CN217721738U - Fast-assembling integrated circuit structure - Google Patents
Fast-assembling integrated circuit structure Download PDFInfo
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- CN217721738U CN217721738U CN202221834200.3U CN202221834200U CN217721738U CN 217721738 U CN217721738 U CN 217721738U CN 202221834200 U CN202221834200 U CN 202221834200U CN 217721738 U CN217721738 U CN 217721738U
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Abstract
The utility model discloses a ready-package integrated circuit structure, including the base subassembly, the joint has the card lid subassembly on the outer wall of base subassembly top, and the card lid subassembly includes the lid, and lid both sides outer wall is close to bottom department and has all seted up the open slot, and the lid looks inside bottom department of being close to of both sides all seted up two spacing grooves, and the base subassembly includes the bottom plate, and integrated into one piece has the boss on the outer wall of bottom plate top, and has all seted up the resettlement groove on the outer wall of boss both sides, installs three installation spring through the bolt on the resettlement groove one side inner wall. The utility model discloses when this equipment of dismouting, press earlier the grafting piece for the grafting piece breaks away from the spacing groove, thereby be convenient for pull down the card lid subassembly fast, thereby removed the clamp plate to the restriction of circuit board, thereby realize the quick assembly disassembly to the circuit board, the card lid subassembly can cover the circuit board, thereby avoid falling the ash on the circuit board, prevent that the deposition of ash is too much to cause circuit board function redundancy on the circuit board, the card lid subassembly can avoid debris to fall on the circuit board and injure the circuit board by a crashing object moreover.
Description
Technical Field
The utility model relates to an integrated circuit technical field, concretely relates to ready-package integrated circuit structure.
Background
The integrated circuit is a circuit miniaturization mode, and elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
If the authorized announcement number is CN214898412U, and the authorized announcement date is 20211126, the shockproof quick-mounting integrated circuit board comprises a base, transverse plates are symmetrically arranged on two sides of the base, hinged plates are symmetrically hinged to two ends of one side of each transverse plate, a spring A is arranged between one side of each hinged plate and each transverse plate, placing seats are symmetrically arranged on two sides of the top of the base, and top plates are hinged to the tops of the placing seats; the utility model discloses a under articulated slab, spring A, stopper and spring B's cooperation, reduction equipment that can be by a wide margin is receiving the collision, and the impact force that integrated circuit board received prevents that the circuit board from causing the harm after receiving the collision, leads to the unable operation of equipment, great improvement the life-span of circuit board, through installation pole, torque spring, place the seat, roof, baffle, slot and picture peg under the cooperation, installation circuit board that can be quick need not utilize the bolt to fix, great improvement the convenience.
As described above, the ic boards in the prior art are generally fixed by a plurality of bolts, which makes the ic boards difficult to be disassembled and assembled, and therefore, a fast-assembly ic structure is needed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a ready-package integrated circuit structure to solve the above-mentioned weak point among the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a ready-package integrated circuit structure, includes the base subassembly, the joint has the card lid subassembly on the base subassembly top outer wall, the card lid subassembly includes the lid, lid both sides outer wall is close to bottom department and has all seted up the open slot, the lid looks inside bottom department of being close to of both sides has all seted up two spacing grooves, the base subassembly includes the bottom plate, integrated into one piece has the boss on the outer wall of bottom plate top, and has all seted up the resettlement groove on the boss both sides outer wall, install three installation spring through the bolt on the resettlement groove one side inner wall, and three installation spring one end installs the grafting piece of pegging graft in open slot, spacing inslot portion through the bolt.
Furthermore, the through-hole has all been seted up to bottom plate top outer wall near four corners department, bottom plate top outer wall both sides all install two springs that are located the boss through the bolt.
Further, the top plate is installed through the bolt in spring top, and has placed the circuit board on the top outer wall of roof.
Furthermore, fins distributed in an equidistant structure are welded on the outer walls of the two sides of the cover body, and wire passing holes distributed in an equidistant structure are formed in the outer walls of the two sides of the cover body.
Furthermore, an embedded groove is formed in one side of the outer wall of the top of the cover body, and a glass plate is bonded inside the embedded groove.
Furthermore, the connecting springs which are distributed in an equidistant structure are mounted on two sides of the inner wall of the top of the cover body through bolts, and the pressing plates which are in mutual contact with the circuit board are mounted at the bottom ends of the three adjacent connecting springs through bolts.
In the above technical scheme, the utility model provides a pair of ready-package integrated circuit structure, (1) through the plug-in block that sets up, a spring, the roof, coupling spring and clamp plate, when needing dismouting this equipment, can press the plug-in block, make the plug-in block break away from the spacing groove, thereby be convenient for pull down the card lid subassembly fast, thereby the restriction of clamp plate to the circuit board has been removed, thereby realize the quick dismouting to the circuit board, and under the spring, the coupling spring effect, the roof, the clamp plate can grasp the circuit board, when making this structure receive the striking, the circuit board can not produce vibrations of a relatively large margin, thereby improve the shock-proof capability of this circuit board; (2) Through the arranged clamping cover assembly, the clamping cover assembly can cover the circuit board, so that ash on the circuit board is avoided, the redundant operation of the circuit board caused by excessive ash accumulation on the circuit board is prevented, and the clamping cover assembly can prevent sundries from falling on the circuit board to damage the circuit board; (3) Through the fins, when the circuit structure is used, the contact area between the cover body and the outside air can be increased, so that the heat dissipation speed of the cover body is increased, and the heat dissipation effect of the structure is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.
Fig. 1 is a schematic view of a ready-package integrated circuit structure according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a base assembly according to an embodiment of the present invention.
Fig. 3 is a schematic structural view of a card cover assembly provided in an embodiment of the fast-assembly integrated circuit structure of the present invention.
Fig. 4 is a schematic structural diagram of a in accordance with an embodiment of the present invention.
Description of the reference numerals:
the novel wire clip comprises a base assembly 1, a clamping cover assembly 2, a base plate 3, a through hole 4, a boss 5, a spring 6, a top plate 7, a circuit board 8, a placement groove 9, a mounting spring 10, an insertion block 11, a cover body 12, an open groove 13, a fin 14, a connecting spring 15, a pressing plate 16, a limiting groove 17, an embedded groove 18, a glass plate 19 and a wire passing hole 20.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, the embodiment of the utility model provides a ready-package integrated circuit structure, including base subassembly 1, the joint has card lid subassembly 2 on the outer wall of base subassembly 1 top, card lid subassembly 2 includes lid 12, lid 12 both sides outer wall is close to bottom department and has all seted up open slot 13, lid 12 looks inside being close to bottom department and has all seted up two spacing grooves 17, base subassembly 1 includes bottom plate 3, integrated into one piece has boss 5 on the outer wall of bottom plate 3 top, and all seted up on the outer wall of boss 5 both sides resettlement groove 9, install three installation spring 10 through the bolt on the inner wall of resettlement groove 9 one side, and three installation spring 10 one end is installed through the bolt and is pegged graft at open slot 13, the inside inserted block 11 of spacing groove 17.
In particular, in this embodiment, including base subassembly 1, the joint has card lid subassembly 2 on the outer wall of base subassembly 1 top, card lid subassembly 2 can improve the protectiveness to circuit board 8, card lid subassembly 2 includes lid 12, lid 12 both sides outer wall is close to bottom department and has all seted up open slot 13, open slot 13 is convenient for 11 one end archs of plug-in block and passes lid 12, lid 12 looks inside both sides and has all seted up two spacing grooves 17 near bottom department, spacing groove 17 is convenient for 11 one end lugs of plug-in block to peg graft on lid 12, realize the fixing to lid 12, base subassembly 1 includes bottom plate 3, integrated into one piece has boss 5 on the outer wall of bottom plate 3 top, and all seted up mounting groove 9 on the outer wall of boss 5 both sides, mounting groove 9 is convenient for installation spring 10, plug-in block 11 installs on boss 5, install three installation spring 10 through the bolt on the inner wall of mounting groove 9 one side, installation spring 10 is convenient for make plug-in block 11 peg graft when not receiving external force at plug-in block 11 and is pegged graft at 13 always, spacing groove 17 inside, avoid 12 to break away from base subassembly 1, and install plug-in three installation spring 20 one end through the bolt, the effect of plug-in opening groove 17 under the fixed mounting block 12 of lid subassembly 11, thereby the fixed mounting groove 12, the effect of lid subassembly 12 of opening groove 11 can be fixed block 17.
The utility model provides a pair of ready-package integrated circuit structure, card lid subassembly 2 can cover circuit board 8 to avoid falling the ash on the circuit board 8, prevent that the ash deposition from excessively causing circuit board 8 function redundancy on the circuit board 8, card lid subassembly 1 can avoid debris to fall on circuit board 8 and injure by a crashing object circuit board 8 moreover.
The utility model provides a further embodiment, as shown in fig. 2, through-hole 4 has all been seted up near four corners department to bottom plate 3 top outer wall, and through-hole 4 is convenient for the bolt to pass bottom plate 3, and bottom plate 3 top outer wall both sides all install two through the bolt and are located the inside spring 6 of boss 5, and spring 6 is convenient for support roof 7, and cooperation connecting spring 15 can avoid circuit board 8 to produce vibrations by a relatively large margin when receiving vibrations.
In another embodiment, as shown in fig. 2, the top of the spring 6 is provided with a top plate 7 through a bolt, the top plate 7 can hold a circuit board 8, and the outer wall of the top plate 7 is provided with the circuit board 8, and the circuit board 8 is an integrated circuit.
The utility model provides a further embodiment, as shown in fig. 1, fig. 3, all weld on the outer wall of lid 12 both sides has the fin 14 that is equidistant structure distribution, and the fin 14 can improve the area of contact of lid 12 with the outside air to improve lid 12 and give off thermal speed, thereby improve the radiating effect of this structure, all seted up on the outer wall of lid 12 both sides and be equidistant structure distribution cross line hole 20, cross the wire on the line hole 20 circuit board 8 and pass lid 12.
The utility model provides a further embodiment, as shown in fig. 3, embedded groove 18 has been seted up to lid 12 top outer wall one side, and embedded groove 18 is convenient for glass board 19 to install on lid 12, and the inside glass board 19 that bonds of embedded groove 18, and glass board 19 is convenient for cover embedded groove 18, avoids the dust to fall on circuit board 8, and glass board 19 is convenient for the staff sees the circuit board 8 condition through lid 12 simultaneously.
The utility model provides a further embodiment, as shown in fig. 3, cover 12 top inner wall both sides all install through the bolt and are the connecting spring 15 that equidistant structure distributes, connecting spring 15 is convenient for support pressing plate 16, make pressing plate 16 tightly push down circuit board 8 when the lid 12 card is on bottom plate 3 on, cooperation spring 6 can avoid circuit board 8 to produce vibrations by a relatively large margin simultaneously, and adjacent three connecting spring 15 bottom installs through the bolt and has the clamp plate 16 with circuit board 8 interact, pressing plate 16 can push down circuit board 8 under connecting spring 15 effect when card lid subassembly 2 card is on base subassembly 1, thereby cooperation roof 7 is spacing to circuit board 8.
The working principle is as follows: when the structure is installed, a bolt can penetrate through the through hole 4 on the bottom plate 3, then the integrated circuit structure is fixed on a shell and other parts, then when the shell and other parts are impacted or greatly vibrated, the pressing plate 16 and the top plate 7 can clamp the circuit board 8 under the action of the connecting spring 15 and the spring 6, so that the circuit board 9 can not generate vibration with a larger amplitude when vibrated, and the shock resistance of the circuit board 9 is improved, and when the circuit board 8 in the clamping cover assembly 2 operates, the fins 14 can improve the contact area of the cover body 12 and the outside air, so that the speed of heat dissipation of the cover body 12 is improved, and the heat dissipation effect of the structure is improved, and then when the circuit board 8 needs to be dismounted and repaired, the inserting block 11 can be pressed by fingers, so that the inserting block 13 presses and installs the spring 10, one end of the inserting block 13 is separated from the limiting groove 17, so that the limitation on the cover body 12 is removed, and the cover body 12 is conveniently dismounted, and meanwhile, the pressing plate 16 can not be pressed on the circuit board 8 when the cover body 12 is dismounted, and so that a worker can conveniently dismount the circuit board 8.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (6)
1. The utility model provides a ready-package integrated circuit structure, includes base subassembly (1), its characterized in that, the joint has card lid subassembly (2) on base subassembly (1) top outer wall, card lid subassembly (2) include lid (12), lid (12) both sides outer wall is close to bottom department and has all seted up open slot (13), lid (12) looks inside being close to bottom department and has all seted up two spacing grooves (17), base subassembly (1) includes bottom plate (3), integrated into one piece has boss (5) on bottom plate (3) top outer wall, and has all seted up on boss (5) both sides outer wall and place groove (9), install three installation spring (10) through the bolt on the inner wall of place groove (9) one side, and three installation spring (10) one end installs grafting piece (11) of pegging graft in open slot (13), spacing groove (17) inside through the bolt.
2. The fast-assembly integrated circuit structure according to claim 1, wherein through holes (4) are formed in the outer wall of the top of the bottom plate (3) near the four corners, and two springs (6) located inside the bosses (5) are mounted on two sides of the outer wall of the top of the bottom plate (3) through bolts.
3. The ready-package integrated circuit structure according to claim 2, characterized in that the top end of the spring (6) is mounted with a top plate (7) by a bolt, and a circuit board (8) is placed on the outer wall of the top plate (7).
4. The fast-assembly integrated circuit structure according to claim 1, wherein fins (14) distributed in an equidistant structure are welded on the outer walls of the two sides of the cover body (12), and wire passing holes (20) distributed in an equidistant structure are formed on the outer walls of the two sides of the cover body (12).
5. The fast-assembly integrated circuit structure according to claim 1, wherein a recessed groove (18) is formed on one side of the outer wall of the top of the cover body (12), and a glass plate (19) is bonded inside the recessed groove (18).
6. The fast-assembly integrated circuit structure according to claim 3, characterized in that the connecting springs (15) are mounted on two sides of the inner wall of the top of the cover body (12) through bolts and distributed in an equidistant structure, and the bottom ends of three adjacent connecting springs (15) are mounted with pressing plates (16) which are in contact with the circuit board (8) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221834200.3U CN217721738U (en) | 2022-07-15 | 2022-07-15 | Fast-assembling integrated circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221834200.3U CN217721738U (en) | 2022-07-15 | 2022-07-15 | Fast-assembling integrated circuit structure |
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| Publication Number | Publication Date |
|---|---|
| CN217721738U true CN217721738U (en) | 2022-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221834200.3U Active CN217721738U (en) | 2022-07-15 | 2022-07-15 | Fast-assembling integrated circuit structure |
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| CN (1) | CN217721738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116170551A (en) * | 2023-02-08 | 2023-05-26 | 深圳市灵犀智慧显示科技有限公司 | Method for burning secret key of board card and TV board card |
-
2022
- 2022-07-15 CN CN202221834200.3U patent/CN217721738U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116170551A (en) * | 2023-02-08 | 2023-05-26 | 深圳市灵犀智慧显示科技有限公司 | Method for burning secret key of board card and TV board card |
| CN116170551B (en) * | 2023-02-08 | 2024-03-15 | 深圳市灵犀智慧显示科技有限公司 | Method for burning secret key of board card and TV board card |
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