CN217820704U

CN217820704U - Electrical property detection equipment for semiconductor chip

Info

Publication number: CN217820704U
Application number: CN202221662912.1U
Authority: CN
Inventors: 黄曙伟; 马楚海
Original assignee: Shenzhen Weiye Yongsheng Technology Co ltd
Current assignee: Shenzhen Weiye Yongsheng Technology Co ltd
Priority date: 2022-06-29
Filing date: 2022-06-29
Publication date: 2022-11-15
Anticipated expiration: 2032-06-29

Abstract

The utility model discloses an electrical property check out test set that semiconductor chip used, the on-line screen storage device comprises a base, the top symmetry fixed mounting of base has two conveyor components, single conveyor components's outer surface mounting has the motor, two install the transmission shaft between the conveyor components jointly, two a plurality of connecting pieces, adjacent two conveyor components all installs a plurality of connecting pieces, two install the standing groove jointly between the connecting piece, top one side fixedly connected with support of base, the telescopic link is installed at the top of support, the expansion end fixed mounting of telescopic link has the pick-up plate. The utility model adopts the assembly line design, which can detect the semiconductor chip more rapidly and meet the detection requirements of some big companies; through the connecting piece and the detachable conversion board that set up again, can change corresponding standing groove, conversion board and probe card according to the semiconductor chip of different model specifications to increase whole suitability.

Description

Electrical property detection equipment for semiconductor chip

Technical Field

The utility model relates to a chip technology field especially relates to an electrical property check out test set that semiconductor chip used.

Background

The chip is also called as microchip, which means a silicon chip containing integrated circuits and has a small volume. The complexity of chips is higher and higher, and in order to ensure that the chips leave a factory without problems, testing needs to be performed before leaving the factory to ensure functional integrity and the like;

there are tens of thousands of chips in big company's the chip of flowing water every day, and the pressure of test is very big, and prior art publication number is CN 211206699U's a semiconductor chip electrical property detection device, including fixing base, support, slide, motor fixing base, slip motor, slide bar, slip table, chip standing groove, detection mechanism and controller, the support is located on the fixing base, the slide is located on the support, the motor fixing base is located on the support lateral wall, the slip motor is located on the motor fixing base, the slide bar slidable is located on the motor fixing base, the slide bar is located on the slip motor output, the slide bar top is located to slip table one end, the slip table other end slidable is located in the slide, the slip table top is located to the chip standing groove, detection mechanism locates the support top and locates chip standing groove top, the controller is located on the detection mechanism. Although the detection efficiency is improved, the detection requirements of large companies are still difficult to meet, and the assembly line type operation is also not facilitated.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing an electrical property detection device for a semiconductor chip.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides an electrical property check out test set that semiconductor chip used, includes the base, the top symmetry fixed mounting of base has two conveyor components, single conveyor component's outer surface mounting has the motor, two install the transmission shaft jointly between the conveyor component, two a plurality of connecting pieces are all installed to conveyor component, adjacent two install the standing groove jointly between the connecting piece, top one side fixedly connected with support of base, the telescopic link is installed at the top of support, the expansion end fixed mounting of telescopic link has the pick-up plate, the bottom of pick-up plate can be dismantled and be connected with the converter plate, the bottom fixed mounting of converter plate has the probe card.

Further, two conveying assembly all includes the casing, and fixed connection between casing and the base, the inside symmetry of casing rotates and is connected with driving gear and driven gear, and fixed connection between the drive shaft of motor and the gear shaft of adjacent driving gear, and fixed connection between the gear shaft of driving gear and the transmission shaft, common meshing is connected with the chain between driving gear and the driven gear, the chain is close to a plurality of installation pieces of the equal fixedly connected with in one side of standing groove, and the installation piece passes through welded connection on the chain surface, can guarantee the joint strength between installation piece and the chain.

Furthermore, bearings are jointly installed between the gear shafts of the driving gear and the driven gear and the shell, inner rings of the bearings are fixedly connected with the outer surface of the gear shaft, outer rings of the bearings are fixedly connected with the shell, the bearings not only have a supporting effect on the gear shafts, but also reduce friction force when the gear shafts rotate.

Further, it is a plurality of the connecting piece all includes a fixed section of thick bamboo, and fixed connection between a fixed section of thick bamboo and the installation piece, the inside fixedly connected with spring of a fixed section of thick bamboo, the one end fixedly connected with limiting plate of installation piece is kept away from to the spring, one side fixedly connected with locating piece of spring is kept away from to the limiting plate, and the locating piece run through the inside of a fixed section of thick bamboo perpendicularly extend to the surface and with fixed section of thick bamboo between sliding connection, sliding connection between locating piece and the fixed section of thick bamboo can guarantee that the stability of locating piece stretches out.

Further, a stroke groove has been seted up at the top of solid fixed cylinder, and the inside sliding connection in stroke groove has the push pedal, and fixed connection between push pedal and the limiting plate, and the surface of push pedal is equipped with anti-skidding line to increase push pedal surface friction, avoid taking place the phenomenon of skidding.

Further, it is a plurality of the equal fixedly connected with position sleeve in surface both sides of standing groove, and the phase-match between position sleeve and the locating piece has location and spacing effect, can not take place the skew after guaranteeing the constant head tank installation and accomplishing.

Furthermore, a bolt is connected between the detection plate and the conversion plate, so that the detection plate can be mounted and dismounted conveniently.

Further, a controller is fixedly mounted on one side of the top of the support, and the controller is electrically connected with the motor, the telescopic rod and the detection board, so that the operation of the motor, the telescopic rod and the detection board can be controlled conveniently.

Furthermore, the detection plate is electrically connected with the conversion plate, and the conversion plate is electrically connected with the probe plate, so that the detection of the semiconductor chip is facilitated.

The utility model has the advantages that:

when the utility model is used, the whole electrical property detection device for the semiconductor chip adopts the assembly line type design, the detection of the semiconductor chip is more rapid, and the detection requirements of some big companies can be met; through the connecting piece and the detachable change-over panel that set up again, can change corresponding standing groove, change-over panel and probe card according to the semiconductor chip of different model specifications to increase whole suitability.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of the conveying assembly of the present invention;

FIG. 3 is a schematic view of the connection between the connecting member and the positioning sleeve of the present invention;

fig. 4 is a schematic view of the connection between the conversion board, the probe card and the detection board of the present invention.

Illustration of the drawings:

1. a base; 2. a delivery assembly; 21. a chain; 22. a housing; 23. mounting a block; 24. a driving gear; 25. a driven gear; 3. a connecting member; 31. a fixed cylinder; 32. a spring; 33. a stroke slot; 34. pushing the plate; 35. positioning a block; 36. a limiting plate; 4. a telescopic rod; 5. a controller; 6. a support; 7. detecting a plate; 8. a placement groove; 81. a positioning sleeve; 9. a motor; 10. a drive shaft; 11. a probe card; 12. a conversion panel.

Detailed Description

Fig. 1 to fig. 4 show, an electrical property check out test set that semiconductor chip used is related to, including base 1, the top symmetry fixed mounting of base 1 has two conveyor components 2, single conveyor component 2's outer surface mounting has motor 9, install transmission shaft 10 between two conveyor components 2 jointly, a plurality of connecting pieces 3 are all installed to two conveyor components 2, install standing groove 8 jointly between two adjacent connecting pieces 3, top one side fixedly connected with support 6 of base 1, telescopic link 4 is installed at the top of support 6, telescopic link 4's movable end fixed mounting has pick-up plate 7, the bottom detachable connection of pick-up plate 7 has converter plate 12, the bottom fixed mounting of converter plate 12 has probe card 11.

The controller 5 is fixedly installed on one side of the top of the support 6, and the controller 5 is electrically connected with the motor 9, the telescopic rod 4 and the detection plate 7.

The detection board 7 is electrically connected with the conversion board 12, and the conversion board 12 is electrically connected with the probe board 11.

As shown in fig. 2, the two conveying assemblies 2 each include a housing 22, and the housing 22 is fixedly connected to the base 1, the housing 22 is connected to a driving gear 24 and a driven gear 25 in a symmetrical manner, a driving shaft of the motor 9 is fixedly connected to a gear shaft of the adjacent driving gear 24, the gear shaft of the driving gear 24 is fixedly connected to the transmission shaft 10, the driving gear 24 and the driven gear 25 are connected to each other by a chain 21 in a meshed manner, and the chain 21 is connected to a plurality of mounting blocks 23 in a fixed manner on one side close to the placement groove 8.

The bearings are installed between the gear shafts of the driving gear 24 and the driven gear 25 and the shell 22, the inner rings of the bearings are fixedly connected with the outer surface of the gear shaft, and the outer rings of the bearings are fixedly connected with the shell 22.

As shown in fig. 3, the plurality of connecting members 3 each include a fixing cylinder 31, and a fixing connection is formed between the fixing cylinder 31 and the mounting block 23, a spring 32 is fixedly connected inside the fixing cylinder 31, a limiting plate 36 is fixedly connected to one end of the spring 32 far away from the mounting block 23, a positioning block 35 is fixedly connected to one side of the limiting plate 36 far away from the spring 32, and the positioning block 35 vertically penetrates through the inside of the fixing cylinder 31, extends to the outer surface, and is slidably connected with the fixing cylinder 31.

The top of the fixed cylinder 31 is provided with a stroke groove 33, the inside of the stroke groove 33 is slidably connected with a push plate 34, and the push plate 34 is fixedly connected with the limit plate 36.

The equal fixedly connected with position sleeve 81 in surface both sides of a plurality of standing grooves 8, and between position sleeve 81 and the locating piece 35 the phase-match.

As shown in fig. 4, a bolt is commonly connected between the detection plate 7 and the changeover plate 12.

When the electrical property detection device for the semiconductor chip is used, firstly, the corresponding conversion plate 12 is fixedly installed on the detection plate 7 through a bolt according to the specification of the semiconductor chip to be detected, then the limiting plate 36 is pushed to move through the push plate 34 until the top end of the locating block 35 is flush with the outer surface of the fixed cylinder 31, then the placing groove 8 is placed between the two locating blocks 35, then the push plate 34 is released, the locating block 35 enters the inside of the locating sleeve 81 under the action of the spring 32, so that the installation of the placing groove 8 is completed, then the semiconductor chip is placed in the inside of the placing groove 8, then the motor 9 is started, the motor 9 drives the adjacent driving gear 24 to rotate, so that the other driving gear 24 is driven to rotate through the transmission shaft 10, then the two driven gears 25 are matched, so that the two chains 21 rotate, the chains 21 drive the placing groove 8 to move through the installation block 23 and the connecting piece 3 until the semiconductor chip is located under the probe plate 11, the motor 9 stops operating, the telescopic rod 4 drives the detection plate 7 to move downwards, so that the conversion plate 11 is driven to move downwards, until the probes of the probe plate 11 are in contact with the semiconductor chip, and then the detection is started, after the detection is completed, the detection of the motor assembly 11 is driven by the motor 2 to operate, and the motor assembly 2 to reset.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. An electrical property detection apparatus for a semiconductor chip, comprising a base (1), characterized in that: the utility model discloses a portable electronic device, including base (1), base, transmission assembly (2), two, transmission assembly (2) and movable end fixed mounting, the top symmetry fixed mounting of base (1) has two transmission assembly (2), singly the surface mounting of transmission assembly (2) has motor (9), two install transmission shaft (10), two jointly between transmission assembly (2) a plurality of connecting pieces (3), adjacent two install standing groove (8) jointly between connecting piece (3), top one side fixedly connected with support (6) of base (1), telescopic link (4) are installed at the top of support (6), the expansion end fixed mounting of telescopic link (4) has pick-up plate (7), the bottom of pick-up plate (7) can be dismantled and be connected with converter plate (12), the bottom fixed mounting of converter plate (12) has probe plate (11).

2. The electrical property inspection apparatus for semiconductor chips as claimed in claim 1, wherein: two conveyor components (2) all include casing (22), and fixed connection between casing (22) and base (1), the inside symmetry of casing (22) is rotated and is connected with driving gear (24) and driven gear (25), and fixed connection between the drive shaft of motor (9) and the gear shaft of adjacent driving gear (24), and fixed connection between the gear shaft of driving gear (24) and transmission shaft (10), common meshing is connected with chain (21) between driving gear (24) and driven gear (25), chain (21) are close to a plurality of installation pieces of the equal fixedly connected with in one side of standing groove (8) (23).

3. An electrical property inspection apparatus for semiconductor chips as defined in claim 2, wherein: and bearings are arranged between the gear shafts of the driving gear (24) and the driven gear (25) and the shell (22) together, inner rings of the bearings are fixedly connected with the outer surface of the gear shaft, and outer rings of the bearings are fixedly connected with the shell (22).

4. An electrical property inspection apparatus for semiconductor chips as defined in claim 2, wherein: a plurality of connecting piece (3) all include solid fixed cylinder (31), and fixed connection between solid fixed cylinder (31) and installation piece (23), the inside fixedly connected with spring (32) of solid fixed cylinder (31), one end fixedly connected with limiting plate (36) of installation piece (23) are kept away from in spring (32), one side fixedly connected with locating piece (35) of spring (32) are kept away from in limiting plate (36), and locating piece (35) run through solid fixed cylinder (31) inside perpendicularly extend to the surface and with solid fixed cylinder (31) between sliding connection.

5. The electrical property inspection apparatus for semiconductor chips as claimed in claim 4, wherein: stroke groove (33) have been seted up at the top of fixed cylinder (31), and the inside sliding connection in stroke groove (33) has push pedal (34), and fixed connection between push pedal (34) and limiting plate (36).

6. An electrical property inspection apparatus for semiconductor chips as defined in claim 4, wherein: a plurality of positioning sleeves (81) are fixedly connected to two sides of the outer surface of the placing groove (8), and the positioning sleeves (81) are matched with the positioning blocks (35).

7. An electrical property inspection apparatus for semiconductor chips as defined in claim 1, wherein: and a bolt is connected between the detection plate (7) and the conversion plate (12) together.

8. An electrical property inspection apparatus for semiconductor chips as defined in claim 1, wherein: the controller (5) is fixedly mounted on one side of the top of the support (6), and the controller (5) is electrically connected with the motor (9), the telescopic rod (4) and the detection plate (7).

9. An electrical property inspection apparatus for semiconductor chips as defined in claim 1, wherein: the detection plate (7) is electrically connected with the conversion plate (12), and the conversion plate (12) is electrically connected with the probe plate (11).