CN217822686U - BIN material casket mechanism - Google Patents
BIN material casket mechanism Download PDFInfo
- Publication number
- CN217822686U CN217822686U CN202220885328.6U CN202220885328U CN217822686U CN 217822686 U CN217822686 U CN 217822686U CN 202220885328 U CN202220885328 U CN 202220885328U CN 217822686 U CN217822686 U CN 217822686U
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- Prior art keywords
- magazine
- wafer
- material box
- riser
- wafer chip
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a BIN material casket mechanism, concretely relates to wafer chip transportation field, including the magazine bottom plate, the both sides fixedly connected with magazine riser of magazine bottom plate one and magazine riser two, through magazine backup pad and magazine curb plate fixed connection between magazine riser one and the magazine riser two, magazine curb plate and magazine backup pad set up about magazine riser symmetry, a silo has been seted up to corresponding on magazine riser one and the magazine riser two, has seted up a silo in square box, inserts the wafer ironsheet that contains wafer chip wherein to prevent that the wafer ironsheet from placing the in-process slope at the magazine, improve the degree of protection to wafer chip, the wafer ironsheet is because a carrier that has constituted wafer chip, so in follow-up transport link, the existence of wafer ironsheet can let wafer chip provide a stress point when the transportation to normally accomplish the transportation work of wafer chip when guaranteeing not to damage wafer chip.
Description
Technical Field
The utility model relates to a wafer chip transportation field, more specifically say, the utility model relates to a BIN material casket mechanism.
Background
In the existing storage device for placing the wafer chips, a trough is not arranged for storing the wafer chips, so that the wafer chips are shaken in the process of batch transportation, and the wafer chips are damaged.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the utility model provides a BIN material casket mechanism, the utility model aims to solve the technical problem that: when the existing equipment transports the wafer chips, the wafer chips have larger damage risks.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a BIN material casket mechanism, includes the magazine bottom plate, the both sides fixedly connected with magazine riser I and magazine riser II of magazine bottom plate, pass through magazine backup pad and magazine curb plate fixed connection between magazine riser I and the magazine riser II, magazine curb plate and magazine backup pad are about a magazine riser symmetrical setting, a silo has been seted up to correspondence on magazine riser I and the magazine riser II.
Preferably, a placing area for placing the wafer chip is arranged on the wafer iron sheet.
Preferably, a plurality of square magnets are fixedly connected to the material box bottom plate, and the wafer iron sheet is located above the square magnets.
Preferably, a material box handle shaft is fixedly connected to the material box side plate, and a material box handle is rotatably connected to the material box handle shaft.
Preferably, the number of the magazine handles is two, and the two magazine handles are symmetrically arranged on the magazine side plate.
The utility model discloses a technological effect and advantage: through by magazine riser one, magazine riser two, a silo has been seted up in the square box that magazine backup pad and magazine curb plate constitute, can insert wherein the wafer iron sheet that contains wafer chip, so as to prevent the slope of wafer iron sheet in the material casket placing process, thereby can improve the protection degree to wafer chip, wafer iron sheet is because a carrier of wafer chip has been constituted in addition, so in follow-up transport link, utilize iron sheet conveying mechanism and iron sheet clamp to get the mechanism and just can accomplish the transportation to wafer chip, later select separately on carrying the wafer iron sheet to primary ring fixture mechanism, wafer iron sheet's existence can let wafer chip provide a stress point when the transportation, normally accomplish the transportation work of wafer chip when in order to guarantee not damaging wafer chip.
Drawings
Fig. 1 is a schematic structural diagram of a BIN magazine mechanism of the present invention.
The reference signs are:
1. a first material box vertical plate; 2. a second material box vertical plate; 3. a magazine support plate; 4. a magazine side plate; 5. a wafer iron sheet; 6. a magazine base; 7. a square magnet; 8. a cartridge handle; 9. a magazine handle shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example one
Referring to fig. 1, a BIN magazine mechanism includes a magazine base plate 6, a magazine vertical plate 1 and a magazine vertical plate 2 are fixedly connected to two sides of the magazine base plate 6, the magazine vertical plate 1 and the magazine vertical plate 2 are fixedly connected through a magazine supporting plate 3 and a magazine side plate 4, the magazine side plate 4 and the magazine supporting plate 3 are symmetrically arranged with respect to the magazine vertical plate 1, and 25 material slots are correspondingly formed in the magazine vertical plate 1 and the magazine vertical plate 2. And a placing area for placing a wafer chip is fixedly connected to the wafer iron sheet 5. Through having seted up 25 silos in the square box that comprises magazine riser one 1, magazine riser two 2, magazine backup pad 3 and magazine curb plate 4, can insert wherein wafer iron sheet 5 that contains wafer chip, so as to prevent that the wafer iron sheet from placing the in-process slope at the magazine, thereby can improve the protection degree to wafer chip, wafer iron sheet 5 is because a carrier of wafer chip has been constituted in addition, so in follow-up transport link, utilize iron sheet conveying mechanism and iron sheet clamp to press from both sides the mechanism and just can accomplish the transportation to wafer chip, later select separately on carrying wafer iron sheet 5 to primary and secondary ring fixture mechanism, wafer iron sheet 5's existence can let wafer chip provide a stress point when the transportation, normally accomplish the transportation work of wafer chip when guaranteeing not to damage wafer chip.
Example two
Referring to fig. 1, on the basis of the above embodiment, a plurality of square magnets 7 are fixedly connected to the magazine base 6, and the wafer iron sheet 5 is located above the square magnets 7. The arrangement of the square magnet 7 can play an attraction role on the wafer iron sheet 5, so that the wafer iron sheet 5 can be prevented from accidentally sliding off from the trough, and the safety and reliability of the design in use can be further improved.
A material box handle shaft 9 is fixedly connected to the material box side plate 4, and a material box handle 8 is rotatably connected to the material box handle shaft 9. The number of the material box handles 8 is two, and the two material box handles 8 are symmetrically arranged on the material box side plate 4. For convenient to carry, still rotate on magazine curb plate 4 and be connected with two magazine handles 8, magazine handle 8 is for loading and unloading convenience, and two magazine handles 8 can provide a balanced atress condition for when the user is through carrying the box in order to transport wafer chip, the box can be in a comparatively balanced state, and the magnetic attraction of square magnet 7 in addition can further prevent that the accident of wafer iron sheet 5 from dropping, thereby has improved the security that this design used.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The utility model provides a BIN magazine mechanism, includes magazine bottom plate (6), its characterized in that: the two sides of the material box bottom plate (6) are fixedly connected with a material box vertical plate I (1) and a material box vertical plate II (2), the material box vertical plate I (1) and the material box vertical plate II (2) are fixedly connected through a material box supporting plate (3) and a material box side plate (4), the material box side plate (4) and the material box supporting plate (3) are symmetrically arranged relative to the material box vertical plate I (1), and 25 material grooves are correspondingly formed in the material box vertical plate I (1) and the material box vertical plate II (2); a plurality of square magnets (7) are fixedly connected to the material box bottom plate (6), and the wafer iron sheet (5) is located above the square magnets (7); and the wafer iron sheet (5) is provided with a placing area for placing a wafer chip.
2. The BIN magazine mechanism of claim 1, wherein: the feed box side plate (4) is fixedly connected with a feed box handle shaft (9), and the feed box handle shaft (9) is rotatably connected with a feed box handle (8).
3. The BIN magazine mechanism of claim 2, wherein: the number of the material box handles (8) is two, and the two material box handles (8) are symmetrically arranged on the material box side plate (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220885328.6U CN217822686U (en) | 2022-04-18 | 2022-04-18 | BIN material casket mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220885328.6U CN217822686U (en) | 2022-04-18 | 2022-04-18 | BIN material casket mechanism |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217822686U true CN217822686U (en) | 2022-11-15 |
Family
ID=83981780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202220885328.6U Active CN217822686U (en) | 2022-04-18 | 2022-04-18 | BIN material casket mechanism |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217822686U (en) |
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2022
- 2022-04-18 CN CN202220885328.6U patent/CN217822686U/en active Active
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