CN217800999U - Composite base diamond grinding pad - Google Patents
Composite base diamond grinding pad Download PDFInfo
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- CN217800999U CN217800999U CN202123081684.7U CN202123081684U CN217800999U CN 217800999 U CN217800999 U CN 217800999U CN 202123081684 U CN202123081684 U CN 202123081684U CN 217800999 U CN217800999 U CN 217800999U
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- diamond
- diamond grinding
- composite fiber
- surfaces based
- grinding surfaces
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Abstract
The utility model relates to a novel compound base diamond grinding pad, including the composite fiber base member, be equipped with a plurality of diamond abrasive surfaces and a plurality of diamond abrasive surfaces based on the resinoid bond based on metallic bond on the abrasive surface of composite fiber base member, a plurality of diamond abrasive surfaces based on the metallic bond are equipped with a plurality of diamond abrasive surfaces based on the resinoid bond on the abrasive surface of composite fiber base member along circumference evenly distributed on adjacent two composite fiber base members between the diamond abrasive surface based on the metallioid bond. The utility model discloses a novel compound base diamond grinding pad grinding effect is even, longe-lived and be suitable for the grinding on unevenness ground.
Description
Technical Field
The utility model relates to a superhard grinding apparatus technical field especially relates to a novel compound base diamond grinding pad.
Background
The diamond grinding pad is mainly applied to the integral grinding and polishing of concrete terraces, dry-scattering type wear-resistant terraces and inorganic terraces, and comprises a substrate and a diamond grinding surface arranged on the substrate, wherein the diamond grinding surface is generally a diamond grinding surface based on a metal bonding agent or a diamond grinding surface based on a resin bonding agent, the existing diamond tool has the outstanding characteristics of high efficiency, energy conservation, long service life and environmental friendliness in the application of the terrace industry, but the existing diamond grinding pad only has one diamond grinding surface at present, different types of diamond grinding surfaces are suitable for different types of to-be-processed surfaces to be ground due to different material properties, the diamond grinding surface based on the metal bonding agent has high rigidity and high cutting depth, can be used for carrying out powerful grinding at uneven positions with large fluctuation on the to-be-processed surface, and the diamond grinding surface based on the resin bonding agent has the characteristics of high grinding efficiency and good self-sharpening, can remove finer scratches, when the scratches, bulges and the like on the to-be-processed surfaces are various, only one type diamond grinding surface is used for grinding, the problems that the grinding effect, the high and low points cannot effectively grind the service life of the diamond grinding pad, and the service life of the diamond grinding pad cannot be influenced.
SUMMERY OF THE UTILITY MODEL
For overcoming the technical defect that prior art exists, the utility model provides a novel compound base diamond grinding pad, its grinding effect is even, longe-lived and be suitable for the grinding on unevenness ground.
The utility model discloses a technical solution be: novel compound base diamond grinding pad, including the composite fiber base member, be equipped with a plurality of diamond abrasive surface based on metal bond and a plurality of diamond abrasive surface based on resin bond on the abrasive surface of composite fiber base member, a plurality of diamond abrasive surfaces based on metal bond are along circumference evenly distributed on the abrasive surface of composite fiber base member, are equipped with a plurality of diamond abrasive surfaces based on resin bond on the composite fiber base member between two adjacent diamond abrasive surfaces based on metal bond.
Preferably, each diamond grinding surface based on the metal bond is composed of an isosceles triangle sub-area and an isosceles trapezoid sub-area, the bottom side of the isosceles trapezoid is overlapped with the bottom surface of the isosceles triangle sub-area, the axes of the isosceles triangle sub-area and the isosceles trapezoid sub-area pass through the circle center of the composite fiber substrate, and the vertex of the isosceles triangle sub-area points to the circle center of the composite fiber substrate.
Preferably, the abrasive surface of the composite fiber substrate is provided with five diamond abrasive surfaces based on metal bond.
Preferably, the composite fiber substrate between two adjacent diamond grinding surfaces based on metal bond is provided with a diamond grinding surface based on resin bond.
Preferably, the resin bond-based diamond abrasive surface is a trapezoid.
Preferably, a chip removing groove is formed between two adjacent diamond grinding surfaces based on resin bonding agent.
The beneficial effects of the utility model reside in that: (1) The novel composite-based diamond grinding pad has the advantages that in the grinding and polishing process, the flexibility of the composite fiber material enables a working layer on the grinding pad to be effectively ground to the uneven part of a terrace, the diamond grinding surface based on the metal bonding agent can effectively remove the uneven part of a processing surface and effectively remove scratches, and the diamond grinding surface based on the resin bonding agent can effectively remove finer scratches to achieve a more delicate processing surface;
(2) The novel composite base diamond grinding pad adopts a large-size integrated design, has two grinding surfaces which act respectively, ensures that the grinding pad has long service life, ensures that the grinding pad is more uniformly ground in the working process, and has higher production efficiency;
(3) The utility model discloses a novel compound base diamond grinding pad adopts the compound base member of fibre, improves the pliability of product, makes the instrument can be fine grind uneven ground of height in the course of the work, reaches level and smooth, fine and smooth effect at last.
Drawings
Fig. 1 is a schematic structural view of the composite-base diamond polishing pad of the present invention.
Description of the reference numerals: 1. a composite fiber matrix; 2. a metal bond based diamond abrasive surface; 3. a resin bond based diamond abrasive surface; 4. a chip groove.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 1, the present embodiment provides a novel composite-based diamond polishing pad, which includes a composite fiber substrate 1, wherein a plurality of diamond polishing surfaces 2 based on metal bond and a plurality of diamond polishing surfaces 3 based on resin bond are disposed on the polishing surface of the composite fiber substrate 1, the plurality of diamond polishing surfaces 2 based on metal bond are uniformly distributed on the polishing surface of the composite fiber substrate 1 along the circumferential direction, and a plurality of diamond polishing surfaces 3 based on resin bond are disposed on the composite fiber substrate 1 between two adjacent diamond polishing surfaces 2 based on metal bond. The novel composite-based diamond polishing pad of the present embodiment.
In this embodiment, each diamond grinding surface 2 based on a metal bond is composed of an isosceles triangle partition and an isosceles trapezoid partition, the bottom side of the isosceles trapezoid coincides with the bottom surface of the isosceles triangle partition, the axes of the isosceles triangle partition and the bottom surface of the isosceles triangle partition pass through the circle center of the composite fiber substrate 1, and the vertex of the isosceles triangle partition points to the circle center of the composite fiber substrate 1. Preferably, the abrasive surface of the composite fiber substrate 1 is provided with five diamond abrasive surfaces 2 based on a metal bond.
In the present embodiment, nine diamond-based abrasive surfaces 3 based on a resin bond are provided on the composite fiber substrate 1 between two adjacent metal bond-based diamond abrasive surfaces 2. Preferably, the resin bond-based diamond grinding surface 3 is a trapezoid, and a chip removal groove 4 is formed between two adjacent resin bond-based diamond grinding surfaces 3.
The novel compound base diamond abrasive pad of this embodiment is at the grinding and polishing in-process, and composite fiber material's pliability can make the work layer on the abrasive pad can effectually grind the unevenness department of terrace, and the scratch is effectively got rid of to 2 can the effectual unevenness departments that get rid of the processing surface of diamond lapping surface based on metal bond, and 3 can the effectual more subtle scratches of getting rid of diamond lapping surface based on resin bond in order to reach more delicate machined surface.
While there have been shown and described what are at present considered the fundamental principles and essential features of the invention and the advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, but is described in the foregoing embodiments and drawings only for the purpose of illustrating the principles of the invention and, without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents, there are also provided various changes and modifications within the scope of the invention as defined by the appended claims and their equivalents.
Claims (6)
1. Novel compound base diamond grinding pad, its characterized in that: the composite fiber base body is provided with a plurality of diamond grinding surfaces based on metal bonding agents and a plurality of diamond grinding surfaces based on resin bonding agents, the diamond grinding surfaces based on the metal bonding agents are uniformly distributed on the grinding surfaces of the composite fiber base body along the circumferential direction, and the diamond grinding surfaces based on the resin bonding agents are arranged on the composite fiber base body between two adjacent diamond grinding surfaces based on the metal bonding agents.
2. The novel composite base diamond polishing pad according to claim 1, characterized in that: each diamond grinding surface based on the metal bond is composed of an isosceles triangle sub-area and an isosceles trapezoid sub-area, the bottom edge of the isosceles trapezoid is overlapped with the bottom surface of the isosceles triangle sub-area, the axes of the isosceles triangle sub-area and the isosceles triangle sub-area pass through the circle center of the composite fiber substrate, and the top point of the isosceles triangle sub-area points to the circle center of the composite fiber substrate.
3. The novel composite-base diamond polishing pad according to claim 1, characterized in that: the grinding surface of the composite fiber substrate is provided with five diamond grinding surfaces based on metal bonding agents.
4. The novel composite-base diamond polishing pad according to claim 1, characterized in that: nine diamond grinding surfaces based on resin bonding agents are arranged on the composite fiber substrate between two adjacent diamond grinding surfaces based on metal bonding agents.
5. The novel composite-base diamond polishing pad according to claim 1, characterized in that: the diamond grinding surface based on the resin bonding agent is a trapezoid.
6. The novel composite-base diamond polishing pad according to claim 1, characterized in that: and a chip removal groove is formed between two adjacent diamond grinding surfaces based on the resin bonding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123081684.7U CN217800999U (en) | 2021-12-09 | 2021-12-09 | Composite base diamond grinding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123081684.7U CN217800999U (en) | 2021-12-09 | 2021-12-09 | Composite base diamond grinding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217800999U true CN217800999U (en) | 2022-11-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123081684.7U Active CN217800999U (en) | 2021-12-09 | 2021-12-09 | Composite base diamond grinding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217800999U (en) |
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2021
- 2021-12-09 CN CN202123081684.7U patent/CN217800999U/en active Active
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