CN217820492U

CN217820492U - Testing mechanism

Info

Publication number: CN217820492U
Application number: CN202221586925.5U
Authority: CN
Inventors: 肖才
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-11-15
Anticipated expiration: 2032-06-22

Abstract

The present disclosure provides a testing mechanism. The test mechanism comprises a test device for testing the current of the electronic device. The testing device comprises a testing part and a driving part connected with the testing part. The test component comprises a needle plate connected with the driving component and a probe connected below the needle plate, the needle plate is driven to move along the vertical direction through the driving component, the probe is driven to move along the vertical direction along with the needle plate, and then the probe is in butt joint with the test contact of the electronic equipment. So, through mutually supporting of driver part and faller, can realize that the probe moves along vertical direction along with the faller, and then with the full-automatic purpose of butt joint of electronic equipment's test contact to make the test part can carry out full-automatic test to electronic equipment's electric current. Compared with the scheme of testing the current of the electronic equipment through semi-automatic and manual combination in the related art, the scheme of the disclosure effectively improves the automation rate and efficiency of the current test of the electronic equipment by the test component.

Description

Testing mechanism

Technical Field

The utility model relates to an intelligent terminal field especially relates to a accredited testing organization.

Background

In the field of intelligent terminals, after electronic equipment is assembled, a series of tests are required. Particularly, the motherboard current of the electronic device needs to be tested, so that whether the motherboard current of the electronic device has a problem can be determined, and the use performance of the electronic device is not affected. However, in the related art, the test is performed by a combination of semi-automatic and manual methods, which results in a problem of low test efficiency.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a testing mechanism that aims to improve the efficiency of testing the current of an electronic device.

The present disclosure provides a test mechanism, wherein, include:

the test device is used for testing the current of the electronic equipment and comprises a test component and a driving component connected with the test component;

the test component comprises a needle plate connected with the driving component and a probe connected below the needle plate, the needle plate is driven by the driving component to move in the vertical direction, the probe is driven to move along with the needle plate in the vertical direction, and then the probe is in butt joint with the test contact of the electronic equipment.

Optionally, the testing device further comprises a supporting member, and the driving member is disposed on the supporting member;

the needle plate comprises a first plate and a second plate, wherein the first plate is connected to the bottom of the supporting part; the probe is connected to the bottom of the second plate; the second plate is connected with the driving part and located below the first plate, and the driving part drives the second plate to move in the vertical direction to drive the first plate to move in the vertical direction.

Optionally, the probe comprises a fixed end and a free end, wherein the fixed end is connected with the bottom of the second plate; the free end extends downwards along the vertical direction; the driving part drives the second plate to move in the direction close to the electronic equipment, and the free end is driven to move in the vertical direction.

Optionally, the testing mechanism further comprises a transmission device, the transmission device is arranged below the testing device, and the transmission device is provided with a positioning hole; a positioning piece is arranged at the bottom of the first plate; when the transmission device moves to a position corresponding to the test component along the vertical direction, the positioning piece is connected with the positioning hole.

Optionally, the supporting component includes a fixing frame and a plurality of supporting columns for supporting the fixing frame; the driving part is arranged above the fixed frame; the first plate is connected to the bottom of the fixing frame.

Optionally, the support member further comprises a fixing member; the fixing frame comprises a mounting hole; the fixing frame penetrates through the mounting hole through the fixing piece and is movably connected with the first plate.

Optionally, a first gap is formed between the fixing piece and the wall of the mounting hole; and

a second gap is formed between the fixed frame and the first plate.

Optionally, the testing device further comprises a hinge; the first side of the fixing frame is connected with the supporting column through the hinge piece, and the second side of the fixing frame is movably connected with the supporting column.

Optionally, the testing mechanism further comprises a telescopic device connected with the fixing frame; when the fixing frame is turned upwards around the hinge, the telescopic device is used for supporting the fixing frame.

Optionally, the testing device further comprises a spring member connected between the fixing frame and the first plate.

The present disclosure provides a testing mechanism including a testing device for testing current of an electronic device. The testing device comprises a testing part and a driving part connected with the testing part. The test component comprises a needle plate connected with the driving component and a probe connected below the needle plate, the needle plate is driven to move along the vertical direction through the driving component, the probe is driven to move along the vertical direction along with the needle plate, and then the probe is in butt joint with the test contact of the electronic equipment. So, through mutually supporting of drive disk assembly and faller, can realize that the probe moves along vertical direction along with the faller, and then with the full-automatic purpose of butt joint of the test contact of electronic equipment to make the test component can carry out full-automatic test to electronic equipment's electric current. Compared with the scheme of testing the current of the electronic equipment through semi-automatic and manual combination in the related art, the scheme of the disclosure effectively improves the automation rate and efficiency of the current test of the electronic equipment by the test component.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

FIG. 1 is a schematic structural diagram of a testing mechanism provided by the present disclosure;

FIG. 2 is a schematic diagram of a testing device of the testing mechanism shown in FIG. 1;

FIG. 3 is a side view of one embodiment of the testing device shown in FIG. 2;

FIG. 4 is a front view of one embodiment of the test device shown in FIG. 2;

FIG. 5 is an enlarged view of a portion A of the test apparatus shown in FIG. 4;

fig. 6 is a schematic view of a part of the testing mechanism shown in fig. 1.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of devices consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in the description and claims does not indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise indicated, "front," "back," "lower," and/or "upper," and the like are for convenience of description, and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. As used in this disclosure and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

The present disclosure provides a testing mechanism. The test mechanism comprises a test device for testing the current of the electronic device. The testing device comprises a testing part and a driving part connected with the testing part. The test component comprises a needle plate connected with the driving component and a probe connected below the needle plate, the needle plate is driven to move along the vertical direction through the driving component, the probe is driven to move along the vertical direction along with the needle plate, and then the probe is in butt joint with the test contact of the electronic equipment. So, through mutually supporting of drive disk assembly and faller, can realize that the probe moves along vertical direction along with the faller, and then with the full-automatic purpose of butt joint of the test contact of electronic equipment to make the test component can carry out full-automatic test to electronic equipment's electric current. Compared with the scheme of testing the current of the electronic equipment through semi-automatic and manual combination in the related art, the scheme of the disclosure effectively improves the automation rate and efficiency of the current test of the electronic equipment by the test component.

Fig. 1 is a schematic structural diagram of a testing mechanism 1 provided by the present disclosure. Fig. 2 is a schematic structural diagram of the testing device 4 of the testing mechanism 1 shown in fig. 1. Referring to fig. 1 and fig. 2, after the electronic device 2 is assembled, a testing mechanism 1 is required to be used for testing the motherboard current of the electronic device 2 to determine whether the motherboard current of the electronic device 2 has a problem, so as to avoid affecting the usability of the electronic device 2. The testing arrangement 1 comprises a testing device 4 for testing the current of the electronic device 2. The test device 4 comprises a test part 6 and a drive part 7 to which the test part 6 is connected. The test component 6 comprises a needle plate 19 connected with the driving component 7 and a probe 20 connected below the needle plate 19, the needle plate 19 is driven to move along the vertical direction through the driving component 7, the probe 20 is driven to move along the vertical direction along with the needle plate 19, and then the probe is in butt joint with a test contact of the electronic equipment. When the electronic device 2 is located at a position corresponding to the testing component 6 in the vertical direction, and the testing contact of the electronic device 2 is opposite to the probe 20, the driving component 7 further drives the needle plate 19 to move downwards, so that the probe 20 moves downwards along with the downward movement and is in butt joint with the testing contact of the electronic device 2, and then the probe 20 can test the mainboard current of the electronic device 2. So, through mutually supporting of drive unit 7 and faller 19, can realize that probe 20 moves along vertical direction along with faller 19, and then with the full-automatic purpose of butt joint of the test contact of electronic equipment 2 to make test unit 6 can carry out full-automatic test to electronic equipment 2's mainboard electric current. Compared with the scheme of testing the mainboard current of the electronic equipment 2 through semi-automatic and manual combination in the related art, the scheme of the disclosure effectively improves the automation rate and efficiency of the test component 6 for testing the mainboard current of the electronic equipment 2. In some embodiments, the electronic device 2 may be a smart terminal product such as a mobile phone, an ipad, a laptop computer, and the like. In some embodiments, the drive member 7 comprises a pneumatic cylinder.

FIG. 3 is a side view of one embodiment of the test device shown in FIG. 2. FIG. 4 is a front view of one embodiment of the testing device 4 shown in FIG. 2. As shown in connection with fig. 1-4. In some embodiments, the testing device 4 further comprises a support member 15, the drive member 7 being provided to the support member 15. The needle plate 19 includes a first plate 29 and a second plate 30 stacked one on another. Wherein the first plate 29 is connected to the bottom of the support member 15. The probe 20 is connected to the bottom of the second plate 30; the second plate 30 is connected with the driving part 7 and located below the first plate 29, and the driving part 7 drives the second plate 30 to move along the vertical direction, so as to drive the first plate 29 to move along the vertical direction. In this embodiment, the second plate 30 can float up and down in the vertical direction with respect to the second plate 30 by the driving of the driving part 7. When the electronic device 2 is located at a position corresponding to the testing component 6 in the vertical direction, and the testing contact of the electronic device 2 is right opposite to the probe 20, the driving component 7 can drive the second plate 30 to move downwards, so that the probe 20 moves downwards along with the second plate 30 to be in butt joint with the testing contact of the electronic device 2, and then the probe 20 can test the main board current of the electronic device 2.

In some embodiments, the probe 20 includes a fixed end 23 and a free end 24, wherein the fixed end 23 is connected to the bottom of the second plate 30, the free end 24 extends downward along the vertical direction, and the driving part 7 drives the second plate 30 to move in a direction close to the electronic device 2, so as to drive the free end 24 to move along the vertical direction. In this embodiment, the bottom of the driving part 7 is connected to the top surface of the second plate member 30. The second plate member 30 can move up and down in the vertical direction in accordance with the telescopic movement of the driving part 7. Further, the second plate 30 can drive the probe 20 at the bottom thereof to move up and down in the vertical direction. In this way, the probe 20 can be conveniently and accurately butted with the test contact of the electronic device 2, so as to achieve the purpose that the probe 20 detects the main board current of the electronic device 2.

As shown in FIG. 3, in some embodiments, the testing device 4 further includes a spring member 35 coupled between the mounting bracket 17 and the first plate member 29. Thus, when the second transmission component 9 jacks up the first plate 29 with the third transmission component 12, the impact of the first plate 29 on the fixing frame 17 can be buffered by the elastic force of the spring element 35, and the first plate 29 and the fixing frame 17 are protected.

As shown in fig. 2 to 4, the support member 15 includes a fixed frame 17 and a plurality of support columns 16 for supporting the fixed frame 17. The driving part 7 is arranged above the fixed frame 17; the first plate 29 is attached to the bottom of the holder 17. A plurality of support columns 16 are attached to the top of the transfer device 3 at intervals in the vertical direction. In some embodiments, the number of the supporting columns 16 may be four, and the four supporting columns are respectively erected on the top of the connecting rod 101, and may form a rectangular structure. The fixing frame 17 is disposed on top of the plurality of supporting columns 16, and is used for fixing the driving part 7. In some embodiments, the mount 17 is a structure having a rectangular cross-section. The plurality of supporting columns 16 are respectively connected with the corners of the fixing frame 17, so that the stress between the plurality of supporting columns 16 and the fixing frame 17 is balanced, and the driving part 7 is fixed by the fixing frame 17 more stably. In some embodiments, the fixing frame 17 includes a frame 21 with a hollow-out middle and a support rod 22, wherein the support rod 22 is overlapped on the frame 21. The driving member 7 is fixed to the support rod 22.

Fig. 5 is an enlarged view of a partial region a of the test apparatus 4 shown in fig. 3. As shown in fig. 5, in some embodiments, the support member 15 further includes a fastener 32. The fixing frame 17 includes a mounting hole 31. The fixing frame 17 penetrates through the mounting hole 31 through a fixing piece 32 and is movably connected with the first plate 29. In some embodiments, the fastener 32 may be a T-bolt having a head sized larger than the bore diameter of the mounting hole 31. In some embodiments, the top of the mounting hole 31 is a trumpet structure, so that the moving space of the T-shaped bolt is increased, thereby facilitating the movement of the first plate 29 relative to the fixed frame 17.

In some embodiments, the fixture 32 has a first gap 33 with the wall of the mounting hole 31. Thus, when the second transmission member 9 lifts up the first plate member 29, the fixing member 32 can be lifted up with the first plate member 29 in the mounting hole 31. The fixing member 32 has a second gap 34 between the fixing frame 17 and the first plate member 29. In this way, when the positioning element 28 is abutted with the positioning hole 27, a space can be provided for moving the first plate 29 relative to the fixed frame 17 so as to enable the positioning element 28 to be abutted with the positioning hole 27. In this embodiment, the first plate 29 can move in the vertical direction and the horizontal direction relative to the fixed frame 17 through the first gap 33 and the second gap 34, and then the positioning element 28 can be driven to move in the vertical direction and the horizontal direction, so that the positioning element 28 can be butted with the positioning hole 27 through the movement of itself. In some embodiments, the size of the first gap 33 may be 1mm. The size of the second gap 34 may be 1mm.

As shown in fig. 2, in some embodiments, testing device 4 further includes a hinge 25. The first side of the fixed mount 17 is connected with the supporting column 16 through a hinge 25, and the second side of the fixed mount 17 is movably connected with the supporting column 16. In this embodiment, the fixing frame 17 can be turned upwards around the hinge 25 by hinging the first side of the fixing frame 17 to the supporting column 16 and movably connecting the second side of the fixing frame 17 opposite to the first side thereof to the supporting column 16. Thus, the fixing frame 17 and the transmission device 3 are in an open state, so that the maintenance of workers is facilitated.

As shown in fig. 4, in some embodiments, the testing mechanism 1 further includes a telescopic device 26, one end of the telescopic device 26 may be connected to the transmission device 3 by a bolt, and the other end may also be connected to the fixing frame 17 by a bolt; the telescopic device 26 is used to support the fixing frame 17 when the fixing frame 17 is flipped up about the hinge 25. Be connected with telescoping device 26 between transmission device 3's lateral part and the lateral part of mount 17, this telescoping device 26 can be followed mount 17 and upwards overturn and be stretched, when this telescoping device 26 was pulled and is risen to mechanical limit point, can play the effect of supporting mount 17 to guarantee that mount 17 and transmission device 3 are continuous open mode, in order to reach the purpose of quick maintenance. In some embodiments, the telescopic device 26 includes a telescopic rod 260, a first fixing seat 261 and a second fixing seat 262, wherein the first fixing seat 261 can be fixed to the transmission device 3 by bolts, the second fixing seat 262 can be fixed to the fixing frame 17 by bolts, and the telescopic rod 260 is interactively connected between the first fixing seat 261 and the second fixing seat 262. The extension bar 260 may be extended as the fixing frame 17 is flipped up or contracted as the fixing frame 17 is flipped down.

Fig. 6 is a partial structural schematic diagram of the testing mechanism 1 shown in fig. 1. As shown in fig. 1 and fig. 6, the testing mechanism 1 further includes a transmission device 3, and the transmission device 3 is disposed below the testing device 4 and can move the electronic device 2 in the horizontal direction and the vertical direction. The electronic device 2 is located between the transfer device 3 and the testing device 4. In some embodiments, the transmission device 3 comprises a plurality of groups. The plurality of sets of transmission devices 3 are connected in sequence. The test device 4 comprises a plurality of sets. The plurality of groups of test devices 4 are connected in sequence. Each group of transmission devices 3 is connected with each group of test devices 4 in a one-to-one correspondence manner. So, can carry out continuous test to a plurality of electronic equipment 2 to improve the efficiency to a plurality of electronic equipment 2 tests, thereby effectively reduce enterprise manufacturing cost, improve production efficiency. In some embodiments, the testing mechanism 1 further includes a support table 18. The support table 18 is used to support the transfer device 3.

In some embodiments, the transfer device 3 comprises a first transfer member 8 and a second transfer member 9. The first transmission unit 8 includes a frame 10 and a plurality of transmission wheels 11 disposed inside the frame 10, and is configured to transmit the movement of the electronic device 2 in the horizontal direction. Specifically, when the electronic device 2 is placed on the transfer wheels 11, the translation motion of the electronic device 2 may be pulled by the rotation of the plurality of transfer wheels 11. The second transport element 9 is slidably arranged on the transport wheel 11 for carrying the electronic device 2. Therefore, when the electronic device 2 slides and translates on the transmission wheel 11, the second transmission part 9 can avoid the direct contact between the electronic device 2 and the transmission wheel 11, and the risk of damage to the electronic device 2 is reduced. In some embodiments, the rack 10 includes at least two brackets 102 disposed side by side, and each bracket 102 includes a plurality of columns 100 and connecting rods 101 disposed on the plurality of columns 100. A plurality of transfer wheels 11 are connected to the inner side of the connection rod 101 at intervals. In some embodiments, the first transmission member 8 may be an logistics line. The second transfer element 9 comprises a carrier platform.

In some embodiments, the transfer device 3 further comprises a third transfer member 12. The third transmission member 12 is for transmitting the movement of the electronic device 2 in the vertical direction. The third transferring unit 12 is disposed on the frame 10 and is located at one side of the testing unit 6. The third transport element 12 is adapted to jack the second transport element 9 upwards when the second transport element 9 carrying the electronic device 2 is moved translationally above the third transport element 12. In this way, on the one hand, the electronic device 2 on the second transport element 9 can be brought close to the test element 6 above this electronic device 2, so that the test contacts of the electronic device 2 can be correctly docked with the test element 6. On the other hand, if a plurality of electronic devices 2 are translated on the conveying wheel 11 sequentially and simultaneously, when one of the electronic devices 2 is jacked up by the third transmission component 12, a space is generated below the electronic device 2, so that the electronic device 2 behind the electronic device 2 is not prevented from being translated to the position below the other testing components 6, and thus, the period of testing the mainboard current of the plurality of electronic devices 2 can be shortened, the testing efficiency is improved, and the production efficiency is also improved.

In some embodiments, the third transfer unit 12 includes a driving member 13 and a lifting frame 14, wherein the driving member 13 is connected to an outer side of the frame body 10; the lifting frame 14 is slidably coupled to the inner side of the frame body 10. The jacking frame 14 and the frame body 10 can be connected through a sliding rail, to achieve relative sliding with respect to the frame 10. The bottom of the jacking frame 14 may penetrate through the frame body 10 and be connected with the bottom of the driving member 13 outside the frame body 10. The driving member 13 is used for driving the jacking frame 14 to slide along the height direction of the frame body 10, so that the jacking frame 14 jacks up the second transmission member 9. So, through mutually supporting of driving piece 13 and jacking frame 14 to realize the purpose of jacking second transmission part 9, thereby make the test contact of electronic equipment 2 on the second transmission part 9 can dock with test component 6, and simple structure is reliable. In some embodiments, the drive member 13 comprises a cylinder. In some embodiments, the jacking frame 14 is a block structure with a U-shaped cross-section. During the process of jacking up the second transmission member 9, the top end of the U-shaped block structure contacts with the bottom of the second transmission member 9, and further the driving member 13 drives the U-shaped block structure to slide upwards, so as to drive the second transmission member 9 to ascend. In some embodiments, the U-shaped block structure may be connected to the inside of the frame 10 by, but not limited to, a guide rail.

The transfer device 3 is provided with positioning holes 27 as shown in fig. 6. The bottom of the first plate member 29 is provided with a positioning member 28, as shown in fig. 3. One end of the positioning member 28 is fixed to the bottom of the first plate member 29, and the other end extends downward in the vertical direction. When the second transfer part 9 of the transfer device 3 is moved to a position corresponding to the test part 6 in the vertical direction, the positioning member 28 is connected to the positioning hole 27. For positioning the second transfer member 9. In this embodiment, in order to make the probes 20 be able to be accurately butted against the test contacts of the electronic device 2 without relative displacement after the butting, the positioning can be realized by positioning the positioning members 28 at the bottom of the needle plate 19 and the positioning holes 27 on the second conveying member 9. In this way, the probe 20 is maintained relatively stable when docked with the test contacts of the electronic device 2.

As shown in fig. 1, the testing mechanism 1 further includes a USB testing device 36 for testing the electronic device 2, wherein the USB testing device 36 is disposed at a side portion of the transmission device 3 for testing the performance of the USB port of the electronic device 2.

Although the present disclosure has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the disclosure.

Claims

1. A testing mechanism, comprising:

the test device is used for testing the current of the electronic equipment and comprises a test part and a driving part connected with the test part;

2. The test mechanism of claim 1, wherein the test device further comprises a support member, and the driving member is disposed on the support member;

3. The test mechanism of claim 2, wherein the probe includes a fixed end and a free end, wherein the fixed end is connected to a bottom of the second plate; the free end extends downwards along the vertical direction; the driving part drives the second plate to move in the direction close to the electronic equipment, so that the free end is driven to move in the vertical direction.

4. The testing mechanism of claim 2, further comprising a transport device disposed below the testing device, the transport device having a positioning hole; a positioning piece is arranged at the bottom of the first plate; when the transmission device moves to a position corresponding to the test component along the vertical direction, the positioning piece is connected with the positioning hole.

5. The test mechanism of claim 2, wherein the support member comprises a mount and a plurality of support posts for supporting the mount; the driving part is arranged above the fixing frame; the first plate is connected to the bottom of the fixing frame.

6. The test mechanism of claim 5, wherein the support member further comprises a fixture; the fixing frame comprises a mounting hole; the fixing frame penetrates through the mounting hole through the fixing piece and is movably connected with the first plate.

7. The test mechanism of claim 6, wherein the fixture has a first clearance with a wall of the mounting hole; and

a second gap is formed between the fixed frame and the first plate.

8. The testing mechanism of claim 5, wherein the testing device further comprises a hinge; the first side of the fixing frame is connected with the supporting column through the hinge piece, and the second side of the fixing frame is movably connected with the supporting column.

9. The testing mechanism of claim 8, further comprising a telescoping device coupled to the mounting bracket; when the fixing frame is turned upwards around the hinge, the telescopic device is used for supporting the fixing frame.

10. The testing mechanism of claim 5, wherein the testing device further comprises a spring member coupled between the mounting bracket and the first plate member.