CN217778349U

CN217778349U - Cooling module and chassis structure

Info

Publication number: CN217778349U
Application number: CN202123427231.5U
Authority: CN
Inventors: 高杰; 严鹏; 陈琪
Original assignee: Youpao Automotive Technology Shanghai Co Ltd
Current assignee: Youpao Automotive Technology Shanghai Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-11-11
Anticipated expiration: 2031-12-31

Abstract

A cooling module and chassis structure, wherein the cooling module comprises: a fan module; the radiator module is fixed with the fan module; and the first buffer pieces are positioned between the fan module and the radiator module. The cooling module has a long service life.

Description

Cooling module and chassis structure

Technical Field

The utility model relates to the field of automobiles, especially, relate to a cooling module and chassis structure.

Background

The automobile cooling module is an important component of an automobile heat exchange system, and the good durability of the automobile cooling module is an important basis for ensuring the performance of an automobile.

At present, cooling modules in various vehicle models all have higher shock attenuation demands. In particular, in some highly integrated chassis structures, the cooling module is directly integrated on the vehicle frame, and during the driving of the vehicle, the road impact on the chassis structure is directly applied to the cooling module, so that the parts of the cooling module are seriously worn, and the durability of the cooling module is influenced.

In the prior art, a primary damping component is arranged between a cooling module and a frame to reduce the shock impact between the cooling module and the frame. However, the damping effect of the existing primary damping component on the cooling module is still to be improved, so that the service life of the cooling module is affected.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem be, provide a cooling module and chassis structure, cooling module's shock attenuation part has better shock attenuation effect to cooling module's life has been promoted.

In order to solve the above technical problem, an embodiment of the present invention provides a cooling module, including: a fan module; the radiator module is fixed with the fan module; and the first buffer pieces are positioned between the fan module and the radiator module.

Optionally, the cooling module further includes: and the first buffer pieces are distributed around the condenser.

Optionally, the cooling module further comprises: a radiator module fixing member fixed to a surface of the radiator module; and the fan module fixing piece is fixed on the surface of the fan module, and is matched with the radiator module fixing piece to fix the radiator module and the fan module.

Optionally, each radiator module fixing member is fixed at each vertex angle of the radiator module.

Optionally, the first buffer member is fixed between the heat sink module fixing member and the fan module fixing member.

Optionally, the number of the radiator module fixing pieces is the same as that of the fan module fixing pieces, and the positions of the radiator module fixing pieces correspond to the positions of the fan module fixing pieces one to one.

Optionally, the first cushion includes a rubber pad.

Optionally, the fan module fixing member includes a first fan module fixing member and a second fan module fixing member, the first fan module fixing member includes a mounting hole recessed relative to a surface of the fan module, the second fan module fixing member includes a boss protruding outward relative to the surface of the fan module, and a boss through hole penetrating through the boss is formed in the boss.

Optionally, the heat sink module fixing member includes a first heat sink module fixing member and a second heat sink module fixing member, the first heat sink module fixing member is matched with the first fan module fixing member, the second heat sink module fixing member is matched with the second fan module fixing member, the first heat sink module fixing member includes a first mounting pin, and the second heat sink module fixing member includes a second mounting pin.

Optionally, the cooling module further includes: the radiator module support is connected with the fan module and comprises a first support portion and a second support portion which are perpendicular to each other, a first support through hole is formed in the first support portion, a second support through hole is formed in the second support portion, the first mounting pin penetrates through the first support through hole, the second support through hole is matched with the mounting hole, and the second support portion is fixed to the surface of the fan module in a threaded connection mode.

Optionally, the first buffer member is fixed between the radiator module support and the first mounting pin, a first buffer member groove recessed relative to an outer side surface of the first buffer member and a first buffer member through hole penetrating through the first buffer member are formed in the first buffer member, the first support portion is clamped in the first buffer member groove, and an outer wall of the first buffer member contacts with the first support portion; the first mounting pin penetrates through the first buffer piece through hole, and the inner wall of the first buffer piece through hole is in contact with the outer wall of the first mounting pin.

Optionally, the second mounting pin penetrates through the boss through hole.

Optionally, the first buffer member is fixed between the boss and the second mounting pin, the first buffer member has a first buffer member groove recessed relative to an outer side surface of the first buffer member and a first buffer member through hole penetrating through the first buffer member, the boss is clamped in the first buffer member groove, and an outer wall of the first buffer member contacts with the boss; the second mounting pin penetrates through the first buffering part through hole, and the inner wall of the first buffering part through hole is in contact with the outer wall of the second mounting pin.

In order to solve the above technical problem, an embodiment of the utility model provides a chassis structure, include: a frame; the cooling module of any preceding claim, wherein the cooling module is secured to the frame.

Optionally, the chassis structure further includes: and the fan module supports are positioned between the cooling module and the frame, and fix the cooling module and the frame together.

Optionally, the chassis structure further includes: a plurality of second bumpers located between each of the fan module supports and the frame.

Compared with the prior art, the utility model discloses technical scheme has following beneficial effect:

the technical scheme of the utility model provide an among the cooling module, the fan module with be fixed with first bolster between the radiator module. Because the first buffer part exists, the radiator module and the fan module are not in direct contact, the first buffer part is used as a damping part in the cooling module, mechanical impact and vibration between the radiator module and the fan module are reduced, the situation that parts in the radiator module and the fan module are failed due to mechanical abrasion is reduced, and the service life of the cooling module is prolonged.

The technical scheme of the utility model provide an among the chassis structure, cooling module has the first bolster that is located between fan module and the radiator module. The first buffer piece reduces mechanical impact transmitted from the frame between the radiator module and the fan module, and prolongs the service life of the cooling module.

Further, a second buffer piece is fixed between the frame and the cooling module. Through placing first bolster as second grade shock attenuation part inside the cooling module to reduced the mechanical impact that the second bolster that is one-level shock attenuation part between cooling module and the frame bore, prolonged the life of second bolster, simultaneously, the existence of first bolster has alleviateed the shock attenuation pressure that the second bolster was undertaken, consequently the permission the size of second bolster reduces to be favorable to promoting the integrated level of chassis structure. In addition, the first buffer part and the second buffer part realize functional decoupling, and the first buffer part and the second buffer part can be independently designed and arranged, so that a better damping effect is provided for the cooling module through mutual matching.

Drawings

FIGS. 1 and 2 are schematic structural views of a chassis structure;

fig. 3 and 4 are schematic structural views of a cooling module according to an embodiment of the present invention;

FIG. 5 is an enlarged view of region A of the cooling module of FIG. 4;

FIG. 6 is a schematic cross-sectional view along direction AA' of the cooling module area A of FIG. 5;

FIG. 7 is an enlarged view of region B of the cooling module of FIG. 4;

FIG. 8 is a schematic cross-sectional view of the cooling module area B of FIG. 7 along direction BB';

fig. 9 and 10 are schematic structural views of a chassis structure according to an embodiment of the present invention.

Detailed Description

As described in the background art, the damping effect of the damping part of the cooling module in the prior art needs to be improved, thereby affecting the service life of the cooling module.

Fig. 1 and 2 are schematic structural views of a chassis structure, fig. 1 is a view of fig. 2 taken along a direction S, and fig. 2 is a view of fig. 1 taken along a direction P.

Referring to fig. 1 and 2, the chassis structure includes: a heat sink module 102; the fan module 101, the said radiator module 102 is fixed with fan module 101 through the radiator support 105; a condenser 103 fixed between the radiator module 102 and the fan module 101; a frame 104, wherein the frame 104 is fixed with the fan module 101; an external buffer (not shown) located between the frame 104 and the fan module 101.

It should be noted that the view shown in fig. 2 does not include frame 104 for ease of understanding.

During the running of the automobile, the frame 104 receives impact from the road surface, and since the fan module 101 is directly fixed on the frame 104, the frame 104 can transmit mechanical impact to the fan module 101, so as to further transmit the mechanical impact to the inside of the cooling module, so that mechanical impact and vibration are generated between the fan module 101 and the radiator module 102, and thus internal components (such as a radiator pipe) of the radiator module 102 are damaged due to excessive wear, and the cooling module fails. The external buffer between the frame 104 and the fan module 101 serves as a primary damping component for reducing external shock transmitted between the frame 104 and the cooling module, and particularly reducing shock transmitted from the fan module 101 to the passenger compartment through the frame 104. However, the external buffer is disposed outside the cooling module overall structure, and has a limited damping effect on the shock impact transmitted to the cooling module by the frame 104. In addition, the external buffer member is easily deformed and failed in the process of being repeatedly compressed or stretched due to large mechanical impact borne by the external buffer member, and meanwhile, in order to have sufficient shock absorption capacity, the external buffer member often needs to have a large size, so that the integration level of the chassis structure is reduced.

In order to solve the above problem, the utility model provides a cooling module, include fan module, radiator module and be located first bolster between fan module and the radiator module. The first buffer reduces mechanical impact between the radiator module and the fan module, and prolongs the service life of the cooling module.

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Fig. 3 and 4 are schematic structural diagrams of a cooling module according to an embodiment of the present invention, fig. 3 is a view of fig. 4 along a Y direction, and fig. 4 is a view of fig. 3 along an X direction.

Referring to fig. 3 and 4, the cooling module includes: a fan module 201; a heat sink module 202, wherein the heat sink module 202 is fixed with the fan module 201; a plurality of first buffers 206 located between the fan module 201 and the heat sink module 202.

The radiator module 202 is used for cooling the automobile and the battery through low-temperature cooling water.

The fan module 201 is used to generate air convection around the heat sink module 202, thereby dissipating heat from the heat sink module 202.

The heat sink module 202 is disposed parallel to the fan module 201, and the fan module 201 includes a fan module frame (not shown) and a fan (not shown) disposed in the fan module frame, the fan module frame includes a first surface and a second surface opposite to each other, and the first surface faces the heat sink module 202. The heat sink module 202 includes a heat sink module cavity (not shown) and a heat dissipation pipe (not shown) located in the heat sink module cavity, and the heat sink module 202 is fixed on the first surface.

During the running of the automobile, the cooling module is subjected to mechanical impact from an external frame, so that impact and vibration are generated between the radiator module 202 and the fan module 201, and components in the radiator module 202 and the fan module 201 are subjected to mechanical abrasion, which affects the service life of the cooling module.

On the basis of a primary damping part arranged between the cooling module and an external frame, the first damping part 206 is arranged between the fan module 201 and the radiator module 202, so that the first damping part serves as a secondary damping part in the cooling module, mechanical impact between the radiator module 202 and the fan module 201 is reduced, the situation that parts in the radiator module 202 and the fan module 201 are failed due to mechanical abrasion is reduced, and the service life of the cooling module is prolonged. In addition, by providing the first buffer 206 as a secondary damping component, functional decoupling from the primary damping component is achieved, so that the secondary damping component and the primary damping component can be designed and arranged independently. Therefore, the proper first buffer 206 can be better selected from the angles of reducing the shock impact inside the cooling module and improving the durability of the components of the cooling module, and the first buffer 206 and the first-level damping component are mutually matched, so that a better damping effect is provided for the cooling module.

In this embodiment, the cooling module further includes: a radiator module fixing member (not shown) fixed to a surface of the radiator module 202; and a fan module fixing member (not labeled) fixed to a surface of the fan module 201, wherein the fan module fixing member is matched with the radiator module fixing member to fix the radiator module 202 and the fan module 201. The number of the radiator module fixing pieces is consistent with that of the fan module fixing pieces. The heat sink module fixing members are respectively fixed at the top corners of the heat sink module 202, and the positions of the heat sink module fixing members correspond to the positions of the fan module fixing members one by one.

Specifically, the surface of the radiator module 202 facing the fan module is quadrilateral, the number of the radiator module fixing pieces is 4, and each radiator module fixing piece is fixed at 4 vertex angles of the radiator module cavity respectively; the first surface of the fan module frame body is quadrilateral, the number of the fan module fixing pieces is 4, and each fan module fixing piece is fixed at 4 vertex angles of the first surface. The size of the fan module 201 is matched with the size of the heat sink module 202, so that the positions of the heat sink module fixing parts correspond to the positions of the fan module fixing parts one by one, and the heat sink module 202 and the fan module 201 are fixed with each other through the matching between the heat sink module fixing parts and the fan module fixing parts.

In this embodiment, the fan module fixing member includes a first fan module fixing member and a second fan module fixing member. The number of the first fan module fixing pieces is 2, and each first fan module fixing piece is positioned at two adjacent top corners of the first surface; the number of the second fan module fixing pieces is 2, and each second fan module fixing piece is located at two adjacent top corners of the first surface.

The radiator module fixing member includes a first radiator module fixing member and a second radiator module fixing member, the first radiator module fixing member is matched with the first fan module fixing member, and the second radiator module fixing member is matched with the second fan module fixing member, so that the radiator module 202 is fixed to the fan module 201.

The first fan module fixing part and the second fan module fixing part are different in structure, and can be matched with each other by selecting a proper first fan module fixing part structure and a proper second fan module fixing part structure, so that the connection and fixation between each radiator module fixing part and each fan module fixing part are more convenient, and the radiator module 202 is convenient to disassemble and assemble relative to the fan module 201.

In this embodiment, the first buffer member 206 is fixed between the heat sink module fixing member and the fan module fixing member, so as to reduce the mechanical impact between the heat sink module fixing member and the fan module fixing member, and thus reduce the impact and vibration between the heat sink module 202 and the fan module 201. The first buffer 206 comprises a rubber pad.

Fig. 5 is an enlarged view of a region a of the cooling module in fig. 4, and fig. 6 is a schematic sectional view of the region a of the cooling module in fig. 5 along a direction AA'.

Referring to fig. 5 and 6, the first fan module fixing member includes a mounting hole 203 recessed with respect to a surface of the fan module 201. The mounting hole 203 includes a plurality of sub-holes (not labeled), and the sub-holes are distributed side by side at a top corner of the first surface of the fan module frame. The inner wall surface of each sub-hole is provided with mounting hole positioning threads for screwing and fixing the radiator module 202 on the first surface.

The first radiator module fixing member includes a first mounting pin 204, and the first mounting pin 204 protrudes in a direction parallel to the first surface with respect to the surface of the radiator module 202. The first mounting pin 204 and the heat sink module cavity are integrally formed, so that the first mounting pin 204 and the heat sink module 202 are more firmly fixed, and the connection structure between the heat sink module fixing member and the heat sink module 202 is also simplified.

The cooling module further includes: a radiator module holder 205 connecting the fan module 201 and the radiator module 202. Specifically, the heat sink module bracket 205 is located between each mounting hole 203 of the fan module 201 and each corresponding first mounting pin 204 of the heat sink module 202, and the heat sink module bracket 205 connects and fixes the mounting hole 203 and the first mounting pin 204, thereby fixing the fan module 201 and the heat sink module 202 to each other. The number of the radiator module holders 205 is 2.

The radiator module support 205 includes a first support portion 208 and a second support portion 207 that are perpendicular to each other. The first frame portion 208 has a first frame through hole (not shown) therein, the first frame through hole having a diameter larger than that of the first mounting pin 204, and the first mounting pin 204 penetrates the first frame portion 208 through the first frame through hole. The second bracket portion 207 has a second bracket through hole (not labeled) therein, which is matched with the mounting hole 203. The second bracket through holes comprise a plurality of second bracket holes (not marked), the number of the second bracket holes is consistent with that of the sub-holes of the mounting hole 203, and the positions of the second bracket holes correspond to those of the sub-holes of the mounting hole 203 one to one. A bolt 215 is fixed in each second bracket hole, the bolt 215 simultaneously penetrates through the second bracket sub-hole and the corresponding sub-hole of the mounting hole 203, the outer wall of the bolt 215 is provided with bolt threads, and the bolt threads are matched with the mounting hole positioning threads, so that the second bracket part 207 is fixed on the surface of the fan module 201 in a threaded manner.

In this embodiment, a first cushion 206 is fixed between the radiator module holder 205 and the first mounting pin 204.

With continued reference to fig. 6, the shape of the pattern projected by the first buffer 206 (as shown in fig. 5) on the first surface is an i-shape. The first buffer element 206 has a first buffer layer 210 and a second buffer layer 209, a first buffer element groove (not labeled) recessed relative to the outer side surface of the first buffer element 206 is provided in the first buffer element 206, the first buffer element groove is located between the first buffer layer 210 and the second buffer layer 209, and the first buffer layer 210 and the second buffer layer 209 are connected through a buffer column 211. The first buffer member 206 has a first buffer member through hole (not labeled) therein, which penetrates through the first buffer member 206, and the first buffer member through hole is located at the center of the buffer column 211. The thickness of the first buffer 206 includes 10 mm to 30 mm.

The first bracket portion 205 (as shown in fig. 5) is engaged with the first buffer recess, and the outer wall of the first buffer 206 contacts with the first bracket portion 205. Specifically, the lower surface of the first buffer layer 210 contacts the upper surface of the first frame part 208, the upper surface of the second buffer layer 209 contacts the lower surface of the first frame part 208, and the outer wall surface of the buffer post 211 contacts the inner wall (not shown) of the first frame through hole. The first mounting pin 204 penetrates the first cushion 206 through the first cushion through hole, and the inner wall of the first cushion through hole contacts with the outer wall of the first mounting pin 204.

The first cushion member 206 is fixedly positioned between the first mounting pin 204 and the heat sink bracket 205, and the first cushion member 206 is in contact with the first mounting pin 204 and the heat sink bracket 205, respectively, so that the first mounting pin 204 and the heat sink bracket 205 are fixed. In addition, due to the existence of the first buffer 206, the first mounting pin 204 is not in direct contact with the radiator support 205, and the first buffer 206 reduces mechanical impact between the first mounting pin 204 and the radiator support 205, so that impact and vibration between the radiator module 202 and the fan module 201 are reduced, thereby reducing the failure of components in the radiator module 202 and the fan module 201 due to mechanical wear, and prolonging the service life of the cooling module.

Fig. 7 is an enlarged view of a region B of the cooling module in fig. 4, and fig. 8 is a schematic sectional view of the region B of the cooling module in fig. 7 along the BB' direction.

The second fan module fixing member includes a boss 220 extending outward relative to the surface of the fan module 201, the extension direction of the boss 220 is perpendicular to the first surface of the fan module frame, and the boss 220 and the fan module frame are integrally formed, so that the boss 220 and the fan module 201 are more firmly fixed, and the connection structure between the fan module fixing member and the fan module 201 is also simplified.

The second radiator module fixing member includes a second mounting pin 221, the second mounting pin 221 protrudes in a direction parallel to the first surface with respect to the surface of the radiator module 202, the second mounting pin 221 extends in a direction opposite to the extending direction of the first mounting pin 204 (shown in fig. 5) with respect to the radiator module 202, and the second mounting pin 221 is integrally formed with the radiator module cavity.

The boss 220 has a boss through hole (not labeled) penetrating through the boss 220, the boss through hole has a diameter larger than that of the second mounting pin 221, and the second mounting pin 221 penetrates through the boss 220 through the boss through hole.

Referring to fig. 8, a first buffer 206 is fixed between the boss 220 and the second mounting pin 221. The boss 220 is clamped in the groove of the first buffer member, and the outer wall of the first buffer member 206 is in contact with the boss 220. Specifically, the surface of the first buffer layer 210 and the surface of the second buffer layer 209 of the first buffer member 206 contact the lower surface and the upper surface of the boss 220, respectively, and the surface of the outer wall of the buffer post 211 contacts the surface of the inner wall of the boss through hole. The second mounting pin 221 penetrates the first buffer 206 through the first buffer through hole (not labeled), and the inner wall of the first buffer through hole contacts the outer wall of the second mounting pin 221.

The first cushion member 206 is fixedly positioned between the second mounting pin 221 and the boss 220, and the first cushion member 206 is in contact with the second mounting pin 221 and the boss 220, respectively, so that the second mounting pin 221 and the boss 220 are fixed. In addition, due to the existence of the first buffer 206, there is no direct contact between the second mounting pin 221 and the boss 220, and the first buffer 206 reduces the mechanical impact between the second mounting pin 221 and the boss 220, so as to reduce the impact and vibration between the heat sink module 202 and the fan module 201, and prolong the service life of the cooling module.

The structure of the boss 220 and the mounting hole 203 of the fan module 201 facilitates the mounting and dismounting of the fan module 201 and the heat sink module 202, thereby facilitating the assembly and maintenance of the cooling module.

In other embodiments, the cooling module further comprises: and the first buffer pieces are distributed around the condenser.

The technical scheme of the utility model a chassis structure is still provided, include the frame and be fixed in the cooling module on the frame, cooling module has the first bolster that is located between fan module and the radiator module. The first buffer piece reduces mechanical impact transmitted from the frame between the radiator module and the fan module, and prolongs the service life of the cooling module.

The following detailed description will be made in conjunction with the accompanying drawings.

Fig. 9 and 10 are schematic structural views of a chassis structure according to an embodiment of the present invention, fig. 9 is a view along direction Q of fig. 10, and fig. 10 is a view along direction Z of fig. 9.

Referring to fig. 9 and 10, the chassis structure includes a frame 303 and a cooling module 300, and the cooling module 300 is fixed on the frame 303.

The cooling module 300 includes: a fan module 301; a heat sink module 302, wherein the heat sink module 302 is fixed with the fan module 301; a plurality of first buffers 306 located between the fan module 301 and the heat sink module 302.

In this embodiment, the chassis structure further includes a plurality of fan module brackets 304 located between the cooling module 300 and the frame 303, and each of the fan module brackets 304 fixes the cooling module 300 to the frame 303. The number of the fan module holders 304 is 4, and each of the fan module holders 304 is located at 4 vertex angles of the upper and lower surfaces of the fan module 301.

In this embodiment, the chassis structure further includes: a plurality of second bumpers 305 positioned between each of the fan module supports 304 and the frame 303. Each second buffer member 305 is fixed to the surface of each fan module support 304, and the position of each second buffer member 305 corresponds to the position of each fan module support 304 one by one. The second buffer 305 includes a rubber pad.

Each second buffer 305 is used as a primary damping component of the cooling module 300, and is used for reducing the shock impact transmitted between the frame 303 and the cooling module 300, especially reducing the shock impact transmitted by the fan module 301 to the passenger cabin through the frame 303, so that the use experience of the automobile is improved.

The structure, shape and position of the first buffer 306 are as described in fig. 3 to fig. 8 and the related description, which are not repeated herein.

In this embodiment, on the basis of the first buffer 305, which is a primary damping component disposed between the cooling module 300 and the frame 303, the first buffer 306 located between the fan module 301 and the radiator module 302 serves as a secondary damping component inside the cooling module 300, so that the mechanical impact transmitted from the frame 303 between the radiator module 302 and the fan module 301 is reduced, the vibration between the radiator module 302 and the fan module 301 is reduced, and the service life of the cooling module 300 is prolonged. In addition, by providing the first cushion member 306 as a secondary damping member, the function decoupling thereof from the primary damping member, i.e., the second cushion member 305, is achieved, so that the first cushion member 306 and the second cushion member 305 can be independently designed and arranged. Therefore, the first buffer 306 can be selected from the aspects of reducing the shock inside the cooling module 300 and improving the durability of the components of the cooling module 300; meanwhile, the second buffer member 305 is preferably selected from the angle of reducing the vibration impact of the fan module 301 on the passenger cabin, so that the first buffer member 306 and the second buffer member 305 are matched with each other, and a better damping effect is provided for the cooling module 300.

In addition, since the first buffer 306 and the second buffer 305 work together to reduce the mechanical impact between the cooling module 300 and the vehicle frame 303, the existence of the first buffer 306 reduces the damping pressure borne by the second buffer 305, which improves the service life of the second buffer 305, and in addition, since the damping pressure borne by the second buffer 305 is reduced, the second buffer 305 is allowed to have a smaller size, which is beneficial to improving the integration level of the chassis structure.

It should be noted that the view shown in fig. 10 does not include frame 303 for ease of understanding.

Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention, and the scope of the present invention is defined by the appended claims.

Claims

1. A cooling module, comprising:

a fan module;

the radiator module is fixed with the fan module;

the fan module fixing piece is matched with the radiator module fixing piece to fix the radiator module and the fan module;

and the first buffer piece is fixed between the radiator module fixing piece and the fan module fixing piece.

2. The cooling module of claim 1, further comprising: and the first buffer pieces are distributed around the condenser.

3. A cooling module according to claim 1, wherein each radiator module securing member is secured to each of the top corners of the radiator module.

4. The cooling module of claim 1, wherein the number of the radiator module fixing members is the same as the number of the fan module fixing members, and the position of each radiator module fixing member corresponds to the position of each fan module fixing member one to one.

5. The cooling module of claim 1, wherein the first dampener includes a rubber pad.

6. A cooling module according to claim 1, wherein the fan module securing member comprises a first fan module securing member including a mounting hole recessed relative to a fan module face and a second fan module securing member including a boss projecting outwardly relative to the fan module face, the boss having a boss through-hole therethrough.

7. The cooling module of claim 6, wherein the heat sink module securing member comprises a first heat sink module securing member and a second heat sink module securing member, the first heat sink module securing member cooperating with the first fan module securing member, the second heat sink module securing member cooperating with the second fan module securing member, the first heat sink module securing member comprising a first mounting pin and the second heat sink module securing member comprising a second mounting pin.

8. The cooling module of claim 7, further comprising: the radiator module support is connected with the fan module and comprises a first support portion and a second support portion which are perpendicular to each other, a first support through hole is formed in the first support portion, a second support through hole is formed in the second support portion, the first mounting pin penetrates through the first support through hole, the second support through hole is matched with the mounting hole, and the second support portion is fixed to the surface of the fan module in a threaded connection mode.

9. The cooling module according to claim 8, wherein the first buffer member is fixed between the radiator module support and the first mounting pin, the first buffer member has a first buffer member groove recessed with respect to an outer surface of the first buffer member and a first buffer member through hole penetrating the first buffer member, the first support portion is engaged with the first buffer member groove, and the first buffer member outer wall is in contact with the first support portion; the first mounting pin penetrates through the first buffer piece through hole, and the inner wall of the first buffer piece through hole is in contact with the outer wall of the first mounting pin.

10. A cooling module according to claim 7, wherein the second mounting pin extends through the boss through-hole.

11. The cooling module of claim 10, wherein the first cushion member is secured between the boss and the second mounting pin, the first cushion member has a first cushion member groove recessed relative to an outer side surface of the first cushion member and a first cushion member through hole penetrating the first cushion member, the boss is engaged in the first cushion member groove, and an outer wall of the first cushion member contacts the boss; the second mounting pin penetrates through the first buffer piece through hole, and the inner wall of the first buffer piece through hole is in contact with the outer wall of the second mounting pin.

12. A chassis structure, comprising:

a frame;

the cooling module of any one of claims 1 to 11, being secured to the vehicle frame.

13. The chassis structure as recited in claim 12, further comprising: and the fan module supports are positioned between the cooling module and the frame and fix the cooling module and the frame.

14. The chassis structure of claim 13, further comprising: a plurality of second bumpers located between each of the fan module supports and the frame.