CN217768341U - Primary and secondary ring fixture mechanism of rotary disc type chip sorting machine - Google Patents
Primary and secondary ring fixture mechanism of rotary disc type chip sorting machine Download PDFInfo
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- CN217768341U CN217768341U CN202220902235.XU CN202220902235U CN217768341U CN 217768341 U CN217768341 U CN 217768341U CN 202220902235 U CN202220902235 U CN 202220902235U CN 217768341 U CN217768341 U CN 217768341U
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- ring
- guide pin
- clamping piece
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Abstract
The utility model provides a carousel formula chip sorter primary and secondary ring anchor clamps mechanism belongs to chip sorter technical field, including the solid brilliant panel of briquetting combination, primary and secondary wafer clamping piece and primary and secondary, the briquetting combination passes through linear bearing fixed connection and is in the solid brilliant panel one side of primary and secondary, the solid brilliant panel one side of primary and secondary is provided with and is used for driving the cylinder that primary and secondary wafer clamping piece removed. The embodiment of the utility model provides a compare in prior art, can realize pressing from both sides the in-process at the chip and not rock, have that chip detection effect is good and absorb stable advantage.
Description
Technical Field
The utility model belongs to the technical field of the chip sorter, specifically a carousel formula chip sorter primary and secondary ring anchor clamps mechanism.
Background
In the chip sorting process, the stability of the wafer chip is poor when the wafer chip is clamped, and improvement is needed urgently.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the embodiment of the utility model is to provide a primary and secondary ring fixture mechanism of carousel formula chip sorter.
In order to solve the technical problem, the utility model provides a following technical scheme:
a primary and secondary ring clamp mechanism of a rotary disc type chip sorting machine comprises a pressing block assembly, primary and secondary wafer clamping pieces and a primary and secondary die-bonding panel,
the pressing block assembly is fixedly connected to one side of the primary and secondary die fixing panel through a linear bearing, and an air cylinder for driving the primary and secondary wafer clamping pieces to move is arranged on one side of the primary and secondary die fixing panel.
As a further improvement of the utility model: one side of the primary and secondary die bonding panels is provided with a wafer combination,
the wafer combination comprises a wafer ring fixing piece, a hoop wafer ring, a hoop pressing block and a blue film frame, wherein the wafer ring fixing piece is fixedly arranged on the blue film frame and used for bearing a chip.
As a further improvement of the utility model: the pressing block assembly comprises a guide pin sleeve, a pressing spring and a clamping piece guide pin,
the guide pin sleeve is sleeved outside the clamping piece guide pin, one end of the clamping piece guide pin is connected with the linear bearing, and the clamping piece guide pin is connected with the primary and secondary die bonding panels through a compression spring.
As a further improvement of the utility model: a primary and secondary cushion block, a primary and secondary limiting block and a sensor are also arranged on one side of the primary and secondary die bonding panel,
and one side of the primary-secondary die bonding panel is connected with a searchlight through a primary-secondary anti-collision ring.
As the utility model discloses further improvement scheme again: a primary-secondary ring jig is arranged on one side of the crystal ring fixing piece, and an anti-slip pad, a proximity switch and a detector are arranged on one side of the primary-secondary ring jig.
Compared with the prior art, the beneficial effects of the utility model are that:
in the embodiment of the utility model, the cylinder drives the primary and secondary wafer clamping pieces to move, so as to realize the clamping of the primary and secondary ring chips, the whole is fixed on the chip sorter X, Y module, and along with the movement of the module X, Y direction, the positions of different material taking positions, material placing positions, three-point alignment, suction nozzle cleaning positions and working positions are realized; primary and secondary ring tool detects the distance between adjustment blue membrane and thimble before the work debugging, generally at 0.5 ~ 1.0mm, has 1 mm's breach above the tool, conveniently detects the debugging and uses, compares in prior art, can realize not rocking the in-process is got to the chip clamp, has that chip detection effect is good and absorb stable advantage.
Drawings
Fig. 1 is a schematic structural diagram of a primary and secondary ring clamp mechanism of a turntable type chip sorting machine.
Detailed Description
The technical solution of the present patent will be further described in detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
Referring to fig. 1, the present embodiment provides a primary and secondary ring fixture mechanism of a turntable type chip handler, including a pressing block assembly 8, primary and secondary wafer clamping pieces 2, and a primary and secondary die bonding panel 1, where the pressing block assembly 8 is fixedly connected to one side of the primary and secondary die bonding panel 1 through a linear bearing, and one side of the primary and secondary die bonding panel 1 is provided with an air cylinder 3 for driving the primary and secondary wafer clamping pieces 2 to move.
The cylinder 3 drives the primary and secondary wafer clamping pieces 2 to move so as to clamp the primary and secondary ring chips, the primary and secondary ring chips are integrally fixed on a chip sorting machine X, Y module, and different positions of material taking, material placing, three-point alignment, suction nozzle cleaning and working positions are realized along with the movement of the module X, Y; the primary and secondary ring tool is mainly before the work debugging, detect the distance between adjustment blue membrane and the thimble, generally at 0.5 ~ 1.0mm, has 1 mm's breach on the tool, makes things convenient for the detection debugging to use.
Referring to fig. 1, in an embodiment, a Wafer assembly 4 is disposed on one side of the primary and secondary die bonding panels 1, and the Wafer assembly 4 includes a Wafer ring fixing piece, a Wafer ring pressing block, and a blue film frame, wherein the Wafer ring fixing piece is fixedly disposed on the blue film frame for bearing a chip, so as to facilitate transportation from the Wafer cassette to the primary and secondary ring clamping mechanism.
Referring to fig. 1, in an embodiment, the pressing block assembly 8 includes a guide pin sleeve, a pressing spring, and a clamping piece guide pin, the guide pin sleeve is sleeved outside the clamping piece guide pin, one end of the clamping piece guide pin is connected to the linear bearing, and the clamping piece guide pin is connected to the primary and secondary die bonding panels 1 through a compression spring.
Referring to fig. 1, in an embodiment, a primary and secondary cushion block 5, a primary and secondary limiting block 6, and an inductor 10 are further disposed on one side of the primary and secondary die bonding panel 1, and a searchlighting device 7 is connected to one side of the primary and secondary die bonding panel 1 through a primary and secondary anti-collision ring 9.
Referring to fig. 1, in one embodiment, a primary-secondary ring fixture 15 is disposed on one side of the wafer ring fixing plate, and a non-slip pad 11, a proximity switch 14 and a detector 13 are disposed on one side of the primary-secondary ring fixture 15.
In the embodiment of the utility model, the cylinder 3 drives the primary and secondary wafer clamping pieces 2 to move, so as to realize the clamping of the primary and secondary ring chips, the whole is fixed on the chip sorter X, Y module, and along with the movement of the module X, Y direction, the positions of different material taking positions, material placing positions, three-point alignment, suction nozzle cleaning positions and working positions are realized; primary and secondary ring tool detects the distance between adjustment blue membrane and thimble before the work debugging, generally at 0.5 ~ 1.0mm, has 1 mm's breach above the tool, conveniently detects the debugging and uses, compares in prior art, can realize not rocking the in-process is got to the chip clamp, has that chip detection effect is good and absorb stable advantage.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (5)
1. A primary and secondary ring clamp mechanism of a rotary disc type chip sorting machine is characterized by comprising a pressing block assembly, primary and secondary wafer clamping pieces and a primary and secondary die-bonding panel,
the pressing block assembly is fixedly connected to one side of the primary and secondary die fixing panel through a linear bearing, and an air cylinder for driving the primary and secondary wafer clamping pieces to move is arranged on one side of the primary and secondary die fixing panel.
2. The fixture mechanism of claim 1, wherein a wafer assembly is disposed on one side of the primary and secondary die bonding panels,
the wafer combination comprises a wafer ring fixing piece, a hoop wafer ring, a hoop pressing block and a blue film frame, wherein the wafer ring fixing piece is fixedly arranged on the blue film frame and used for bearing a chip.
3. The master-slave ring clamp mechanism of the rotary disk type chip sorting machine as claimed in claim 1, wherein the pressing block assembly comprises a guide pin sleeve, a pressing spring and a clamping piece guide pin,
the guide pin sleeve is sleeved outside the clamping piece guide pin, one end of the clamping piece guide pin is connected with the linear bearing, and the clamping piece guide pin is connected with the primary and secondary die bonding panels through a compression spring.
4. The fixture mechanism of claim 1, wherein a mother-son cushion block, a mother-son limit block and an inductor are further disposed on one side of the mother-son die bonding panel,
one side of the primary-secondary die bonding panel is connected with a searchlight through a primary-secondary anti-collision ring.
5. The fixture mechanism of claim 2, wherein a primary and secondary ring fixture is disposed on one side of the wafer ring fixing plate, and a non-slip pad, a proximity switch and a detector are disposed on one side of the primary and secondary ring fixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220902235.XU CN217768341U (en) | 2022-04-19 | 2022-04-19 | Primary and secondary ring fixture mechanism of rotary disc type chip sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220902235.XU CN217768341U (en) | 2022-04-19 | 2022-04-19 | Primary and secondary ring fixture mechanism of rotary disc type chip sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217768341U true CN217768341U (en) | 2022-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220902235.XU Active CN217768341U (en) | 2022-04-19 | 2022-04-19 | Primary and secondary ring fixture mechanism of rotary disc type chip sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217768341U (en) |
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2022
- 2022-04-19 CN CN202220902235.XU patent/CN217768341U/en active Active
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