CN217740518U - Light-emitting diode with high heat dissipation capability - Google Patents

Light-emitting diode with high heat dissipation capability Download PDF

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Publication number
CN217740518U
CN217740518U CN202221575864.2U CN202221575864U CN217740518U CN 217740518 U CN217740518 U CN 217740518U CN 202221575864 U CN202221575864 U CN 202221575864U CN 217740518 U CN217740518 U CN 217740518U
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Prior art keywords
heat dissipation
emitting diode
diode
side wall
plate
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CN202221575864.2U
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Chinese (zh)
Inventor
刘芳
刘轩宏
刘其荣
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Yunnan Xuanrong New Energy Technology Co.,Ltd.
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Kunming Xuanrong Lighting Engineering Co ltd
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Abstract

The utility model discloses a high heat-sinking capability's emitting diode relates to emitting diode technical field. The utility model discloses a diode shell, the inside fixed mounting of diode shell has emitting diode, the both sides wall of diode shell passes through latch mechanism fixed mounting and has the heating panel, a plurality of evenly distributed's louvre is seted up to the lateral wall of heating panel, logical groove has been seted up to the rear end face of diode shell, it has radiator fan to lead to inslot fixed mounting, the inserted bar that two symmetries of lateral wall fixedly connected with set up of heating panel, the slot that two symmetries set up is seted up to the lateral wall of diode shell, the inserted bar stretch into in the slot and rather than sliding connection. The utility model provides a current the most radiating effect of emitting diode is relatively poor, leads to when the use in-process operating temperature high, thereby the heat very easily accumulates in the emitting diode chip causes inside components and parts to appear damaging, influences emitting diode life's problem.

Description

Light-emitting diode with high heat dissipation capacity
Technical Field
The utility model belongs to the technical field of emitting diode, especially, relate to a high heat-sinking capability's emitting diode.
Background
The light-emitting diode is a solid semiconductor device, can directly convert electricity into light, changes the principle of tungsten filament light emission of an incandescent lamp and three-primary-color powder light emission of an energy-saving lamp, adopts electric field light emission, and has the characteristics of long service life, high light efficiency, no radiation and low power consumption.
However, most of the existing light emitting diodes have poor heat dissipation effect, so that the internal working temperature is high in the using process, heat is easy to accumulate in the light emitting diode chip, internal components are damaged, the service life of the light emitting diode is influenced, and great inconvenience is brought.
In order to solve the above problems, the present invention provides a light emitting diode with high heat dissipation capability.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat-sinking capability's emitting diode, it is relatively poor to solve the most radiating effect of current emitting diode, leads to when the use in-process inside operating temperature high, thereby the heat very easily accumulates and causes inside components and parts to appear damaging in emitting diode chip, influences emitting diode life's problem.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a light-emitting diode with high heat dissipation capacity, which comprises a diode shell, wherein the inside of the diode shell is fixedly provided with a light-emitting diode, the two side walls of the diode shell are fixedly provided with a heat dissipation plate through a clamping mechanism, the side wall of the heat dissipation plate is provided with a plurality of heat dissipation holes which are evenly distributed, the rear end surface of the diode shell is provided with a through groove, a heat dissipation fan is fixedly arranged in the through groove, the clamping mechanism comprises a support pillar, a pressing plate, a sliding groove, an insertion rod, a mounting groove, a reset spring and a clamping block, the side wall of the heat dissipation plate is fixedly connected with two symmetrically arranged insertion rods, the side wall of the diode shell is provided with two symmetrically arranged slots, the insertion rod extends into the slots and is in sliding connection with the insertion rods, the inner side wall of the insertion rod extends into the slots and is provided with the mounting groove, the sliding block is connected in the mounting groove in a sliding manner, the side wall of the front end surface of the diode shell is provided with a sliding groove, one end of the clamping block extends out of the mounting groove and extends into the sliding groove and is in sliding connection with the mounting groove, the inner side wall of the mounting groove is provided with a reset spring, two ends of the reset spring are respectively connected with the inner side wall of the mounting groove and the side wall of the clamping block, a top post is in sliding connection with the sliding groove, one end of the top post extends out of the sliding groove and is fixedly connected with a pressing plate, the clamping block is in contact with the top post, the heat dissipation holes and the heat dissipation fan are arranged, heat dissipation protection treatment can be conveniently carried out on the inner part of the light emitting diode, the possibility that the use of the light emitting diode is influenced due to overhigh temperature is reduced, meanwhile, the heat dissipation plates can be conveniently and rapidly disassembled, cleaned and replaced and the like through the arranged top post, the pressing plate, the sliding groove, the inserting rod, the mounting groove, the reset spring and the clamping block, the possibility that the heat dissipation effect of the device is influenced by the blockage of dust and the heat dissipation holes is reduced, the most of the existing light emitting diodes are poor in heat dissipation effect, and the internal working temperature is high in the using process, the heat is easy to accumulate in the LED chip, thereby causing the damage of the internal components and influencing the inconvenience of the service life of the LED.
The lateral wall of the cooling fan is fixedly provided with a dustproof screen plate through a detachable mechanism, and the cooling fan can be conveniently protected from dust through the arranged dustproof screen plate.
The upper surface of the diode shell is fixedly provided with a silicone grease radiating block, and the radiating effect of the light-emitting diode can be improved conveniently through the arranged silicone grease radiating block.
The detachable mechanism comprises a locking bolt and a dustproof screen plate, the equal corner of the dustproof screen plate is in threaded connection with the locking bolt, the locking bolt penetrates through the dustproof screen plate and is in threaded connection with the dustproof screen plate, and the dustproof screen plate can be rapidly detached and cleaned through the arranged locking bolt.
The diode shell is characterized in that a sliding column is fixedly connected to the side wall of the front end face of the diode shell, penetrates through the pressing plate and is in sliding connection with the pressing plate, a compression spring is sleeved on the outer surface of the sliding column, and the sliding column can be used for limiting the pressing plate when being pressed.
The sliding column penetrates through one end of the pressing plate and is fixedly connected with a limiting plate, and the possibility that the pressing plate falls off can be reduced through the limiting plate.
The lateral wall of heating panel is seted up the catching groove of two symmetry settings, can be convenient for dismantle the heating panel through the catching groove that sets up.
The utility model discloses following beneficial effect has:
the utility model discloses a heating panel that sets up, the louvre, radiator fan can be convenient for carry out the heat dissipation protection processing to LED inside, thereby reduce the possibility that the high temperature influences its use, simultaneously through the fore-set that sets up, pressing plates, the spout, the inserted bar, the mounting groove, reset spring and fixture block can be convenient for dismantle the clearance fast to the heating panel and change etc. reduce the louvre thereby influence the possibility of device radiating effect by blockking up such as dust, it is relatively poor to reduce the most radiating effect of current LED, it is high to lead to in-process inside operating temperature when using, thereby the heat very easily accumulates and causes inside components and parts to appear damaging in the LED die, influence LED life's inconvenience.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a side view of the structure of the present invention;
fig. 3 is a schematic structural view of a heat dissipation fan of the present invention;
fig. 4 is a front view of the present invention;
fig. 5 is a schematic structural view of the middle fixture block of the present invention.
In the drawings, the reference numbers indicate the following list of parts:
1. a diode housing; 2. a silicone grease heat dissipation block; 3. a heat dissipation plate; 4. heat dissipation holes; 5. buckling grooves; 6. A through groove; 7. a dustproof screen plate; 8. a heat radiation fan; 9. locking the bolt; 10. pressing a plate; 11. a limiting plate; 12. a traveler; 13. a compression spring; 14. a top pillar; 15. a chute; 16. inserting a rod; 17. a return spring; 18. a clamping block; 19. and (4) mounting the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner", and the like indicate orientation or positional relationship only for convenience of description and simplicity of description, but do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
Referring to fig. 1-5, the present invention relates to a light emitting diode with high heat dissipation capability, which comprises a diode housing 1, wherein the light emitting diode is fixedly mounted inside the diode housing 1, a heat dissipating plate 3 is fixedly mounted on two side walls of the diode housing 1 through a clamping mechanism, a plurality of heat dissipating holes 4 are uniformly distributed on the side wall of the heat dissipating plate 3, a through groove 6 is formed on the rear end surface of the diode housing 1, a heat dissipating fan 8 is fixedly mounted in the through groove 6, the clamping mechanism comprises a support pillar 14, a pressing plate 10, a sliding groove 15, an inserting rod 16, a mounting groove 19, a return spring 17 and a clamping block 18, two symmetrically arranged inserting rods 16 are fixedly connected to the side wall of the heat dissipating plate 3, two symmetrically arranged slots are formed on the side wall of the diode housing 1, the inserting rods 16 extend into the slots and are slidably connected with the slots, the side wall of the inserting rods 16 extends into the slots, and the portions of the inserting rods 16 extend into the slots are provided with the mounting grooves 19, a clamping block 18 is connected in the mounting groove 19 in a sliding manner, a sliding groove 15 is formed in the side wall of the front end face of the diode shell 1, one end of the clamping block 18 extends out of the mounting groove 19 and extends into the sliding groove 15 and is connected with the sliding groove in a sliding manner, a return spring 17 is arranged on the inner side wall of the mounting groove 19, two ends of the return spring 17 are respectively connected with the inner side wall of the mounting groove 19 and the side wall of the clamping block 18, a top column 14 is connected in the sliding groove 15 in a sliding manner, one end of the top column 14 extends out of the sliding groove 15 and is fixedly connected with a pressing plate 10, the clamping block 18 is in contact with the top column 14, the heat dissipation hole 4 and the heat dissipation fan 8 are arranged to facilitate heat dissipation protection treatment inside the light emitting diode, the possibility that the use of the light emitting diode is affected due to overhigh temperature is reduced, and the rapid disassembly, cleaning, replacement and the like of the heat dissipation plate 3 can be facilitated through the arranged top column 14, the pressing plate 10, the sliding groove 15, the insertion rod 16, the mounting groove 19, the return spring 17 and the clamping block 18, thereby reduce louvre 4 and blockked up the possibility that influences the device radiating effect by dust etc, it is relatively poor to reduce the most radiating effect of current emitting diode, thereby it is high to lead to in-process operating temperature when using, thereby the heat very easily accumulates in emitting diode chip and causes inside components and parts to appear damaging, influence emitting diode life's inconvenience, two symmetrical catching grooves 5 that set up are seted up to the lateral wall of heating panel 3, can be convenient for dismantle heating panel 3 through the catching groove 5 that sets up.
The diode housing 1's preceding terminal surface lateral wall fixedly connected with traveller 12, traveller 12 run through the clamp plate 10 and rather than sliding connection, and the surface cover of traveller 12 is equipped with compression spring 13, can carry out spacing processing to it when pressing down the clamp plate 10 through the traveller 12 that sets up, and traveller 12 runs through one end fixedly connected with limiting plate 11 of clamp plate 10, can reduce the possibility that the clamp plate 10 appears droing through the limiting plate 11 that sets up.
The lateral wall of radiator fan 8 has dustproof otter board 7 through detachable mechanism fixed mounting, dustproof protection can be convenient for carry out to radiator fan 8 through dustproof otter board 7 that sets up, detachable mechanism includes locking bolt 9 and dustproof otter board 7, the equal threaded connection in edge department of dustproof otter board 7 has locking bolt 9, locking bolt 9 runs through dustproof otter board 7 and rather than threaded connection, can be convenient for carry out quick dismantlement clearance to dustproof otter board 7 through the locking bolt 9 that sets up.
The upper surface of the diode shell 1 is fixedly provided with the silicone grease radiating block 2, and the radiating effect of the light-emitting diode can be improved conveniently through the arranged silicone grease radiating block 2.
As shown in fig. 1 to 5, this embodiment is a method for using a light emitting diode with high heat dissipation capability: start radiator fan 8 and carry out the heat dissipation processing to inside during the use, can be convenient for outwards spill the inside heat through heating panel 3 and louvre 4 that set up simultaneously, hoisting device's radiating effect, when needs are torn open and are washd the clearance to heating panel 3 and change, press down and directly take heating panel 3 out after the clamp plate 10 and can carry out quick dismantlement to it and overhaul the change processing, it is relatively poor to reduce the most radiating effect of current emitting diode, it is high to lead to in-process operating temperature when using, thereby the heat is very easy to accumulate and causes inside components and parts to appear damaging in the emitting diode chip, influence emitting diode life's inconvenience.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims (7)

1. A high heat dissipation capacity light emitting diode, includes diode shell (1), its characterized in that: the LED lamp comprises a diode shell (1), wherein a light emitting diode is fixedly arranged in the diode shell (1), two side walls of the diode shell (1) are fixedly provided with a heat dissipation plate (3) through a clamping mechanism, the side wall of the heat dissipation plate (3) is provided with a plurality of heat dissipation holes (4) which are uniformly distributed, the rear end face of the diode shell (1) is provided with a through groove (6), a heat dissipation fan (8) is fixedly arranged in the through groove (6), the clamping mechanism comprises a support pillar (14), a pressing plate (10), a sliding groove (15), an insertion rod (16), a mounting groove (19), a reset spring (17) and a fixture block (18), the side wall of the heat dissipation plate (3) is fixedly connected with the two symmetrically arranged insertion rods (16), the side wall of the diode shell (1) is provided with two symmetrically arranged slots, the insertion rod (16) extends into the slots and is slidably connected with the slots, the insertion rod (16) extends into the partial side wall of the slots and is provided with the mounting groove (19), the fixture block (18) is slidably connected in the mounting groove (19), the side wall of the front end face of the diode shell (1) is provided with the sliding groove (15), one end of the fixture block (18) extends into the mounting groove (19) and is provided with the inner side wall of the reset spring (17), the fixture block (17) respectively, a top post (14) is connected in the sliding groove (15) in a sliding mode, one end of the top post (14) extends out of the sliding groove (15) and is fixedly connected with a pressing plate (10), and the clamping block (18) is in contact with the top post (14).
2. The LED with high heat dissipation capability as claimed in claim 1, wherein the side wall of the heat dissipation fan (8) is fixedly provided with a dustproof screen (7) by a detachable mechanism.
3. A high heat dissipation capability led according to claim 1, wherein the top surface of the led housing (1) is fixedly mounted with a silicone grease heat sink (2).
4. The LED with high heat dissipation capability according to claim 2, wherein the detachable mechanism comprises locking bolts (9) and a dustproof mesh plate (7), the locking bolts (9) are connected to the corners of the dustproof mesh plate (7) in a threaded manner, and the locking bolts (9) penetrate through the dustproof mesh plate (7) and are connected with the dustproof mesh plate in a threaded manner.
5. The LED with high heat dissipation capacity according to claim 1, wherein a sliding column (12) is fixedly connected to a side wall of the front end face of the LED housing (1), the sliding column (12) penetrates through the pressing plate (10) and is slidably connected with the pressing plate, and a compression spring (13) is sleeved on the outer surface of the sliding column (12).
6. The LED with high heat dissipation capacity as claimed in claim 5, wherein the sliding column (12) penetrates through one end of the pressing plate (10) and is fixedly connected with a limiting plate (11).
7. The LED with high heat dissipation capability as claimed in claim 1, wherein the side wall of the heat dissipation plate (3) is provided with two symmetrically arranged slots (5).
CN202221575864.2U 2022-06-23 2022-06-23 Light-emitting diode with high heat dissipation capability Active CN217740518U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221575864.2U CN217740518U (en) 2022-06-23 2022-06-23 Light-emitting diode with high heat dissipation capability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221575864.2U CN217740518U (en) 2022-06-23 2022-06-23 Light-emitting diode with high heat dissipation capability

Publications (1)

Publication Number Publication Date
CN217740518U true CN217740518U (en) 2022-11-04

Family

ID=83841803

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221575864.2U Active CN217740518U (en) 2022-06-23 2022-06-23 Light-emitting diode with high heat dissipation capability

Country Status (1)

Country Link
CN (1) CN217740518U (en)

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CP01 Change in the name or title of a patent holder

Address after: No. 2, Building 19, District A, Dashanghui, Qianxing Road, Xishan District, Kunming City, Yunnan Province, 650000

Patentee after: Yunnan Xuanrong New Energy Technology Co.,Ltd.

Address before: No. 2, Building 19, District A, Dashanghui, Qianxing Road, Xishan District, Kunming City, Yunnan Province, 650000

Patentee before: Kunming Xuanrong Lighting Engineering Co.,Ltd.

CP01 Change in the name or title of a patent holder