CN217847066U - Network card equipment with label card shape - Google Patents

Abstract

The application provides a network card device in a label card shape, and relates to the technical field of network cards. The network card device in the form of a label card comprises: the shell structure is provided with an accommodating cavity; the network card structure is arranged in the accommodating cavity and comprises a first network card body and a second network card body which are arranged at intervals along the vertical direction, the first network card body is used for processing network load, the second network card body is used for assisting the first network card body to work, the first network card body is provided with a first interface, the second network card body is provided with a second interface, and the first interface and the second interface are exposed out of the shell structure; the blowing component is arranged in the accommodating cavity and connected with the first network card body or the second network card body, so that air outside the shell structure is blown to the network card structure through the air inlet and then blown out of the air outlet. The network card structure can be actively cooled efficiently, and the heat dissipation of the server system to the network card structure is reduced.

Description

Network card equipment in label card form

Technical Field

The application relates to the technical field of network cards, in particular to a network card device in a label card shape.

Background

The core of the smart network card (SmartNIC) is to assist a Central Processing Unit (CPU) to process network load through an FPGA (Field Programmable Gate Array), and program a network interface function to release expensive CPU computing power on a server and provide more CPU computing power for computing tasks.

In related technologies, temperature control of an intelligent network card depends on a fan of a server complete machine system, and control elements such as a BMC (Baseboard Management Controller) and a CPLD (complex programmable logic device) on a motherboard are used to control the system fan, so that a certain heat dissipation effect can be achieved, but the requirements cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a network card equipment of mark card form, be favorable to high-efficient heat dissipation.

In order to achieve the purpose, the following technical scheme is adopted in the application:

the application provides a network card equipment of mark card form includes: the shell structure is provided with an accommodating cavity and is provided with an air inlet and an air outlet which are communicated with the accommodating cavity; the network card structure is configured in the accommodating cavity and comprises a first network card body and a second network card body which are arranged at intervals along the vertical direction, the first network card body is used for processing network loads, the second network card body is used for assisting the first network card body to work, the first network card body is provided with a first interface, the second network card body is provided with a second interface, and the first interface and the second interface are exposed out of the shell structure; and the blowing component is arranged in the accommodating cavity, is connected with the first network card body or the second network card body and is used for blowing out air from the air outlet after the air outside the shell structure is blown to the network card structure through the air inlet.

In the process of above-mentioned realization, the network card structure sets up in the intracavity that holds of shell structure, and the network card structure includes first network card body and second network card body, can the maximize utilization hold the space in chamber, and hold the intracavity and still be provided with the subassembly of blowing, can initiatively carry out high-efficient heat dissipation for the network card structure through the subassembly of blowing, reduces the heat dissipation of server system to the network card structure.

In some embodiments, the first network card body includes a first circuit board, a first chip body, an optical module and a first heat sink, the first chip body and the optical module are both configured to be connected with the first circuit board, and the optical module has the first interface, the first heat sink is configured to be connected with the first circuit board, and the first heat sink is configured above the first chip body for heat dissipation of the first chip body.

In the implementation process, the first circuit board is connected with the first chip body, the optical module and the first radiator, and the first radiator is arranged on the first chip body, so that the first chip body and the optical module can be radiated by the blowing assembly while the first chip body is radiated by the first radiator, and the overall heat radiation performance is improved.

In some embodiments, the optical module is provided with at least one, when the optical module is provided with two or more, the two optical modules are distributed at intervals along the front-back direction of the accommodating cavity, and the shell structure is provided with a plurality of heat dissipation holes corresponding to the positions between the two optical modules.

In the implementation process, at least two optical modules are arranged at intervals, and the shell structure is provided with heat dissipation holes corresponding to the two optical modules, so that the optical modules can be cooled, the problem of the heat dissipation bottleneck of the optical modules is solved, the problem of heat dissipation hotspots of the network card structure is balanced, and the heat dissipation boundary condition of the network card structure is improved.

In some embodiments, the air inlet and the air outlet are disposed on opposite sides of the housing structure, the blowing assembly is disposed corresponding to the air inlet, and the optical module is disposed corresponding to the air outlet.

In some embodiments, the first heat sink is provided with a ventilation groove along the left-right direction of the accommodating cavity, and the ventilation groove is recessed along the direction in which the first heat sink is close to the first circuit board.

In the process of the implementation, the first radiator is provided with the ventilation groove, so that when the air blowing assembly works, the air blowing assembly can radiate the light module through the ventilation groove, the heat radiation bottleneck problem of the light module is further improved, and the heat radiation boundary condition of the network card structure is optimized.

In some embodiments, the second network card body includes a second circuit board, a second chip body and a second heat sink, the second chip body is configured to be connected to the second circuit board, the second circuit board has the second interface, the second heat sink is configured to be connected to the second circuit board, and the second heat sink is configured above the second chip body for heat dissipation of the second chip body.

In the process of realizing the structure, the second chip body and the second radiator are connected to the second circuit board, the second radiator can radiate the second chip body, the first circuit board and the second circuit board are arranged, the first chip body is arranged on the first circuit board, the second chip body is arranged on the second circuit board, the space of the accommodating cavity can be utilized to the maximum extent, the overall impedance of the network card structure is uniform, the first chip body and the second chip body are separately arranged, the mutual influence between the first chip body and the second chip body can be avoided, and efficient heat radiation between the first chip body and the second chip body is realized.

In some embodiments, the second network card body is disposed above the first network card body, the first chip body, the optical module and the first heat sink are disposed between the first circuit board and the second circuit board, and the second chip body and the second heat sink are disposed on a side of the second circuit board away from the first circuit board.

In the process of the implementation, the second network card body is arranged above the first network card body, so that the first chip body and the second chip body are separately arranged, the functions can be guaranteed to be uniformly distributed on the first circuit board and the second circuit board, and the mutual influence between the first chip body and the second chip body can also be avoided.

In some embodiments, the first network card body has a plurality of first cooling fins, the second network card body has a plurality of second cooling fins, at least two kinds of spacing exist between the plurality of first cooling fins, and/or at least two kinds of spacing exist between the plurality of second cooling fins.

In the implementation process, at least two kinds of intervals are arranged among the first radiating fins and/or at least two kinds of intervals are arranged among the second radiating fins, so that the radiating bottleneck problem of the optical module can be improved, and the radiating boundary condition of the network card structure is optimized.

In some embodiments, the first network card body includes a first circuit board, a first chip body and an optical module, the second network card body includes a second circuit board, a second chip body and a third heat sink, the first chip body and the optical module are both configured to be connected to the first circuit board, the second chip body is configured to be connected to the second circuit board, the third heat sink is configured to be connected to the first circuit board or the second circuit board, and the first chip body, the optical module and the second chip body are all located between the first circuit board and the second circuit board to dissipate heat through the third heat sink.

In the implementation process, the first circuit board is provided with the first chip body and the optical module, the second circuit board is provided with the second chip body, the third radiator is connected with the first circuit board or the second circuit board, and the first chip body, the second chip body, the optical module and the third radiator are positioned between the first circuit board and the second circuit board, so that the first chip body and the second chip body share the third radiator for radiating, and the production cost can be saved while the overall layout is kept unchanged.

In some embodiments, the housing structure includes a back plate, a shell disposed above the back plate, and a side plate disposed above the back plate and on a side of the shell facing away from the blower assembly.

In some embodiments, a heat conducting medium is disposed between the housing and the second network card body, so as to dissipate heat of the network card structure.

In the implementation process, the shell is provided with the heat-conducting medium, so that heat generated by the first network card body and/or the second network card body is conducted to the shell, the heat dissipation area of the shell is expanded, the heat dissipation boundary condition of the network card structure is improved, the function of the whole equipment is reduced, and meanwhile, the tolerance can be made up.

Additional features and advantages of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the embodiments of the present application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for a user of ordinary skill in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a network card device in a tag card form disclosed in an embodiment of the present application.

Fig. 2 is a schematic partial structural diagram of a network card device in a tag card form disclosed in the embodiment of the present application.

Fig. 3 is a schematic structural diagram of a first network card body of a network card device in a tag card shape disclosed in an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a second network card body of a network card device in a tag card form disclosed in the embodiment of the present application.

Reference numerals

100. A housing structure; 101. a housing; 102. a side plate; 1021. heat dissipation holes; 103. a back plate; 200. a network card structure; 201. a first network card body; 2011. a first circuit board; 2012. a first chip body; 2013. a first heat sink; 20131. a ventilation slot; 2014. a first interface; 2015. an optical module; 202. a second network card body; 2021. a second circuit board; 2022. a second chip body; 2023. a second heat sink; 2024. a second interface; 300. a blowing assembly.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are usually placed in when used, and are only for convenience of describing the present application and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case to a user of ordinary skill in the art.

Examples

The intelligent network card (SmartNIC) has the core that a Central Processing Unit (CPU) is assisted by a Field Programmable Gate Array (FPGA) to process a network load, and the existing intelligent network card scheme mostly adopts a passive heat dissipation scheme, which is only based on the design thought of a common network card and lacks the coordination layout and heat dissipation design of the CPU, the FPGA and an optical module; with the increase of the whole machine traffic, the performance of a CPU, an FPGA and an optical module used on the intelligent network card is stronger and stronger, and the power consumption is also high.

The inventor finds that the heat dissipation scheme of the board card layer surface of the intelligent network card does not consider the requirements of the whole machine during design in the design process; the heat dissipation design of integrated circuit board aspect is just considering to carry out the heat dissipation design to several chips on the integrated circuit board, and does not carry out furthest's excavation to the integrated circuit board space, and the radiator that leads to current scheme itself size is very little, and its radiating ability is extremely limited, and the impedance distribution on the scheme leads to the integrated circuit board is arranged to the radiator of smaller size moreover, causes blocking of air current easily, and the available amount of wind of the radiator of flowing through can be littleer.

In view of this, as shown in fig. 1-2, the present application provides a card-shaped network card device, which can be applied to a server, and the card-shaped network card device includes: the network card structure 200 is provided with a first interface 2014 and a second interface 2024, the first interface 2014 and the second interface 2024 are exposed out of the shell structure 100 to be used for being connected with other devices of the server, and the blowing component 300 is electrically connected with the network card structure 200 to be used for dissipating heat of the network card structure 200, so that the power consumption of the whole server can be reduced.

Specifically, the housing structure 100 has a receiving cavity, and the housing structure 100 is configured with an air inlet and an air outlet which are communicated with the receiving cavity; the network card structure 200 is disposed in the accommodating cavity, the network card structure 200 includes a first network card body 201 and a second network card body 202 that are arranged at intervals in an up-down direction, the first network card body 201 is configured to process a network load, the second network card body 202 is configured to assist the first network card body 201 in working, the first network card body 201 has a first interface 2014, the second network card body 202 has a second interface 2024, and both the first interface 2014 and the second interface 2024 are exposed to the housing structure 100; the blowing component 300 is disposed in the accommodating cavity, and the blowing component 300 is electrically connected to the first network card body 201 or the second network card body 202, so that the air outside the casing structure 100 is blown out from the air outlet after being blown towards the network card structure 200 through the air inlet.

For example, the housing structure 100 is made of a material including, but not limited to, an all-metal material, which is beneficial for fixing the network card structure 200 and can absorb heat to a certain extent, the air inlet and the air outlet may be disposed on opposite sides of the housing structure 100, for example, the air inlet is disposed on the left side of the housing structure 100, the air outlet is disposed on the right side of the housing structure 100, the network card structure 200 is located between the air inlet and the air outlet, wherein the blowing assembly 300 may be disposed at the air inlet and may also be disposed at the air outlet, and the blowing direction of the blowing assembly 300 may be adjusted, that is, according to the position of the network card device in the form of a standard card, the fixing position of the blowing assembly 300 may be unchanged, and the blowing direction of the blowing assembly 300 may be changed (for example, the blowing assembly 300 is turned 180 ° to achieve adjustment of the blowing direction).

An existing intelligent network card in the market is a passive heat dissipation scheme, heat dissipation is performed only by means of a fan of a server, and in order to improve the heat dissipation capacity of network card equipment, more targeted and independent heat dissipation adjustment is performed, so that the blowing assemblies 300 are arranged in the accommodating cavity, the blowing assemblies 300 include but are not limited to fans and supports, the fans can be fixedly connected to the shell structure 100 through the supports, at least two blowing assemblies 300 can be arranged, and the at least two blowing assemblies 300 are distributed along the front and back directions of the shell structure 100 to fully blow the network card structure 200, so that circulation of air in the accommodating cavity is accelerated, and the heat dissipation effect of the network card structure 200 is further achieved.

It should be noted that the fan may perform closed-loop speed regulation according to the built-in temperature readings of the first chip, the second chip, and the like of the network card structure 200, or perform open-loop speed regulation according to the temperature sensor of the network card structure 200, thereby reducing the power consumption of the entire server; meanwhile, the installation direction of the fan can be adjusted, and the effect of the air inlet volume of the network card equipment can be realized no matter the network card equipment is installed on the air inlet side or the air outlet side of the whole server.

In the process of the implementation, the network card structure 200 is disposed in the accommodating cavity of the housing structure 100, the network card structure 200 includes the first network card body 201 and the second network card body 202, the space of the accommodating cavity can be utilized to the maximum extent, the accommodating cavity is further provided with the blowing assembly 300, the blowing assembly 300 can actively dissipate heat efficiently for the network card structure 200, and heat dissipation of the server system to the network card structure 200 is reduced.

The intelligent network card on the market is only the finished card of component manufacturers such as Mi luo si, intel and sai ling, can see that the overall arrangement of CPU chip and FPGA chip on the most intelligent network cards is in same circuit board, can shelter from each other between its CPU chip and the FPGA chip, cause the chip heat dissipation of low reaches easily to receive the preheating influence of the chip of upper reaches, lead to the chip of low reaches to become the heat dissipation bottleneck, influence the boundary condition of whole card, promote the radiating fan power consumption of integrated circuit board.

The CPU chip, the FPGA chip and the optical module are necessary components on the SmartNIC; in order to realize efficient transmission and efficient processing of data, the I/O transmission speed of the optical module equipped in the intelligent network card is very high, and the volume of the optical module is correspondingly increased. This results in the light modules 2015 occupying more than 1/3 of the area in the cross-section parallel to the shutter.

In view of this, as shown in fig. 3, fig. 3 is a schematic structural diagram of a first network card body 201 of a standard card type network card device disclosed in the embodiment of the present application; the first network card body 201 includes a first circuit board 2011, a first chip body 2012, an optical module 2015 and a first heat sink 2013, wherein the first chip body 2012 includes but is not limited to a CPU chip; the first chip body 2012 and the optical module 2015 are both configured to be connected to the first circuit board 2011, and the optical module 2015 has the first interface 2014, the first heat sink 2013 is configured to be connected to the first circuit board 2011, and the first heat sink 2013 is configured above the first chip body 2012 for heat dissipation of the first chip body 2012.

For example, the first Circuit Board 2011 includes, but is not limited to, a PCB (Printed Circuit Board-Printed Circuit Board) Board, which is an important electronic component, and is a support for electronic components and a carrier for electrical interconnection of electronic components; the optical module 2015 is composed of an optoelectronic device, a functional circuit, the first interface 2014 (optical interface), and the like, wherein the optoelectronic device comprises a transmitting end and a receiving end, and the transmitting end converts an electrical signal into an optical signal, and the receiving end converts the optical signal into the electrical signal after the optical signal is transmitted through an optical fiber.

In the implementation process, the first circuit board 2011 is connected to the first chip body 2012, the optical module 2015 and the first heat sink 2013, and the first heat sink 2013 is disposed on the first chip body 2012, so that the air blowing assembly 300 can also dissipate the heat of the first chip body 2012 and the optical module 2015 while the first heat sink 2013 dissipates the heat of the first chip body 2012, thereby improving the overall heat dissipation performance.

The inventor discovers in the design process that the existing scheme closely parallels two optical modules 2015 together, which causes the two optical modules 2015 to become the part with the maximum impedance on the board card no matter the intelligent network card is on the front side or the rear side of the whole server, greatly affects the air passing amount on the board card, and significantly affects the heat dissipation of the whole board card.

In view of this, referring to fig. 3 again, at least one of the optical modules 2015 is disposed, when there are two or more of the optical modules 2015, the two or more of the optical modules 2015 are spaced apart from each other along the front-rear direction of the accommodating cavity, a plurality of heat dissipation holes 1021 are disposed on the side plate 102 of the housing structure 100 at positions corresponding to a position between the two optical modules 2015, and specifically, the heat dissipation holes 1021 are disposed on the side plate 102 of the housing structure 100; wherein, optical module 2015 interval is provided with two at least, and shell structure 100 is provided with louvre 1021 between corresponding to two optical modules 2015, can dispel the heat to optical module 2015, has improved the problem of the heat dissipation bottleneck of optical module 2015, has promoted network card structure 200's heat dissipation boundary condition.

In some embodiments, the air inlet and the air outlet are disposed on opposite sides of the housing structure 100, the blowing assembly 300 is disposed corresponding to the air inlet, and the optical module 2015 is disposed corresponding to the air outlet; in other embodiments, the optical module 2015 may be disposed at the air outlet, and the blower assembly 300 may also be disposed at the air outlet.

The inventor finds that the prior art does not individually optimize the heat dissipation bottleneck of the optical module 2015 in the design process; the upper limit of the temperature of the optical module 2015 is 70 ℃, and in actual use, the intelligent network card is basically positioned at the rear end of the whole server; the characteristic that the upper temperature limit of the optical module 2015 is 70 ℃ causes the optical module 2015 to be a heat dissipation bottleneck point; it can be seen from the prior art that there is no targeted optimization of the heat dissipation of the optical module 2015, which results in a greater risk of heat dissipation of the optical module 2015.

In view of this, referring to fig. 3 again, the first heat sink 2013 is configured with a ventilation groove 20131 along the left-right direction of the accommodating cavity, the ventilation groove 20131 is recessed along the direction in which the first heat sink 2013 approaches the first circuit board 2011 (that is, at least a part of the structure of the upper end of the first heat sink 2013 is recessed along the up-down direction to form the ventilation groove 20131), the ventilation groove 20131 is configured on the first heat sink 2013, and the first heat sink 2013 has a plurality of first heat dissipation fins, so that when the blower assembly 300 works, the light module 2015 can be dissipated through the ventilation groove 20131, and meanwhile, the distance between two adjacent first heat dissipation fins can be increased, the problem of heat dissipation bottleneck of the optical module 2015 is further improved, and the heat dissipation boundary condition of the network card structure 200 is optimized.

As shown in fig. 4, fig. 4 is a schematic structural diagram of a second network card body 202 of a tag card type network card device disclosed in this embodiment of the present application, where the second network card body 202 includes a second circuit board 2021, a second chip body 2022 and a second heat sink 2023, the second chip body 2022 includes but is not limited to an FPGA chip, the second circuit board 2021 includes but is not limited to a PCB board, the second chip body 2022 is configured to be connected to the second circuit board 2021, the second circuit board 2021 has the second interface 2024, the second heat sink 2023 is configured to be connected to the second circuit board 2021, and the second heat sink 2023 is configured above the second chip body 2022 for heat dissipation of the second chip body 2022, where the second heat sink 2023 has a plurality of second heat dissipation fins, and the heat dissipation efficiency can be improved by increasing a distance between two adjacent second heat dissipation fins; it should be noted that, the first network card body 201 has a plurality of first cooling fins, the second network card body 202 has a plurality of second cooling fins, and is a plurality of there are two kinds of intervals between the first cooling fins at least, and/or a plurality of there are two kinds of intervals between the second cooling fins at least, set up two kinds of intervals at least between a plurality of first cooling fins, and/or set up two kinds of intervals at least between a plurality of second cooling fins, can improve the heat dissipation bottleneck problem of optical module 2015, has optimized the heat dissipation boundary condition of network card structure 200.

In the implementation process, the second chip body 2022 and the second heat sink 2023 are connected to the second circuit board 2021, the second heat sink 2023 can dissipate heat of the second chip body 2022, and by arranging the first circuit board 2011 and the second circuit board 2021, the first circuit board 2011 is provided with the first chip body 2012, and the second circuit board 2021 is provided with the second chip body 2022, so that the space of the accommodating cavity can be maximally utilized, the overall impedance of the network card structure 200 is uniform, and the first chip body 2012 and the second chip body 2022 are separately arranged, so that mutual influence between the first chip body 2012 and the second chip body 2022 can be avoided, and efficient heat dissipation between the first chip body 2012 and the second chip body 2022 can be realized.

Referring to fig. 2 again, the second network card body 202 is disposed above the first network card body 201, the first chip body 2012, the optical module 2015 and the first heat sink 2013 are located between the first circuit board 2011 and the second circuit board 2021, and the second chip body 2022 and the second heat sink 2023 are located on a side of the second circuit board 2021 away from the first circuit board 2011; in other embodiments, the second network card body 202 may also be disposed below the first network card body 201, and accordingly, the first chip body 2012, the optical module 2015 and the first heat sink 2013 are located on a side of the first network card body 201 away from the second network card body 202, and the second chip body 2022 and the second heat sink 2023 are located on a side of the second network card body 202 close to the first network card body 201.

In the implementation process, the second network card body 202 is disposed above the first network card body 201, so that the first chip body 2012 and the second chip body 2022 are separately disposed, which can ensure that the functions are uniformly distributed on the first circuit board 2011 and the second circuit board 2021, and can also avoid the mutual influence between the first chip body 2012 and the second chip body 2022.

In some embodiments, the first network card body 201 includes a first circuit board 2011, a first chip body 2012 and an optical module 2015, the second network card body 202 includes a second circuit board 2021, a second chip body 2022 and a third heat sink, the first chip body 2012 and the optical module 2015 are both configured to be connected to the first circuit board 2011, the second chip body 2022 is configured to be connected to the second circuit board 2021, the third heat sink is configured to be connected to the first circuit board 2011 or the second circuit board 2021, and the first chip body 2012, the optical module 2015 and the second chip body 2022 are all located between the first circuit board 2011 and the second circuit board 2021 to dissipate heat through the third heat sink.

Illustratively, the optical module 2015 is provided with at least one, when the optical module is provided with two or more, the two optical modules 2015 are distributed at intervals along the front-rear direction of the accommodating cavity, and a plurality of heat dissipation holes 1021 are formed in the position, corresponding to the space between the two optical modules 2015, of the side plate 102 of the housing structure 100.

The third heat sink is disposed on the first circuit board 2011 (or disposed on the second circuit board 2021), the third heat sink is configured with ventilation grooves 20131 along the left and right directions of the accommodating cavity, the ventilation grooves 20131 are recessed along the direction in which the third heat sink is close to the first circuit board 2011, and the third heat sink has multiple third heat dissipation fins, so that when the blowing assembly 300 works, the light module 2015 can be cooled through the ventilation grooves 20131, and the distance between two adjacent third heat dissipation fins can be increased, thereby further improving the heat dissipation bottleneck problem of the light module 2015, and optimizing the heat dissipation boundary condition of the network card structure 200.

In the implementation process, the first circuit board 2011 is provided with the first chip body 2012 and the optical module 2015, the second circuit board 2021 is provided with the second chip body 2022, the third heat sink is connected with the first circuit board 2011 or the second circuit board 2021, and the first chip body 2012, the second chip body 2022, the optical module 2015 and the third heat sink are located between the first circuit board 2011 and the second circuit board 2021, so that the first chip body 2012 and the second chip body 2022 share the third heat sink for heat dissipation, and the production cost can be saved while the overall layout is kept unchanged.

In some embodiments, the casing structure 100 includes a back plate 103, a casing 101 and a side plate 102, the casing 101 is disposed above the back plate 103, the side plate 102 is disposed above the back plate 103 and on a side of the casing 101 facing away from the blowing assembly 300, a heat conducting medium is disposed between the casing 101 and the second network card body 202 for dissipating heat of the network card structure 200, wherein the heat conducting medium includes but is not limited to a heat conducting gel, the heat conducting gel is a relatively flexible heat conducting medium, which can be used for filling fine gaps like a heat conducting silica gel, and can make up tolerance like a heat conducting gasket, and since the heat conducting medium is flexible but cannot flow by itself, it can be ensured that the surface of the second heat sink 2023 can be sufficiently filled; the casing 101 is made of a metal material, so that the wind field can be converged, and when the second network card body 202 is disposed above the first network card body 201, generally, an installation gap of about 1mm is formed between the second network card body 202 and the casing 101, so that heat on the surface of the second radiator 2023 of the second network card body 202 can be conducted to the casing 101, that is, the casing 101 is filled with the heat-conducting medium.

In the implementation process, the shell 101 is provided with the heat-conducting medium, so that heat generated by the first network card body 201 and/or the second network card body 202 is conducted to the shell 101, the heat dissipation area of the shell is expanded, the heat dissipation boundary condition of the network card structure 200 is improved, the function of the whole device is reduced, and meanwhile, the tolerance can be compensated.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (11)

1. A network card device in a tag card form, comprising:

the shell structure is provided with an accommodating cavity, and the shell structure is provided with an air inlet and an air outlet which are communicated with the accommodating cavity;

the network card structure is configured in the accommodating cavity and comprises a first network card body and a second network card body which are arranged at intervals along the vertical direction, the first network card body is used for processing network load, the second network card body is used for assisting the first network card body to work, the first network card body is provided with a first interface, the second network card body is provided with a second interface, and the first interface and the second interface are exposed out of the shell structure;

and the blowing component is arranged in the accommodating cavity, is connected with the first network card body or the second network card body and is used for blowing out air from the air outlet after the air outside the shell structure is blown to the network card structure through the air inlet.

2. The token-like network card device according to claim 1, wherein the first network card body comprises a first circuit board, a first chip body, an optical module and a first heat sink, the first chip body and the optical module are both configured to be connected to the first circuit board, the optical module has the first interface, the first heat sink is configured to be connected to the first circuit board, and the first heat sink is configured above the first chip body for heat dissipation of the first chip body.

3. The card-shaped network card device according to claim 2, wherein the number of the optical modules is at least one, when the number of the optical modules is two or more, the optical modules are distributed at intervals along the front-rear direction of the accommodating cavity, and the housing structure is provided with a plurality of heat dissipation holes corresponding to positions between the two optical modules.

4. The standard card type network card device of claim 3, wherein the air inlet and the air outlet are disposed on opposite sides of the housing structure, the blowing assembly is disposed corresponding to the air inlet, and the optical module is disposed corresponding to the air outlet.

5. The standard card form network card device of claim 2, wherein the first heat sink is configured with ventilation grooves along the left and right direction of the accommodating cavity, and the ventilation grooves are recessed along the direction of the first heat sink close to the first circuit board.

6. The network card device in the form of a badge as in claim 2, wherein said second network card body includes a second circuit board, a second chip body and a second heat sink, said second chip body is configured to be connected to said second circuit board, said second circuit board has said second interface, said second heat sink is configured to be connected to said second circuit board, and said second heat sink is configured above said second chip body for heat dissipation of said second chip body.

7. The network card device in the form of a badge as in claim 6, wherein said second network card body is disposed above said first network card body, and said first chip body, said optical module and said first heat sink are located between said first circuit board and said second circuit board, and said second chip body and said second heat sink are located on a side of said second circuit board facing away from said first circuit board.

8. The card-shaped network card device of claim 6, wherein the first network card body has a plurality of first heat dissipating fins, the second network card body has a plurality of second heat dissipating fins, and at least two kinds of spaces exist between the plurality of first heat dissipating fins and/or at least two kinds of spaces exist between the plurality of second heat dissipating fins.

9. The card-like network card device of claim 1, wherein the first network card body comprises a first circuit board, a first chip body and an optical module, the second network card body comprises a second circuit board, a second chip body and a third heat sink, the first chip body and the optical module are configured to be connected to the first circuit board, the second chip body is configured to be connected to the second circuit board, the third heat sink is configured to be connected to the first circuit board or the second circuit board, and the first chip body, the optical module and the second chip body are located between the first circuit board and the second circuit board to dissipate heat via the third heat sink.

10. The card-shaped network card device of claim 1, wherein the housing structure comprises a back plate, a housing, and a side plate, the housing is disposed above the back plate, and the side plate is disposed above the back plate and on a side of the housing away from the blowing assembly.

11. The network card device in the form of a badge as in claim 10, wherein a heat-conducting medium is disposed between said housing and said second network card body for dissipating heat of said network card structure.

Images