CN217749767U

CN217749767U - High heat capacity DBC copper-clad ceramic packaging substrate

Info

Publication number: CN217749767U
Application number: CN202221244355.1U
Authority: CN
Inventors: 钟水民; 金垚丞; 欧阳琦; 赖新建
Original assignee: Zhejiang Jingci Semiconductor Co ltd
Current assignee: Zhejiang Jingci Semiconductor Co ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-11-08
Anticipated expiration: 2032-05-23

Abstract

The utility model discloses a high heat capacity DBC covers copper ceramic packaging substrate relates to electronic component to the field, including packaging substrate, movable mounting has two spacing clamps on the packaging substrate, and the bottom side slidable mounting of two spacing clamps has same connecting plate, and the equal fixed mounting in both sides of connecting plate has two spacing axles, and four spacing epaxial equal fixed mounting have spacing pieces, lie in and cup jointed same spacing pinion rack with two spacing epaxial slidingly of one side, and the equal fixed mounting in one side that two spacing pinion racks kept away from each other has the handle. The utility model discloses, through the setting of unable adjustment base, radiator fan isotructure, can install unable adjustment base on the station of machine when using, can start radiator fan when the machine is to packaging substrate welded machining, radiator fan can add at packaging substrate and cool off its fast for need not to place the cooling after packaging substrate has processed, can replace next packaging substrate to process as early as possible.

Description

High heat capacity DBC copper-clad ceramic packaging substrate

Technical Field

The utility model relates to an electronic component field especially relates to a high heat capacity DBC covers copper ceramic packaging substrate.

Background

The ceramic copper-clad packaging plate has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength, low expansion, high heat capacity and the like of ceramic, has the high electrical conductivity and excellent welding performance of oxygen-free copper, can etch various patterns like a PCB (printed circuit board), and can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for a chip.

Among the prior art, when welding process is carried out to ceramic copper-clad package substrate, because do not cool off package substrate, can make package substrate temperature rise, the unable rapid cooling of the molten tin on the while welding solidifies, it can take off it and process next time usually to place after having processed, and when fixed to package substrate processing, the position is measured earlier usually, twist the screw and stationary blade and fix on the station of machine, putting package substrate and fixing a position between several stationary blades, it is more loaded down with trivial details, and the oxidation rust can appear for a long time in screw live, and the screw hole can appear wearing and tearing, influence the machining precision, consequently, need a high heat capacity DBC copper-clad ceramic package substrate to satisfy people's demand.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high heat capacity DBC covers copper ceramic packaging substrate to can't in time cool off when solving the ceramic that proposes in the above-mentioned background art and covering copper packaging substrate and carrying out welding process, use the mode of screw reinforcement stator when fixing a position to it, more loaded down with trivial details problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high heat capacity DBC covers copper ceramic packaging substrate, including packaging substrate, movable mounting has two spacing clamps on the packaging substrate, the bottom side slidable mounting of two spacing clamps has same connecting plate, the equal fixed mounting in both sides of connecting plate has two spacing axles, equal fixed mounting has spacing piece on four spacing axles, it has same spacing pinion rack to lie in to slide to cup joint on two spacing axles with one side, the equal fixed mounting in one side that two spacing pinion racks kept away from each other has the handle, the equal fixed mounting in both sides of two spacing clamps has spacing rack, lie in two spacing racks with one side and same spacing pinion rack mesh, a plurality of louvres have been seted up on the connecting plate, movable mounting has unable adjustment base on the connecting plate, fixed mounting has radiator fan on the unable adjustment base, two movable grooves have been seted up on the unable adjustment base, two movable grooves all rotate to install and support the strip, can fix on processing machine during the use, radiator fan on the unable adjustment base can start when the packaging substrate carries out welding process, can cool off packaging substrate through radiator fan, thereby can process next as early as possible after welding a packaging substrate.

Preferably, support and seted up the rotation hole on the strip, rotate downthehole rotation and install the axis of rotation, the both ends of axis of rotation are fixed mounting respectively on the both sides inner wall of activity groove, support the strip upset and can overturn in the axis of rotation through rotating the hole for support the strip and had this fulcrum of axis of rotation.

Preferably, the fixed cover in the axis of rotation has connect the torsional spring, and the one end fixed mounting of torsional spring is on the inner wall that rotates the hole, and the other one end fixed mounting of torsional spring is in the axis of rotation, and wherein, the torsional spring can drive to the strip and be in the bagging-off that the upset was opened all the time for it can contact unable adjustment base to support the strip, makes unable adjustment base can be more stable.

Preferably, spacing spout has all been seted up to the both sides of connecting plate, and equal slidable mounting has spacing in two spacing spouts, and the equal fixed mounting of two spacing is on unable adjustment base, and the connecting plate slides and can slide on two spacing respectively through the spacing spout of both sides for can not squint when the connecting plate is gliding, can only slide in the horizontal direction.

Preferably, two sliding holes are formed in the limiting toothed plate, the two limiting shafts are respectively slidably mounted in the two sliding holes, and the limiting toothed plate can slide on the two limiting shafts through the two sliding holes respectively, so that the limiting toothed plate can only slide in the horizontal direction.

Preferably, the spring has been cup jointed in the slip on the spacing axle, and the both ends difference fixed mounting of spring can drive the spring and compress when spacing pinion rack is gliding in one side that spacing piece and spacing pinion rack are close to each other, loosens the handle, and the spring can reset and promote spacing pinion rack and resume the normal position.

Preferably, T type groove has been seted up to the inner wall of connecting plate, and slidable mounting has two T type pieces in T type groove, and two T type pieces are fixed mounting respectively in the bottom side of two spacing clamps, stimulate two spacing clamps for spacing clamp drives T type piece and slides in T type groove, makes spacing clamp gliding time can not drop.

The utility model has the advantages that:

the utility model discloses in, through the setting of unable adjustment base, radiator fan isotructure, can install unable adjustment base on the station of machine when using, can start radiator fan when the machine is to packaging substrate welded machining, radiator fan can add at packaging substrate and cool off its fast for need not to place the cooling after packaging substrate has processed, can replace next packaging substrate to process as early as possible.

The utility model discloses in, through the setting of spacing clamp, connecting plate, spacing pinion rack isotructure, two strip that support of upset can take out the connecting plate from unable adjustment base, later stimulate two spacing pinion racks and can remove the restriction to spacing clamp, and the spacing clamp of spur both sides can be taken out the packaging substrate from the connecting plate and change to need not twist repeatedly and move the new packaging substrate of screw can quick replacement and process, can not appear rustting the dead condition of card like the screw, promote the machining precision.

Drawings

Fig. 1 is a schematic perspective view of a high heat capacity DBC copper-clad ceramic package substrate according to the present invention;

fig. 2 is a schematic structural diagram of a connecting plate and a limiting toothed plate of a high heat capacity DBC copper-clad ceramic package substrate provided by the present invention;

fig. 3 is a schematic structural diagram of a portion a in fig. 2 of a high heat capacity DBC copper-clad ceramic package substrate according to the present invention;

fig. 4 is a schematic structural diagram of a fixing base portion of a high heat capacity DBC copper-clad ceramic package substrate according to the present invention;

fig. 5 is a schematic structural diagram of a supporting strip portion of a high heat capacity DBC copper-clad ceramic package substrate according to the present invention.

In the figure: 1. a package substrate; 2. a limiting clamp; 3. a connecting plate; 4. a limiting shaft; 5. a limiting sheet; 6. a limit toothed plate; 7. a handle; 8. a limit rack; 9. a fixed base; 10. heat dissipation holes; 11. a heat radiation fan; 12. a movable groove; 13. supporting the strips; 14. rotating the hole; 15. a rotating shaft; 16. a torsion spring; 17. a limiting chute; 18. a limiting strip; 19. a slide hole; 20. a spring; 21. a T-shaped groove; 22. and a T-shaped block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-5, a high heat capacity DBC copper-clad ceramic package substrate, including package substrate 1, movable mounting has two spacing clips 2 on package substrate 1, the bottom side slidable mounting of two spacing clips 2 has same connecting plate 3, equal fixed mounting has two spacing axles 4 in both sides of connecting plate 3, equal fixed mounting has spacing piece 5 on four spacing axles 4, it has same spacing pinion rack 6 to slide on two spacing axles 4 that lie in same side to cup joint, equal fixed mounting has handle 7 in the one side that two spacing pinion rack 6 kept away from each other, equal fixed mounting has spacing rack 8 in both sides of two spacing clips 2, two spacing rack 8 that lie in same side mesh with same spacing pinion rack 6, a plurality of louvres 10 have been seted up on connecting plate 3, movable mounting has unable adjustment base 9 on connecting plate 3, fixed mounting has radiator fan 11 on unable adjustment base 9, two movable slots 12 have all rotated and installed to support strip 13 on two movable slots 12, can fix unable adjustment base 9 on the processing machine during the use, can start radiator fan 11 on unable adjustment base 9 when the machine carries out welding process as soon as possible package substrate 1, thereby can carry out a quick welding process to a base 1.

Referring to fig. 5, the utility model discloses in, support and seted up rotation hole 14 on the strip 13, rotate the rotation axis 15 installed in the 14 internal rotations in hole, the both ends of rotation axis 15 fixed mounting respectively on the both sides inner wall of activity groove 12, support the strip 13 upset and can pass through rotation hole 14 and overturn in rotation axis 15 for support strip 13 has had this fulcrum of rotation axis 15.

Referring to fig. 5, the utility model discloses in, fixed cover has connect torsional spring 16 in the axis of rotation 15, and the one end fixed mounting of torsional spring 16 is on rotating the inner wall of hole 14, and the other one end fixed mounting of torsional spring 16 is in the bagging-off that the upset was opened all the time, wherein, and torsional spring 16 can drive to strip 13 for it can contact unable adjustment base 9 to support strip 13, makes unable adjustment base 9 can be more stable.

Referring to fig. 3-4, the utility model discloses in, spacing spout 17 has all been seted up to the both sides of connecting plate 3, and equal slidable mounting has spacing 18 in two spacing spouts 17, and the equal fixed mounting of two spacing 18 is on unable adjustment base 9, and connecting plate 3 slides and can slide on two spacing 18 respectively through the spacing spout 17 of both sides for connecting plate 3 can not squint when gliding, can only slide in the horizontal direction.

Referring to fig. 3, the utility model discloses in, two sliding hole 19 have been seted up on the spacing pinion rack 6, and two spacing axle 4 are slidable mounting respectively in two sliding hole 19, and spacing pinion rack 6 slides and can slide on two spacing axles 4 respectively through two sliding hole 19 for spacing pinion rack 6 can only slide in the horizontal direction.

Referring to fig. 3, the utility model discloses in, the spring 20 has been cup jointed in the slip on the spacing axle 4, and spring 20's both ends difference fixed mounting can drive spring 20 and compress in spacing piece 5 and the one side that spacing pinion rack 6 is close to each other, 6 gliding while of spacing pinion rack, unclamp handle 7, and spring 20 can restore to the throne and promote 6 normal positions of spacing pinion rack.

Referring to fig. 2, in the utility model, the inner wall of the connecting plate 3 is provided with a T-shaped groove 21, two T-shaped blocks 22 are slidably mounted in the T-shaped groove 21, the two T-shaped blocks 22 are respectively fixedly mounted at the bottom sides of the two spacing clamps 2, and the two spacing clamps 2 are pulled, so that the spacing clamps 2 drive the T-shaped blocks 22 to slide in the T-shaped groove 21, and the spacing clamps 2 can not fall off when sliding.

The utility model discloses the theory of operation:

when in use, the fixed base 9 can be fixed on a processing machine, when the machine performs welding processing on the packaging substrate 1, the cooling fan 11 on the fixed base 9 can be started, the packaging substrate 1 can be rapidly cooled through the cooling fan 11, so that the next packaging substrate 1 can be processed as soon as possible after being welded, when the packaging substrate 1 needs to be replaced, two supporting strips 13 can be turned over, the supporting strips 13 can be turned over on the rotating shaft 15 through the rotating holes 14, the supporting strips 13 have the pivot of the rotating shaft 15, the supporting strips 13 can be driven to be compressed when being turned over, wherein the torsion springs 16 can drive the supporting strips 13 to be always in a turning-open bagging mode, the supporting strips 13 can be in contact with the fixed base 9, the fixed base 9 can be more stable, the turned supporting strips 13 can be far away from the connecting plate 3, and therefore locking of the connecting plate 3 can be eliminated, then the limiting clamp 2 is pulled to enable the limiting clamp 2 to drive the connecting plate 3 to slide, the connecting plate 3 can slide on the two limiting strips 18 through the limiting sliding grooves 17 on the two sides respectively, the connecting plate 3 cannot deviate when sliding and can only slide in the horizontal direction, the connecting plate 3 can be continuously slid and taken down from the fixed base 9, meanwhile, the heat dissipation fan 11 can be exposed, the heat dissipation fan 11 can be conveniently cleaned, the handles 7 on the two sides can be pulled after the connecting plate 3 is taken down, the handles 7 can drive the limiting toothed plate 6 to slide, the limiting toothed plate 6 can slide on the two limiting shafts 4 through the two sliding holes 19 respectively, the limiting toothed plate 6 can only slide in the horizontal direction, the spring 20 can be driven to compress when the limiting toothed plate 6 slides, the two sliding limiting toothed plates 6 can be far away from the limiting racks 8 on the two sides of the limiting clamp 2, thereby can relieve the locking to spacing clamp 2, think two spacing clamps 2 of both sides pulling, make spacing clamp 2 drive T type piece 22 and slide in T type groove 21, make spacing clamp 2 gliding time can not drop, gliding spacing clamp 2 can keep away from packaging substrate 1, make packaging substrate 1 can take off, after the packaging substrate 1 of renewal, inwards promote two spacing clamps 2 and press from both sides tight packaging substrate 1, later loosen two handles 7, spring 20 can reset and promote spacing pinion rack 6 and resume the normal position, spacing pinion rack 6 resumes the normal position and can mesh with spacing rack 8 on the spacing clamp 2 again, thereby can fix the position of spacing clamp 2, and then fix packaging substrate 1, thereby can quick replacement packaging substrate 1 carries out subsequent processing.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a high heat capacity DBC copper cladding ceramic package substrate, includes package substrate (1), its characterized in that: the packaging structure is characterized in that two limiting clamps (2) are movably mounted on a packaging substrate (1), the bottom side of the two limiting clamps (2) is slidably mounted on the same connecting plate (3), two limiting shafts (4) are fixedly mounted on two sides of the connecting plate (3), limiting pieces (5) are fixedly mounted on the four limiting shafts (4), the two limiting shafts (4) located on the same side are slidably sleeved with the same limiting toothed plate (6), a handle (7) is fixedly mounted on one side of the two limiting toothed plates (6) which are far away from each other, limiting racks (8) are fixedly mounted on two sides of the two limiting clamps (2), the two limiting racks (8) located on the same side are meshed with the same limiting toothed plate (6), a plurality of heat dissipation holes (10) are formed in the connecting plate (3), a fixing base (9) is movably mounted on the connecting plate (3), a cooling fan (11) is fixedly mounted on the fixing base (9), two movable grooves (12) are formed in the fixing base (9), and a supporting strip (13) is rotatably mounted in the two movable grooves (12).

2. The DBC copper-clad ceramic package substrate with high heat capacity as claimed in claim 1, wherein: the supporting strip (13) is provided with a rotating hole (14), a rotating shaft (15) is rotatably installed in the rotating hole (14), and two ends of the rotating shaft (15) are fixedly installed on the inner walls of two sides of the movable groove (12) respectively.

3. The DBC copper-clad ceramic package substrate with high heat capacity as claimed in claim 2, wherein: the rotating shaft (15) is fixedly sleeved with a torsion spring (16), one end of the torsion spring (16) is fixedly installed on the inner wall of the rotating hole (14), and the other end of the torsion spring (16) is fixedly installed on the rotating shaft (15).

4. The DBC copper-clad ceramic package substrate with high heat capacity as claimed in claim 1, wherein: limiting sliding grooves (17) are formed in the two sides of the connecting plate (3), limiting strips (18) are arranged in the two limiting sliding grooves (17) in a sliding mode, and the two limiting strips (18) are fixedly arranged on the fixing base (9).

5. The DBC copper-clad ceramic package substrate with high heat capacity as claimed in claim 1, wherein: two sliding holes (19) are formed in the limiting toothed plate (6), and the two limiting shafts (4) are respectively installed in the two sliding holes (19) in a sliding mode.

6. The high heat capacity DBC copper-clad ceramic package substrate of claim 1, wherein: the limiting shaft (4) is sleeved with a spring (20) in a sliding mode, and two ends of the spring (20) are fixedly installed on one side, close to the limiting toothed plate (6), of the limiting sheet (5) respectively.

7. The DBC copper-clad ceramic package substrate with high heat capacity as claimed in claim 1, wherein: t type groove (21) have been seted up to the inner wall of connecting plate (3), and slidable mounting has two T type pieces (22) in T type groove (21), and two T type pieces (22) are fixed mounting respectively in the bottom side of two spacing clamps (2).