CN217847024U - Heat dissipation device and case - Google Patents

Abstract

The application discloses a heat dissipation device and a chassis, wherein the heat dissipation device comprises a heat dissipation shell and at least one wind power assembly, one end of the heat dissipation shell facing the external environment is provided with a ventilation part and an air inlet part, the ventilation part is positioned in the middle of one end of the heat dissipation shell facing the external environment, and the air inlet part is positioned on the periphery of the ventilation part; a mounting cavity and a vent seam are formed at one end of the heat dissipation shell, which is far away from the external environment, the mounting cavity is communicated with the air inlet part, a ventilation cavity is formed in the heat dissipation shell, the ventilation cavity is communicated with the ventilation part, and the vent seam is communicated between the ventilation cavity and the mounting cavity; the wind power component is arranged in the mounting cavity and close to the air inlet part. The heat dissipation device can reduce the risk of corrosion of the control panel in the case caused by accumulation of dust and the like, and can improve the heat dissipation efficiency.

Description

Heat dissipation device and case

Technical Field

The application relates to the technical field of a case, in particular to a heat dissipation device and a case.

Background

The middle part of the existing case adopts the fan to directly blow for heat dissipation, when the fan works, dust in the air is easily thrown to the front position of the fan, dust and the like are accumulated on circuit devices such as a control panel, and further the circuit devices such as the control panel in the case are corroded.

SUMMERY OF THE UTILITY MODEL

The application provides a heat abstractor and quick-witted case to solve among the prior art partial quick-witted case middle part and adopt the fan to directly blow the heat dissipation, the fan is got rid of the dust in the air to the preceding position of fan, causes dust etc. to pile up to circuit devices such as control panel on, and then leads to technical problem that circuit devices such as control panel corrode in the quick-witted incasement.

In order to solve the above technical problem, the present application provides a heat dissipation device, which includes: the heat dissipation shell is provided with a ventilation part and an air inlet part, wherein the ventilation part is positioned in the middle of one end of the heat dissipation shell facing the external environment, and the air inlet part is positioned on the periphery of the ventilation part; a mounting cavity and a vent seam are formed at one end of the heat dissipation shell, which is far away from the external environment, the mounting cavity is communicated with the air inlet part, a ventilation cavity is formed on the heat dissipation shell, the ventilation cavity is communicated with the ventilation part, and the vent seam is communicated between the ventilation cavity and the mounting cavity; the wind power component is arranged in the mounting cavity and is close to the air inlet part; wherein, the wind-force subassembly makes the air in the external environment form high-velocity air flow after air inlet portion, installation cavity and the crack flows in proper order, and high-velocity air flow flows to the ventilation cavity to the air that makes in the external environment passes through the ventilation portion and gets into in the ventilation cavity.

The heat dissipation shell comprises a first inner side wall and a second inner side wall which are arranged oppositely, a first protruding portion is arranged around the first inner side wall, a second protruding portion is arranged around the second inner side wall, the second protruding portion is located on the periphery of the first protruding portion, and the first protruding portion is located on the periphery of the ventilation portion; vent slits are formed between the inner side surfaces of the first protruding portion and the second protruding portion and between the second protruding portion and the first inner side wall.

Wherein, the distance between the inner side walls of the first lug boss and the second lug boss is greater than or equal to 0.5mm and less than or equal to 2mm.

The distance between the second lug boss and the first inner side wall is smaller than or equal to the extending height of the first lug boss relative to the first inner side wall.

Wherein, the air inlet part comprises a plurality of air inlets; and/or the vent portion includes a number of vents.

Wherein, wind-force subassembly includes driving fan and control panel, and driving fan is connected with the control panel, and driving fan and control panel all can be dismantled in the installation intracavity.

Wherein, the heat dissipation casing includes first apron and second apron, and first apron and second apron can dismantle the connection, and one side of first apron orientation second apron is first inside wall, and one side of second apron orientation first apron is the second inside wall, and first apron and second apron are formed with installation cavity, air vent and ventilation chamber through first bellying and second bellying, and ventilation portion and air inlet portion all set up in first apron.

Wherein, first apron both sides all set up air inlet portion, and the ventilation portion is located two air inlet portion middles, and the both sides of installation cavity all are provided with wind-force component.

Wherein, one of first apron and second apron is provided with the buckle groove, and another is provided with the buckle, buckle and buckle groove joint.

In order to solve the above technical problem, the present application provides a chassis, where the chassis includes a chassis body and a heat dissipation device, the heat dissipation device is the above heat dissipation device, the heat dissipation device is disposed at an end of the chassis body, and the heat dissipation device is used for dissipating heat of electronic components in the chassis body.

The beneficial effect of this application is: be different from prior art's the condition, this application provides a heat abstractor, and ventilation portion is located the heat dissipation casing towards the one end intermediate position of external environment, and the air inlet portion is located ventilation portion periphery, therefore wind-force component sets up in heat dissipation casing intermediate position periphery. Through the mode, the risk that dust and the like are accumulated to cause corrosion of the control panel in the case is reduced. At least one wind power component enables air in the external environment to flow along the air inlet portion, the mounting cavity and the vent seam in sequence to form high-speed airflow, and the high-speed airflow flows to the ventilation cavity, so that the air in the external environment enters the ventilation cavity through the ventilation portion. Through the mode, the air can be accelerated to dissipate the heat of the heat dissipation component, and the heat dissipation efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

FIG. 2 is a first angled, partial cross-sectional view of a heat dissipation device according to an embodiment of the present application;

FIG. 3 is a second angled partial cross-sectional view of a heat sink in accordance with an embodiment of the present application;

FIG. 4 is an exploded view of a heat dissipation device according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a chassis according to an embodiment of the present application.

Reference numerals: 10. a heat sink; 1. a heat dissipating housing; 11. a first cover plate; 111. a ventilation portion; 1111. a vent; 112. an air inlet part; 1121. an air inlet; 113. a first boss; 114. a first inner side wall; 115. a recessed portion; 12. a second cover plate; 121. a second boss portion; 122. a second inner side wall; 13. a ventilation cavity; 14. a mounting cavity; 15. ventilating seams; 16. a fastening groove; 17. buckling; 2. a wind power assembly; 21. driving a fan; 22. a control panel; 100. a chassis; 1001. a case body.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The following describes the heat dissipation device and the chassis in detail with reference to the embodiments.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present application; fig. 2 is a first-angle partial cross-sectional view of a heat sink in accordance with an embodiment of the present application.

The present application provides a heat dissipation device 10. The heat dissipation device 10 can be applied to heat dissipation of electronic components and the like in a chassis. The heat sink 10 comprises a heat sink housing 1 and at least one wind power module 2. At least one wind power module 2 is arranged in the heat-dissipating housing 1. One end of the heat dissipating housing 1 facing the outside environment is provided with a ventilation portion 111. The ventilation portion 111 is for air to pass through. The ventilation portion 111 is located at an intermediate position of one end of the heat radiation housing 1 toward the outside environment. An air inlet 112 is provided at one end of the heat dissipation case 1 facing the outside environment. The air inlet portion 112 is used for air in the external environment to pass through. The air inlet portion 112 is located at the outer periphery of the ventilation portion 111. The specific structures of the air inlet portion 112 and the ventilation portion 111 are not limited, and ventilation may be achieved.

The end of the heat dissipation housing 1 facing away from the external environment is formed with a mounting cavity 14 and a vent 15. The installation cavity 14 is communicated with the air inlet portion 112, and air in the external environment can directly enter the installation cavity 14 through the air inlet portion 112. Meanwhile, the heat dissipation case 1 is formed with a ventilation chamber 13. The ventilation chamber 13 communicates with the ventilation portion 111, and air in the external environment can enter the ventilation chamber 13 through the ventilation portion 111. The vent slit 15 communicates between the vent chamber 13 and the mounting chamber 14. The specific structure of the ventilation cavity 13 and the installation cavity 14 is not limited.

At least one wind module 2 is arranged in the installation cavity 14. Wherein the wind power assembly 2 is arranged close to the air inlet portion 112. The wind power assembly 2 makes the air in the external environment flow along the air inlet portion 112, the mounting cavity 14 and the ventilation slot 15 in sequence to form a high-speed airflow, and the high-speed airflow flows to the ventilation cavity 13, so that the air in the external environment enters the ventilation cavity 13 through the ventilation portion 111.

Specifically, since the ventilation portion 111 is located at the middle position of one end of the heat dissipation housing 1 facing the external environment, and the air inlet portion 112 is located at the periphery of the ventilation portion 111, the wind power assembly 2 is disposed at the periphery of the middle position of the heat dissipation housing 1. When the wind power assembly 2 is in operation, the wind power assembly 2 drives a part of air in the external environment from the air inlet portion 112 into the installation cavity 14, and the air flow passes through the vent slits 15 from the installation cavity 14. The wind power assembly 2 and the ventilation slits 15 cooperate with each other to form a high-speed airflow, and the high-speed airflow entering the ventilation cavity 13 can accelerate the air flow of the heat dissipation device 10, thereby improving the heat dissipation efficiency. At the same time, a high velocity airflow is created as a result of the airflow from the mounting cavity 14 through the vent slits 15. Therefore, a negative pressure region is formed around the high-speed airflow, and according to the bernoulli principle, another part of air in the external environment enters the ventilation cavity 13 from the ventilation part 111 to form an air duct blown inwards from the outside of the heat dissipation device 10, so that the electronic components and the like in the chassis are blown and dissipated, the air flow in the heat dissipation device 10 is accelerated, the heat dissipation is increased, and the heat dissipation efficiency is further improved.

Compare in prior art, this embodiment reduces wind power component 2 and directly throws into quick-witted incasement intermediate position department with dust in the air through setting up wind power component 2 in heat dissipation casing 1 intermediate position periphery department to reduce the risk that accumulation such as dust leads to the control panel 22 of quick-witted incasement to corrode. Further, through air inlet portion 112, installation cavity 14, vent seam 15, ventilation cavity 13 and ventilation portion 111 mutually supporting, the wind channel is soft even for the air can dispel the heat to electronic components. In addition, the heat dissipation device 10 is disposed at an end of the chassis, and the heat dissipation device 10 does not occupy an internal space of the chassis.

The number of the wind power assemblies 2 is one, two or more, and the number can be determined according to actual conditions. The wind power can be increased by the plurality of wind power assemblies 2, so that the air inlet amount of air entering the installation cavity 14 through the air inlet part 112 is increased. As in the present embodiment with two wind assemblies 2. Both sides of one end of the heat dissipation case 1 facing the external environment are provided with air inlet portions 112, and the ventilation portion 111 is located between the two air inlet portions 112. Wherein one wind module 2 is arranged adjacent to one air inlet 112. Promote wind-force through above-mentioned two wind-force components 2, and then accelerate air current velocity in the wind channel, promote the radiating efficiency. In other embodiments, the number of the wind power assemblies 2 may be three, four, five, etc., and is not limited herein.

In an embodiment, with reference to fig. 1 and fig. 2, the interior of the heat dissipation housing 1 includes a first inner sidewall 114 (not shown) and a second inner sidewall 122 (not shown), and the first inner sidewall 114 and the second inner sidewall 122 are disposed opposite to each other. The first inner sidewall 114 is surrounded by a first protrusion 113. The first projection portion 113 is located at an outer peripheral position of the ventilation portion 111. The second boss 121 is located at an outer circumferential position of the first boss 113. Meanwhile, a space (not shown) is formed between the second protrusion 121 and the first inner sidewall 114.

The above-mentioned vent slits 15 are formed between a side surface of the first protrusion portion 113 facing the second protrusion portion 121 and a side surface of the second protrusion portion 121 facing the first protrusion portion 113, and between the second protrusion portion 121 and the first inner sidewall 114. By changing the internal structure of the heat dissipation case 1, the vent slits 15 are formed. The air can be extruded at a high speed through the vent slits 15 to form high-speed airflow, so that a negative pressure region is formed in the ventilation cavity 13, subsequent air can flow into the case quickly, and the electronic components in the case are cooled.

Referring to fig. 3, fig. 3 is a partial sectional view of a heat dissipation device at a second angle according to an embodiment of the present application. With reference to fig. 2, in an embodiment, a distance between a side wall of the first protrusion 113 facing the second protrusion 121 and a side arm of the second protrusion 121 facing the first protrusion 113 is greater than or equal to 0.5mm, and a distance between a side arm of the first protrusion 113 facing the second protrusion 121 and a side arm of the second protrusion 121 facing the first protrusion 113 is less than or equal to 2mm. By setting the distance range, air can be extruded at a high speed to form high-speed airflow, so that the air can enter the heat dissipation device 10 quickly, and the heat dissipation efficiency is improved.

The distance between the inner side walls of the first protrusion 113 and the second protrusion 121 may be, but not limited to, 0.5mm, 0.93mm, 1mm, 1.37mm, 1.423mm, and 1.5mm. Of course, the distance between the inner side walls of the first protrusion 113 and the second protrusion 121 may be other values, and is not limited herein.

In practical process, first bellying 113 and second bellying 121 can be the setting of arbitrary shape, can realize that second bellying 121 is located first bellying 113 periphery, guarantees that the distance between the relative inside wall of both is for being more than or equal to 0.5, and just is less than or equal to 2mm all can.

In this embodiment, the first protrusion 113 and the second protrusion 121 are disposed in a square shape, and the distance between the inner sidewalls of the first protrusion 113 and the second protrusion 121 may be the same, such as 1 mm. Of course, the first protrusion 113 and the second protrusion 121 may have other shapes, for example, the first protrusion 113 is square, and the second protrusion 121 is rectangular, that is, the distance between the inner side walls of the first protrusion 113 and the second protrusion 121 may have two different values, for example, 1mm, 1.5mm, etc.

In an embodiment, with reference to fig. 2 and fig. 3, the distance between the second protrusion 121 and the first inner sidewall 114 is less than or equal to the extending height of the first protrusion 113 relative to the first inner sidewall 114, so that the air enters the air gap 15 through the distance between the second protrusion 121 and the first inner sidewall 114, and the air is pressed out at a higher speed to form a high-speed air flow, thereby improving the heat dissipation efficiency.

In one embodiment, the air inlet portion 112 includes a plurality of air inlets 1121. The plurality of air inlets 1121 is used for air flow. The shape of the air inlet 1121 may be any shape, for example, the air inlet 1121 may be a circle, a square, a hexagon, or the like, and is not limited herein. The number of the air inlets 1121 may be determined according to actual conditions. When the number of the air inlets 1121 is plural, the plural air inlets 1121 may be combined into different shapes, such as a circle or a polygon, and the like, which is not limited herein. In this embodiment, the air inlet 1121 is hexagonal. The plurality of wind inlets 1121 are arranged to form a circle, and have a shape similar to the overall shape of the wind module 2.

In practice, a filter structure (not shown) may be added to the air inlet 112 for filtering air and purifying the air quality entering the installation cavity 14. Wherein, the filtering structure can be a filter screen and the like.

In one embodiment, the vent 111 includes a plurality of vents 1111. Several vents 1111 are used for air flow. The shape and number of the ventilation openings 1111 can be determined according to actual conditions. Vent 1111, in this embodiment, is a lateral vent. Of course, in other embodiments, the ventilation opening 1111 may also be other shapes such as a vertical ventilation opening, and is not limited herein. In practice, a related filtering structure may be added at the ventilation portion 111, air may be filtered, and the like.

Referring to fig. 4, fig. 4 is an exploded schematic view of a heat dissipation device according to an embodiment of the present application. With reference to fig. 1 and 3, in an embodiment, the wind power assembly 2 comprises a driving fan 21 and a control panel 22. The driving fan 21 is connected to a control board 22, and the control board 22 is used to supply power to the driving fan 21 and control the driving fan 21. When the heat sink 10 is in operation, the control board 22 controls the driving fan 21 to operate, and the driving fan 21 draws air outside the heat sink 10 into the mounting cavity 14 through the air inlet portion 112, and forms a high-speed airflow into the ventilation cavity 13 after passing through the ventilation slot 15.

The driving fan 21 and the control board 22 are detachably mounted in the mounting chamber 14. As in the present embodiment, the driving fan 21 is mounted to the mounting chamber 14 at the position of the air inlet portion 112 by a plurality of screws.

In an embodiment, referring to fig. 2 to 4, the heat dissipation housing 1 includes a first cover plate 11 and a second cover plate 12. The first cover plate 11 and the second cover plate 12 are detachably connected. Wherein, the ventilation portion 111 and the air inlet portion 112 are disposed on the first cover plate 11. One side of the first cover plate 11 facing the second cover plate 12 is a first inner side wall 114, and the first protrusion 113 is protruded on the first inner side wall 114. One side of the second cover plate 12 facing the second cover plate 12 is a second inner sidewall 122, and the second protrusion 121 is protruded on the second inner sidewall 122. The first cover plate 11 and the second cover plate 12 are formed with the aforementioned mounting cavity 14, vent slit 15, and vent cavity 13 by the first protrusion 113 and the second protrusion 121.

The heat dissipation housing 1 is formed by the first cover plate 11 and the second cover plate 12, so that the heat dissipation device 10 can be conveniently installed and detached; meanwhile, the adaptability of the heat dissipation device 10 is improved.

The first cover plate 11 and the second cover plate 12 can be connected by various means, such as a snap connection, a bolt connection, a positioning connection, and the like. In one embodiment, the first cover plate 11 and the second cover plate 12 are detachably mounted to each other through the cooperation of the latch 17 and the latch slot 16. In an embodiment, as shown in fig. 4, a plurality of fastening grooves 16 are formed on the periphery of the first cover plate 11, a plurality of fasteners 17 are formed on the periphery of the second cover plate 12 facing the first cover plate 11, and the fasteners 17 are fastened in the fastening grooves 16, so as to connect the first cover plate 11 and the second cover plate 12. In another embodiment, a plurality of fasteners 17 are disposed on the periphery of the first cover plate 11, a plurality of fastener grooves 16 are disposed on the periphery of the second cover plate 12 facing the first cover plate 11, and the fasteners 17 are fastened in the fastener grooves 16 to connect the first cover plate 11 and the second cover plate 12.

In an embodiment, referring to fig. 1 and fig. 4, the first cover plate 11 is provided with recesses 115 at two ends of a side surface thereof facing away from the first inner sidewall 114. The concave portion 115 is a handle position, so that a user can conveniently install the first cover plate 11 on the second cover plate 12, and the installation efficiency is improved. By providing the air inlet portion 112 in the recessed portion 115, an installation position is provided for installing the air inlet portion 112, and the overall aesthetic appearance of the heat dissipation device 10 is improved.

Compared with the prior art, the ventilation part 111 is located at the middle position of one end of the heat dissipation shell 1 facing the external environment, and the air inlet part 112 is located at the periphery of the ventilation part 111, so that the wind power assembly 2 is arranged at the periphery of the middle position of the heat dissipation shell 1. In this way, the risk of the control board 22 inside the cabinet corroding due to the accumulation of dust and the like is reduced. At least one wind power assembly 2 enables air in the external environment to flow along the air inlet portion 112, the installation cavity 14 and the ventilating slits 15 in sequence to form high-speed air flow, and the high-speed air flow flows to the ventilating cavity 13, so that the air in the external environment enters the ventilating cavity 13 through the ventilating portion 111. Through the mode, the air can be accelerated to dissipate heat of the electronic component, and the heat dissipation efficiency is improved.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a chassis according to an embodiment of the present application. With reference to fig. 1 to 4, the present application provides a chassis 100, where the chassis 100 includes a chassis body 1001 and a heat dissipation device 10. The heat sink 10 is disposed at an end of the chassis 1001. The heat dissipation device 10 is used for dissipating heat of electronic components in the chassis body 1001. It should be noted that the heat dissipation device 10 described in the present embodiment is the heat dissipation device 10 described in the above embodiments, and is not limited herein.

In practical applications, when the heat sink 10 is applied to the chassis 100, the first cover 11 of the heat sink 10 is a decorative plate of the chassis. The decorative board of the case is arranged at the front part of the case 100, does not occupy the space of the case 100, and has the functions of decoration and preventing the hard disk and the like from being taken by mistake. In the embodiment, the ventilation part 111 and the air inlet part 112 are arranged on the decorative plate, so that the air inlet amount of the case 100 is increased, and the heat dissipation performance and the air inlet uniformity are improved; meanwhile, no fan is provided inside the enclosure 100, the internal space of the enclosure body 1001 is saved, and the enclosure 100 is highly densified.

In addition, the heat dissipation device 10 is disposed at an end of the chassis body 1001, and does not occupy the internal space of the chassis body 1001, so as to implement a high-density design of the internal modules of the chassis body 1001, such as disposing more hard disks. The electronic components in the chassis body 1001 may be a hard disk, a motherboard, or the like.

Compared with the prior art, the chassis 100 in the present embodiment can improve the heat dissipation efficiency and the service life through the heat dissipation device 10.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the embodiment of the present application, all directional indicators (such as up, down, left, right, front, rear \8230;) are used only to explain the relative positional relationship between the components, the motion situation, etc. at a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. A process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to the listed steps or elements but may alternatively include additional steps or elements not listed or inherent to such process, method, article, or apparatus.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims (10)

1. A heat sink, characterized in that the heat sink (10) comprises:

the heat dissipation device comprises a heat dissipation shell (1), wherein one end, facing the external environment, of the heat dissipation shell (1) is provided with a ventilation part (111) and an air inlet part (112), the ventilation part (111) is located in the middle position of one end, facing the external environment, of the heat dissipation shell (1), and the air inlet part (112) is located on the periphery of the ventilation part (111); an installation cavity (14) and an air vent (15) are formed at one end, away from the external environment, of the heat dissipation shell (1), the installation cavity (14) is communicated with the air inlet portion (112), a ventilation cavity (13) is formed in the heat dissipation shell (1), the ventilation cavity (13) is communicated with the ventilation portion (111), and the air vent (15) is communicated between the ventilation cavity (13) and the installation cavity (14);

at least one wind power assembly (2), the wind power assembly (2) being arranged in the installation cavity (14) and close to the air inlet portion (112);

the wind power assembly (2) enables air in the external environment to flow along the air inlet portion (112), the installation cavity (14) and the ventilating gap (15) in sequence to form high-speed air flow, the high-speed air flow flows to the ventilating cavity (13), and therefore the air in the external environment enters the ventilating cavity (13) through the ventilating portion (111).

2. The heat sink according to claim 1, wherein the heat sink housing (1) comprises a first inner side wall (114) and a second inner side wall (122) which are oppositely arranged, the first inner side wall (114) is surrounded by a first protruding portion (113), the second inner side wall (122) is surrounded by a second protruding portion (121), the second protruding portion (121) is located at the periphery of the first protruding portion (113), and the first protruding portion (113) is located at the periphery of the ventilation portion (111);

the vent slits (15) are formed between the opposite inner side surfaces of the first protrusion (113) and the second protrusion (121), and between the second protrusion (121) and the first inner side wall (114).

3. The heat sink according to claim 2, wherein the distance between the inner side walls of the first protrusion (113) and the second protrusion (121) is greater than or equal to 0.5mm and less than or equal to 2mm.

4. The heat sink according to claim 2, wherein a distance between the second protrusion (121) and the first inner sidewall (114) is less than or equal to an extension height of the first protrusion (113) with respect to the first inner sidewall (114).

5. The heat dissipating device of claim 1, wherein the air inlet portion (112) comprises a plurality of air inlets (1121); and/or the ventilation portion (111) comprises several ventilation openings (1111).

6. The heat sink according to claim 1, wherein the wind power assembly (2) comprises a driving fan (21) and a control board (22), the driving fan (21) is connected with the control board (22), and both the driving fan (21) and the control board (22) are detachable in the mounting cavity (14).

7. The heat dissipating device according to claim 2, wherein the heat dissipating housing (1) comprises a first cover plate (11) and a second cover plate (12), the first cover plate (11) and the second cover plate (12) are detachably connected, a side of the first cover plate (11) facing the second cover plate (12) is the first inner side wall (114), a side of the second cover plate (12) facing the first cover plate (11) is the second inner side wall (122), the first cover plate (11) and the second cover plate (12) are formed with the mounting cavity (14), the vent slit (15) and the vent cavity (13) by the first protruding portion (113) and the second protruding portion (121), and the vent portion (111) and the air inlet portion (112) are both provided on the first cover plate (11).

8. The heat sink according to claim 7, wherein the air inlet portions (112) are disposed on both sides of the first cover plate (11), the ventilation portion (111) is located between the two air inlet portions (112), and the wind power assemblies (2) are disposed on both sides of the mounting cavity (14).

9. The heat sink according to claim 7, wherein one of the first cover plate (11) and the second cover plate (12) is provided with a snap groove (16), and the other is provided with a snap (17), and the snap (17) is snapped into the snap groove (16).

10. A chassis, characterized in that, the chassis (100) includes a chassis body (1001) and a heat sink (10), the heat sink (10) is the heat sink (10) according to any one of claims 1 to 9, the heat sink (10) is disposed at an end of the chassis body (1001), and the heat sink (10) is used for dissipating heat of electronic components in the chassis body (1001).

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