 217881851 U CN217881851 U CN 217881851U
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Abstract
The utility model discloses a phased array antenna radiation face heat abstractor belongs to antenna technical field, including the heat dissipation casing that is used for installing antenna panel and wave control module, there are a plurality of chips on the antenna panel, its characterized in that: still include back heating panel, heat pipe and hou gai, be provided with recess and heat dissipation wind channel on the heat dissipation casing inner chamber, the heat pipe inlays in the recess, is provided with first heat dissipation tooth on the outer wall of heat dissipation casing, be provided with second heat dissipation tooth and air exhauster on the heat dissipation casing of back, it has the air outlet corresponding with the air exhauster to cover to open after, the heat dissipation casing is fixed and is covered after. The utility model discloses a combine together heat pipe and air-cooled heat dissipation, can guarantee the difference in temperature of a plurality of chips of antenna plate in the certain limit, improve the temperature homogeneity of a plurality of heat sources.
Description
Technical Field
The utility model relates to antenna technical field especially relates to a phased array antenna radiation face heat abstractor.
Background
A large number of chips with high density and large heat productivity are installed on a radiating surface of the tile-type phased-array antenna, a wave control module and a power module which are tightly attached to the back of the radiating surface are also large in heat, the device temperature can be increased sharply due to heat concentration, the temperature difference of a plurality of heating chips is also large, the performance and the service life of the antenna are seriously affected, and therefore the performance of the antenna is greatly determined by whether good heat dissipation measures are provided.
In the prior art, the overall size of the radiating surface of the antenna is increased due to the fact that air cooling heat dissipation is carried out on radiating teeth on the same plane of the radiating surface by concentrating heat of the radiating surface of a cold plate heat conduction antenna; or the heat is directly conducted to the heat dissipation teeth for natural heat dissipation, so that the requirement on the temperature uniformity of the concentrated heat source device is difficult to meet.
Chinese patent document No. CN113394542a, published 2021, 09/14 discloses a heat dissipation assembly for a phased array antenna, comprising:
the rectangular T/R component is characterized in that two groups of radiating fins with the same structure are symmetrically arranged on the surface of one side of the T/R component, and a fixing area is arranged between the two groups of radiating fins;
the radiating fins comprise a plurality of first radiating fins which are arranged in parallel, and the first radiating fins are perpendicular to the T/R component; the included angle between the first radiating fin and one diagonal line of the T/R component is 0-45 degrees;
a rectangular wave control module is fixed in the fixed area, a plurality of second radiating fins are arranged on the surface of one side of the wave control module in parallel, and the second radiating fins are perpendicular to the wave control module; and the included angle between the second radiating fin and one diagonal line of the wave control module is 0-45 degrees.
According to the radiating assembly of the phased array antenna disclosed by the patent document, the radiating fins in an inclined mode are arranged on the surface of one side of the T/R assembly and the wave control module, and the T/R assembly and the wave control module are arranged in a T shape, so that the radiating efficiency of a single-point heat generating module can be improved, the temperature rise superposition effect is weakened, and natural air cooling radiating of the phased array antenna is realized. However, in the case of such a natural heat radiation method, when there is a concentrated heat source, the temperature uniformity of a plurality of heat sources is poor.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an overcome above-mentioned prior art's defect, provide a phased array antenna radiation face heat abstractor, the utility model discloses a combine together heat pipe and air-cooled heat dissipation, can guarantee that the difference in temperature of a plurality of chips of antenna panel improves the temperature homogeneity of a plurality of heat sources in certain extent.
The utility model discloses a following technical scheme realizes:
the utility model provides a phased array antenna radiating surface heat abstractor, is including the heat dissipation casing that is used for installing antenna panel and ripples accuse module, has a plurality of chips, its characterized in that on the antenna panel: still include back heating panel, heat pipe and hou gai, be provided with recess and heat dissipation wind channel on the heat dissipation casing inner chamber, the heat pipe inlays in the recess, is provided with first heat dissipation tooth on the outer wall of heat dissipation casing, be provided with second heat dissipation tooth and air exhauster on the heat dissipation casing of back, it has the air outlet corresponding with the air exhauster to cover to open after, the heat dissipation casing is fixed and is covered after.
The cross section of the groove and the cross section of the heat conducting pipe are both L-shaped.
The exhaust fans are 4, and the 4 exhaust fans are respectively positioned at four corners of the back radiating plate.
The radiating shell is provided with a heat conducting pad, and the antenna board is installed on the radiating shell through the heat conducting pad.
The wave control module is fixed in the heat dissipation shell and clings to the heat conduction pipe.
The position of the heat conduction pipe corresponds to the position of the chip on the antenna plate.
The cross section of the heat conducting pad and the cross section of the antenna plate are rectangular, and the size of the heat conducting pad is the same as that of the antenna plate.
The beneficial effects of the utility model are mainly expressed in the following aspect:
1. the utility model discloses, be provided with recess and heat dissipation wind channel on the heat dissipation casing inner chamber, the heat pipe inlays in the recess, be provided with first heat dissipation tooth on the outer wall of heat dissipation casing, be provided with second heat dissipation tooth and air exhauster on the heating panel of back, the back is covered and is opened there is the air outlet corresponding with the air exhauster, the heat dissipation casing is fixed and is covered at the back, compared with the prior art, through combining together heat pipe and forced air cooling heat dissipation, can guarantee the difference in temperature of a plurality of chips of antenna panel in the certain limit, improve the temperature homogeneity of a plurality of heat sources.
2. The utility model discloses, the cross section of recess and the cross section of heat pipe all are "L" type, through the heat pipe that sets up "L" type, can carry out the forced air cooling heat dissipation, guarantee radiating effect with the concentrated heat source heat conduction of antenna radiation face to the antenna rear portion.
3. The utility model discloses, 4 air exhauster are located four angles of back heating panel respectively, through the outside convulsions of air exhauster, can distribute the heat on the first heat dissipation tooth of heat dissipation casing through heat pipe heat conduction to the environment as early as possible, improve the radiating effect; and because the air exhauster is arranged at the back of the antenna, the cross-sectional dimension of the radiation surface of the antenna can be effectively reduced.
4. The utility model discloses, be provided with the heat conduction pad on the heat dissipation casing, the antenna board passes through the heat conduction pad to be installed on the heat dissipation casing, and the heat conduction pad can be favorable to follow-up quick heat dissipation with the heat conduction that the antenna board chip produced to the heat dissipation casing.
5. The utility model discloses, the wave control module is fixed in the radiating shell, and the heat pipe is hugged closely to the wave control module, and the calorific capacity of wave control module is great, through hugging closely the heat pipe with the wave control module, a large amount of heats that produce the wave control module that can be better distribute away.
6. The utility model discloses, the position of the chip on the position of heat pipe and the antenna panel is corresponding, and the difference in temperature of a plurality of chips that can more effectual assurance antenna panel improves the radiating temperature homogeneity within a certain range.
7. The utility model discloses, the cross section of heat conduction pad and the cross section of antenna panel all are the rectangle, and the size of heat conduction pad is the same with the size of antenna panel, and the heat that can maximize degree produce a plurality of chips on with the antenna panel is conducted heat to the heat dissipation casing on to do benefit to and improve whole radiating effect.
Drawings
The invention will be further described with reference to the accompanying drawings and specific embodiments, wherein:
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic view of the heat dissipation air duct of the present invention;
the labels in the figure are: 1. antenna panel, 2, ripples accuse module, 3, heat dissipation casing, 4, back heating panel, 5, heat pipe, 6, back lid, 7, heat dissipation wind channel, 8, first heat dissipation tooth, 9, second heat dissipation tooth, 10, air exhauster, 11, air outlet, 12, heat conduction pad.
Detailed Description
Example 1
Referring to fig. 1 and 2, a phased array antenna radiation surface heat abstractor, including the heat dissipation casing 3 that is used for installing antenna panel 1 and wave control module 2, there are a plurality of chips on the antenna panel 1, still include back heating panel 4, heat pipe 5 and back lid 6, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, is provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the back lid 6, heat dissipation casing 3 is fixed on back lid 6.
This embodiment is the most basic embodiment, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, be provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the back lid 6, heat dissipation casing 3 is fixed on back lid 6, compared with the prior art, through combining together heat pipe 5 and air-cooled heat dissipation, can guarantee that the difference in temperature of a plurality of chips of antenna panel 1 is in certain extent, improve the temperature homogeneity of a plurality of heat sources.
Example 2
Referring to fig. 1 and 2, a phased array antenna radiation surface heat abstractor, including the heat dissipation casing 3 that is used for installing antenna panel 1 and wave control module 2, there are a plurality of chips on the antenna panel 1, still include back heating panel 4, heat pipe 5 and back lid 6, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, is provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the back lid 6, heat dissipation casing 3 is fixed on back lid 6.
Further, the cross section of the groove and the cross section of the heat conducting pipe 5 are both in an L shape.
This embodiment is a preferred implementation, and the cross section of recess and the cross section of heat pipe 5 all are "L" type, through the heat pipe 5 that sets up "L" type, can carry out the forced air cooling heat dissipation to the antenna rear portion with the concentrated heat source heat conduction of antenna radiating surface, guarantee radiating effect.
Example 3
Referring to fig. 1 and 2, a phased array antenna radiation surface heat abstractor, including the heat dissipation casing 3 that is used for installing antenna panel 1 and wave control module 2, there are a plurality of chips on the antenna panel 1, still include back heating panel 4, heat pipe 5 and back lid 6, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, is provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the back lid 6, heat dissipation casing 3 is fixed on back lid 6.
The cross section of the groove and the cross section of the heat conduction pipe 5 are both L-shaped.
Furthermore, the number of the exhaust fans 10 is 4, and the 4 exhaust fans 10 are respectively located at four corners of the back heat dissipation plate 4.
Further, a heat conduction pad 12 is disposed on the heat dissipation housing 3, and the antenna board 1 is mounted on the heat dissipation housing 3 through the heat conduction pad 12.
In another preferred embodiment, the number of the exhaust fans 10 is 4, and the 4 exhaust fans 10 are respectively located at four corners of the back heat dissipation plate 4, so that the heat conducted to the first heat dissipation teeth 8 of the heat dissipation housing 3 through the heat conduction tube 5 can be dissipated to the environment as quickly as possible by exhausting air through the exhaust fans 10, thereby improving the heat dissipation effect; and because the exhaust fan 10 is arranged at the back of the antenna, the cross-sectional size of the radiation surface of the antenna can be effectively reduced.
Be provided with thermal pad 12 on the radiating shell 3, antenna panel 1 installs on radiating shell 3 through thermal pad 12, and thermal pad 12 can be with the heat conduction that antenna panel 1 chip produced to radiating shell 3 on, do benefit to follow-up quick heat dissipation.
Example 4
Referring to fig. 1 and 2, a phased array antenna radiation surface heat abstractor, including the heat dissipation casing 3 that is used for installing antenna panel 1 and ripples accuse module 2, have a plurality of chips on the antenna panel 1, still include back heating panel 4, heat pipe 5 and hou gai 6, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, is provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the hou gai 6, heat dissipation casing 3 is fixed on hou gai 6.
The cross section of the groove and the cross section of the heat conduction pipe 5 are both L-shaped.
The number of the exhaust fans 10 is 4, and the 4 exhaust fans 10 are respectively positioned at four corners of the back heat dissipation plate 4.
The heat dissipation shell 3 is provided with a heat conduction pad 12, and the antenna board 1 is mounted on the heat dissipation shell 3 through the heat conduction pad 12.
Furthermore, the wave control module 2 is fixed in the heat dissipation shell 3, and the wave control module 2 is tightly attached to the heat conduction pipe 5.
In this embodiment, the wave control module 2 is fixed in the heat dissipation housing 3, the wave control module 2 is tightly attached to the heat conduction pipe 5, the amount of heat generated by the wave control module 2 is large, and a large amount of heat generated by the wave control module 2 can be more effectively dissipated by tightly attaching the wave control module 2 to the heat conduction pipe 5.
Example 5
Referring to fig. 1 and 2, a phased array antenna radiation surface heat abstractor, including the heat dissipation casing 3 that is used for installing antenna panel 1 and wave control module 2, there are a plurality of chips on the antenna panel 1, still include back heating panel 4, heat pipe 5 and back lid 6, be provided with recess and heat dissipation wind channel 7 on the 3 inner chambers of heat dissipation casing, heat pipe 5 inlays in the recess, is provided with first heat dissipation tooth 8 on the outer wall of heat dissipation casing 3, be provided with second heat dissipation tooth 9 and air exhauster 10 on the back heating panel 4, it has the air outlet 11 corresponding with air exhauster 10 to open on the back lid 6, heat dissipation casing 3 is fixed on back lid 6.
The cross section of the groove and the cross section of the heat conduction pipe 5 are both L-shaped.
The number of the exhaust fans 10 is 4, and the 4 exhaust fans 10 are respectively positioned at four corners of the back heat dissipation plate 4.
The heat dissipation shell 3 is provided with a heat conduction pad 12, and the antenna board 1 is installed on the heat dissipation shell 3 through the heat conduction pad 12.
The wave control module 2 is fixed in the heat dissipation shell 3, and the wave control module 2 is tightly attached to the heat conduction pipe 5.
Further, the position of the heat conduction pipe 5 corresponds to the position of the chip on the antenna board 1.
Further, the cross section of the heat conducting pad 12 and the cross section of the antenna board 1 are both rectangular, and the size of the heat conducting pad 12 is the same as that of the antenna board 1.
This embodiment is the best mode, and the position of heat pipe 5 corresponds with the position of the chip on antenna plate 1, can more effectual assurance antenna plate 1 a plurality of chips the temperature difference in certain extent, improves heat dissipation temperature homogeneity.
The cross section of thermal pad 12 and antenna panel 1 all are the rectangle, and the size of thermal pad 12 is the same with antenna panel 1's size, can maximize the heat conduction that a plurality of chips on with antenna panel 1 produced to heat dissipation casing 3 on to do benefit to and improve whole radiating effect.
The utility model is explained by the thermal simulation test below:
128 chips are uniformly distributed on the antenna plate 1, the heat consumption of each chip is 2.2W, the temperature difference of the chips is required to be not more than 10 ℃,4 wave control modules 2 are required, the heat consumption of each module is 16W, and the heat consumption accounts for 345.6W. Thermal simulation is carried out according to the environment temperature of 65 ℃, and the simulation result is as follows:
the heat consumption of a single chip of the antenna plate 1 is 2.2W, the thermal resistance is 12 ℃/W, the simulated shell temperature is 85.99 ℃, the calculated junction temperature is 112.39 ℃, and the allowable junction temperature is 150 ℃.
The heat consumption of a single chip of the wave control module 2 is 8W, the thermal resistance is 4.6 ℃/W, the simulated shell temperature is 82.26 ℃, the calculated junction temperature is 119.06 ℃, and the allowable junction temperature is 150 ℃.
From the simulation result, the calculated junction temperatures of the chip of the antenna plate 1 and the chip of the wave control module 2 do not exceed the allowable junction temperature, so that the requirements are met, the temperature difference of the chip of the antenna plate 1 is 6.81 ℃, and the requirement that the temperature difference of the chip of the antenna plate 1 is not more than 10 ℃ is met.
Claims (7)
1. The utility model provides a phased array antenna radiation face heat abstractor, is including heat dissipation casing (3) that are used for installing antenna panel (1) and wave accuse module (2), has a plurality of chips on antenna panel (1), its characterized in that: still include back heating panel (4), heat pipe (5) and hou gai (6), be provided with recess and heat dissipation wind channel (7) on heat dissipation casing (3) inner chamber, heat pipe (5) inlay in the recess, are provided with first heat dissipation tooth (8) on the outer wall of heat dissipation casing (3), be provided with second heat dissipation tooth (9) and air exhauster (10) on back heating panel (4), it has air outlet (11) corresponding with air exhauster (10) to open on back lid (6), heat dissipation casing (3) are fixed on back lid (6).
2. The phased array antenna radiating surface heat sink of claim 1, wherein: the cross section of the groove and the cross section of the heat conduction pipe (5) are both L-shaped.
3. The phased array antenna radiating surface heat sink of claim 1, wherein: the number of the exhaust fans (10) is 4, and the 4 exhaust fans (10) are respectively positioned at four corners of the back radiating plate (4).
4. The phased array antenna radiating surface heat sink of claim 1, wherein: the radiating shell (3) is provided with a heat conducting pad (12), and the antenna board (1) is installed on the radiating shell (3) through the heat conducting pad (12).
5. The phased array antenna radiating surface heat sink of claim 1, wherein: the wave control module (2) is fixed in the heat dissipation shell (3), and the wave control module (2) is tightly attached to the heat conduction pipe (5).
6. The phased array antenna radiating surface heat sink of claim 1, wherein: the position of the heat conduction pipe (5) corresponds to the position of a chip on the antenna plate (1).
7. The phased array antenna radiating surface heat sink device of claim 4, wherein: the cross section of the heat conducting pad (12) and the cross section of the antenna plate (1) are both rectangular, and the size of the heat conducting pad (12) is the same as that of the antenna plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221922067.7U CN217881851U (en) | 2022-07-25 | 2022-07-25 | Radiating surface heat dissipation device of phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221922067.7U CN217881851U (en) | 2022-07-25 | 2022-07-25 | Radiating surface heat dissipation device of phased array antenna |
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| CN217881851U true CN217881851U (en) | 2022-11-22 |
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| CN202221922067.7U Active CN217881851U (en) | 2022-07-25 | 2022-07-25 | Radiating surface heat dissipation device of phased array antenna |
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