CN217857785U

CN217857785U - High-efficiency semiconductor chip plasma cleaning equipment

Info

Publication number: CN217857785U
Application number: CN202222206004.8U
Authority: CN
Inventors: 万华亿; 韦太球
Original assignee: Shenzhen Zhenhua Plasma Intelligent Manufacturing Co ltd
Current assignee: Shenzhen Zhenhua Plasma Intelligent Manufacturing Co ltd
Priority date: 2022-08-22
Filing date: 2022-08-22
Publication date: 2022-11-22
Anticipated expiration: 2032-08-22

Abstract

The utility model relates to a plasma cleaning technical field especially relates to high efficiency semiconductor chip plasma cleaning equipment. The technical scheme comprises the following steps: the cabinet body, the internal portion of cabinet central point department fixed mounting has the transmission frame, and the both sides of transmission frame inside all rotate and install the gyro wheel, and the outside of gyro wheel is rotated and is installed the transmission band, and is equipped with multiunit locating frame on the transmission band, one side fixedly connected with deashing cover at transmission frame top, and the inside fixedly connected with multiunit deashing nozzle of deashing cover, the inside fixed mounting of the cabinet body has the air compressor machine, two sets of electronic slide rails of the top fixedly connected with of the internal portion of cabinet. The utility model discloses a combination of various structures makes this equipment can transmit the removal to the semiconductor on the transmission belt, and the equipment of being convenient for carries out the continuous cleaning operation to the semiconductor, and this equipment can carry out cleaning process at the attached dirt ash on the surface before equipment washs the semiconductor, has increased equipment to the clear mode of semiconductor, has enlarged application scope.

Description

High-efficiency semiconductor chip plasma cleaning equipment

Technical Field

The utility model relates to a plasma cleaning technical field specifically is high efficiency semiconductor chip plasma cleaning equipment.

Background

A plasma cleaner (also called a plasma cleaner) or a plasma surface treatment instrument is a brand-new high-tech technology, the plasma is used for achieving the effect which cannot be achieved by a conventional cleaning method, the structure of the existing plasma cleaner is simple, and the existing plasma cleaner does not have the function of continuously cleaning objects when in use, so that high-efficiency semiconductor chip plasma cleaning equipment is provided.

Through retrieval, patent publication No. CN216161704U discloses a plasma nozzle and an atmospheric plasma cleaning device for semiconductors, relating to the technical field of semiconductor processing. The plasma torch includes a housing, a tubular electrode, and an insulator. The shell is internally provided with a containing cavity, the tubular electrode is arranged in the containing cavity, insulators are filled between two sides of the tubular electrode and the inner wall of the shell, the containing cavity is divided into a first cavity and a second cavity, an air inlet of the shell is communicated with the first cavity, an air jet of the shell is communicated with the second cavity, the first cavity is communicated with the second cavity through an internal channel of the tubular electrode, a gap is formed between an air outlet of the tubular electrode and the inner wall of the shell, and in the prior art, the CN216161704U has a simple structure in the using process, mostly needs workers to manually feed equipment when in use, and does not have the function of continuously and automatically cleaning semiconductors; meanwhile, the plasma cleaning device has a single function and does not have a function of cleaning dust attached to the surface of a semiconductor, so that the high-efficiency plasma cleaning device for the semiconductor chip is provided to solve the existing problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide high efficiency semiconductor chip plasma cleaning equipment to solve the problem that provides in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: high efficiency semiconductor chip plasma cleaning equipment, the intelligent cabinet temperature adjusting device comprises a cabinet body, the internal portion of cabinet fixed mounting of central position department has the transmission frame, and the both sides of transmission frame inside all rotate and install the gyro wheel, the outside of gyro wheel is rotated and is installed the transmission band, and is equipped with the multiunit locating frame on the transmission band, one side fixedly connected with deashing cover at transmission frame top, and the inside fixedly connected with multiunit deashing nozzle of deashing cover, the inside fixed mounting of the cabinet body has the air compressor machine, two sets of electronic slide rails of the top fixedly connected with of the internal portion of cabinet, and all slidable mounting have electric putter on the electronic slide rail, electric putter's output fixed connection plasma spray gun, the inside fixed mounting of the cabinet body has plasma host computer.

Use this technical scheme's high efficiency semiconductor chip plasma cleaning equipment, the transmission band can support the semiconductor, the gyro wheel can drive the transmission band through rotating simultaneously and rotate, thereby can transmit the removal to the semiconductor, the transmission frame can be installed gyro wheel and transmission band and support, the position when locating frame can place the semiconductor is fixed a position, plasma spray gun and the cooperation of plasma host computer can wash the semiconductor on the transmission band through plasma, can carry out the back-and-forth movement regulation to plasma spray gun through electronic slide rail simultaneously, electric putter can descend to plasma spray gun through extending, the deashing nozzle can clear up the operation at the dust of equipment semiconductor plasma cleaning front surface with the cooperation of air compressor machine, equipment has increased the clear mode of semiconductor, the practicality is improved.

Preferably, the top movable mounting that the cabinet body is positive has sealing door, and inlays on the sealing door and installs the observation window, sealing door's front is equipped with the kerve. The sealing door can be closed and sealed on the front surface of the sealing door during operation of equipment, meanwhile, workers can observe the inside operation condition under the closing condition of the sealing door through the observation window, and the pull groove is convenient for the workers to operate the sealing door when opening.

Preferably, the top fixedly connected with location camera of the internal portion of cabinet, and be equipped with the multiunit induction coil on the transmission band, one side fixed mounting of air compressor machine has the main control system. The positioning camera can shoot the induction coil, and the induction coil shot by the positioning camera can be identified and determined through the control host, so that the semiconductor on the transmission belt is determined after being moved to a specified position, and the semiconductor on the transmission belt is accurately cleaned by the equipment.

Preferably, a servo motor is fixedly installed on one side of the front face of the transmission frame, and a supporting plate is fixedly installed inside the transmission frame. Servo motor can drive the gyro wheel and rotate to can rotate the transmission band, the backup pad can support the central point department of transmission band.

Preferably, a maintenance plate is fixedly arranged below the front surface of the cabinet body, and ventilation holes are uniformly distributed in the maintenance plate. The maintenance board is convenient for the staff later stage to overhaul the inside of equipment and maintain, and the ventilation hole can be handled the inside ventilation cooling of equipment.

Preferably, the bottom of the cabinet body is rotated and is installed the multiunit bracing piece, and the bottom of bracing piece all fixed mounting has the supporting seat. The bottom of bracing piece and supporting seat cooperation when can placing the use to equipment supports, has increased the stability of equipment when using.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through setting up transmission band and gyro wheel, the cooperation of locating frame, the transmission band can support the semiconductor, and the position when placing the semiconductor can be carried out the accurate positioning through the locating frame simultaneously to the equipment of being convenient for carries out the accurate operation of wasing to the semiconductor, and the gyro wheel can drive the transmission band through rotating and rotate, thereby can transmit the removal to the semiconductor on the transmission band, and the equipment of being convenient for carries out the continuous operation of wasing to the semiconductor, has increased the cleaning efficiency of equipment, has improved the practicality.

2. Through setting up deashing cover and deashing nozzle, air compressor machine cooperation, the nozzle can blow off the dirt ash on the semiconductor with the air compressor machine to can carry out cleaning process at the equipment to the attached dirt ash on the surface before the semiconductor washs, quality and effect when having avoided the semiconductor surface to adhere to the dirt ash and lead to influencing the plasma washing have increased equipment to the clear mode of semiconductor, have improved the practicality, have enlarged application scope.

Drawings

Fig. 1 is a perspective view of the present invention;

FIG. 2 is a front view of the internal structure of the present invention;

fig. 3 is a schematic view of a top view structure of the conveyor belt of the present invention;

fig. 4 is a schematic front structural view of the present invention.

In the figure: 1. a supporting seat; 101. a support bar; 2. a cabinet body; 3. maintaining the guard plate; 301. a vent hole; 4. a transmission rack; 401. a support plate; 5. a conveyor belt; 501. a positioning frame; 502. an induction coil; 6. a servo motor; 601. a roller; 7. a dust removing cover; 701. a dust removal nozzle; 8. a sealing door; 801. an observation window; 802. groove drawing; 9. a plasma host; 10. a control host; 11. an air compressor; 12. a plasma torch; 13. an electric push rod; 14. an electric slide rail; 15. and (6) positioning the camera.

Detailed Description

The technical solution of the present invention will be further explained with reference to the accompanying drawings and specific embodiments.

Example one

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the utility model provides a high efficiency semiconductor chip plasma cleaning equipment, including the cabinet body 2, the inside central point of cabinet body 2 department fixed mounting has transmission frame 4, and the inside both sides of transmission frame 4 all rotate and install gyro wheel 601, transmission band 5 is installed in the outside rotation of gyro wheel 601, and be equipped with multiunit locating frame 501 on transmission band 5, one side fixedly connected with deashing cover 7 at transmission frame 4 top, and the inside fixedly connected with multiunit deashing nozzle 701 of deashing cover 7, the inside fixed mounting of the cabinet body 2 has air compressor machine 11, two sets of electric slide rail 14 of the inside top fixedly connected with of the cabinet body 2, and all slidable mounting has electric putter 13 on the electric slide rail 14, electric putter 13's output fixed connection plasma spray gun 12, the inside fixed mounting of the cabinet body 2 has plasma host computer 9.

The working principle of the high-efficiency semiconductor chip plasma cleaning equipment based on the embodiment 1 is as follows: transmission band 5 can support the semiconductor, and gyro wheel 601 can drive transmission band 5 through rotating simultaneously and rotate to can transmit the removal to the semiconductor, transmission frame 4 can carry out the erection bracing to gyro wheel 601 and transmission band 5, and the position when locating frame 501 can place the semiconductor is fixed a position, and plasma spray gun 12 can wash through plasma to the semiconductor on the transmission band 5 with the cooperation of plasma host computer 9, and the model of plasma host computer 9 is: SPA-2800-2 model, and the electric slide rail 14 can be used for adjusting the plasma spray gun 12 back and forth, and the model of the electric slide rail 14 can be: model M45, the electric push rod 13 can descend the plasma spray gun 12 by stretching, and the model of the electric push rod 13 can be: YS-NZ-1224-A type, the deashing nozzle 701 cooperates with air compressor machine 11 and can carry out the cleaning operation at the dust of equipment to semiconductor plasma cleaning front surface, has increased the equipment and has cleaned the mode of semiconductor, has improved the practicality, and the model of air compressor machine 11 can be: SST-KYJ-001 type.

Example two

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, the present invention provides a high efficiency semiconductor chip plasma cleaning apparatus, compared with the first embodiment, the present embodiment further includes: 2 positive top movable mounting of the cabinet body has sealing door 8, and inlays on the sealing door 8 and install observation window 801, sealing door 8's front is equipped with

kerve

802, and 2 inside top fixedly connected with location camera 15 of the cabinet body, and be equipped with multiunit induction coil 502 on the transmission band 5, one side fixed mounting of air compressor machine 11 has main control system 10, and the positive one side fixed mounting of transmission frame 4 has servo motor 6, and the inside fixed mounting of transmission frame 4 has backup pad 401, and the positive below fixed mounting of the cabinet body 2 has maintenance board 3, and the equipartition is equipped with ventilation hole 301 on the maintenance board 3, and the bottom of the cabinet body 2 is rotated and is installed multiunit bracing piece 101, and the bottom of bracing piece 101 all fixed mounting have supporting seat 1.

In this embodiment, as shown in fig. 1 and 4, the sealing door 8 can close and seal the front side of the device during operation, and meanwhile, the observation window 801 is convenient for a worker to observe the operation condition inside the sealing door 8 when the sealing door 8 is closed, and the pull groove 802 is convenient for the worker to operate when the sealing door 8 is opened; as shown in fig. 2 and fig. 3, the positioning camera 15 can shoot the induction coil 502, and the induction coil 502 shot by the positioning camera 15 can be identified and determined by the control host 10, so that the semiconductor on the conveying belt 5 is determined after being moved to a specified position, so that the semiconductor on the conveying belt 5 can be accurately cleaned by the equipment, and the model of the control host 10 can be: IPC-610L type; as shown in fig. 1, fig. 2 and fig. 4, the servo motor 6 can drive the roller 601 to rotate, so as to rotate the transmission belt 5, the support plate 401 can support the central position of the transmission belt 5, and the type of the servo motor 6 can be: 130ST-M06025; as shown in fig. 1 and 4, the maintenance plate 3 facilitates the later-period maintenance of the inside of the equipment by workers, and the ventilation holes 301 can perform ventilation and heat dissipation treatment on the inside of the equipment; as shown in fig. 1, 2 and 4, the supporting rod 101 is matched with the supporting seat 1 to support the bottom of the equipment when the equipment is placed for use, so that the stability of the equipment when the equipment is used is increased.

The above embodiments are merely some preferred embodiments of the present invention, and those skilled in the art can make various alternative modifications and combinations to the above embodiments based on the technical solution of the present invention and the related teachings of the above embodiments.

Claims

1. High efficiency semiconductor chip plasma cleaning equipment, including the cabinet body (2), its characterized in that: fixed mounting is located to the inside central position of the cabinet body (2) has transmission frame (4), and the both sides of transmission frame (4) inside all rotate and install gyro wheel (601), the outside of gyro wheel (601) is rotated and is installed transmission band (5), and is equipped with multiunit locating frame (501) on transmission band (5), one side fixedly connected with deashing cover (7) at transmission frame (4) top, and the inside fixedly connected with multiunit deashing nozzle (701) of deashing cover (7), the inside fixed mounting of the cabinet body (2) has air compressor machine (11), two sets of electric slide rail (14) of top fixedly connected with of the inside of the cabinet body (2), and all slidable mounting have electric putter (13) on electric slide rail (14), the output fixed connection plasma spray gun (12) of electric putter (13), the inside fixed mounting of the cabinet body (2) has plasma host computer (9).

2. The high efficiency semiconductor chip plasma cleaning apparatus according to claim 1, wherein: the cabinet body (2) positive top movable mounting have sealing door (8), and inlay on sealing door (8) and install observation window (801), the front of sealing door (8) is equipped with pull groove (802).

3. The high efficiency semiconductor chip plasma cleaning apparatus according to claim 1, wherein: the top fixedly connected with location camera (15) of the cabinet body (2) inside, and be equipped with multiunit induction coil (502) on transmission band (5), one side fixed mounting of air compressor machine (11) has main control system (10).

4. The high efficiency semiconductor chip plasma cleaning apparatus according to claim 1, wherein: one side of the front surface of the transmission frame (4) is fixedly provided with a servo motor (6), and the inside of the transmission frame (4) is fixedly provided with a support plate (401).

5. The high efficiency semiconductor chip plasma cleaning apparatus according to claim 1, wherein: the lower part of the front surface of the cabinet body (2) is fixedly provided with a maintenance plate (3), and ventilation holes (301) are uniformly distributed on the maintenance plate (3).

6. The high efficiency semiconductor chip plasma cleaning apparatus according to claim 1, wherein: the bottom of the cabinet body (2) is rotated and is installed a plurality of groups of supporting rods (101), and the bottom of the supporting rods (101) is fixedly provided with a supporting seat (1).