CN217770682U

CN217770682U - Novel high-precision high-order high-density HDI circuit board

Info

Publication number: CN217770682U
Application number: CN202221225984.XU
Authority: CN
Inventors: 甘颖燕; 王建业; 陈丽
Original assignee: Shenzhen Honglian Circuit Co ltd
Current assignee: Shenzhen Honglian Circuit Co ltd
Priority date: 2022-05-21
Filing date: 2022-05-21
Publication date: 2022-11-08
Anticipated expiration: 2032-05-21

Abstract

The utility model discloses a novel high multistage HDI high density circuit board of high accuracy, including a main part frame and No. two main parts frames, a main part frame left end fixed mounting has the radiator, be provided with two connecting plates between a main part frame and No. two main parts frames jointly, the mounting groove has been seted up jointly to a main part frame and No. two main part frame upper ends, a main part frame and No. two main part frame upper ends are provided with the main part board jointly, and are two sets of distribute and every group sets up to two around spacing being. A novel high multistage HDI high density circuit board of high accuracy, through setting up radiator and connecting plate and spacing, drive the rotation post through the fan, drive the flabellum by rotating the post again to improve the radiating effect, thereby drive the stopper through the adjusting bolt and be convenient for carry out spacing fixed to the circuit board, through No. two main part framves of removal on the connecting plate, thereby be convenient for adjust according to the length of circuit board and control spacing distance.

Description

Novel high-precision high-order high-density HDI circuit board

Technical Field

The utility model relates to a circuit board technical field, in particular to novel high multistage HDI high density circuit board of high accuracy.

Background

HDI is english shorthand for highdensity interconnect, and High Density Interconnect (HDI) manufacturing is one of the fastest developing areas in the printed circuit board industry, and from the first 32-bit computer introduced by hewlett packard in 1985 to today's large customer servers that employ 36 sequentially laminated multilayer printed boards and stacked micro vias, HDI/micro via technology is undoubtedly the future PCB architecture, with smaller device pitch, larger ASICs and FPGAs with more I/O pins and embedded passive devices having shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, driving a strong demand for HDI/micro vias.

The existing equipment has the following problems: 1. the installation distance about current equipment can't be adjusted according to the length of circuit board, and is poor to the spacing effect of circuit board simultaneously to reduce the availability factor, 2, current equipment is poor to the radiating effect of circuit board, thereby reduces the availability factor, thereby has caused the limitation that this novel high-precision high multistage HDI high density circuit board used, so we provide a neotype high-precision high multistage HDI high density circuit board.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a novel multistage HDI high density circuit board of high accuracy height, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a novel high multistage HDI high density circuit board of high accuracy, includes main part frame and No. two main part framves, main part frame left end fixed mounting has the heat-radiating equipment, be provided with two connecting plates between main part frame and No. two main part frames jointly, the mounting groove has been seted up jointly to main part frame and No. two main part frame upper ends, main part frame and No. two main part frame upper ends are provided with the main part board jointly, the equal fixed mounting in anterior and the upper end rear portion of main part frame upper end and No. two main part frame upper ends has a set of spacing, and is two sets of it sets up to two to distribute and every group around spacing being.

Preferably, a plurality of bleeder vents have all been seted up to inside lower terminal surface of a main part frame and No. two main part frames, the radiating groove has been seted up to No. two main part frame right-hand members, the shifting chute has all been seted up at No. two main part frame left end front portions and left end rear portion, the equal spread groove in a main part frame and No. two main part frame upper end front portions and upper end rear portion, no. two main part frame front end left part and rear end left part have all been seted up spacing hole.

Preferably, a plurality of the air holes are distributed at equal intervals, and the two connecting plates are connected in the moving groove in a sliding mode.

Preferably, an adjusting bolt is movably inserted and connected to the upper end of the limiting frame, a limiting block is fixedly connected to the lower end of the adjusting bolt, a plurality of clamping grooves are formed in the front end of the connecting plate, a limiting pin is movably connected into each clamping groove, and a placing groove is formed in the left end of the first main body frame; the limiting block is driven by the adjusting bolt so as to limit and fix the circuit board, and the second main body frame is moved on the connecting plate so as to adjust the left and right limiting distances according to the length of the circuit board.

Preferably, the limiting pin penetrates through the limiting hole and is movably connected in the clamping groove in an inserting mode, and the limiting frame is connected in the connecting groove.

Preferably, the heat dissipation device comprises a fixed frame, a fan is fixedly connected inside the fixed frame, the output end of the fan is fixedly connected with a rotating column, the right end of the rotating column is fixedly connected with a plurality of fan blades, the left end of the fixed frame is provided with a plurality of air inlets, and the fixed frame is fixedly connected in the placing groove; the fan drives the rotating column, and then the rotating column drives the fan blades, so that the heat dissipation effect is improved.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. in the utility model, by arranging the connecting plate and the limiting frame, when in use, when the length of the circuit board is greater than the limiting distance, the limiting pin is taken out from the limiting hole and moves the second main body frame rightwards, so that the left and right limiting distances can be conveniently adjusted according to the length of the circuit board;

2. the utility model discloses in, through setting up the radiating equipment, when using, when the heat that the circuit board produced when the operation, need drive the rotation post through the fan, drive the flabellum by the rotation post again, make wind-force inhale the mount from the inlet port in, again by the effect of flabellum under, carry wind-force to a main part frame and No. two main part framves in, the heat that makes the circuit board distribute out can be followed bleeder vent and radiating groove and discharged to improve the radiating effect.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a novel high-precision high-multi-stage HDI high-density circuit board according to the present invention;

fig. 2 is a schematic diagram of the overall structure of a second main frame of the novel high-precision high-multi-stage HDI high-density circuit board according to the present invention;

FIG. 3 is a schematic diagram of the overall structure of the connecting plate of the novel high-precision high-multi-stage HDI high-density circuit board according to the present invention;

fig. 4 is the utility model relates to a novel heat radiating equipment's of multistage HDI high density circuit board of high accuracy overall structure schematic diagram.

In the figure: 1. a first body frame; 2. a second main body frame; 3. a heat dissipating device; 4. a main body plate; 5. a limiting frame; 6. a connecting plate; 7. mounting grooves; 8. a placement groove; 9. air holes are formed; 21. a moving groove; 22. a limiting hole; 23. a heat sink; 24. connecting grooves; 31. a fixed mount; 32. a fan; 33. rotating the column; 34. a fan blade; 35. an air inlet; 51. adjusting the bolt; 52. a limiting block; 61. a card slot; 62. and a limiting pin.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "provided," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in figures 1-4, a novel high multistage HDI high density circuit board of high accuracy, including main body frame 1 and No. two

main body frame

2, 1 left end fixed mounting of main body frame has heat abstractor 3, be provided with two connecting plates 6 between 1 main body frame and No. two main body frame 2 jointly, mounting groove 7 has been seted up jointly to 1 main body frame and No. two main body frame 2 upper ends, 1 main body frame and No. two main body frame 2 upper ends are provided with main body board 4 jointly, the equal fixed mounting in anterior and the upper end rear portion of 2 upper ends of 1 main body frame and No. two main body frame has a set of spacing 5, two sets of spacing 5 distribute around being and every group sets up to two.

A plurality of air holes 9 are formed in the lower end faces of the inner parts of the first main body frame 1 and the second main body frame 2, a heat dissipation groove 23 is formed in the right end of the second main body frame 2, moving grooves 21 are formed in the front part of the left end and the rear part of the left end of the second main body frame 2, connecting grooves 24 are formed in the front part of the upper end and the rear part of the upper end of the first main body frame 1 and the second main body frame 2, and limiting holes 22 are formed in the left part of the front end and the left part of the rear end of the second main body frame 2; the plurality of air holes 9 are distributed at equal intervals, and the two connecting plates 6 are connected in the moving groove 21 in a sliding way; an adjusting bolt 51 is movably and alternately connected to the upper end of the limiting frame 5, a limiting block 52 is fixedly connected to the lower end of the adjusting bolt 51, a plurality of clamping grooves 61 are formed in the front end of the connecting plate 6, a limiting pin 62 is movably connected into each clamping groove 61, and a placement groove 8 is formed in the left end of the first main body frame 1; the circuit board is conveniently limited and fixed by driving the limiting block 52 through the adjusting bolt 51, and the left and right limiting distances are conveniently adjusted according to the length of the circuit board by moving the second main body frame 2 on the connecting plate 6; the limit pin 62 penetrates through the limit hole 22 and is movably inserted and connected in the clamping groove 61, and the limit frame 5 is connected in the connecting groove 24.

The heat dissipation device 3 comprises a fixed frame 31, a fan 32 is fixedly connected inside the fixed frame 31, the output end of the fan 32 is fixedly connected with a rotating column 33, the right end of the rotating column 33 is fixedly connected with a plurality of fan blades 34, the left end of the fixed frame 31 is provided with a plurality of air inlets 35, and the fixed frame 31 is fixedly connected in the placing groove 8; the fan 32 drives the rotary column 33, and the rotary column 33 drives the fan blades 34, thereby improving the heat dissipation effect.

It should be noted that, the utility model relates to a novel high multistage HDI high density circuit board of high accuracy, through setting up connecting plate 6 and spacing 5, when using, when the length of circuit board is greater than spacing distance, take out spacer pin 62 from spacing hole 22, and move No. two main part frame 2 of right side, thereby be convenient for adjust according to the length of circuit board about spacing distance, when the circuit board is connected in mounting groove 7, drive stopper 52 to move downwards through adjusting bolt 51, thereby be convenient for carry out spacing fixed to the circuit board, thereby improve the steadiness; through setting up heat dissipation equipment 3, when using, when the heat that the circuit board produced when the operation, need drive through fan 32 and rotate post 33, drive flabellum 34 by rotating post 33 again, make wind-force follow inlet port 35 inhale the mount 31 in, again by under the effect of flabellum 34, carry wind-force to a main part frame 1 and No. two main part frames 2 in, the heat that makes the circuit board distribute out can be followed bleeder vent 9 and radiating groove 23 and discharged to improve the radiating effect.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a novel high multistage HDI high density circuit board of high accuracy, includes No. one main part frame (1) and No. two main part frames (2), its characterized in that: a main part frame (1) left end fixed mounting has heat-radiating equipment (3), be provided with two connecting plates (6) between a main part frame (1) and No. two main part frames (2) jointly, mounting groove (7) have been seted up jointly to a main part frame (1) and No. two main part frame (2) upper ends, a main part frame (1) and No. two main part frame (2) upper ends are provided with main part board (4) jointly, the equal fixed mounting in anterior and the upper end rear portion of a main part frame (1) and No. two main part frame (2) upper ends has a set of spacing (5), and is two sets of it sets up to two to distribute and every group around spacing (5).

2. The novel high-precision high-order high-HDI high-density circuit board as claimed in claim 1, wherein: a plurality of bleeder vents (9) have all been seted up to the terminal surface under first main part frame (1) and No. two main part frame (2) insides, radiating groove (23) have been seted up to No. two main part frame (2) right-hand members, shifting chute (21) have all been seted up to No. two main part frame (2) left end front portions and left end rear portion, no. one main part frame (1) and No. two main part frame (2) upper end front portions and upper end rear portion equal spread groove (24), no. two main part frame (2) front end left part and rear end left part have all been seted up spacing hole (22).

3. The novel high-precision high-order HDI high-density circuit board according to claim 2, characterized in that: the air holes (9) are distributed at equal intervals, and the two connecting plates (6) are connected in the moving groove (21) in a sliding manner.

4. The novel high-precision high-order HDI high-density circuit board according to claim 3, characterized in that: spacing (5) upper end activity interlude is connected with adjusting bolt (51), adjusting bolt (51) lower extreme fixedly connected with stopper (52), a plurality of draw-in grooves (61) have been seted up to connecting plate (6) front end, swing joint has spacer pin (62) in draw-in groove (61), standing groove (8) have been seted up to main part frame (1) left end.

5. The novel high-precision high-order HDI high-density circuit board according to claim 4, characterized in that: the limiting pin (62) penetrates through the limiting hole (22) and is movably connected in the clamping groove (61) in a penetrating mode, and the limiting frame (5) is connected in the connecting groove (24).

6. The novel high-precision high-order HDI high-density circuit board according to claim 5, characterized in that: the heat dissipation device (3) comprises a fixing frame (31), a fan (32) is fixedly connected inside the fixing frame (31), a rotating column (33) is fixedly connected to the output end of the fan (32), a plurality of fan blades (34) are fixedly connected to the right end of the rotating column (33), a plurality of air inlets (35) are formed in the left end of the fixing frame (31), and the fixing frame (31) is fixedly connected in the placing groove (8).