CN217789970U - Multilayer circuit board - Google Patents
Multilayer circuit board Download PDFInfo
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- CN217789970U CN217789970U CN202221331098.5U CN202221331098U CN217789970U CN 217789970 U CN217789970 U CN 217789970U CN 202221331098 U CN202221331098 U CN 202221331098U CN 217789970 U CN217789970 U CN 217789970U
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Abstract
The application provides a multilayer circuit board, includes: the first circuit substrate comprises a first thermosetting resin layer and a first conductive circuit layer arranged on the first thermosetting resin layer; the second circuit substrate is arranged at an interval with the first circuit substrate and comprises a second thermosetting resin layer and a second conductive circuit layer arranged on the second thermosetting resin layer, and the first conductive circuit layer is arranged towards the second conductive circuit layer; the first thermoplastic resin layer is arranged between the first conductive circuit layer and the second conductive circuit layer, at least one first conduction body penetrates through the first thermoplastic resin layer, and the first conduction body is electrically connected with the first conductive circuit layer and the second conductive circuit layer. The multilayer circuit board does not need secondary pressing to form an outer protection layer, and the manufacturing process is simple.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a multilayer circuit board.
Background
In the prior art, when a protective layer of a multilayer circuit board is manufactured, a secondary pressing process is required, the operation is complex, and the problems of uneven transmission loss, poor dimensional stability and the like are easily caused.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application provides a multilayer circuit board capable of solving the above-mentioned problems.
An embodiment of the present application provides a multilayer circuit board, including:
the first circuit substrate comprises a first thermosetting resin layer and a first conductive circuit layer arranged on the first thermosetting resin layer;
the second circuit substrate is arranged at an interval with the first circuit substrate and comprises a second thermosetting resin layer and a second conductive circuit layer arranged on the second thermosetting resin layer, and the first conductive circuit layer is arranged towards the second conductive circuit layer;
the first thermoplastic resin layer is arranged between the first conductive circuit layer and the second conductive circuit layer, at least one first conduction body penetrates through the first thermoplastic resin layer, and the first conduction body is electrically connected with the first conductive circuit layer and the second conductive circuit layer.
In some possible embodiments, the multilayer circuit board includes at least two first thermoplastic resin layers and at least one third circuit substrate, the at least one third circuit substrate and at least two first thermoplastic resin layers are disposed at intervals between the first conductive trace layer and the second conductive trace layer, and each third circuit substrate is disposed between two first thermoplastic resin layers.
In some possible embodiments, the third circuit substrate includes a third thermosetting resin layer and a third conductive circuit layer formed on the third thermosetting resin layer, the third thermosetting resin layer has a second via formed therethrough, and two opposite sides of the second via are electrically connected to the third conductive circuit layer and the first via, respectively.
In some possible embodiments, the third circuit substrate further includes a fourth conductive trace layer, and the third conductive trace layer and the fourth conductive trace layer are respectively disposed on two opposite sides of the third thermosetting resin layer; the second conducting body penetrates through the third conducting circuit layer, the second conducting body is electrically connected with the fourth conducting circuit layer, and the fourth conducting circuit layer is electrically connected with the first conducting body.
In some possible embodiments, the first thermosetting resin layer and the second thermosetting resin layer are made of perfluoroalkoxy resin, and the first thermoplastic resin layer is made of liquid crystal high polymer.
In some possible embodiments, the conductive circuit board comprises a plurality of first thermoplastic resin layers and at least one second thermoplastic resin layer, the plurality of first thermoplastic resin layers and the at least one second thermoplastic resin layer are arranged between the first conductive circuit layer and the second conductive circuit layer at intervals, and each second thermoplastic resin layer is arranged between two first thermoplastic resin layers.
In some possible embodiments, a fifth conductive trace layer and a sixth conductive trace layer are respectively disposed on two opposite sides of the second thermoplastic resin layer, and the fifth conductive trace layer and the sixth conductive trace layer are respectively electrically connected to the first vias on two adjacent first thermoplastic resin layers.
In some possible embodiments, at least one third via is disposed through the second thermoplastic resin layer, and the third via is electrically connected to the fifth conductive trace layer and the sixth conductive trace layer.
In some possible embodiments, the material of the second thermoplastic resin layer is the same as the material of the first thermoplastic resin layer.
In some possible embodiments, at least one opening is formed through the first thermosetting resin layer, and the first conductive circuit layer is exposed from a bottom of the opening.
The application provides a pressfitting once of multilayer circuit board accessible, the outer first circuit substrate that contains first thermosetting resin layer and the second circuit substrate that contains second thermosetting resin layer that sets up, inlayer set up first thermoplastic resin layer, need not the outer protective layer of secondary pressfitting preparation, and the processing procedure is simple.
In addition, when the first thermosetting resin layer and the second thermosetting resin layer are both made of perfluoroalkoxy resin, the perfluoroalkoxy resin has low dielectric loss, and is favorable for high-frequency signal transmission of the multilayer circuit board.
In addition, the multilayer circuit board can be formed by one-time mixing and laminating of the first thermoplastic resin layer, the first thermosetting resin layer and the second thermosetting resin layer, so that the phenomenon of line drift during laminating is avoided.
Drawings
Fig. 1 is a schematic structural diagram of a multilayer circuit board provided in a first embodiment of the present application.
Fig. 2 is an exploded view of the multi-layered circuit board shown in fig. 1.
Fig. 3 is a schematic structural diagram of a multilayer circuit board provided in a second embodiment of the present application.
Fig. 4 is an exploded view of the multilayer circuit board shown in fig. 2.
Fig. 5 is a schematic structural diagram of a multilayer circuit board provided in a third embodiment of the present application.
Fig. 6 is an exploded view of the multilayer circuit board shown in fig. 5.
Description of the main elements
First thermosetting resin layer 11
First conductive circuit layer 12
First thermoplastic resin layer 20
First conductive body 21
Second thermosetting resin layer 31
Second conductive trace layer 32
Third thermosetting resin layer 41
Third conductive trace layer 42
Second conductive body 43
Fourth conductive trace layer 44
Second thermoplastic resin layer 50
Fifth conductive trace layer 51
Sixth conductive trace layer 52
Third conductive body 53
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
Referring to fig. 1 and 2, a multilayer circuit board 100 according to a first embodiment of the present invention includes a first circuit substrate 10, at least one first thermoplastic resin layer 20, a second circuit substrate 30, and at least one third circuit substrate 40. The first circuit board 10 and the second circuit board 30 are disposed with a space therebetween, and the first thermoplastic resin layer 20 and the third circuit board 40 are disposed with a space therebetween, respectively, between the first circuit board 10 and the second circuit board 30.
In the present embodiment, the multilayer circuit board 100 includes two third circuit substrates 40 and three first thermoplastic resin layers 20. One of the three first thermoplastic resin layers 20 is disposed between the first circuit substrate 10 and the third circuit substrate 40, the other of the three first thermoplastic resin layers 20 is disposed between the two third circuit substrates 40, and the other of the three first thermoplastic resin layers 20 is disposed between the third circuit substrate 40 and the second circuit substrate 30.
The first circuit board 10 includes a first thermosetting resin layer 11 and a first conductive trace layer 12 disposed on the first thermosetting resin layer 11, and the first conductive trace layer 12 is connected to the first thermoplastic resin layer 20. At least one first conductive via 21 is formed through the first thermoplastic resin layer 20, and the first conductive via 21 is made of conductive paste.
The second circuit substrate 30 includes a second thermosetting resin layer 31 and a second conductive trace layer 32 disposed on the second thermosetting resin layer 31, and the second conductive trace layer 32 is connected to the first thermoplastic resin layer 20. The second conductive trace layer 32 is electrically connected to the first via 21 in the other thermoplastic resin layer 20.
The third circuit substrate 40 includes a third thermosetting resin layer 41 and a third conductive trace layer 42 formed on the third thermosetting resin layer 41. A second conductive via 43 is formed through the third thermosetting resin layer 41, and the second conductive via 43 is made of conductive paste. One end of the second conductive via 43 is electrically connected to the third conductive trace layer 42, and the other end is electrically connected to the first conductive via 21. Thereby, the first conductive circuit layer 12, the first vias 21, the third conductive circuit layer 42, the second vias 43 and the second conductive circuit layer 32 are electrically connected.
In this embodiment, the first thermosetting resin layer 11, the second thermosetting resin layer 31, and the third thermosetting resin layer 41 are made of the same material, and are all Perfluoroalkoxy (PFA). The material of the first thermoplastic resin layer 20 is Liquid Crystal Polymer (LCP).
In an actual manufacturing process, each circuit substrate and the thermoplastic resin layer may be provided as shown in fig. 2, and then the multilayer circuit board 100 may be prepared by one-time pressing.
The multilayer circuit board 100 provided by the application is provided with the first circuit substrate 10 containing the first thermosetting resin layer 11, the second circuit substrate 30 containing the second thermosetting resin layer 31 and the first thermoplastic resin layer 20 through the outer layer, and the outer protective layer is manufactured without secondary pressing.
In addition, when the first thermosetting resin layer 11 and the second thermosetting resin layer 31 are made of perfluoroalkoxy resin, the resin has low dielectric loss, and is used as an outer protection layer of the multilayer circuit board 100, so that high-frequency signal transmission is facilitated.
Further, the first thermoplastic resin layer 20, the first thermosetting resin layer 11, and the second thermosetting resin layer 31 are subjected to one-time hybrid press molding, and a drift-off state of the wiring at the time of pressing can be avoided. In addition, the first conductive vias 21 are arranged in the second thermosetting resin layer 31 to electrically connect the first conductive circuit layer 12 and the second conductive circuit layer 32, so that the risk of hole failure caused by difficulty in drilling and electroplating in the thermosetting resin layer can be avoided.
Referring to fig. 3 and 4, a second embodiment of the present invention provides another multi-layer circuit board 200, wherein the structure of the multi-layer circuit board 200 is substantially the same as that of the multi-layer circuit board 100, except that: the third circuit substrate 40 further includes a fourth conductive trace layer 44, the fourth conductive trace layer 44 and the third conductive trace layer 42 are respectively disposed on two opposite sides of the third thermosetting resin layer 41, and the second conductive via 43 penetrates through the third conductive trace layer 42 and the third thermosetting resin layer 41. The first conductive trace layer 12, the first via 21, the third conductive trace layer 42, the fourth conductive trace layer 44, the second via 43, and the second conductive trace layer 32 are electrically connected.
In an actual manufacturing process, each circuit substrate and the thermoplastic resin layer may be provided as shown in fig. 4, and then the multilayer circuit board 200 may be prepared by one-time pressing.
Compared to the multilayer circuit board 100, the multilayer circuit board 200 provided by the present application also has the following advantages: by additionally providing the fourth electrically conductive wiring layer 44 on the third circuit substrate 40, and the second vias 43 penetrating the third electrically conductive wiring layer 42 and the third thermosetting resin layer 41, the multilayer circuit board 200 is made to have a larger wiring area.
Referring to fig. 5 and 6, a multilayer circuit board 300 according to a third embodiment of the present invention includes a first circuit board 10, at least one first thermoplastic resin layer 20, a second circuit board 30, and at least one second thermoplastic resin layer 50, wherein the first thermoplastic resin layer 20 and the second thermoplastic resin layer 50 are disposed between the first circuit board 10 and the second circuit board 30 at an interval.
In the present embodiment, the multilayer circuit board 300 includes two first thermoplastic resin layers 20 and one second thermoplastic resin layer 50, and the second thermoplastic resin layer 50 is disposed between the two first thermoplastic resin layers 20.
The first circuit substrate 10 includes a first thermosetting resin layer 11 and a first conductive circuit layer 12 disposed on the first thermosetting resin layer 11, the first conductive circuit layer 12 is connected to the first thermoplastic resin layer 20, at least one opening 13 is formed through the first thermosetting resin layer 11, and the first conductive circuit layer 12 is exposed from the bottom of the opening 13 to form a pad (not shown) for external connection of an electronic component. At least one first conductive via 21 is formed through the first thermoplastic resin layer 20, and the first conductive via 21 is made of conductive paste. The second circuit substrate 30 includes a second thermosetting resin layer 31 and a second conductive trace layer 32 disposed on the second thermosetting resin layer 31, and the second conductive trace layer 32 is connected to the first thermoplastic resin layer 20. The second conductive trace layer 32 is electrically connected to the first conductive via 21.
A fifth conductive circuit layer 51 and a sixth conductive circuit layer 52 are respectively disposed on two opposite sides of the second thermoplastic resin layer 50, the fifth conductive circuit layer 51 and the sixth conductive circuit layer 52 are respectively electrically connected to the first conductive via 21 on the first thermoplastic resin layer 20, a third conductive via 53 penetrates through the second thermoplastic resin layer 50, and the third conductive via 53 is made of conductive paste. The third conductive vias 53 are electrically connected to the fifth conductive trace layer 51 and the sixth conductive trace layer 52, so that the first conductive trace layer 12, the first conductive via 21, the fifth conductive trace layer 51, the third conductive via 53, the sixth conductive trace layer 52 and the second conductive trace layer 32 are electrically connected.
In this embodiment, the first thermoplastic resin layer 20 and the second thermoplastic resin layer 50 are made of the same material and are both Liquid Crystal Polymer (LCP).
In the actual manufacturing process, each circuit substrate and the thermoplastic resin layer may be provided as shown in fig. 6, and the multilayer circuit board 300 may be prepared by one-time pressing, then using laser to make the opening 13 on the first thermosetting resin layer 11, and finally performing conventional surface treatment.
Compared to the multilayer circuit board 100 and the multilayer circuit board 200, the multilayer circuit board 300 provided by the present application further has the following advantages: the inner layer of the multilayer circuit board 300 is made of thermoplastic resin, so that the uniformity is high, and the multilayer circuit board is more favorable for products with characteristic impedance which is difficult to match. In addition, the first via 21 and the third via 53 are formed by drilling only in the first thermoplastic resin layer 20 and the second thermoplastic resin layer 50 (i.e., the dielectric layers), which can effectively improve the efficiency of the laser drilling process.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment.
Claims (10)
1. A multilayer circuit board, comprising:
the first circuit substrate comprises a first thermosetting resin layer and a first conductive circuit layer arranged on the first thermosetting resin layer;
the second circuit substrate is arranged at an interval with the first circuit substrate and comprises a second thermosetting resin layer and a second conductive circuit layer arranged on the second thermosetting resin layer, and the first conductive circuit layer is arranged towards the second conductive circuit layer;
the first thermoplastic resin layer is arranged between the first conductive circuit layer and the second conductive circuit layer, at least one first conduction body penetrates through the first thermoplastic resin layer, and the first conduction body is electrically connected with the first conductive circuit layer and the second conductive circuit layer.
2. The multilayer circuit board according to claim 1, wherein the multilayer circuit board comprises at least two first thermoplastic resin layers and at least one third circuit substrate, the at least one third circuit substrate and at least two of the first thermoplastic resin layers being disposed at intervals between the first electrically conductive wiring layers and the second electrically conductive wiring layers, each of the third circuit substrates being disposed between two of the first thermoplastic resin layers.
3. The multilayer circuit board according to claim 2, wherein the third circuit substrate includes a third thermosetting resin layer and third conductive wiring layers formed on the third thermosetting resin layer, the third thermosetting resin layer having a second via formed therethrough, opposite sides of the second via being electrically connected to the third conductive wiring layers and the first vias, respectively.
4. The multilayer circuit board of claim 3, wherein the third circuit substrate further comprises a fourth electrically conductive trace layer, the third and fourth electrically conductive trace layers being disposed on opposite sides of the third thermosetting resin layer, respectively; the second conduction body penetrates through the third conductive circuit layer, the second conduction body is electrically connected with the fourth conductive circuit layer, and the fourth conductive circuit layer is electrically connected with the first conduction body.
5. The multilayer circuit board according to claim 1, wherein the first thermosetting resin layer and the second thermosetting resin layer are made of perfluoroalkoxy resin, and the first thermoplastic resin layer is made of liquid crystal polymer.
6. The multilayer circuit board according to claim 1, comprising a plurality of first thermoplastic resin layers and at least one second thermoplastic resin layer, the plurality of first thermoplastic resin layers and the at least one second thermoplastic resin layer being disposed at intervals between the first conductive trace layer and the second conductive trace layer, each of the second thermoplastic resin layers being disposed between two of the first thermoplastic resin layers.
7. The multilayer circuit board according to claim 6, wherein a fifth conductive trace layer and a sixth conductive trace layer are disposed on opposite sides of the second thermoplastic resin layer, respectively, and the fifth conductive trace layer and the sixth conductive trace layer are electrically connected to the first vias on two adjacent first thermoplastic resin layers, respectively.
8. The multilayer circuit board of claim 7, wherein at least one third via is formed through the second thermoplastic resin layer, the third via being electrically connected to the fifth conductive trace layer and the sixth conductive trace layer.
9. The multilayer circuit board according to claim 6, wherein the material of the second thermoplastic resin layer is the same as the material of the first thermoplastic resin layer.
10. The multilayer circuit board of claim 1, wherein the first thermosetting resin layer has at least one opening formed therethrough, and the first conductive trace layer is exposed from a bottom of the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221331098.5U CN217789970U (en) | 2022-05-30 | 2022-05-30 | Multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221331098.5U CN217789970U (en) | 2022-05-30 | 2022-05-30 | Multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217789970U true CN217789970U (en) | 2022-11-11 |
Family
ID=83926491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221331098.5U Active CN217789970U (en) | 2022-05-30 | 2022-05-30 | Multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217789970U (en) |
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2022
- 2022-05-30 CN CN202221331098.5U patent/CN217789970U/en active Active
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