CN217721785U - HDI high density lamination circuit board - Google Patents
HDI high density lamination circuit board Download PDFInfo
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- CN217721785U CN217721785U CN202221658516.1U CN202221658516U CN217721785U CN 217721785 U CN217721785 U CN 217721785U CN 202221658516 U CN202221658516 U CN 202221658516U CN 217721785 U CN217721785 U CN 217721785U
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- joint
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- 238000003475 lamination Methods 0.000 title claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 230000008878 coupling Effects 0.000 claims abstract description 8
- 238000010168 coupling process Methods 0.000 claims abstract description 8
- 238000005859 coupling reaction Methods 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000008859 change Effects 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a HDI high density lamination circuit board, which belongs to the technical field of circuit boards, and aims at the problem that the existing circuit board is generally tightly attached to a mounting plate, and the gap between the circuit board and the mounting plate is smaller, so that the heat dissipation efficiency of the circuit board is lower, and the service life of the circuit board and an electrical element is influenced; the utility model discloses well erection joint passes through coupling mechanism and fixes on the top of base, fixes the standing groove with the circuit board through fixture again to on fixing the erection joint with the circuit board, with the unsettled fixed mounting of circuit board in the top of circuit board, leave the space between circuit board and the mounting panel and make things convenient for the air to flow, make things convenient for the heat dissipation of circuit board, conveniently dismantle the erection joint through coupling mechanism, it is convenient to dismantle.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to HDI high density lamination circuit board.
Background
The high-density HDI laminated multilayer circuit board is a printed circuit board with the aperture of 6 mils, the ring diameter of a hole ring of less than 0.25mm, the contact density of more than 130 points per square and the line width of 3 mils. The board can reduce the production cost of the circuit board, increase the circuit density, and has the advantages of high reliability and good conductivity, thereby having wide application in electronic products.
The HDI high-density laminated circuit board is a structural element formed by insulating material and conductor wiring, when the printed circuit board is manufactured into a final product, an integrated circuit, a transistor, a diode, a passive element such as a resistor, a capacitor, a connector and other various electronic parts are mounted on the printed circuit board, and the circuit board has the following defects in practical use:
(1) the circuit board is generally fixed to the mounting plate through a plurality of screws, and then is fixed to the inside of the case through the mounting plate, although the insulating layer and the heat dissipation holes are arranged in the circuit board to increase heat dissipation, because the circuit board is generally tightly attached to the mounting plate, the gap between the circuit board and the mounting plate is small, the heat dissipation efficiency of the circuit board is low, and the service life of the circuit board and the service life of electrical components are affected.
Therefore, a high-density HDI laminated circuit board is needed, and the problems that the existing circuit board is generally tightly attached to the mounting plate, the gap between the circuit board and the mounting plate is small, the heat dissipation efficiency of the circuit board is low, and the service lives of the circuit board and electrical components are influenced are solved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a HDI high density lamination circuit board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a HDI high density build-up circuit board, includes mounting panel and circuit board, be fixed with two bases that are symmetric distribution on the top side of mounting panel, be provided with coupling mechanism on the base top, the top of base can be dismantled through coupling mechanism and be connected with the erection joint, the standing groove has been seted up on the top of erection joint, be provided with fixture in the standing groove, the end fixing of mounting panel has a plurality of connecting plates that are symmetric distribution, the screw hole has been seted up on the connecting plate.
In the scheme, the clamping mechanism comprises a screw rod in threaded connection with the top end of the mounting joint, a clamping plate is fixed at the bottom end of the screw rod, and a screw joint is fixed at the top end of the screw rod.
It is further worth explaining that the connecting mechanism comprises an inserting column fixed to the side face of the bottom end of the mounting connector, a slot matched with the inserting column in a sliding mode is formed in the side face of the top end of the base, a limiting bolt is connected to the side face of the base in a threaded mode, and a limiting hole matched with the limiting bolt is formed in the side face of the inserting column.
It should be further noted that a rubber pad b is fixedly attached to the side surface of the bottom end of the clamping plate, and a rubber pad a is fixedly attached to the side surface of the placing groove close to the side surface of the bottom end of the clamping plate.
In a preferred embodiment, a plurality of ribs are fixed on the side surface of the screw joint and are distributed annularly.
As a preferred embodiment, the circuit board includes a solder mask layer and a first inner layer board, the first inner layer board is fixed below the solder mask layer, a power supply layer is fixed below the first inner layer board, a first prepreg is fixed below the power supply layer, an inner core board is fixed below the first prepreg, a second prepreg is fixed below the inner core board, a ground layer is fixed below the second prepreg, a second inner layer board is fixed below the ground layer, a solder mask layer is also fixed below the second inner layer board, and a buried hole is formed in the circuit board.
Compared with the prior art, the utility model provides a pair of HDI high density lamination circuit board includes following beneficial effect at least:
(1) Through the unsettled fixed mounting of fixture with the circuit board in the top of circuit board, make the heat radiating area increase of circuit board, leave the space between circuit board and the mounting panel and make things convenient for the air current to flow, make things convenient for the heat dissipation of circuit board.
(2) The fixing of erection joint and base is relieved through the spacing bolt of outward turning to can go up the pull-up erection joint, with the same dismantlement of erection joint intercommunication circuit board, thereby tear out the circuit board and overhaul the change, avoid dismantling a plurality of screws and can tear out the circuit board fast, it is convenient to dismantle.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a partial structure of the connection plate of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 2;
FIG. 4 is a schematic structural view of the present invention with the installation joint removed;
FIG. 5 is an enlarged view of the structure at B in FIG. 4;
FIG. 6 is a schematic view of a partial structure of the splint of the present invention;
fig. 7 is a schematic diagram of the internal structure of the circuit board of the present invention.
In the figure: 1. a clamping mechanism; 101. a screw joint; 102. a screw; 103. a splint; 2. a connecting mechanism; 201. inserting a column; 202. a limiting hole; 203. a slot; 204. a limit bolt; 3. mounting a plate; 4. a circuit board; 5. a connecting plate; 6. screw holes; 7. a base; 8. installing a connector; 9. a placement groove; 10. a rubber pad a; 11. a rubber pad b; 12. a rib is protruded; 13. a solder resist layer; 14. a power layer; 15. a first semi-cured panel; 16. an inner core board; 17. a second prepreg; 18. an earth formation; 19. a second inner-layer board; 20. a first inner-layer board; 21. and (6) burying holes.
Detailed Description
The present invention will be further described with reference to the following examples.
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the following will combine the drawings of the embodiments of the present invention to clearly and completely describe the technical solution of the embodiments of the present invention, and obviously, the described embodiments are a part of the embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative labor are within the scope of the protection of the present invention based on the described embodiments of the present invention.
The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention. The condition in the embodiment can be further adjusted according to concrete condition the utility model discloses a it is right under the design prerequisite the utility model discloses a simple improvement of method all belongs to the utility model discloses the scope of claiming.
Referring to fig. 1-7, the utility model provides a HDI high density build-up circuit board, including mounting panel 3 and circuit board 4, be fixed with two bases 7 that are the symmetric distribution on the top side of mounting panel 3, be provided with coupling mechanism 2 on the top of base 7, the top of base 7 is through coupling mechanism 2 detachable connection with installation joint 8, the top of installation joint 8 has seted up standing groove 9, be provided with fixture 1 in the standing groove 9, the end of mounting panel 3 is fixed with a plurality of connecting plates 5 that are the symmetric distribution, has seted up screw hole 6 on connecting plate 5; firstly, the mounting plate 3 is fixed in the case through mounting screws in the screw holes 6, the mounting joints 8 are fixed on the top ends of the bases 7 through the connecting mechanisms 2, the circuit board 4 is inserted into the placing groove 9, the circuit board 4 is fixed in the placing groove 9 through the clamping mechanisms 1, the circuit board 4 is fixed on the mounting joints 8, the circuit board 4 is fixedly mounted above the circuit board 4 in a hanging mode, the heat dissipation area of the circuit board 4 is increased, gaps are reserved between the circuit board 4 and the mounting plate 3 to facilitate air flowing, heat dissipation of the circuit board 4 is facilitated, when the circuit board 4 needs to be dismounted for replacement and maintenance, the fixing of the mounting joints 8 and the bases 7 is firstly released through the connecting mechanisms 2, the mounting joints 8 can be pulled upwards, the mounting joints 8 are communicated with the circuit board 4 to be dismounted together, then the fixing of the mounting joints 8 and the circuit board 4 is released through the clamping mechanisms 1, the circuit board 4 is dismounted for maintenance and replacement, the circuit board 4 can be quickly dismounted without dismounting a plurality of screws, and the dismounting is convenient and convenient.
As further shown in fig. 1, 5 and 6, it is worth specifically describing that the clamping mechanism 1 includes a screw rod 102 in threaded connection with the top end of the mounting joint 8, a clamping plate 103 is fixed at the bottom end of the screw rod 102, and a screw joint 101 is fixed at the top end of the screw rod 102; when carrying out fixed mounting to circuit board 4 on erection joint 8, insert circuit board 4 in standing groove 9, rotate screw joint 101 again and drive screw rod 102 and revolve down, screw rod 102 drives splint 103 and moves down, press from both sides circuit board 4 tightly to standing groove 9 in to fix circuit board 4 on erection joint 8, with the unsettled fixed mounting of circuit board 4 in the top of circuit board 4, make the heat radiating area increase of circuit board 4, leave the space between circuit board 4 and the mounting panel 3 and make things convenient for the air to flow, make things convenient for the heat dissipation of circuit board 4.
As further shown in fig. 1, fig. 3 and fig. 5, it is worth specifically describing that the connecting mechanism 2 includes an inserting column 201 fixed with the bottom end side of the installation joint 8, a slot 203 in sliding fit with the inserting column 201 is formed on the top end side of the base 7, a limit bolt 204 is connected with the side of the base 7 in a threaded manner, and a limit hole 202 in fit with the limit bolt 204 is formed on the side of the inserting column 201; insert the post 201 in slot 203, screw in limit bolt 204 again and insert in spacing hole 202, with the erection joint 8 fixed to the top of base 7 on, when needing to pull out circuit board 4 and change the maintenance, earlier remove the fixed of erection joint 8 and base 7 through outer limit bolt 204 of revolving, thereby can pull out erection joint 8 more, with the 8 intercommunication circuit boards of erection joint 4 together pull out, thereby pull out the maintenance change with circuit board 4, avoid dismantling a plurality of screws and can pull out circuit board 4 fast, it is convenient to dismantle.
The scheme has the following working processes: firstly, the mounting plate 3 is fixed in the case by mounting screws in the screw holes 6, the inserting posts 201 are inserted into the inserting slots 203, then the limiting bolts 204 are screwed in and inserted into the limiting holes 202, the mounting connector 8 is fixed on the top end of the base 7, the circuit board 4 is inserted into the placing groove 9, then the screw rod connector 101 is rotated to drive the screw rod 102 to rotate downwards, the screw rod 102 drives the clamping plate 103 to move downwards, the circuit board 4 is clamped in the placing groove 9, and the circuit board 4 is fixed on the mounting connector 8, with the unsettled fixed mounting of circuit board 4 in the top of circuit board 4, make the heat radiating area increase of circuit board, when needing to tear out circuit board 4 and change the maintenance, earlier through outward turning on spacing bolt 204 remove the fixed of attach fitting 8 and base 7 to can pull up attach fitting 8, with attach fitting 8 intercommunication circuit board 4 together tear out, reverse screw rod joint 101 again, drive screw rod 102 top spin, splint 103 shifts up, thereby removes the clamp of circuit board 4, thereby tears out the maintenance change with circuit board 4.
According to the working process, the following steps are known: fix circuit board 4 to erection joint 8 on, with the unsettled fixed mounting of circuit board 4 in the top of circuit board 4, make the heat radiating area increase of circuit board 4, leave the space between circuit board 4 and the mounting panel 3 and make things convenient for the air to flow, make things convenient for the heat dissipation of circuit board 4, pull-up erection joint 8, communicate circuit board 4 with erection joint 8 and together tear out to tear out circuit board 4 out and overhaul the change, avoid dismantling a plurality of screws and can tear out circuit board 4 fast, it is convenient to dismantle.
As further shown in fig. 5 and fig. 6, it is worth concretely explaining that a rubber pad b11 is fixedly attached to the bottom end side surface of the clamping plate 103, and a rubber pad a10 is fixedly attached to the side surface of the placing groove 9 close to the bottom end side surface of the clamping plate 103; during specific work, the arranged rubber pads b11 and a10 increase the friction force for clamping the side surface of the circuit board 4, and the stability of fixing the circuit board 4 in the placing groove 9 is realized.
As further shown in fig. 6, it is worth specifically describing that a plurality of ribs 12 are fixed on the side surface of the screw joint 101, and the ribs 12 are distributed annularly; during specific work, the arranged convex ribs 12 improve the friction force when the screw rod connector 101 is rotated, and the operation is convenient.
Further as shown in fig. 7, it is worth specifically describing that the circuit board 4 includes a solder resist layer 13 and a first inner board 20, the first inner board 20 is fixed below the solder resist layer 13, a power supply layer 14 is fixed below the first inner board 20, a first semi-cured board 15 is fixed below the power supply layer 14, an inner core board 16 is fixed below the first semi-cured board 15, a second semi-cured board 17 is fixed below the inner core board 16, a ground layer 18 is fixed below the second semi-cured board 17, a second inner board 19 is fixed below the ground layer 18, a solder resist layer 13 is also fixed below the second inner board 19, and a buried hole 21 is formed in the circuit board 4.
To sum up: fix circuit board 4 to erection joint 8 on, with the unsettled fixed mounting of circuit board 4 in the top of circuit board 4, make the heat radiating area increase of circuit board 4, leave the space between circuit board 4 and the mounting panel 3 and make things convenient for the air to flow, make things convenient for the heat dissipation of circuit board 4, pull-up erection joint 8, communicate circuit board 4 with erection joint 8 and together tear out, thereby tear out circuit board 4 out and overhaul the change, avoid dismantling a plurality of screws and can tear out circuit board 4 fast, it is convenient to dismantle, the rubber pad b11 and the rubber pad a10 that set up increase the tight frictional force of circuit board 4 side clamp, through the stability of circuit board 4 internal fixation in standing groove 9, the convex rib 12 that sets up improves the frictional force when rotating screw rod joint 101, and convenient for operation.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those of ordinary skill in the art, and the use of the term "including" or "comprising" in the present application shall mean that the element or item preceding the term covers the element or item listed after the term and its equivalents, but does not exclude other elements or items, and the term "connected" or "connected" is not limited to physical or mechanical connections, and may include electrical connections, whether direct or indirect, "upper", "lower", "left", "right", etc. merely indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may be changed accordingly.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a HDI high density lamination circuit board, includes mounting panel (3) and circuit board (4), its characterized in that, be fixed with two base (7) that are the symmetric distribution on the top side of mounting panel (3), be provided with coupling mechanism (2) on base (7) top, the top of base (7) is through coupling mechanism (2) detachable connections has erection joint (8), standing groove (9) have been seted up on the top of erection joint (8), be provided with fixture (1) in standing groove (9), the end fixing of mounting panel (3) has a plurality of connecting plates (5) that are the symmetric distribution, screw hole (6) have been seted up on connecting plate (5).
2. An HDI high-density laminated circuit board according to claim 1, characterized in that the clamping mechanism (1) comprises a screw rod (102) in threaded connection with the top end of the mounting joint (8), a clamping plate (103) is fixed at the bottom end of the screw rod (102), and a screw joint (101) is fixed at the top end of the screw rod (102).
3. An HDI high-density laminated circuit board according to claim 2, characterized in that the connecting mechanism (2) comprises a plug column (201) fixed with the bottom end side surface of the mounting connector (8), the top end side surface of the base (7) is provided with an insertion slot (203) matched with the plug column (201) in a sliding manner, the side surface of the base (7) is connected with a limit bolt (204) in a threaded manner, and the side surface of the plug column (201) is provided with a limit hole (202) matched with the limit bolt (204).
4. An HDI high-density laminated circuit board according to claim 2, wherein a rubber pad b (11) is fixedly attached to the bottom end side surface of the clamping plate (103), and a rubber pad a (10) is fixedly attached to the side surface of the placing groove (9) close to the bottom end side surface of the clamping plate (103).
5. An HDI high-density laminated circuit board according to claim 4, characterized in that a plurality of ribs (12) are fixed on the side surface of the screw rod joint (101), and the ribs (12) are distributed annularly.
6. An HDI high-density build-up circuit board according to claim 1, characterized in that the circuit board (4) comprises a solder mask layer (13) and a first inner board (20), the first inner board (20) is fixed below the solder mask layer (13), a power supply layer (14) is fixed below the first inner board (20), a first semi-curing plate (15) is fixed below the power supply layer (14), an inner core plate (16) is fixed below the first semi-curing plate (15), a second semi-curing plate (17) is fixed below the inner core plate (16), a ground layer (18) is fixed below the second semi-curing plate (17), a second inner board (19) is fixed below the ground layer (18), the second inner board (19) is also fixed below the second inner board (13), and a buried hole (21) is opened in the circuit board (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221658516.1U CN217721785U (en) | 2022-06-29 | 2022-06-29 | HDI high density lamination circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221658516.1U CN217721785U (en) | 2022-06-29 | 2022-06-29 | HDI high density lamination circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217721785U true CN217721785U (en) | 2022-11-01 |
Family
ID=83774654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221658516.1U Active CN217721785U (en) | 2022-06-29 | 2022-06-29 | HDI high density lamination circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217721785U (en) |
-
2022
- 2022-06-29 CN CN202221658516.1U patent/CN217721785U/en active Active
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