CN217733350U - Seed is brilliant bonds with constant temperature and pressure equipment - Google Patents

Seed is brilliant bonds with constant temperature and pressure equipment Download PDF

Info

Publication number
CN217733350U
CN217733350U CN202221418632.6U CN202221418632U CN217733350U CN 217733350 U CN217733350 U CN 217733350U CN 202221418632 U CN202221418632 U CN 202221418632U CN 217733350 U CN217733350 U CN 217733350U
Authority
CN
China
Prior art keywords
pressure
plate
seed crystal
pressing block
constant temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202221418632.6U
Other languages
Chinese (zh)
Inventor
鲁永
郑建生
吴明森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Roshow New Energy Technology Co ltd
Original Assignee
Roshow New Energy Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roshow New Energy Technology Co ltd filed Critical Roshow New Energy Technology Co ltd
Priority to CN202221418632.6U priority Critical patent/CN217733350U/en
Application granted granted Critical
Publication of CN217733350U publication Critical patent/CN217733350U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The utility model discloses a constant temperature and pressure device for seed crystal bonding, which comprises a case, wherein the top surface of the case is provided with a base plate, a support frame is arranged above the case, and the support frame is provided with a main shaft perpendicular to the base plate and a lifting mechanism for driving the main shaft to lift; the bottom of the main shaft is in transmission connection with a pressurizing assembly, and a heating assembly is arranged at a position, opposite to the pressurizing assembly, on the substrate; the pressure assembly comprises a pressure transmission shaft and an aligning pressure head, the aligning pressure head comprises a spherical pressing block and a universal pressure plate, and the spherical pressing block is embedded in the universal pressure plate; and a constant-temperature and constant-pressure operation space is formed between the aligning pressure head and the heating disc assembly. The utility model discloses beneficial effect such as life that has reduction heat loss, extension equipment.

Description

Seed is brilliant bonds with constant temperature and pressure equipment
Technical Field
The utility model relates to a semiconductor production technical field especially relates to a seed is brilliant bonds and uses constant temperature and pressure device.
Background
The preparation method of the silicon carbide crystal mostly adopts a physical vapor transport method (PVT), and comprises the following specific steps: putting the silicon carbide powder into a graphite crucible, and bonding silicon carbide seed crystals on a seed crystal support at the top of the crucible; and heating the silicon carbide powder in the crucible and sublimating the silicon carbide powder into gas-phase silicon carbide, wherein the gas-phase silicon carbide grows on the seed crystal under the action of the temperature gradient to form silicon carbide single crystals.
In the process of preparing the silicon carbide crystal by the PVT method, the SiC seed crystal is bonded on the crucible cover as an important process, and the bonding quality of the SiC seed crystal is one of the most basic and most important influencing factors influencing the crystal growth. However, the problems of insecure bonding, uneven glue, bubbles and the like easily occur when the seed crystal is directly in hard-to-hard contact with the crucible cover, and at present, a flexible buffer layer (not limited to graphite paper) is usually added between the seed crystal and the crucible cover, so that the warping of the seed crystal and the crucible cover can be leveled, and the thermal expansion degree of the seed crystal and the crucible cover can be buffered.
The seed crystal and the graphite paper are usually bonded and fixed through an adhesive, then heating and pressurizing equipment is adopted to assist in increasing the fixing strength under constant temperature and constant pressure, the pressure generated by a pressure head of the existing heating and pressurizing equipment is uneven when the pressure is applied, the seed crystal and the graphite paper cannot be fully extruded, bubbles generated by the adhesive between the seed crystal and the graphite paper in the heating process cannot be timely discharged, and the quality of the silicon carbide crystal is influenced; in addition, the texture of the seed crystal is brittle, and the pressure unevenness can generate certain impact force, so that the seed crystal is broken, and the smooth proceeding of the seed crystal bonding process is influenced.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing prior art's shortcoming, an object of the utility model is to provide a seed crystal bonds uses constant temperature and pressure equipment for solve among the prior art seed crystal bonding and use the pressure inequality that produces when heating pressure device exerts pressure, unable abundant extrusion work piece, the bonding agent between seed crystal and the graphite paper can't in time be discharged at the bubble that the in-process produced of being heated, influences the quality problems of carborundum crystal.
To achieve the above objects and other related objects, the present invention provides a solution including the following features.
The utility model provides a constant temperature and pressure device for bonding seed crystals, which comprises a case, wherein the top surface of the case is provided with a base plate, a support frame is arranged above the case, and the support frame is provided with a main shaft perpendicular to the base plate and a lifting mechanism for driving the main shaft to lift; the bottom of the main shaft is in transmission connection with a pressurizing assembly, and a heating assembly is arranged at a position, opposite to the pressurizing assembly, on the substrate; the pressure assembly comprises a pressure transmission shaft and an aligning pressure head, the aligning pressure head comprises a spherical pressing block and a universal pressure plate, and the spherical pressing block is embedded in the universal pressure plate; and a constant-temperature and constant-pressure operation space is formed between the aligning pressure head and the heating disc assembly.
Preferably, the universal pressure plate comprises a pressure transmission plate and a pressure plate, a groove matched with the spherical pressing block in shape is formed in the center of the pressure transmission plate, the spherical pressing block is embedded in the groove, and the pressure transmission plate is fixedly connected with the pressure plate.
Preferably, the pressure transmission disc is a circular truncated cone-shaped structure with a groove formed in the surface, the groove is formed with a hemispherical cavity matched with the spherical pressing block in shape, and the lower hemisphere of the spherical pressing block is embedded in the hemispherical cavity.
Preferably, the pressurizing assembly further comprises a plurality of pressing blocks, and the pressing blocks are used for pressing and attaching the spherical pressing blocks to the inner surface of the groove of the pressure transmission disc. The compact heap can be ensured spherical briquetting and the inseparable cooperation of pressure transmission dish, improves the stability of device, ensures to exert pressure steadily.
Preferably, the pressurizing assembly further comprises a pressure sensor, and the pressure sensor is arranged between the pressure transmission shaft and the main shaft. The pressure sensor can feed back the magnitude of the applied pressure in time, and avoid the crushing of the seed crystal caused by overlarge applied pressure.
Preferably, the outer side wall of the pressure transmission shaft is provided with a heat dissipation assembly, so that heat conducted by the heating assembly below is dissipated out in time, the pressure sensor is prevented from being damaged by heating, and the service life of the device is prolonged.
Preferably, the heat dissipation assembly comprises a hollow cylinder and a plurality of heat dissipation fins arranged on the outer side wall of the hollow cylinder; the heat dissipation assembly is sleeved outside the pressure transmission shaft through the hollow cylinder. The radiating fins have higher specific surface area and high radiating efficiency, and can be made of metal, such as copper, aluminum, alloy and the like.
Preferably, the heating assembly comprises a support ring and a heat-conducting plate fixed on the support ring, a heat-insulating layer is arranged at the lower end of the heat-conducting plate, and a heating plate is arranged between the heat-conducting plate and the heat-insulating layer. The design of the heat insulation layer enables the heat of the heating plate to be directionally and upwards conducted to the workpiece, so that heat loss is reduced, and on the other hand, the heat can be prevented from being transferred to the base platform to damage equipment.
Preferably, the upper end of the spherical pressing block is provided with a connecting rod, and the spherical pressing block is in transmission connection with the pressure transmission shaft through the connecting rod.
Preferably, the base plate is further provided with a heat insulation brick and a limiting piece, and the heating assembly is fixed on the heat insulation brick through the limiting piece. The design of the heat insulation brick further avoids heat transfer to the base station and damage to equipment; the limiting piece can ensure that the heating assembly is prevented from shifting when being stressed, and the stability of the device is further improved.
Preferably, the lifting mechanism comprises a lifter and a driving mechanism, and a power transmission mechanism is arranged between the lifter and the driving mechanism.
As mentioned above, the utility model discloses a seed crystal bonds and uses constant temperature and pressure device has following beneficial effect: by adopting the aligning pressure head embedded with the spherical pressing block, the seed crystals can be fully extruded when the seed crystals are bonded at constant temperature and constant pressure, so that bubbles generated in the heating process of a bonding agent between the seed crystals and the graphite paper are timely discharged, and the quality of the silicon carbide crystal is ensured; the heat dissipation assembly is arranged on the pressure transmission shaft between the pressure sensor and the aligning pressure head, so that heat conduction heat of the heating assembly is dissipated upwards in time, the pressure sensor is prevented from being damaged by heating, the service life of equipment is prolonged, and the smooth proceeding of a seed crystal bonding procedure is ensured; the design of the heat insulation layer of the heating assembly enables the heat of the heating plate to be directionally and upwards conducted to the workpiece, so that heat loss is reduced, and on the other hand, the heat can be prevented from being transferred to the base platform to damage equipment.
Drawings
Fig. 1 shows one of the structural schematic diagrams of the constant temperature and pressure device for bonding seed crystals of the present invention.
Fig. 2 is shown as a side view of fig. 1.
Fig. 3 shows one of the structural diagrams of the aligning indenter.
Fig. 4 shows a schematic view of an assembled structure of the heating assembly and the insulating bricks.
FIG. 5 is a schematic view showing the operation of the constant temperature and pressure apparatus for seed crystal bonding.
In the figure: the device comprises a case 1, a substrate 2, a support frame 3, a main shaft 4, a heating assembly 5, a pressure transmission shaft 6, a spherical pressing block 7, a universal pressing disc 8, a pressure transmission disc 9, a pressing disc 10, a pressing block 11, a pressure sensor 12, a heat dissipation assembly 13, a hollow cylinder 14, a heat dissipation fin 15, a support ring 16, a heat conduction plate 17, a heat insulation layer 18, a heating disc 19, a connecting rod 20, a heat insulation brick 21, a limiting piece 22, a lifter 23, a driving mechanism 24, a power transmission mechanism 25, a control electric box 26, a screw 27, an upper pressing plate 28, a lower pressing plate 29, graphite paper and a seed crystal bonding piece 30.
Detailed Description
The following description is given for illustrative embodiments of the present invention, and other advantages and effects of the present invention will be apparent to those skilled in the art from the disclosure of the present invention.
Please refer to fig. 1 to 5. It should be understood that the structure, proportion, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions of the present invention, so that the present invention does not have the substantial technical significance, and the modification of any structure, the change of the proportion relation or the adjustment of the size should still fall within the scope covered by the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
As shown in fig. 1 to 5, the utility model provides a constant temperature and pressure device for bonding seed crystal, which comprises a case 1, wherein the top surface of the case 1 is provided with a substrate 2, a support frame 3 is arranged above the case 1, and the support frame 3 is provided with a main shaft 4 perpendicular to the substrate 2 and a lifting mechanism for driving the main shaft to lift; the bottom of the main shaft is in transmission connection with a pressurizing assembly, and a heating assembly 5 is arranged at a position, opposite to the pressurizing assembly, on the substrate 2; the pressurizing assembly comprises a pressure transmission shaft 6 and an aligning pressure head, the aligning pressure head comprises a spherical pressing block 7 and a universal pressure plate 8, and the spherical pressing block 7 is embedded in the universal pressure plate 8; and a constant-temperature and constant-pressure operation space is formed between the aligning pressure head and the heating assembly 5.
In a specific embodiment, the universal pressure plate 8 includes a pressure transmission plate 9 and a pressure plate 10, a groove adapted to the shape of the spherical pressing block 7 is formed in the center of the pressure transmission plate 9, the spherical pressing block 7 is embedded in the groove, and the pressure transmission plate 9 is fixedly connected with the pressure plate 10. In a more specific embodiment as shown in fig. 3, the groove has a hemispherical structure adapted to the shape of the spherical pressing block 7, and the lower hemisphere of the spherical pressing block 7 is embedded in the groove.
In a more specific embodiment as shown in fig. 3, the pressure transmission disc 9 is a truncated cone-shaped structure with a groove on the surface, the groove is formed with a hemispherical cavity matched with the shape of the spherical pressing block 7, and the lower hemisphere of the spherical pressing block 7 is embedded in the hemispherical cavity.
In a specific embodiment as shown in fig. 3, the pressing assembly further comprises a plurality of pressing blocks 11, and the pressing blocks 11 are used for pressing and jointing the spherical pressing blocks 7 with the inner surfaces of the grooves of the pressure transmission discs 9. The pressing block 11 is provided with an assembling through hole and is fixed on the edge of the contact surface of the spherical pressing block 7 and the pressure transmission disc 9 through a screw 27.
In a specific embodiment, the pressurizing assembly further comprises a pressure sensor 12, and the pressure sensor 12 is arranged between the pressure transmission shaft 6 and the main shaft 4.
In a specific embodiment, the outer side wall of the pressure transmission shaft 6 is provided with a heat dissipation assembly 13.
In one specific embodiment as shown in fig. 1, the heat dissipation assembly 13 includes a hollow cylinder 14 and a plurality of heat dissipation fins 15 disposed on an outer side wall of the hollow cylinder 14; the heat dissipation assembly 13 is sleeved outside the pressure transmission shaft 6 through the hollow cylinder 14.
In a specific embodiment as shown in fig. 4, the heating assembly 5 comprises a support ring 16, a heat conducting plate 17 fixed on the support ring 16, a heat insulating layer 18 arranged at the lower end of the heat conducting plate 17, and a heating plate 19 arranged between the heat conducting plate 17 and the heat insulating layer 18.
In a specific embodiment as shown in fig. 3, a connecting rod 20 is arranged at the upper end of the spherical pressing block 7, and the spherical pressing block 7 is in transmission connection with the pressure transmission shaft 6 through the connecting rod 20.
In a specific embodiment as shown in fig. 4, a heat insulation brick 21 and a stopper 22 are further disposed on the base plate 2, and the heating assembly 5 is fixed on the heat insulation brick 21 through the stopper 22.
In a specific embodiment, the lifting mechanism comprises a lifter 23 and a driving mechanism 24, a power transmission mechanism 25 is arranged between the lifter 23 and the driving mechanism 24, and the lifter 23, the driving mechanism 24 and the power transmission mechanism 25 are electrically connected with the control electronic box 25.
In a more specific embodiment as shown in fig. 2, the lifter 23 is a screw lifter, the driving mechanism 24 is a servo motor, and the power transmission mechanism 25 is a planetary reducer; the main shaft is a ball screw arranged on the screw lifter, and a planetary reducer is arranged between the screw lifter and the servo motor; the planetary reducer is used for transmitting the power of the servo motor to the screw rod lifter and driving the screw rod lifter to drive the ball screw rod to do lifting movement.
The utility model discloses a seed crystal bonds uses constant temperature and pressure device's application method does:
as shown in fig. 5, fixing the graphite paper and the seed crystal by using a binder to obtain a graphite paper and seed crystal bonded piece 30, slowly and flatly placing the graphite paper and seed crystal bonded piece 30 between an upper pressing plate 28 and a lower pressing plate 29, then placing the graphite paper and seed crystal bonded piece together on the surface of a heat conducting plate 17 of a heating assembly 5, and starting the heating assembly to heat; when the heating temperature is up to the target temperature T, PCL control is adopted, the planetary reducer transmits the power of the servo motor to the screw rod lifter, the screw rod lifter is driven to drive the main shaft 4 (ball screw) to do lifting motion, the main shaft 4 drives the aligning pressure head to downwards apply pressure to the surface of the upper pressure plate 28, and the pressure sensor keeps the pressure when detecting the target pressure F; the graphite paper and seed crystal bonding piece 30 extrudes and diffuses bubbles generated in the heating process of the bonding agent under the constant temperature and pressure continuous action of the target temperature T and the target pressure F; and the complete fixation and bonding of the seed crystal and the graphite paper are realized.
When the constant temperature and pressure device for seed crystal bonding is used for bonding the seed crystal and the graphite paper in a hot-pressing manner, the universal pressure plate 8 embedded with the spherical pressing block 7 can fully extrude the seed crystal towards all directions, so that bubbles generated in the heating process of a bonding agent between the seed crystal and the graphite paper are discharged in time, and the quality of the silicon carbide crystal is guaranteed; the heat of the upward heat conduction of the heating component 5 is timely dissipated to the environment through the heat dissipation component 13, the pressure sensor 12 is prevented from being damaged due to overheating, the service life of the equipment is prolonged, and the smooth proceeding of the bonding process of seed crystals and graphite paper is ensured.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. The constant-temperature and constant-pressure device for bonding the seed crystals is characterized by comprising a case (1), wherein a base plate (2) is arranged on the top surface of the case (1), a support frame (3) is arranged above the case (1), and a main shaft (4) perpendicular to the base plate (2) and a lifting mechanism for driving the main shaft to lift are arranged on the support frame (3); the bottom of the spindle is in transmission connection with a pressurizing assembly, and a heating assembly (5) is arranged on the base plate (2) at a position opposite to the pressurizing assembly; the pressurizing assembly comprises a pressure transmission shaft (6) and an aligning pressure head, the aligning pressure head comprises a spherical pressing block (7) and a universal pressure plate (8), and the spherical pressing block (7) is embedded in the universal pressure plate (8); and a constant-temperature and constant-pressure working space is formed between the aligning pressure head and the heating assembly (5).
2. The constant temperature and pressure apparatus for seed crystal bonding according to claim 1, wherein: the universal pressure plate (8) comprises a pressure transmission plate (9) and a pressure plate (10), a groove matched with the spherical pressing block (7) in shape is formed in the center of the pressure transmission plate (9), the spherical pressing block (7) is embedded in the groove, and the pressure transmission plate (9) is fixedly connected with the pressure plate (10).
3. The constant temperature and pressure apparatus for seed crystal attachment according to claim 2, wherein: the pressure transmission disc (9) is of a round table-shaped structure with a groove formed in the surface, the groove is formed with a hemispherical cavity matched with the spherical pressing block (7) in shape, and the lower hemisphere of the spherical pressing block (7) is embedded in the hemispherical cavity.
4. The constant temperature and pressure apparatus for seed crystal bonding according to claim 3, wherein: the pressurizing assembly further comprises a plurality of pressing blocks (11), and the pressing blocks (11) are used for pressing and attaching the spherical pressing blocks (7) to the inner surface of the groove of the pressure transmission disc (9).
5. The constant temperature and pressure apparatus for seed crystal attachment according to claim 1, wherein: the pressurizing assembly further comprises a pressure sensor (12), and the pressure sensor (12) is arranged between the pressure transmission shaft (6) and the main shaft (4).
6. The constant temperature and pressure apparatus for seed crystal bonding according to claim 5, wherein: and a heat radiation component (13) is arranged on the outer side wall of the pressure transmission shaft (6).
7. The constant temperature and pressure apparatus for seed crystal bonding according to claim 6, wherein: the heat dissipation assembly (13) comprises a hollow cylinder (14) and a plurality of heat dissipation fins (15) arranged on the outer side wall of the hollow cylinder (14); the heat dissipation assembly (13) is sleeved outside the pressure transmission shaft (6) through the hollow cylinder (14).
8. The constant temperature and pressure apparatus for seed crystal attachment according to claim 1, wherein: heating element (5) are including support ring (16), fix heat-conducting plate (17) on support ring (16), heat-conducting plate (17) lower extreme is equipped with insulating layer (18), be equipped with heating plate (19) between heat-conducting plate (17) and insulating layer (18).
9. The constant temperature and pressure apparatus for seed crystal attachment according to claim 1, wherein: the upper end of the spherical pressing block (7) is provided with a connecting rod (20), and the spherical pressing block (7) is in transmission connection with the pressure transmission shaft (6) through the connecting rod (20); still be equipped with insulating brick (21) and locating part (22) on base plate (2), heating element (5) are fixed in through locating part (22) on insulating brick (21).
10. A constant temperature and pressure apparatus for seed crystal attachment according to any one of claims 1 to 9, wherein: the lifting mechanism comprises a lifter (23) and a driving mechanism (24), and a power transmission mechanism (25) is arranged between the lifter (23) and the driving mechanism (24).
CN202221418632.6U 2022-06-07 2022-06-07 Seed is brilliant bonds with constant temperature and pressure equipment Active CN217733350U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221418632.6U CN217733350U (en) 2022-06-07 2022-06-07 Seed is brilliant bonds with constant temperature and pressure equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221418632.6U CN217733350U (en) 2022-06-07 2022-06-07 Seed is brilliant bonds with constant temperature and pressure equipment

Publications (1)

Publication Number Publication Date
CN217733350U true CN217733350U (en) 2022-11-04

Family

ID=83840553

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221418632.6U Active CN217733350U (en) 2022-06-07 2022-06-07 Seed is brilliant bonds with constant temperature and pressure equipment

Country Status (1)

Country Link
CN (1) CN217733350U (en)

Similar Documents

Publication Publication Date Title
CN1253931C (en) Electronic part compression-bonding apparatus and method
US20100024667A1 (en) Pressure-heating apparatus and method
CN106929733B (en) A kind of compound liquid metal thermal interface material of foamed aluminium
CN217733350U (en) Seed is brilliant bonds with constant temperature and pressure equipment
CN102135248A (en) Liquid metal heat dissipation-based high-power LED (Light Emitting Diode) light source with threaded connection structure
CN1551340A (en) Semiconductor device and its manufacturing method
CN211125696U (en) Novel COB packaging technology L ED circuit board
CN110396718B (en) Three-station silicon carbide seed crystal bonding furnace
CN206558540U (en) A kind of flexible COB light source of the good upside-down mounting of thermal diffusivity
CN217733341U (en) Hot pressing structure easy to radiate heat
CN104400174B (en) A kind of Novel welding device and method of soldering components and parts on ceramic substrate
JP3792180B2 (en) Manufacturing method of heat dissipation parts
CN210058835U (en) Silicon carbide wafer wax sticking device
CN213547942U (en) Multi-pressure head hot-pressing backflow device
CN210085565U (en) Binding equipment for planar target
CN112333932A (en) Multi-pressure-head hot-pressing backflow device and operation method thereof
CN102263185A (en) Thermal radiation light emitting diode structure and manufacturing method thereof
CN212550324U (en) Automatic glue sealing equipment
CN201303004Y (en) Novel LED encapsulating bracket
JP2010099686A (en) Aluminum-silicon carbide composite body and method for producing the same
JP5659542B2 (en) Insulating substrate and power module
JP6710083B2 (en) Heat radiating member, power semiconductor module, and LED package
CN103515521B (en) One covers copper AlSiC composite radiating substrate and preparation method thereof
CN100481543C (en) Light-emitting diode package structure
CN216119757U (en) Ceramic substrate for potentiometer with hole

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant