CN217740502U

CN217740502U - Manipulator fixture to wafer product

Info

Publication number: CN217740502U
Application number: CN202220883369.1U
Authority: CN
Inventors: 田金泉; 王广禄; 李涛; 陈曦
Original assignee: Jingcheng Optoelectronic Technology Xiamen Co ltd
Current assignee: Jingcheng Optoelectronic Technology Xiamen Co ltd
Priority date: 2022-04-18
Filing date: 2022-04-18
Publication date: 2022-11-04
Anticipated expiration: 2032-04-18

Abstract

The utility model discloses a manipulator fixture to wafer product, manipulator fixture includes the arm and sets up the centre gripping module at the arm front end, the centre gripping module includes the wafer grip slipper, be located the two sets of grip blocks of front end and the centre gripping slider of tail end, the grip slipper is "Y" font, the arm front end is fixed with the centre gripping cylinder, centre gripping cylinder front end is equipped with the installing module who is used for fixed centre gripping slider, install the sensor that is used for examining the wafer and responds to in the seat on the grip slipper, the front end fixed connection of grip slipper tail end and arm. The utility model discloses a mechanism of constituteing such as centre gripping cylinder realizes automatic action, to the wafer product from the card casket in automatic centre gripping and get the function of putting, only contact product edge 3-5mm when taking out the wafer product from the card casket, can not contact other positions of product, to the wafer product, still is equipped with simultaneously and responds to functional device in the seat, and the inspection product has or not, prevents to damage the product, plays the alarm action stop function.

Description

Manipulator fixture to wafer product

Technical Field

The utility model relates to a, especially, relate to a manipulator fixture to wafer product.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed and manufactured on a silicon wafer to form an IC product with a specific electrical function, wherein an inspection machine is often used for inspecting the wafer in the process of manufacturing the produced wafer, a clamping mechanism in the wafer inspection machine transfers the wafer, but the traditional clamping mechanism is usually a single material taking mode, the clamping mode reduces the working efficiency, and the transferring range of the wafer is shortened in the transferring process.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a manipulator fixture to wafer product.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: the utility model provides a manipulator fixture to wafer product which characterized in that: manipulator fixture includes the arm and sets up the centre gripping module at the arm front end, the centre gripping module includes the wafer grip slipper, is located two sets of grip blocks of front end and the centre gripping slider of tail end, the grip slipper is "Y" font, the arm front end is fixed with the centre gripping cylinder, and centre gripping cylinder front end is equipped with the installation module who is used for fixed centre gripping slider, install the sensor that is used for examining the wafer on the grip slipper, the front end fixed connection of grip slipper tail end and arm.

Furthermore, the clamping block and the clamping sliding block are made of one of soft plastic or rubber.

Further, the sensor is located on the side of the clamping slide block.

Furthermore, the periphery of the clamping block is machined with a round angle.

When the clamping module enters the cassette to take the wafer, the clamping block firstly props against the side edge of the wafer, and the air cylinder acts on the clamping slide block to clamp the other side of the wafer, so that the wafer is clamped out by three points of stress.

From the above description of the structure of the present invention, compared with the prior art, the present invention has the following advantages: through the cooperation of cylinder, grip block and centre gripping slider, get and put wafer convenient and fast, can detect whether the wafer is in the seat moreover, and can not make dirty crystal face and scratch wafer face.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:

fig. 1 is a schematic structural view of a robot clamping mechanism for wafer products according to the present invention;

fig. 2 is a schematic view of a robot clamping mechanism for wafer products according to the present invention;

fig. 3 is a schematic view of a partial structure of a robot clamping mechanism for wafer products according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Examples

Referring to fig. 1, fig. 2 and fig. 3, a manipulator fixture to wafer product, manipulator fixture includes arm 1 and the centre gripping module of setting at the arm front end, the centre gripping module includes wafer grip slipper 2, be located the two sets of grip blocks 3 of front end and the grip slipper 4 of tail end, grip slipper 2 is "Y" font, 1 front end of arm is fixed with

centre gripping cylinder

5, 5 front ends of centre gripping cylinder are equipped with the installation module 6 that is used for fixed grip slipper 4, install the sensor 7 that is used for examining the wafer on the

grip slipper

2, 2 tail ends of grip slipper and the front end fixed connection of arm 1.

The clamping block 3 and the clamping slide block 4 are both made of soft plastic or rubber.

The sensor 7 is located on the side of the clamping shoe 4.

The periphery of the clamping block 3 is processed with a round angle.

When a wafer is taken, the clamping module enters the clamping box, the clamping block 3 firstly props against the edge of the wafer, the clamping cylinder 5 acts to push the clamping slide block 4 to clamp the edge of the other edge of the wafer, so that three points of the wafer are stressed, and the mechanical arm drives the clamping module to withdraw from the clamping box and convey the wafer to a working point.

When storing the wafer, the wafer is first transported into the cassette, the clamping cylinder 5 is operated to withdraw from the clamping of the clamping slide block 4, and the wafer automatically drops to the storage layer number in the cassette.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a manipulator fixture to wafer product which characterized in that: manipulator fixture includes arm (1) and sets up the centre gripping module at the arm front end, the centre gripping module includes wafer grip slipper (2), is located two sets of grip blocks (3) of front end and the centre gripping slider (4) of tail end, grip slipper (2) are "Y" font, arm (1) front end is fixed with centre gripping cylinder (5), and centre gripping cylinder (5) front end is equipped with installation module (6) that are used for fixed centre gripping slider (4), install sensor (7) that are used for examining the wafer at the seat on grip slipper (2), the front end fixed connection of grip slipper (2) tail end and arm (1).

2. A robot gripping mechanism for wafer products according to claim 1, characterized in that: the clamping block (3) and the clamping sliding block (4) are both made of soft plastic or rubber.

3. The robot clamping mechanism for wafer products as claimed in claim 1, wherein: the sensor (7) is positioned on the side edge of the clamping sliding block (4).

4. A robot gripping mechanism for wafer products according to claim 1, characterized in that: the periphery of the clamping block (3) is machined with a round angle.