CN217719029U - Heat dissipation device and electronic equipment - Google Patents

Abstract

The application discloses a heat dissipation device and electronic equipment, wherein the heat dissipation device comprises a connecting seat and a heat dissipation plate, and the connecting seat is used for being connected with a mainboard of the electronic equipment; one end of the heat dissipation plate is connected with the connecting seat, and the other end of the heat dissipation plate is provided with a connecting part used for being connected with a main board of the electronic equipment; the bottom surface epirelief of heating panel is equipped with a plurality of bellyings, the bellyings by the part plate body uplift of heating panel is formed for with the surface contact of the part of treating the heat dissipation on the mainboard in order to carry out heat conduction. The heat abstractor of this application embodiment under the condition that does not set up the heat-conducting layer, can reach or be close to the heat abstractor's that sets up the heat-conducting layer among the prior art radiating effect basically, through saving the heat-conducting layer, can reduction in production cost to simplify the equipment step, be of value to and improve production efficiency.

Description

Heat dissipation device and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a heat dissipation device and an electronic device.

Background

With the development of the related technology of the solid state disk, the storage capacity and the data transmission speed of the solid state disk are obviously improved, and meanwhile, the heat productivity of the solid state disk is also improved. In order to keep the solid state disk stably operating, some manufacturers configure a heat dissipation device for the solid state disk, and perform auxiliary heat dissipation on the solid state disk through the heat dissipation device, so as to avoid the over-high temperature of the solid state disk, and further keep the solid state disk stably operating.

In order to make sufficient contact between the solid state disk and the heat sink, and thus to achieve high heat conduction efficiency therebetween, a heat conduction layer with high heat conduction efficiency is generally required to be arranged between the solid state disk and the heat sink. Although the heat conduction layer can provide high heat conduction efficiency, the heat conduction layer is not beneficial to reducing the production cost and simplifying the production and assembly steps.

SUMMERY OF THE UTILITY MODEL

To solve the above technical problems in the prior art, embodiments of the present application provide a heat dissipation apparatus and an electronic device, so that the heat dissipation apparatus can still fully contact with a heat dissipation component such as a solid state disk to maintain a good heat dissipation effect without providing a heat conduction layer.

In order to solve the technical problem, the embodiment of the application adopts the following technical scheme:

a heat dissipation device, comprising:

the connecting seat is used for being connected with a main board of the electronic equipment;

one end of the heat dissipation plate is connected with the connecting seat, and the other end of the heat dissipation plate is provided with a connecting part used for being connected with a main board of the electronic equipment; the bottom surface epirelief of heating panel is equipped with a plurality of bellyings, the bellyings by the part plate body uplift of heating panel is formed for with the surface contact of the part of treating the heat dissipation on the mainboard in order to carry out heat conduction.

In some embodiments, the heat dissipation plate includes a heat dissipation plate body and a frame body surrounding a periphery of the heat dissipation plate body, and the protruding portion is located on the heat dissipation plate body.

In some embodiments, the bottom surface of the heat dissipation plate body protrudes from the bottom surface of the frame body.

In some embodiments, a plurality of elastic connecting ribs are convexly arranged on the periphery of the heat dissipation plate body, the elastic connecting ribs are sequentially arranged along the periphery of the heat dissipation plate body at intervals, the heat dissipation plate body is connected with the frame body through the elastic connecting ribs, and a convection hole is formed between the adjacent elastic connecting ribs.

In some embodiments, at least a portion of the frame body is provided with a bead at its outer periphery.

In some embodiments, the protrusion has a flat surface at its outer dome through which the protrusion contacts the surface of the part to be heat dissipated.

In some embodiments, the heat spreader plate is a copper plate; and/or the heat dissipation plate is of an integrated structure.

In some embodiments, one end of the heat dissipation plate is provided with one or more insertion parts in a protruding manner, and the insertion parts are inserted into the connection base.

In some embodiments, a part of the plate body at the other end of the heat dissipation plate protrudes to the surface where the protruding portion is located to form a concave pit, a through connection hole is formed in the bottom of the concave pit, and the other end of the heat dissipation plate is connected with the main board through a screw penetrating through the connection hole.

An electronic device comprises a mainboard, a solid state disk and the heat dissipation device, wherein the solid state disk is arranged on the mainboard, a heat dissipation plate of the heat dissipation device covers the solid state disk, and a protruding part on the heat dissipation plate is in contact with the solid state disk.

The heat abstractor of this application embodiment, the bottom surface epirelief of heating panel is equipped with a plurality of bellyings, and under the condition that does not set up the heat-conducting layer, the heating panel still can keep comparatively abundant contact through the bellyings with for example the surface that solid state hard waited for the heat-dissipating part, is difficult to take place the condition that the large tracts of land breaks away from the contact. So, the heating panel with treat can maintain higher heat conduction efficiency between the radiating part, and then will treat the abundant conduction of heat on the radiating part to the heating panel, give off through the heating panel, make heat abstractor keep better radiating effect. Moreover, the heat conduction layer is not required, so that the production cost is reduced, the installation steps of the heat dissipation device are simplified, and the production efficiency is improved.

Drawings

Fig. 1 is a perspective view of a heat dissipation device according to an embodiment of the present application;

fig. 2 and 3 are perspective views of the heat dissipation plate at different viewing angles, respectively;

FIG. 4 is a cross-sectional view of a heat sink plate;

FIG. 5 is a schematic diagram illustrating the connection between a heat sink and a solid state drive;

fig. 6 is a partially enlarged view of a portion a in fig. 5.

Description of reference numerals:

100-a connecting seat;

200-a heat sink; 210-a heat sink body; 211-a boss; 212-plane; 220-a frame body; 221-reinforcing ribs; 222-elastic tie bars; 223-convection holes; 224-a plug-in part; 225-pits; 226-connecting hole; 227-screws;

300-solid state disk.

Detailed Description

Various aspects and features of the present application are described herein with reference to the drawings.

It will be understood that various modifications may be made to the embodiments of the present application. Accordingly, the foregoing description should not be construed as limiting, but merely as exemplifications of embodiments. Those skilled in the art will envision other modifications within the scope and spirit of the application.

The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the application and, together with a general description of the application given above and the detailed description of the embodiments given below, serve to explain the principles of the application.

These and other characteristics of the present application will become apparent from the following description of preferred forms of embodiment, given as non-limiting examples, with reference to the attached drawings.

It should also be understood that, although the present application has been described with reference to some specific examples, a person of skill in the art shall certainly be able to achieve many other equivalent forms of application, having the characteristics as set forth in the claims and hence all coming within the field of protection defined thereby.

The above and other aspects, features and advantages of the present application will become more apparent in view of the following detailed description when taken in conjunction with the accompanying drawings.

Specific embodiments of the present application are described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the application, which can be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the application of unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present application in virtually any appropriately detailed structure.

The description may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may each refer to one or more of the same or different embodiments in accordance with the application.

The embodiment of the application provides a heat dissipation device, which can be used for dissipating heat of a part to be dissipated on a mainboard of electronic equipment. The electronic device may be, for example, a notebook computer, a desktop computer, a tablet computer, and the like, and the component to be radiated may be, for example, a solid state disk or an internal memory, and the type of the electronic device, that is, the type of the component to be radiated, is not limited herein.

Referring to fig. 1 to 6, the heat dissipation device of the embodiment of the present application may include a connection socket 100 and a heat dissipation plate 200, where the connection socket 100 is used for connecting with a main board of an electronic apparatus. The connection socket 100 may be formed by a connector between a member to be heat-dissipated and a main board. For example, in the case that the component to be cooled is the solid state disk 300, the solid state disk 300 may be connected to the motherboard through, for example, a high-speed serial computer expansion bus (PCIE) connector, and the connection socket 100 may be formed by a portion of the PCIE connector. The connection socket 100 may also be a connection socket 100 provided specifically for the heat dissipation plate 200. For example, the docking cradle 100 may be different from a PCIE connector, the docking cradle 100 may be configured to be capable of being adhered or snapped onto the PCIE connector, or the docking cradle 100 may be configured to be capable of being directly connected to a motherboard.

One end of the heat dissipation plate 200 is connected to the connection base 100, and the other end of the heat dissipation plate 200 is provided with a connection portion for connecting to a main board of the electronic device, so that the heat dissipation plate 200 can be fixed to the main board by the cooperation of the connection base 100 and the connection portion. The other end of the heat dissipation plate 200 may be directly connected to the main board, or may be connected to the main board through a component to be dissipated. For example, in the case where the solid state disk 300 is connected to a motherboard, the other end of the heat dissipation plate 200 may be connected to the solid state disk 300. The bottom surface of the heat dissipation plate 200 is convexly provided with a plurality of protruding parts 211, and the protruding parts 211 are formed by protruding part of the plate body of the heat dissipation plate 200 and are used for being in contact with the surface of a part to be dissipated on the main board to conduct heat conduction. Alternatively, in the case where the heat dissipation plate 200 is a metal plate, the protruding portion 211 may be formed by an integral molding process such as a metal plate.

In the heat dissipation device of the embodiment of the application, the plurality of protrusions 211 are convexly arranged on the bottom surface of the heat dissipation plate 200, and under the condition that no heat conduction layer is arranged, the heat dissipation plate 200 can still be in sufficient contact with the surface of the solid state disk 300 waiting for the heat dissipation part through the protrusions 211, and the large-area contact is not easy to occur. So, heating panel 200 and wait to maintain higher heat conduction efficiency between the radiating part, and then will wait that the abundant conduction of heat on the radiating part reaches heating panel 200, gives off through heating panel 200, makes heat abstractor keep better radiating effect. Moreover, the heat conduction layer is not required, so that the production cost is reduced, the installation steps of the heat dissipation device are simplified, and the production efficiency is improved.

As shown in fig. 4 to 6, in some embodiments, the outer dome of the protrusion 211 has a flat surface 212, and the protrusion 211 contacts with the surface of the component to be heat-dissipated through the flat surface 212. Thus, the contact area between the protruding portion 211 and the member to be heat-dissipated can be increased, which is beneficial to improving the heat dissipation effect. Alternatively, the protrusion 211 may be approximately hemispherical in its entirety, and a flat surface 212 may be formed near the hemispherical dome.

In some embodiments, the heat dissipation plate 200 may be a copper plate, an aluminum plate, or other plate material with high thermal conductivity. Thus, a good heat dissipation effect can be achieved. Alternatively, the heat dissipation plate 200 may be a unitary structure. For example, when the heat dissipation plate 200 is made of copper plate, aluminum plate, or other metal plate material, the heat dissipation plate 200 may be formed by an integral molding process such as sheet metal.

As shown in fig. 2 and 3, in some embodiments, the heat dissipation plate 200 includes a heat dissipation plate body 210 and a frame 220 surrounding a periphery of the heat dissipation plate body 210, and the protrusion 211 is located on the heat dissipation plate body 210. That is, the heat dissipation plate 200 may include a heat dissipation plate body 210 located at the middle portion, and a frame body 220 disposed around the heat dissipation plate body 210, wherein the protruding portion 211 is disposed on the heat dissipation plate body 210. The frame 220 not only improves the structural strength of the entire heat sink 200, but also protects the heat sink 210.

As shown in fig. 4, in some embodiments, the bottom surface of the heat dissipation plate 210 protrudes from the bottom surface of the frame 220. For example, in the case where the heat dissipation plate 200 is a rectangular copper plate, a rectangular protrusion may be formed at the middle of the rectangular copper plate by, for example, a sheet metal process, and the protrusion 211 having an approximately hemispherical shape may be formed on the rectangular protrusion. The bottom surface of the heat dissipation plate body 210 is configured to protrude out of the bottom surface of the frame body 220, so that the protrusion 211 and the part to be dissipated are favorably maintained to be in contact with each other, a good heat dissipation effect is favorably maintained, and the heat dissipation device can be prevented from being out of contact with the part to be dissipated due to the heat dissipation plate 200.

As shown in fig. 1 to fig. 3, in some embodiments, a plurality of elastic connection ribs 222 are protruded from the periphery of the heat dissipation plate 210, the elastic connection ribs 222 are sequentially arranged along the periphery of the heat dissipation plate 210 at intervals, the heat dissipation plate 210 is connected to the frame 220 through the plurality of elastic connection ribs 222, and a convection hole 223 is formed between the adjacent elastic connection ribs 222. Alternatively, the resilient connecting ribs 222 may be configured to: when the protruding portion 211 on the heat dissipation plate body 210 and the component to be dissipated are in contact with each other, an elastic force toward the component to be dissipated can be applied to the heat dissipation plate body 210 to keep the protruding portion 211 and the component to be dissipated in contact with each other. Therefore, the heat dissipation device can keep a good heat dissipation effect, and the stability of the heat dissipation device can be improved. In addition, the convection holes 223 are formed between the elastic connection ribs 222, which is advantageous for forming air convection and further improving the heat dissipation effect. Alternatively, when the heat dissipation plate 200 is a metal plate, the elastic connection ribs 222 and the convection holes 223 may be formed by a sheet metal process.

As shown in fig. 3, in some embodiments, at least a portion of the frame 220 is provided with a rib 221 at an outer periphery thereof, and the rib 221 is beneficial to improve the structural strength of the heat dissipation plate 200, and is beneficial to keep the protrusion 211 in contact with a component to be dissipated. Taking the overall shape of the heat dissipation plate 200 as an example, the frame 220 may also be rectangular, one end of the frame 220 may be connected to the connecting socket 100, the other end of the frame 220 may be provided with a connecting part, and two opposite side edges of the frame 220 located between the two ends may be respectively provided with a reinforcing rib 221. In the case where the heat sink 200 is a copper plate, both side edges of the frame 220 may be bent toward the side where the protruding portion 211 is located to form folded edges, and the ribs 221 may be formed by the folded edges.

In some embodiments, one end of the heat dissipation plate 200 is protruded with one or more insertion parts 224, and the insertion parts 224 are inserted into the connection socket 100. Correspondingly, the connecting base 100 may be provided with an insertion hole. When the heat dissipation plate 200 is installed, the insertion portion 224 at one end of the heat dissipation plate 200 is inserted into the insertion hole of the connection base 100, and the other end of the heat dissipation plate 200 is connected to the main board, so that the heat dissipation plate 200 is assembled.

In some embodiments, a part of the plate body at the other end of the heat dissipation plate 200 is raised to a surface where the protrusion 211 is located to form a recess 225, a through connection hole 226 is formed at the bottom of the recess 225, and the other end of the heat dissipation plate 200 is connected to the main board through a screw 227 passing through the connection hole 226. The concave pit 225 can abut against a main board or a part to be heat-dissipated so as to make the heights of both ends of the heat dissipation plate 200 consistent, and moreover, the screw 227 can be made to be not in the concave pit 225, so that the screw 227 is prevented from protruding out of the surface of the heat dissipation plate 200.

The heat dissipation effect of the heat dissipation device according to the embodiment of the present application is described below with reference to experimental data. The Original socket is a heat dissipation device in the prior art, a heat conduction layer is arranged between the Original socket and the solid state disk 300, a 0.5mm socket is a heat dissipation device adopting a copper heat dissipation plate 200 with the thickness of 0.5mm, and a 0.3mm socket is a heat dissipation device adopting a copper heat dissipation plate 200 with the thickness of 0.3 mm. In the same environment, in the case where the operation conditions were substantially the same, the experimental data obtained are shown in table 1.

TABLE 1

It can be seen from the above table that the heat dissipation device of the embodiment of the present application can basically achieve or approach the heat dissipation effect of the heat dissipation device with a heat conduction layer in the prior art without the heat conduction layer, and can reduce the production cost by omitting the heat conduction layer, simplify the assembly steps, and be beneficial to improving the production efficiency.

Referring to fig. 5 and 6, an electronic device may be an electronic device such as a desktop computer, a laptop computer, a notebook computer, or a tablet computer, and the type of the electronic device is not limited herein. The electronic device can comprise a mainboard, a solid state disk 300 and the heat dissipation device of any one of the above embodiments, wherein the solid state disk 300 is arranged on the mainboard, the heat dissipation plate 200 of the heat dissipation device covers the solid state disk 300, and the convex part 211 on the heat dissipation plate 200 is in contact with the solid state disk 300. That is, the heat dissipation plate 200 may cover a side of the solid state disk 300 facing away from the motherboard, and the protrusion 211 may contact a side of the solid state disk 300 facing away from the motherboard. For example, in the case where a memory chip is provided on the solid state disk 300, the convex portion 211 should be in contact with at least the memory chip.

Because the heat dissipation device can still be in sufficient contact with the solid state disk 300 under the condition that no heat conduction layer is arranged, the situation that the heat dissipation device is separated from the contact in a large area is not easy to occur, and high heat conduction efficiency and good heat dissipation effect can be maintained, the electronic equipment using the heat dissipation device can also be kept with good heat dissipation effect even if no heat conduction layer is arranged. Moreover, the heat conduction layer is not required to be arranged, so that the assembly steps of the electronic equipment are facilitated, and the production efficiency is further facilitated to be improved.

The above embodiments are only exemplary embodiments of the present application, and are not intended to limit the present application, and the protection scope of the present application is defined by the claims. Various modifications and equivalents may be made to the disclosure by those skilled in the art within the spirit and scope of the disclosure, and such modifications and equivalents should also be considered as falling within the scope of the disclosure.

Claims (10)

1. A heat dissipating device, comprising:

the connecting seat is used for being connected with a main board of the electronic equipment;

one end of the heat dissipation plate is connected with the connecting seat, and the other end of the heat dissipation plate is provided with a connecting part used for being connected with a main board of the electronic equipment; the bottom surface epirelief of heating panel is equipped with a plurality of bellyings, the bellyings by the part plate body uplift of heating panel is formed for with the surface contact of the part of treating the heat dissipation on the mainboard in order to carry out heat conduction.

2. The heat dissipating device of claim 1, wherein the heat dissipating plate comprises a heat dissipating plate body and a frame body surrounding a periphery of the heat dissipating plate body, and the protruding portion is located on the heat dissipating plate body.

3. The heat dissipating device of claim 2, wherein the bottom surface of the heat dissipating plate protrudes from the bottom surface of the frame.

4. The heat dissipating device of claim 2, wherein a plurality of elastic connecting ribs are protruded from the periphery of the heat dissipating plate, the elastic connecting ribs are sequentially spaced along the periphery of the heat dissipating plate, the heat dissipating plate is connected to the frame through the elastic connecting ribs, and a convection hole is formed between adjacent elastic connecting ribs.

5. The heat dissipating device of claim 2, wherein at least a portion of the frame body is provided with a rib at an outer periphery thereof.

6. The heat dissipating device as claimed in any one of claims 1 to 5, wherein the projections have a flat surface at their outer dome, and the projections are in contact with the surface of the member to be heat dissipated through the flat surface.

7. The heat dissipating device according to any one of claims 1 to 5, wherein the heat dissipating plate is a copper plate; and/or the heat dissipation plate is of an integrated structure.

8. The heat dissipating device of any one of claims 1 to 5, wherein one end of the heat dissipating plate is provided with one or more insertion portions, and the insertion portions are inserted into the connecting bases.

9. The heat dissipating device according to any one of claims 1 to 5, wherein a portion of the plate body at the other end of the heat dissipating plate protrudes toward the surface of the protrusion to form a concave pit, a through connection hole is formed at the bottom of the concave pit, and the other end of the heat dissipating plate is connected to the main board through a screw penetrating through the connection hole.

10. An electronic device, comprising a motherboard, a solid state disk and the heat dissipation device of any one of claims 1 to 9, wherein the solid state disk is disposed on the motherboard, a heat dissipation plate of the heat dissipation device covers the solid state disk, and a protrusion on the heat dissipation plate contacts with the solid state disk.

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