CN217799686U - LED chip welding platform - Google Patents
LED chip welding platform Download PDFInfo
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- CN217799686U CN217799686U CN202221152917.XU CN202221152917U CN217799686U CN 217799686 U CN217799686 U CN 217799686U CN 202221152917 U CN202221152917 U CN 202221152917U CN 217799686 U CN217799686 U CN 217799686U
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Abstract
The application provides a LED chip welded platform, this LED chip welded platform include platform body, heating mechanism, temperature measurement mechanism and controller, and the platform body is used for bearing the chip base plate, is equipped with on the chip base plate to treat the welded LED chip. The heating mechanism is used for heating the platform body, and the temperature measuring mechanism is used for measuring the temperature of the platform body and generating a temperature signal corresponding to the temperature of the platform body; the controller is respectively connected with the heating mechanism and the temperature measuring mechanism and is used for receiving the temperature signal and controlling the heating mechanism to work based on the temperature signal. The controller received temperature signal and based on temperature signal control heating mechanism work in this application to control heating mechanism heats the platform body, and the heat conducts to on chip base plate and the LED chip and heats chip base plate and LED chip to the settlement temperature and welds again through the platform body, and the user only need adjust the parameter of laser light in less within range during the welding, thereby the user operation of being convenient for.
Description
Technical Field
The application belongs to the technical field of chip manufacturing equipment, and particularly relates to an LED chip welding platform.
Background
At present, in an existing Mini LED chip welding mode, a substrate carrying an LED chip is placed on a welding platform, the LED chip and a glass substrate are affected by the surrounding environment, and different initial temperatures before the LED chip and the glass substrate are welded require a user to adjust laser light parameters during welding, which causes inconvenience in operation.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an LED chip welding platform to solve the problem that the LED chip cannot be heated by the existing welding platform.
The embodiment of the application provides a LED chip welded platform, LED chip welded platform includes:
the platform comprises a platform body, a chip substrate and a welding device, wherein the platform body is used for bearing the chip substrate, and the chip substrate is provided with an LED chip to be welded;
the heating mechanism is used for heating the platform body;
the temperature measuring mechanism is used for measuring the temperature of the platform body and generating a temperature signal corresponding to the temperature of the platform body;
and the controller is respectively connected with the heating mechanism and the temperature measuring mechanism and is used for receiving the temperature signal and controlling the heating mechanism to work based on the temperature signal.
Optionally, the heating mechanism includes a first heating assembly and a second heating assembly, and the first heating assembly and the second heating assembly are respectively disposed on two opposite sides of the platform body.
Optionally, the first heating assembly and the second heating assembly are symmetrically arranged on two opposite sides of the platform body along the first direction.
Optionally, the first heating assembly includes a plurality of first heating members, the plurality of first heating members are sequentially arranged along a second direction, and the second direction is perpendicular to the first direction; the second heating element includes a plurality of second heating members, and is a plurality of the second heating member is followed the second direction sets gradually.
Optionally, a plurality of the first heating member is along the second direction is equidistant to be set up, and a plurality of the second heating member is along the second direction is equidistant to be set up.
Optionally, a connection point of the temperature measuring mechanism and the platform body is a first connection point, and the first connection point is arranged between the first heating assembly and the second heating assembly.
Optionally, the projection of the first heating member on the first plane is located within the projection of the chip substrate on the first plane, and the projection of the second heating member on the first plane is located within the projection of the chip substrate on the first plane; the first plane is parallel to the first direction, and the first plane is also parallel to the second direction.
Optionally, the platform body is provided with a plurality of adsorption through holes.
Optionally, a projection of the first heating member on the first plane is not coincident with a projection of the adsorption through hole on the first plane, and a projection of the second heating member on the first plane is not coincident with a projection of the adsorption through hole on the first plane.
Optionally, the projection of the adsorption through hole on the first plane is located within the projection of the chip substrate on the first plane.
In the LED chip welding platform provided by the embodiment of the application, a platform body bears a chip substrate, a heating mechanism heats the platform body, a temperature measuring mechanism measures the temperature of the platform body and generates a temperature signal corresponding to the temperature of the platform body; and the controller receives the temperature signal and controls the heating mechanism to work based on the temperature signal, so that the heating mechanism is controlled to heat the platform body, heat is conducted to the chip substrate and the LED chip through the platform body, the chip substrate and the LED chip are heated to a set temperature and then welded, and a user only needs to adjust the parameters of the laser light within a smaller range during welding, so that the operation of the user is facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic structural diagram of an LED chip bonding platform according to an embodiment of the present application.
Fig. 2 is a schematic structural view of the LED chip bonding platform in fig. 1 after a chip substrate is hidden.
Fig. 3 is a structural schematic diagram of the LED chip soldering platform in fig. 2 after the platform body is cut.
Fig. 4 is a bottom view of fig. 1.
Fig. 5 is a schematic structural view of the LED chip soldering platform in fig. 4 after the platform body is hidden.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
At present, in the existing Mini LED chip welding mode, a glass substrate carrying an LED chip is placed on a welding platform, the LED chip and the glass substrate are affected by the surrounding environment, and the initial temperature of the LED chip and the glass substrate before welding is different, so that the laser parameters during welding need to be adjusted by a user, which causes inconvenience in operation.
In order to solve the above problem, an embodiment of the present application provides an LED chip bonding platform, as shown in fig. 1, fig. 1 is a schematic structural diagram of the LED chip bonding platform provided in the embodiment of the present application. The LED chip welding platform comprises a platform body 100, a heating mechanism 200, a temperature measuring mechanism 300 and a controller 400, wherein the platform body 100 is used for bearing a chip substrate 500, and an LED chip to be welded is arranged on the chip substrate 500. The heating mechanism 200 is used for heating the platform body 100, and the temperature measuring mechanism 300 is used for measuring the temperature of the platform body 100 and generating a temperature signal corresponding to the temperature of the platform body 100; the controller 400 is respectively connected with the heating mechanism 200 and the temperature measuring mechanism 300, and the controller 400 is used for receiving the temperature signal and controlling the heating mechanism 200 to work based on the temperature signal.
In the LED chip soldering platform provided in the embodiment of the present application, the platform body 100 bears the chip substrate 500, the heating mechanism 200 heats the platform body 100, and the temperature measuring mechanism 300 measures the temperature of the platform body 100 and generates a temperature signal corresponding to the temperature of the platform body 100; the controller 400 receives the temperature signal and controls the heating mechanism 200 to work based on the temperature signal, so as to control the heating mechanism 200 to heat the platform body 100, the heat is conducted to the chip substrate 500 and the LED chip through the platform body 100, the chip substrate 500 and the LED chip are heated to a set temperature and then welded, and a user only needs to adjust the parameters of the laser light within a smaller range during welding, so that the operation of the user is facilitated.
In addition, as the chip substrate 500 and the LED chip are preheated before welding, the time required in the welding process is shorter, and the energy consumption in the welding process is also reduced; the welding time of the welding equipment is short, the energy is low, and the service life of the welding equipment can also be prolonged. Preheating the chip substrate 500 and the LED chip can also enable the soldering tin between the LED chip and the chip substrate 500 to be more uniformly melted, so that the LED chip is better and firmer after being welded, and the thrust of the LED chip is improved.
As shown in fig. 3, the heating mechanism 200 includes a first heating element 210 and a second heating element 220, and the first heating element 210 and the second heating element 220 are respectively disposed on two opposite sides of the platform body 100. The first and second heating assemblies 210 and 220 heat the stage body 100 from both sides thereof, respectively, so that the stage can be heated more rapidly.
As shown in fig. 3, the first heating element 210 and the second heating element 220 are symmetrically disposed on two opposite sides of the platform body 100 along a first direction; this first direction is shown in the direction of arrow X in fig. 3.
As shown in fig. 3, the first heating member 210 includes a plurality of first heating members 211, and the plurality of first heating members 211 are sequentially arranged in a second direction perpendicular to the first direction, as shown by an arrow Y in fig. 3. The second heating member 220 includes a plurality of second heating members 221, and the plurality of second heating members 221 are sequentially arranged along the second direction. For example, the first heating element 210 in this embodiment may further include a power supply line connected to the first heating element 211, and the second heating element 220 in this embodiment may further include a power supply line connected to the second heating element 221.
As exemplarily shown in fig. 3, the plurality of first heating members 211 are disposed at equal intervals in the second direction, and the plurality of second heating members 221 are disposed at equal intervals in the second direction. A plurality of first heating members 211 are arranged along the second direction at equal intervals, and then every first heating member 211 is arranged to the platform body 100 at equal intervals in the second direction, so that the uniformity of the first heating assembly 210 for heating the platform body 100 can be improved. The plurality of second heating members 221 are disposed at equal intervals along the second direction, so that each second heating member 221 is disposed at equal intervals along the second direction with respect to the platform body 100, which can improve the uniformity of the second heating assembly 220 for heating the platform body 100.
As shown in fig. 3, a plurality of connection holes 120 are formed on the left side surface of the platform body 100 opposite to the respective first heating members 211; each of the first heating members 211 is inserted into the coupling hole 120 on the left side surface of one of the platform bodies 100, thereby being coupled to the platform body 100; and the first heating member 211 conducts heat by contacting with the inner wall surface of the connection hole 120. A plurality of connection holes 120 are formed on the right side surface of the platform body 100 corresponding to the second heating members 221; each of the second heating members 221 is inserted into a connection hole 120 on the right side surface of one of the table bodies 100, thereby being connected to the table body 100; and the second heating member 221 conducts heat by contacting with the inner wall surface of the connection hole 120.
As shown in fig. 3, the connection point of the temperature measuring mechanism 300 and the platform body 100 is a first connection point, and the first connection point is disposed between the first heating element 210 and the second heating element 220. The first connection point is disposed between the first heating element 210 and the second heating element 220, so that the temperature of the platform body 100 can be measured more accurately. For example, in the present embodiment, the temperature measuring mechanism 300 may be a thermocouple, the controller 400 may be a thermostat, and the first heating member 211 and the second heating member 221 may be heating rods.
As exemplarily shown in fig. 4 and 5, the projection of the first heating member 211 on the first plane is located within the projection of the chip substrate 500 on the first plane, and the projection of the second heating member 221 on the first plane is located within the projection of the chip substrate 500 on the first plane. The first plane is parallel to the first direction, and the first plane is also parallel to the second direction. The projection of the first heating member 211 on the first plane is located within the projection of the chip substrate 500 on the first plane, and the projection of the second heating member 221 on the first plane is located within the projection of the chip substrate 500 on the first plane, so that the heat generated by each of the first heating member 211 and the second heating member 221 can be more rapidly conducted to the chip substrate 500 and the LED chip.
As shown in fig. 2 and 4, the platform body 100 is provided with a plurality of suction through holes 110. Through set up absorption through-hole 110 on platform body 100, cooperation negative pressure adsorption apparatus constructs and produces the negative pressure in adsorbing through-hole 110, can adsorb chip substrate 500 on platform body 100 steadily, very high LED chip welding process in chip substrate 500's stability to improve the welding effect. The negative pressure adsorption mechanism is well known to those skilled in the art and will not be described in detail.
As shown in fig. 3, a projection of the first heating member 211 on the first plane does not coincide with a projection of the adsorption through hole 110 on the first plane, and a projection of the second heating member 221 on the first plane does not coincide with a projection of the adsorption through hole 110 on the first plane. After the arrangement, each heating element and each adsorption through hole 110 cannot interfere with each other in the working process, so that the working stability of each heating element and each adsorption through hole 110 is ensured.
As shown in fig. 1, the projection of the suction via 110 on the first plane is located within the projection of the chip substrate 500 on the first plane.
Set up and adsorb through-hole 110 and lie in chip substrate 500 within the projection of first plane at the projection of first plane, then each adsorbs through-hole 110 and can both adsorb chip substrate 500, improves chip substrate 500's stability to avoid adsorbing through-hole 110 and not adsorbing chip substrate 500 and leading to the negative pressure energy waste.
In summary, the present application provides an LED chip bonding platform, in which a platform body 100 bears a chip substrate 500, a heating mechanism 200 heats the platform body 100, and a temperature measuring mechanism 300 measures the temperature of the platform body 100 and generates a temperature signal corresponding to the temperature of the platform body 100; the controller 400 receives the temperature signal and controls the heating mechanism 200 to work based on the temperature signal, so as to control the heating mechanism 200 to heat the platform body 100, the heat is conducted to the chip substrate 500 and the LED chip through the platform body 100, the chip substrate 500 and the LED chip are heated to a set temperature, and then welding is performed, and a user only needs to adjust the parameters of the laser light within a smaller range during welding, so that the operation of the user is facilitated.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying a number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The LED chip soldering platform provided in the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An LED chip bonding platform, comprising:
the platform body is used for bearing a chip substrate, and an LED chip to be welded is arranged on the chip substrate;
the heating mechanism is used for heating the platform body;
the temperature measuring mechanism is used for measuring the temperature of the platform body and generating a temperature signal corresponding to the temperature of the platform body;
and the controller is respectively connected with the heating mechanism and the temperature measuring mechanism and is used for receiving the temperature signal and controlling the heating mechanism to work based on the temperature signal.
2. The LED chip bonding platform of claim 1, wherein the heating mechanism comprises a first heating element and a second heating element, the first heating element and the second heating element being disposed on opposite sides of the platform body.
3. The LED chip bonding platform of claim 2, wherein the first and second heating elements are symmetrically disposed on opposite sides of the platform body along a first direction.
4. The LED chip bonding platform of claim 3, wherein the first heating assembly comprises a plurality of first heating elements, the plurality of first heating elements being arranged in sequence along a second direction, the second direction being perpendicular to the first direction; the second heating element includes a plurality of second heating members, and is a plurality of the second heating member is followed the second direction sets gradually.
5. The LED chip bonding stage according to claim 4, wherein a plurality of the first heating members are arranged at equal intervals in the second direction, and a plurality of the second heating members are arranged at equal intervals in the second direction.
6. The LED chip soldering platform according to claim 4 or 5, wherein the connection point of the temperature measuring mechanism to the platform body is a first connection point, and the first connection point is arranged between the first heating assembly and the second heating assembly.
7. The LED chip bonding platform of claim 6, wherein the projection of the first heating element on the first plane is located within the projection of the chip substrate on the first plane, and the projection of the second heating element on the first plane is located within the projection of the chip substrate on the first plane; the first plane is parallel to the first direction, and the first plane is also parallel to the second direction.
8. The LED chip soldering platform according to claim 7, wherein the platform body is provided with a plurality of suction through holes.
9. The LED chip bonding platform of claim 8, wherein the projection of the first heating element on the first plane is not coincident with the projection of the suction through hole on the first plane, and the projection of the second heating element on the first plane is not coincident with the projection of the suction through hole on the first plane.
10. The LED chip bonding platform of claim 9, wherein a projection of the suction through hole in the first plane is located within a projection of the chip substrate in the first plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221152917.XU CN217799686U (en) | 2022-05-13 | 2022-05-13 | LED chip welding platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221152917.XU CN217799686U (en) | 2022-05-13 | 2022-05-13 | LED chip welding platform |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217799686U true CN217799686U (en) | 2022-11-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221152917.XU Active CN217799686U (en) | 2022-05-13 | 2022-05-13 | LED chip welding platform |
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|---|---|
| CN (1) | CN217799686U (en) |
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2022
- 2022-05-13 CN CN202221152917.XU patent/CN217799686U/en active Active
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