CN217765042U - Wafer detection calibration mechanism - Google Patents
Wafer detection calibration mechanism Download PDFInfo
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- CN217765042U CN217765042U CN202221481056.XU CN202221481056U CN217765042U CN 217765042 U CN217765042 U CN 217765042U CN 202221481056 U CN202221481056 U CN 202221481056U CN 217765042 U CN217765042 U CN 217765042U
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Abstract
The utility model relates to the technical field of wafer processing, in particular to a wafer detection calibration mechanism, wherein a first calibration base and a second calibration base are respectively arranged on two sides of a bearing platform, and a plurality of calibration components are respectively arranged on the first calibration base and the second calibration base; the calibration assembly comprises an attenuation tool calibration assembly, and the attenuation tool calibration assembly comprises an attenuation fixed block, a jackscrew adjusting block and a groove supporting block; the calibration assembly comprises a fifth type of tool calibration assembly, the positioning pin is mounted to the center positions of the mark plate fixing block and the switching positioning block, and the ball head type locking screws are arranged in threaded hole positions on two sides of the switching positioning block and used for adjusting the Rz angle of the mark plate fixing block and the top mark plate of the mark plate fixing block. The utility model realizes the corresponding adjustment requirements through the adjusting mechanisms arranged on different components; the size requirement can be adjusted in a layered mode, and the phenomenon that the adjustment of one variable affects other sizes to generate deviation is effectively avoided.
Description
Technical Field
The utility model relates to a wafer processing technology field specifically is a wafer detects calibration mechanism.
Background
The mechanical calibration component is used as an indispensable mechanical component for optical detection of the whole equipment, and the calibration precision directly influences the precision size of the whole equipment; special adjustment mechanisms are required for different calibration assemblies to meet the optical detection accuracy requirements. The prior art can not meet the requirement of optical detection precision through adjustment, and therefore a wafer detection calibration mechanism is provided.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wafer detection calibration mechanism, which realizes the corresponding adjustment requirement through adjusting mechanisms arranged on different components; the size requirement can be adjusted in a layered mode, and the phenomenon that the adjustment of one variable affects other sizes to generate deviation is effectively avoided.
In order to achieve the above object, the utility model provides a following technical scheme: a wafer detection calibration mechanism comprises a bearing table, wherein a first calibration base and a second calibration base are respectively arranged on two sides of the bearing table, and a plurality of calibration components are respectively arranged on the first calibration base and the second calibration base;
the calibration component comprises an attenuation tool calibration component, the attenuation tool calibration component comprises an attenuation fixed block, a jackscrew adjusting block and a groove supporting block, and the up-and-down movement size distance of a lug of the attenuation fixed block is adjusted on the positioning surface of the groove supporting block through the jackscrew;
the calibration assembly comprises a fifth type of tool calibration assembly, the fifth type of tool calibration assembly comprises a mark plate fixing block, a positioning pin, a switching positioning block and ball head type locking screws, the positioning pin is mounted to the center positions of the mark plate fixing block and the switching positioning block, and the ball head type locking screws are arranged in threaded hole positions on two sides of the switching positioning block and used for adjusting Rz angles of the mark plate fixing block and a mark plate on the top of the mark plate fixing block;
the surface of the switching positioning block is provided with screw connecting holes and ball head jackscrew adjusting hole positions, and the ball head jackscrews are used for adjusting the inclination adjusting allowance of the X axis and the Y axis of the marking plate fixing block and the marking plate at the top of the marking plate fixing block and adjusting the integral horizontal height size of the marking plate fixing block and the marking plate at the top of the marking plate fixing block.
Preferably, the fifth type of tool calibration component is arranged on an inclined plane inclined by 0.1 rad.
Preferably, the calibration assembly further comprises a step tool calibration assembly which is the same as the five types of tool calibration assemblies in adjustment mode, and the step tool calibration assembly is installed on the first calibration base.
Preferably, the calibration assembly further comprises a third type of tool calibration assembly which is the same as the fifth type of tool calibration assembly in adjustment mode, and the third type of tool calibration assembly is installed on the second calibration base.
Preferably, the calibration assembly further comprises a fourth type tool calibration assembly which is the same as the fifth type tool calibration assembly in adjustment mode, and the fourth type tool calibration assembly is installed on the second calibration base.
Preferably, the calibration assembly further comprises a second type of tool calibration assembly which is the same as the five type of tool calibration assembly in adjustment mode, and the second type of tool calibration assembly is installed on the second calibration base.
Preferably, the attenuation tool calibration component and the fifth tool calibration component are both arranged on the first calibration base.
Compared with the prior art, the beneficial effects of the utility model are as follows:
the utility model realizes the corresponding adjustment requirements through the adjusting mechanisms arranged on different components; the requirement of the size can be adjusted in a layered mode, and the phenomenon that the other sizes are affected to generate deviation due to adjustment of one variable is effectively avoided; the method has universality for adjusting modes requiring multiple degrees of freedom, and the mounting connecting piece is only required to be changed or processed according to the shape structure difference of the product; through independent mode of regulation, can improve the convenience and the efficiency of regulation greatly.
Drawings
FIG. 1 is a perspective view of the present invention;
fig. 2 is a top view of the present invention;
fig. 3 is a left side view of the present invention;
FIG. 4 is a right side view of the present invention;
fig. 5 is an exploded view of a single calibration assembly of the present invention.
In the figure: 1. an attenuation tool calibration component; 2. calibrating a component by a fifth tool; 3. a step tool calibration component; 301. fixing blocks of the marking plates; 302. positioning pins; 303. transferring a positioning block; 4. calibrating a component by a third type of tool; 5. a fourth type tool calibration component; 6. calibrating a component by a second type of tool; 7. a first calibration base; 8. a second calibration base; 9. a bearing platform.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, a wafer detecting and calibrating mechanism includes a carrier 9, a first calibrating base 7 and a second calibrating base 8 are respectively installed on two sides of the carrier 9, and a plurality of calibrating components are installed on the first calibrating base 7 and the second calibrating base 8; the calibration assembly is formed by arranging 6 groups of calibration blocks of different types on two sides of the bearing platform 9; each calibration component consists of different adjusting mechanisms;
the calibration assembly comprises an attenuation tool calibration assembly 1, the attenuation tool calibration assembly 1 comprises an attenuation fixed block, a jackscrew adjusting block and a groove supporting block, and the distance of the vertical movement dimension of a lug of the attenuation fixed block is adjusted on the positioning surface of the groove supporting block through the jackscrew;
as shown in fig. 5, the calibration assembly includes a fifth type tool calibration assembly 2, the fifth type tool calibration assembly 2 includes a mark plate fixing block 301, a positioning pin 302, a transfer positioning block 303, and ball-head type locking screws, the positioning pin 302 is mounted to the center positions of the mark plate fixing block 301 and the transfer positioning block 303, and the ball-head type locking screws are disposed in threaded hole positions on both sides of the transfer positioning block 303 and used for adjusting Rz angles of the mark plate fixing block and a top mark plate thereof. The Rz angle of the marking plate fixing block 301 is adjusted by using a ball head type jackscrew, and the marking plate is fixedly installed in a groove above the fixing block, so that the Rz angle of the marking plate is adjusted. The Rz angle here refers to the angle at which it is adjusted to rotate along the Z-axis.
Meanwhile, a screw connecting hole and a ball head jackscrew adjusting hole site are distributed on the surface of the switching positioning block 303, so that the inclination adjusting allowance of the X axis and the Y axis corresponding to the upper calibration block can be provided through the ball head jackscrew, and the integral horizontal height size can be adjusted in a micro-motion manner; mainly through adjusting four at least bulb jackscrew heights that are located the four corners, through adjusting two bulb jackscrews with one side to adjust calibration piece X axle slope or Y axle slope, adjust four bulb jackscrew heights that are located the four corners simultaneously, can realize the whole level size of calibration piece and adjust.
The structure of the step tool calibration component 3 is mainly different from that of a fifth type marking plate in that the fifth type marking plate is arranged on an inclined plane with the inclination of 0.1rad, the realization modes of other mechanism adjusting structures are consistent, and the specific detail structure is shown in an explosion diagram of a calibration component in fig. 5; similarly, the third type of tool calibration component 4, the fourth type of tool calibration component 5 and the second type of tool calibration component 6 can refer to the adjustment mode of the mechanism of the step tool calibration component 3, and the third type of tool calibration component 4, the fourth type of tool calibration component 5 and the second type of tool calibration component 6 are all installed on the second calibration base 8.
The utility model discloses the regulatory function of demand is markd in better satisfaction, and Rz, X are adjusted with the Y axle amplitude of inclination, and the fine motion of upper and lower level is adjusted. The mechanism better ensures the relative position of X and Y and realizes the adjustment of Rz by arranging the positioning pin 302 at the center; effectively avoids adjusting one variable to influence other sizes to generate deviation. The surface of the transfer positioning block 303 in the mechanism is provided with a screw connecting hole and a ball head jackscrew adjusting hole position, the ball head jackscrew can provide the inclination amplitude adjusting allowance of the X axis and the Y axis corresponding to the upper calibration block, the adjusted Rz is only required to be fixed for adjusting the X and Y inclination amplitude adjustment, and the adjustment of the two is relatively independent.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a wafer detects calibration mechanism, includes plummer (9), its characterized in that: a first calibration base (7) and a second calibration base (8) are respectively arranged on two sides of the bearing table (9), and a plurality of calibration components are respectively arranged on the first calibration base (7) and the second calibration base (8);
the calibration component comprises an attenuation tool calibration component (1), the attenuation tool calibration component (1) comprises an attenuation fixed block, a jackscrew adjusting block and a groove supporting block, and the up-and-down movement size distance of a convex block of the attenuation fixed block is adjusted through the jackscrew on the positioning surface of the groove supporting block;
the calibration assembly comprises a fifth type tool calibration assembly (2), the fifth type tool calibration assembly (2) comprises a mark plate fixing block (301), a positioning pin (302), a switching positioning block (303) and ball head type locking screws, the positioning pin (302) is installed at the central positions of the mark plate fixing block (301) and the switching positioning block (303), and the ball head type locking screws are arranged in threaded hole positions on two sides of the switching positioning block (303) and used for adjusting Rz angles of the mark plate fixing block (301) and a mark plate on the top of the mark plate fixing block;
the surface of the switching positioning block (303) is provided with a screw connecting hole and a ball head jackscrew adjusting hole, and the ball head jackscrew is used for adjusting the inclination adjusting allowance of the X axis and the Y axis of the marking plate fixing block (301) and the marking plate on the top of the marking plate fixing block, and adjusting the integral horizontal height size of the marking plate fixing block (301) and the marking plate on the top of the marking plate fixing block.
2. The wafer detection calibration mechanism of claim 1, wherein: and the fifth type of tool calibration component (2) is arranged on an inclined plane inclined by 0.1 rad.
3. The wafer detection and calibration mechanism of claim 1, wherein: the calibration assembly further comprises a step tool calibration assembly (3) which is the same as the five types of tool calibration assemblies in adjustment mode, and the step tool calibration assembly (3) is installed on the first calibration base (7).
4. The wafer detection and calibration mechanism of claim 1, wherein: the calibration assembly further comprises a third type tool calibration assembly (4) which is the same as the five type tool calibration assembly in adjustment mode, and the third type tool calibration assembly (4) is installed on the second calibration base (8).
5. The wafer detection and calibration mechanism of claim 1, wherein: the calibration assembly further comprises a fourth type tool calibration assembly (5) which is the same as the fifth type tool calibration assembly in adjustment mode, and the fourth type tool calibration assembly (5) is installed on the second calibration base (8).
6. The wafer detection calibration mechanism of claim 1, wherein: the calibration assembly further comprises a second type tool calibration assembly (6) which is the same as the five type tool calibration assembly in adjustment mode, and the second type tool calibration assembly (6) is installed on a second calibration base (8).
7. The wafer detection and calibration mechanism of claim 1, wherein: the attenuation tool calibration component (1) and the fifth tool calibration component (2) are both arranged on the first calibration base (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221481056.XU CN217765042U (en) | 2022-06-14 | 2022-06-14 | Wafer detection calibration mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221481056.XU CN217765042U (en) | 2022-06-14 | 2022-06-14 | Wafer detection calibration mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217765042U true CN217765042U (en) | 2022-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221481056.XU Active CN217765042U (en) | 2022-06-14 | 2022-06-14 | Wafer detection calibration mechanism |
Country Status (1)
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|---|---|
| CN (1) | CN217765042U (en) |
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2022
- 2022-06-14 CN CN202221481056.XU patent/CN217765042U/en active Active
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