CN217847116U - Signal switching circuit board - Google Patents
Signal switching circuit board Download PDFInfo
- Publication number
- CN217847116U CN217847116U CN202221539115.4U CN202221539115U CN217847116U CN 217847116 U CN217847116 U CN 217847116U CN 202221539115 U CN202221539115 U CN 202221539115U CN 217847116 U CN217847116 U CN 217847116U
- Authority
- CN
- China
- Prior art keywords
- pins
- pin
- conversion circuit
- circuit
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 88
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 101150042711 adc2 gene Proteins 0.000 claims description 6
- 101100102627 Oscarella pearsei VIN1 gene Proteins 0.000 claims description 4
- 101100434411 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) ADH1 gene Proteins 0.000 claims description 4
- 101150102866 adc1 gene Proteins 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 4
- 101100463786 Zea mays PG14 gene Proteins 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
The utility model discloses a signal switching circuit board, which comprises a circuit board, wherein the circuit board is provided with a plurality of packaging hole sites, a plurality of packaging welding discs and a plurality of copper-clad wires connected with the packaging hole sites; the packaging hole is welded with a J30J-51ZKW-P7 socket, an SD card adapter, a dynamic pressure sensor interface and a combined navigation adapter; the packaging pad is fixedly welded with a pin header interface, an STM32F769NIH6 chip, a power conversion circuit, a 485 conversion circuit, a 422 conversion circuit, a 232 conversion circuit, a power filter circuit, a power switching circuit, an AD conversion circuit and a serial port conversion circuit. Compare with STM32F769NIH6 aassessment board, STM32F769NIH6 chip resource that this signal switching circuit board used is less, makes whole system power consumption reduce, and the structure is small and exquisite, the good reliability, and the integrated level is high.
Description
Technical Field
The utility model belongs to the technical field of the switching circuit board, concretely relates to signal switching circuit board.
Background
STM32F769NIH6 evaluation board that US ST company sold is abundant in resources, powerful, but its size is great, and the peripheral hardware interface of embarkation is more single, if need use a plurality of interfaces simultaneously can lead to the wiring cable to become more to lead to the poor reliability, walk the line messy.
Therefore, in view of reducing on-board power consumption, board size and board level peripheral interface, those skilled in the art are devoted to developing a signal switching circuit board with an STM32F769NIH6 chip as a core.
Disclosure of Invention
In view of this, the utility model provides a signal switching circuit board to solve the single, poor problem of reliability of current STM32F769NIH6 aassessment board peripheral hardware interface.
The signal switching circuit board of the utility model comprises a circuit board, wherein a plurality of packaging hole sites and a plurality of packaging bonding pads are arranged on the circuit board; the packaging hole is welded with a J30J-51ZKW-P7 socket, an SD card adapter, a dynamic pressure sensor interface and a combined navigation adapter; the packaging pad is fixedly welded with a pin header interface, an STM32F769NIH6 chip, a power conversion circuit, a 485 conversion circuit, a 422 conversion circuit, a 232 conversion circuit, a power filter circuit, a power switching circuit, an AD conversion circuit and a serial port conversion circuit; and the copper-clad wires are used for connecting the packaging hole positions and the packaging bonding pads.
The utility model has the advantages that: compare with STM32F769NIH6 aassessment board, STM32F769NIH6 chip resource that this signal switching circuit board used is less, makes whole system power consumption reduce, and the structure is small and exquisite, the good reliability, the integrated level is high.
Drawings
Fig. 1 is a schematic structural diagram of the signal transfer circuit board of the present invention.
Detailed Description
The technical contents of the preferred embodiments of the present invention will be more clearly understood and appreciated by referring to the drawings attached to the specification. The present invention may be embodied in many different forms of embodiments, and the scope of the invention is not limited to only the embodiments described herein.
In the drawings, structurally identical elements are represented by like reference numerals, and structurally or functionally similar elements are represented by like reference numerals throughout the several views. The size and thickness of each component shown in the drawings are arbitrarily illustrated, and the present invention is not limited to the size and thickness of each component. The thickness of the components has been exaggerated in some places in the drawings where appropriate for clarity of illustration.
As shown in fig. 1, a signal adapting circuit board includes a circuit board 1, where the circuit board 1 is provided with a plurality of package holes and a plurality of package pads; the packaging hole is welded with a J30J-51ZKW-P7 socket 2, an SD card adapter interface 3, a dynamic pressure sensor interface 4 and a combined navigation adapter interface 5; the pin header interface 6, the STM32F769NIH6 chip 7, the power conversion circuit 8, the 485 conversion circuit 9, the 422 conversion circuit 10, the 232 conversion circuit 11, the power filter circuit 12, the power switching circuit 13, the AD conversion circuit 14 and the serial port conversion circuit 15 are fixedly welded on the packaging bonding pad; the signal transfer circuit board further comprises a plurality of copper-clad wires for connecting the packaging hole sites and the packaging bonding pads. Wherein, the J30J-51ZKW-P7 socket 2 has 51 pins in total, and the code number is 1 to 51; the SD card adapter interface 3 has 10 pins in total, and the code numbers of the pins are 1 to 10; the dynamic pressure sensor interface 4 has 6 pins in total, and the code number of the dynamic pressure sensor interface is 1~6; the combined navigation adapter interface 5 has 22 pins in total, and the code numbers of the pins are 1 to 22; the pin header interfaces 6 comprise 3 pin header interfaces P4-P6 with 5 pins and 2.54mm intervals, 1 pin header interface P8 with 6 pins and 2.54mm intervals and a pin header interface P9 with 4 pins and 2.54mm intervals; the pin header interfaces P4-P6 are all provided with 5 pins, and the numbers are 1~5; the pin header P8 has 6 pins in total, and the code of the pin header P is 1~6; the pin header P9 has 4 pins in total; the STM32F769NIH6 chip 7 has 216 pins, wherein the VSS pin is grounded; the power conversion circuit 8 comprises 1 input pin VIN, 1 3.3V output pin and 1 5V output pin; the 485 conversion circuit 9 has 6 input pins and 6 output pins in total; 422 the conversion circuit 10 has 2 input pins and 4 output pins in total; the 232 conversion circuit 11 has 16 pins in total, and the code numbers of the pins are 1 to 16; the power filter circuit 12 includes 2 input pins VIN1 and VIN2 and 2 output pins VIN1_ F, VIN _ F; the power switching circuit 13 includes 2 input pins VIN1_ F, VIN2_ F and 1 output pin VIN; the AD conversion circuit 14 has 3 power supply pins and 2 pins, and the codes are VIN1_ F, VIN _ F, 5.5V, ADC and ADC2; the serial port conversion circuit 15 has 14 pins in total, and the serial port conversion circuit has the code numbers of 1 to 14.
Specifically, pins 1 and 2 of the J30J-51ZKW-P7 socket 2 are connected to the input pin VIN1 of the power filter circuit 12; the No. 5 and No. 6 pins are connected with an input pin VIN2 of the power supply filter circuit 12; the No. 9 and No. 10 pins are respectively connected with the No. 10 and No. 11 pins of the serial port conversion circuit 15; pins 11, 12, 33 and 34 are respectively connected with pins 14, 13, 7 and 8 of the 232 conversion circuit 11; pin 14 is connected with ADC1 pin of AD conversion circuit 14 and PC0 pin of STM32F769NIH6 chip 7; pin 15 is connected with pin ADC2 of AD conversion circuit 14 and pin PA3 of STM32F769NIH6 chip 7; pins 17, 21 and 25 are connected with a VIN pin of the power supply switching circuit 13; pins 19, 20, 23, 24, 27 and 28 are respectively connected with 6 input pins of the 485 conversion circuit 9; the No. 29, 30, 31, 32, 44, 45 and 46 pins are respectively connected with the No. 21, 22, 19, 20, 9, 11 and 12 pins of the combined navigation adapter 5; no. 36 and No. 37 pins are respectively connected with No. 2 and No. 3 pins of the SD card adapter interface 3; no. 39, no. 40 and No. 41 pins are respectively connected with No. 5, no. 3 and No. 2 pins of the pin header P4; no. 42 and No. 47 are connected with a 3.3V pin of the power supply conversion circuit 8; leaving a space for No. 49 to No. 51 pins; the other pins are connected with the ground;
the No. 1 pin of the SD card adapter 3 is connected with the ground; pins No. 4 and No. 5 are respectively connected with pins PC12 and PD2 of the STM32F769NIH6 chip 7; no. 6~9 pin is left empty; no. 10 is connected with a 3.3V pin of a power supply conversion circuit 8;
no. 1~4 pin of dynamic pressure sensor 4 is connected to PA4, PB3, PB5 and PB4 pins of ST32F769NIH6 chip 7; the No. 5 pin is connected with a 3.3V pin of the power supply conversion circuit 8; the No. 6 pin is grounded;
the No. 1 pin of the combined navigation adapter 5 is connected with the VIN pin of the power supply switching circuit 13; no. 2, no. 10 and No. 15 pins are connected with the ground; the No. 13 and No. 18 pins are connected with a 3.3V pin of the power supply conversion circuit 8; no. 3, no. 4, no. 7 and No. 8 are respectively connected with No. 4, no. 5, no. 1 and No. 2 pins of a pin header P8; no. 14, no. 16 and No. 17 pins are respectively connected with No. 5, no. 3 and No. 2 pins of the pin header interface P5; no. 9, 11 and 12 pins are respectively connected with No. 5, 3 and 2 pins of the pin header interface P6;
all No. 1 pins of the P4-P6 pin header are connected with the 3.3V pins of the power conversion circuit, and all No. 4 pins are grounded; the No. 3 and No. 6 pins of the pin header P8 are connected with the ground; 4 pins of the pin header interface P9 are respectively connected with 4 output pins of the 422 conversion circuit 10;
an input pin VIN of the power conversion circuit 8 is connected with a VIN pin of the power switching circuit 13; the 3.3V output pin is also connected with the power supply pins of the 485 conversion circuit 9, the 422 conversion circuit 10 and the 232 conversion circuit 11 and the No. 1, no. 8 and No. 14 pins of the serial port conversion circuit 15; the 5.5V output pin is connected with the 5.5V pin of the AD conversion circuit 14;
6 output pins of the 485 conversion circuit 9 are respectively connected with pins PE0, PE1, PG9, PG14, PA0 and PA1 of the STM32F769NIH6 chip 7;
2 input pins of the 422 conversion circuit 10 are respectively connected with pins PA9 and PA10 of the STM32F769NIH6 chip 7;
no. 1 and No. 2 pins of the 232 conversion circuit 11 are connected together through a capacitor; no. 4 and No. 5 pins are connected together through a capacitor; the No. 2 and No. 15 pins are grounded; the No. 6 and No. 16 pins are connected with a 3.3V pin of a power supply conversion circuit 8; pins 9, 10, 11 and 12 are respectively connected with pins PC7, PC6, PE8 and PE7 of the STM32F769NIH6 chip 7;
an output pin VIN1_ F of the power supply filter circuit 12 is connected with a VIN1_ F pin of the power supply switching circuit 13 and a VIN1_ F pin of the AD conversion circuit 14; the output pin VIN2_ F is connected with the pin VIN2_ F of the power switching circuit 13 and the pin VIN2_ F of the AD conversion circuit 14;
an ADC1 pin of the AD conversion circuit 14 is connected with a PC0 pin of the STM32F769NIH6 chip 7; the ADC2 pin is connected with a PA3 pin of the STM32F769NIH6 chip 7;
pins No. 2, 3, 6, 9, 12 and 13 of the serial port conversion circuit 15 are left blank; the No. 4 pin is connected with a PB10 pin of the STM32F769NIH6 chip; no. 5 is connected with a PD5 pin of the STM32F769NIH6 chip;
STM32F769NIH6 chip 7 has 216 pins, wherein VSS pin is grounded and unconnected pin is left blank.
The signal switching circuit board also comprises 4 fixed mounting holes, and the aperture of each fixed mounting hole is 3.5mm. Preferably, the signal transfer circuit board has a width of 60mm and a length of 91mm.
The foregoing has described in detail preferred embodiments of the present invention. It should be understood that numerous modifications and variations could be devised by those skilled in the art in light of the teachings of this invention without undue experimentation. Therefore, the technical solutions that can be obtained by a person skilled in the art through logic analysis, reasoning or limited experiments based on the prior art according to the concepts of the present invention should be within the scope of protection defined by the claims.
Claims (5)
1. A signal relay circuit board, comprising:
the circuit board is provided with a plurality of packaging hole positions and a plurality of packaging bonding pads; the packaging hole is welded with a J30J-51ZKW-P7 socket, an SD card adapter, a dynamic pressure sensor interface and a combined navigation adapter; the packaging pad is fixedly welded with a pin header interface, an STM32F769NIH6 chip, a power conversion circuit, a 485 conversion circuit, a 422 conversion circuit, a 232 conversion circuit, a power filter circuit, a power switching circuit, an AD conversion circuit and a serial port conversion circuit;
and the copper-clad wires are used for connecting the packaging hole positions and the packaging bonding pads.
2. The signal-relay circuit board of claim 1,
the J30J-51ZKW-P7 socket has 51 pins in total, and the code number is 1 to 51;
the SD card adapter port has 10 pins in total, and the code numbers of the pins are 1 to 10;
the dynamic pressure sensor interface has 6 pins in total, and the code number of the dynamic pressure sensor interface is 1~6;
the combined navigation adapter interface comprises 22 pins with the code numbers of 1 to 22;
the pin header comprises 3 pin header interfaces P4-P6 with 5 pins and 2.54mm spacing, 1 pin header interface P8 with 6 pins and 2.54mm spacing, and a pin header interface P9 with 4 pins and 2.54mm spacing; the pin header interfaces P4-P6 are all provided with 5 pins, and the numbers are 1~5; the pin header P8 has 6 pins in total, and the code of the pin header P is 1~6; the pin header P9 has 4 pins in total;
the STM32F769NIH6 chip has 216 pins, wherein the VSS pin is grounded;
the power conversion circuit comprises 1 input pin VIN, 1 3.3V output pin and 1 5V output pin;
the 485 conversion circuit has 6 input pins and 6 output pins in total;
the 422 conversion circuit has 2 input pins and 4 output pins in total;
the 232 conversion circuit has 16 pins in total, and the code numbers of the pins are 1 to 16;
the power supply filter circuit comprises 2 input pins VIN1 and VIN2 and 2 output pins VIN1_ F, VIN2_ F;
the power supply switching circuit comprises 2 input pins VIN1_ F, VIN2_ F and 1 output pin VIN;
the AD conversion circuit has 3 power supply pins and 2 pins, and the codes of the pins are VIN1_ F, VIN2_ F, 5.5V, ADC and ADC2 respectively;
the serial port conversion circuit has 14 pins in total, and the serial port conversion circuit has the code numbers of 1 to 14.
3. The signal transfer circuit board of claim 1, wherein pins 1 and 2 of the J30J-51ZKW-P7 socket are connected to input pin VIN1 of the power filter circuit; the No. 5 and No. 6 pins are connected with an input pin VIN2 of the power supply filter circuit; the No. 9 and No. 10 pins are respectively connected with the No. 10 and No. 11 pins of the serial port conversion circuit; no. 11, 12, 33 and 34 pins are respectively connected with No. 14, 13, 7 and 8 pins of the 232 conversion circuit; the 14 th pin is connected with an ADC1 pin of the AD conversion circuit and a PC0 pin of the STM32F769NIH6 chip; the No. 15 pin is connected with an ADC2 pin of the AD conversion circuit and a PA3 pin of the STM32F769NIH6 chip; pins 17, 21 and 25 are connected with a VIN pin of the power supply switching circuit; no. 19, 20, 23, 24, 27 and 28 pins are respectively connected with 6 input pins of the 485 conversion circuit; no. 29, 30, 31, 32, 44, 45 and 46 pins are respectively connected with No. 21, 22, 19, 20, 9, 11 and 12 pins of the combined navigation adapter; no. 36 and No. 37 pins are respectively connected with No. 2 and No. 3 pins of the SD card adapter interface; no. 39, no. 40 and No. 41 pins are respectively connected with No. 5, no. 3 and No. 2 pins of the pin header P4; no. 42 and No. 47 are connected with a 3.3V pin of the power supply conversion circuit; leaving a space for No. 49 to No. 51 pins; the other pins are connected with the ground;
the No. 1 pin of the SD card adapter is connected with the ground; pins No. 4 and No. 5 are respectively connected with pins PC12 and PD2 of the STM32F769NIH6 chip; no. 6~9 pin is left empty; no. 10 is connected with a 3.3V pin of the power supply conversion circuit;
the No. 1~4 pin of the dynamic pressure sensor is respectively connected with the PA4, PB3, PB5 and PB4 pins of the ST32F769NIH6 chip; the No. 5 pin is connected with a 3.3V pin of the power supply conversion circuit; the No. 6 pin is grounded;
the No. 1 pin of the combined navigation adapter interface is connected with the VIN pin of the power supply switching circuit; no. 2, 10 and 15 pins are connected with the ground; no. 13 and No. 18 pins are connected with a 3.3V pin of the power supply conversion circuit; no. 3, no. 4, no. 7 and No. 8 are respectively connected with No. 4, no. 5, no. 1 and No. 2 pins of the pin header P8; no. 14, no. 16 and No. 17 pins are respectively connected with No. 5, no. 3 and No. 2 pins of the pin header P5; the No. 9, no. 11 and No. 12 pins are respectively connected with the No. 5, no. 3 and No. 2 pins of the pin header interface P6;
all pins No. 1 of the P4-P6 pin header are connected with pins No. 3.3V of the power conversion circuit, and all pins No. 4 are grounded; the No. 3 and No. 6 pins of the pin header interface P8 are connected with the ground; 4 pins of the pin header interface P9 are respectively connected with 4 output pins of the 422 conversion circuit;
an input pin VIN of the power supply conversion circuit is connected with a VIN pin of the power supply switching circuit; the 3.3V output pin is also connected with the 485 conversion circuit, the 422 conversion circuit, the power supply pin of the 232 conversion circuit and the No. 1, 8 and 14 pins of the serial port conversion circuit; the 5.5V output pin is connected with the 5.5V pin of the AD conversion circuit;
6 output pins of the 485 conversion circuit are respectively connected with pins PE0, PE1, PG9, PG14, PA0 and PA1 of the STM32F769NIH6 chip;
2 input pins of the 422 conversion circuit are respectively connected with pins PA9 and PA10 of the STM32F769NIH6 chip;
the No. 1 and No. 2 pins of the 232 conversion circuit are connected together through a capacitor; no. 4 and No. 5 pins are connected together through a capacitor; pins No. 2 and No. 15 are grounded; no. 6 and No. 16 pins are connected with a 3.3V pin of the power supply conversion circuit; pins 9, 10, 11 and 12 are respectively connected with pins PC7, PC6, PE8 and PE7 of the STM32F769NIH6 chip;
an output pin VIN1_ F of the power supply filter circuit is connected with a VIN1_ F pin of the power supply switching circuit and a VIN1_ F pin of the AD conversion circuit; an output pin VIN2_ F is connected with a VIN2_ F pin of the power supply switching circuit and a VIN2_ F pin of the AD conversion circuit;
an ADC1 pin of the AD conversion circuit is connected with a PC0 pin of the STM32F769NIH6 chip; the ADC2 pin is connected with a PA3 pin of the STM32F769NIH6 chip;
pins No. 2, 3, 6, 9, 12 and 13 of the serial port conversion circuit are left empty; the No. 4 pin is connected with a PB10 pin of the STM32F769NIH6 chip; no. 5 is connected with a PD5 pin of the STM32F769NIH6 chip;
the STM32F769NIH6 chip has 216 pins, wherein the VSS pin is grounded, and the unconnected pins are left blank.
4. The signal-relay circuit board of claim 1, wherein the signal-relay circuit board further comprises 4 fixing holes, each having a diameter of 3.5mm.
5. The signal relay circuit board of claim 1, wherein the signal relay circuit board has a width of 60mm and a length of 91mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221539115.4U CN217847116U (en) | 2022-06-20 | 2022-06-20 | Signal switching circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221539115.4U CN217847116U (en) | 2022-06-20 | 2022-06-20 | Signal switching circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217847116U true CN217847116U (en) | 2022-11-18 |
Family
ID=84024509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221539115.4U Active CN217847116U (en) | 2022-06-20 | 2022-06-20 | Signal switching circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217847116U (en) |
-
2022
- 2022-06-20 CN CN202221539115.4U patent/CN217847116U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6914786B1 (en) | Converter device | |
USRE36773E (en) | Method for plating using nested plating buses and semiconductor device having the same | |
US5483099A (en) | Standardized power and ground design for pin grid array packages | |
EP1447849A3 (en) | Semiconductor device and circuit board having the same mounted thereon | |
US20050133935A1 (en) | Embedded redistribution interposer for footprint compatible chip package conversion | |
GB2307336B (en) | Integrated circuit package and method of fabrication | |
EP1811563A3 (en) | Ball grid array | |
US6489682B1 (en) | Ball grid array semiconductor package and substrate therefor | |
CN106876556B (en) | A kind of back sticking type paster LED being exclusively used in transparent substrate | |
CN100365810C (en) | Diffusion and laser photoelectric coupling integrated circuit signal line | |
GB2289985B (en) | Method of connecting the output pads on an integrated circuit chip,and multichip module thus obtained | |
CN217847116U (en) | Signal switching circuit board | |
CN100490263C (en) | Heat sink for encapsulation of electroabsorption modulation laser | |
KR101333387B1 (en) | Package with power and ground through via | |
US6677668B1 (en) | Configuration for testing a substrate mounted with a most performance-demanding integrated circuit | |
CN102937663B (en) | The encapsulating structure of kernel module of intelligent electricity meter and method for packing | |
CN216719090U (en) | Heterogeneous multi-cache high-performance digital signal processor based on double-SiP system | |
CN103904552A (en) | Laser chip packaging structure for projection | |
CN211580109U (en) | Universal mobile phone camera static test board | |
CN212209485U (en) | Rectifier bridge circuit module of rear TVS protection diode | |
US8199519B2 (en) | Chip adapter | |
CN201812817U (en) | Adapter substrate of integrated circuit package | |
CN101404271B (en) | Audio power amplifier package | |
US6687133B1 (en) | Ground plane on 2 layer PBGA | |
CN100353553C (en) | Semiconductor integrated device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Building 16, Zilang Technology City, No. 60 Chongzhou Avenue, Innovation Zone, Nantong City, Jiangsu Province, 226009 Patentee after: Nantong Yangtze River Delta Intelligent Perception Research Institute Country or region after: China Address before: Building 16, Zilang Technology City, No. 60 Chongzhou Avenue, Innovation Zone, Nantong City, Jiangsu Province, 226009 Patentee before: Nantong Institute of intelligent perception Country or region before: China |