CN217718668U

CN217718668U - A test fixture for detecting fingerprint identification module performance

Info

Publication number: CN217718668U
Application number: CN202221685848.9U
Authority: CN
Inventors: 匡志尖
Original assignee: Jiangxi Holitech Technology Co Ltd
Current assignee: Jiangxi Holitech Technology Co Ltd
Priority date: 2022-07-01
Filing date: 2022-07-01
Publication date: 2022-11-01
Anticipated expiration: 2032-07-01

Abstract

The utility model relates to a test fixture for detecting fingerprint identification module performance, including the tool body, the tool body is right through being connected with the BTB connector the performance of fingerprint identification module is tested, the fingerprint identification module includes the fingerprint identification chip, the tool body includes the PCB board, set up at least one first wiring region on the PCB board, set up the jumper wire region on the PCB board body and set up at least one second wiring region on the PCB board body, first wiring region includes that a plurality of is used for corresponding the first electrically conductive hole of being connected with the pin of fingerprint identification chip, second wiring region includes that a plurality of is used for corresponding the electrically conductive hole of the second of being connected with the pin of BTB connector, the jumper wire region includes a chip mapping district and a plurality of BTB pin mapping district, and this kind of mode of wiring is simple, and simple to handle, can reduce the probability that takes place the wrong of wiring and connect, further improves the efficiency of testing of fingerprint identification module performance.

Description

A test fixture for detecting fingerprint identification module performance

Technical Field

The utility model belongs to the technical field of the fingerprint identification module detects technique and specifically relates to a test fixture for detecting fingerprint identification module performance is related to.

Background

At present, electronic products have generally introduced a fingerprint identification function, such as a mobile phone, a tablet computer, and the like, and the demand for a fingerprint identification module in the market of the electronic products is increasing.

In fingerprint identification module production process, need carry out capability test to the fingerprint identification module, traditional test method is: leading out each pin of the fingerprint identification chip on the test board one by using a plurality of DuPont wires, and then correspondingly connecting the DuPont wires with the pins of the BTB connector respectively so as to detect the performance of the fingerprint identification module; this method has the following drawbacks: 1. the wiring is complex, the operation is difficult, the phenomenon of wrong wiring of pins of the fingerprint identification chip is easy to occur, and the testing efficiency is reduced; 2. the pins used by the fingerprint identification chips of various manufacturers are different, the fingerprint identification chips of different models are required to be reconnected for testing, the testing efficiency is low, and the universality is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a wiring is simple, the operation is simplified is provided, can reduce the probability that takes place the wiring and connect the mistake to improve the efficiency of software testing for detecting fingerprint identification module performance.

The utility model discloses the technical scheme who adopts is, a test fixture for detecting fingerprint identification module performance, including the tool body, the tool body is right through being connected with the BTB connector the performance of fingerprint identification module is tested, the fingerprint identification module includes the fingerprint identification chip, the tool body includes the PCB board, set up at least one first wiring region on the PCB board, set up jumper wire region on the PCB board body and set up at least one second wiring region on the PCB board body, first wiring region includes that a plurality of is used for corresponding the first electrically conductive hole of being connected with the pin of fingerprint identification chip, second wiring region includes that a plurality of is used for the electrically conductive hole of second of being connected with the pin correspondence of BTB connector, the jumper wire region includes a chip pin mapping district and a plurality of BTB pin mapping district, chip pin mapping district includes the first pad of a plurality of, the quantity of BTB pin mapping district with the quantity of first pad is the same, first pad with the BTB pin mapping district one-to-one, first electrically conductive hole of first electrically conductive hole and second electrically conductive hole switch on the second one-to-one.

The utility model has the advantages that: when a certain pin of the fingerprint identification chip is required to be connected with a pin of the corresponding BTB connector, only a conductor needs to be artificially adopted, one end of the conductor is connected with the first bonding pad corresponding to the pin of the fingerprint identification chip, the other end of the conductor is connected with the second conductive hole corresponding to the pin of the BTB connector in the BTB pin mapping area corresponding to the first bonding pad, and the connection of the fingerprint identification chip and the BTB connector can be realized by directly connecting the conductor on the PCB board; set up a plurality of first wiring region on the PCB board, every first wiring region can set up a plurality of second wiring region to different fingerprint identification chip models on the PCB board, and every second wiring region can be to different BTB connectors, has just so improved test fixture's commonality.

Preferably, a plurality of first pads in the chip pin mapping area are uniformly distributed in sequence along the vertical direction, each BTB pin mapping area and the corresponding first pad are located on the same horizontal direction, a plurality of second pads in the BTB pin mapping area are uniformly distributed in sequence along the horizontal direction, and by adopting the structure, the first pads and the second pads can jointly form rectangular array distribution, so that each first conductive hole can be directly connected with the corresponding pins of the BTB connector through wires in the corresponding BTB pin mapping area.

Preferably, a plurality of first pads in the chip pin mapping area are uniformly distributed in sequence along the horizontal direction, the BTB pin mapping area and the corresponding first pads are located in the same vertical direction, a plurality of second pads in the BTB pin mapping area are uniformly distributed in sequence along the vertical direction, and by adopting the structure, the first pads and the second pads can jointly form rectangular array distribution, so that each first conductive hole can be directly connected with the corresponding pins of the BTB connector through wires in the corresponding BTB pin mapping area.

Preferably, the first terminal area further includes a first naming area for naming each first conductive via, the first naming area includes a name for naming each first conductive via, the jumper area includes a second naming area for naming each first pad, the second naming area includes a name for naming each first pad, the name for naming each first pad is the same as the name for naming the corresponding first conductive via, the second terminal area further includes a third naming area for naming each second conductive via, the third naming area includes a name for naming each second conductive via, the jumper area further includes a fourth naming area for naming each column of second pads, the fourth naming area includes a name for naming each column of second pads, the names of the first bonding pads are the same as the names of the second conductive holes corresponding to the first bonding pads, the structure is adopted to name each first bonding pad and each column of second bonding pads, each first bonding pad is the same as the name of the corresponding first conductive hole, each column of second bonding pads is the same as the name of the corresponding second conductive hole, when a certain pin of the pattern recognition chip is required to be correspondingly connected with a certain pin of the BTB connector, only the first bonding pad which is consistent with the name of the first conductive hole corresponding to the pin of the pattern recognition chip on the chip pin mapping area needs to be found, then the second bonding pad which is consistent with the name of the second conductive hole corresponding to the pin of the BTB connector in the corresponding BTB pin mapping area is found, and then the first bonding pad and the second bonding pad are connected together by adopting a lead, so that the conduction of the pattern recognition chip and the BTB connector is realized, the method is simple, the wiring efficiency is improved, and the testing efficiency of the performance of the fingerprint identification module is further improved.

Preferably, the pins of the fingerprint identification chip are inserted into the corresponding first conductive holes through the pin headers, and by adopting the structure, the pins of the fingerprint identification chip are directly inserted into the corresponding first conductive holes through the contact pins.

Preferably, the pins of the BTB connector are inserted into the corresponding second conductive holes through the pin headers, and by adopting the structure, the pins of the BTB connector are inserted into the corresponding first conductive holes through the contact pins, or the pins of the BTB connector are directly welded with the corresponding second conductive holes.

Preferably, the pins of the BTB connector are welded with the corresponding second conductive holes, and by adopting the structure, the pins of the BTB connector are directly welded with the first conductive holes through the base of the BTB connector.

Preferably, the first bonding pad and the second bonding pad are both provided with the electrifying holes, and by adopting the structure, one end of the wire is inserted into the electrifying hole of the first bonding pad, and the other end of the wire is inserted into the electrifying hole of the corresponding second bonding pad, so that signal conduction between the first bonding pad and the second bonding pad can be realized, and the pins of the fingerprint identification chip and the pins of the corresponding BTB connector are connected together.

Drawings

Fig. 1 is a schematic structural view of a testing jig for detecting the performance of a fingerprint identification module according to the present invention;

as shown in the figure: 1. a PCB board; 2. a first terminal area; 3. a jumper area; 4. a second terminal area; 5. a first conductive via; 6. a second conductive via; 7. a chip pin mapping area; 8. a BTB pin mapping area; 9. a first bonding pad; 10. a second pad; 11. a first named region; 12. a second named region; 13. a third named area; 14. a fourth named zone.

Detailed Description

The invention is further described below with reference to the accompanying drawings in combination with the embodiments so that those skilled in the art can implement the invention with reference to the description, and the scope of the invention is not limited to the embodiments.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and simplicity in description, but do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular manner of operation, and thus, the terms are not to be construed as limiting the invention.

Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The embodiment of the utility model provides a test fixture for detecting the performance of a fingerprint identification module, which comprises a fixture body, wherein the fixture body is connected with a BTB connector to test the performance of the fingerprint identification module, the fingerprint identification module comprises a fingerprint identification chip, the fixture body comprises a PCB (printed circuit board) 1, at least one first wiring area 2 which is arranged on the PCB 1 and is used for being connected with the fingerprint identification chip, a jumper area 3 which is arranged on the PCB 1 body and at least one second wiring area 4 which is arranged on the PCB 1 body and is used for being connected with the BTB connector, in the figure 1, the number of the first wiring areas 2 is three, each first wiring area 2 corresponds to the type of a fingerprint identification chip, namely, the three first wiring areas 2 can be used for the fingerprint identification chips with three different types, and the number of the second wiring areas 4 is four, each second wiring area 4 corresponds to the type of a BTB connector, that is, three second wiring areas 4 can be used by three different types of BTB connectors, the first wiring area 2 includes a plurality of first conductive holes 5 correspondingly connected to pins of a fingerprint identification chip, the second wiring area 4 includes a plurality of second conductive holes 6 correspondingly connected to pins of the BTB connector, the jumper area 3 includes a chip pin mapping area 7 and a plurality of BTB pin mapping areas 8, the chip pin mapping area 7 includes a plurality of first pads 9, the number of the BTB pin mapping areas 8 is the same as the number of the first pads 9, the first pads 9 correspond to the BTB pin mapping areas 8 one by one, the first pads 9 are electrically conducted with the first conductive holes 5 one by one, the BTB pin mapping areas 8 include a plurality of second pads 10, the second pads 10 are electrically connected with the second conductive holes 6 in a one-to-one correspondence manner. In fig. 1, the number of the first pads 9 is 20, the number of the BTB pin mapping regions 8 is 20, the right side of each first pad 9 in fig. 1 corresponds to one chip pin mapping region 7, a plurality of second pads 10 are disposed in the BTB pin mapping regions 8, that is, each first pad 9 corresponds to a plurality of second pads 10, the corresponding second pads 10 are electrically connected to the second conductive holes 6 one by one, and the first pads 9 are electrically connected to the first conductive holes 5 one by one.

In fig. 1, when a PCB 1 is manufactured, first pads 9 of a jumper area 3 are correspondingly conducted with first conductive holes 5 of a first wiring area 2 one by one, and the number of BTB pin mapping areas 8 is the same as that of the first pads 9, that is, each first pad 9 corresponds to one BTB pin mapping area 8, a second pad 10 in each BTB pin mapping area 8 is correspondingly conducted with a second conductive hole 6 of a second wiring area 4 one by one, when a fingerprint identification module needs to be subjected to function detection, a fingerprint identification chip is only required to be connected to the first wiring area 2, pins of the fingerprint identification chip are correspondingly connected with the first conductive holes 5, a BTB connector is connected to the second wiring area 4, pins of the BTB connector are correspondingly connected with the first conductive holes 5, then a wire is manually adopted, one end of the wire is connected to the first pad 9 corresponding to the pins of the fingerprint identification chip, the other end of the wire is connected to the second pad 10 corresponding to the second pad, the second pad 10 corresponding to the first pad 9 is located in the first pad 9, and the BTB connector is connected to the first pad 9, and the BTB pin, so that the efficiency of the BTB identification chip is further reduced by simply connecting the wire connection of the BTB connector and the BTB connector, and the BTB connector is connected to the chip, and the BTB connector, and the efficiency of the BTB identification module can be further reduced by simply connected to the simple connection efficiency of the BTB connector is reduced by the simple connection of the chip; set up a plurality of first wiring region 2 on PCB board 1, every first wiring region 2 can be to different fingerprint identification chip models, sets up a plurality of second wiring region 4 on PCB board 1, and every second wiring region 4 can be to different BTB connectors, has just so improved test fixture's commonality.

As shown in fig. 1, the plurality of first pads 9 in the chip pin mapping region 7 are uniformly distributed in sequence along the vertical direction, each BTB pin mapping region 8 and the corresponding first pad 9 are located in the same horizontal direction, the plurality of second pads 10 in the BTB pin mapping region 8 are uniformly distributed in sequence along the horizontal direction, in fig. 1, the number of the first pads 9 is 20 rows and 1 columns, the number of the second pads 10 is 20 rows and 11 columns, all the first pads 9 and all the second pads 10 form a rectangular array distribution together, in fig. 1, in any column of the second pads 10 in the wiring region, each second pad 10 is conducted with the same second conductive hole 6, so that the pins of each fingerprint identification chip can be directly connected with the pins of the corresponding BTB connector through wires in the corresponding BTB pin mapping region 8, the structure is simple, the operation is convenient, the board arrangement is neat, a disordered situation does not occur, and the wiring efficiency is improved.

Except the structure given in fig. 1, a plurality of first pads 9 in the chip pin mapping area 7 can also be uniformly distributed in sequence along the horizontal direction, the BTB pin mapping area 8 and the corresponding first pads 9 are located on the same vertical direction, a plurality of second pads 10 in the BTB pin mapping area 8 are uniformly distributed in sequence along the vertical direction, and by adopting the structure, the first pads 9 and the second pads 10 can be distributed together in a rectangular array, so that each first conductive hole 5 can be directly connected with the corresponding pin of the BTB connector through a wire in the corresponding BTB pin mapping area 8.

As shown in fig. 1, the first terminal area 2 further includes a first naming zone 11 for naming each first conductive via 5, the first naming zone 11 includes a name for naming each first conductive via 5, and as shown in fig. 1, the name of a first conductive via 5 includes: a1, A2, A3, A4, A5, A6, A7, A8, A9, a10, B1, B2, B3, B4, B5, B6, B7, B8, B9 and B10, the first conductive via 5 of each first terminal area 2 is named, the terminal area 3 includes a second naming area 12 for naming each first pad 9, the second naming area 12 includes a name for naming each first pad 9, the name for naming each first pad 9 is the same as the name for naming the corresponding first conductive via 5, the terminal area 4 further includes a third naming area 13 for naming each second conductive via 6, the third naming area 13 includes a name for naming each second conductive via 6, as in fig. 1, the names of the second conductive vias 6 include: 01. 02, 03, 04, 05, 06, 07, 08, 09, 10, 11, and 12, the jumper region 3 further includes a fourth naming region 14 for naming each column of the second pads 10, the fourth naming region 14 includes names for naming each column of the second pads 10, the names for each column of the second pads 10 are the same as the names named by the corresponding second conductive vias 6, in fig. 1, each first pad 9 is named and each column of the second pads 10 is named, each first pad 9 is the same as the name of the corresponding first conductive via 5, each column of the second pads 10 is the same as the name of the corresponding second conductive via 6, when it is necessary to connect a certain pin of the texture recognition chip and a certain pin of the BTB connector together, it is only necessary to find the first pad 9 on the chip pin mapping region 7 that is consistent with the name of the corresponding first conductive via 5 of the pin of the fingerprint recognition chip, and then find the second pad 9 in the corresponding BTB mapping region 8 that is consistent with the name of the corresponding first conductive via 5 of the pin of the fingerprint recognition chip, and then the second pad 10 are connected together by a simple method for improving the efficiency of the connection of the second conductive pads and the chip.

The pins of the BTB connector are inserted into the corresponding second conductive holes 6 through the pin header, and by adopting the structure, the pins of the BTB connector are inserted into the corresponding first conductive holes 5 through the pin header, or the pins of the BTB connector are directly welded with the corresponding second conductive holes 6 together.

The pins of the BTB connector are welded with the corresponding second conductive holes 6, and by adopting the structure, the pins of the BTB connector are directly welded with the first conductive holes 5 through the base of the BTB connector.

All be provided with the circular telegram hole on first pad 9 and the second pad 10, adopt this structure, insert the one end of wire in the circular telegram hole of first pad 9, the other end of wire inserts the circular telegram hole of the second pad 10 that corresponds, just so can realize the signal between first pad 9 and the second pad 10 and switch on to the pin that realizes the fingerprint identification chip links together with the pin of the BTB connector that corresponds, this simple structure, convenient operation has improved wiring efficiency.

Claims

1. The utility model provides a test fixture for detecting fingerprint identification module performance, includes the tool body, the tool body is right through being connected with the BTB connector the performance of fingerprint identification module is tested, the fingerprint identification module includes the fingerprint identification chip, its characterized in that: the jig body comprises a PCB (1), at least one first wiring region (2) arranged on the PCB (1), a jumper wire region (3) arranged on the PCB (1) and at least one second wiring region (4) arranged on the PCB (1), wherein the first wiring region (2) comprises a plurality of first conductive holes (5) which are used for being connected with pins of a fingerprint identification chip in a corresponding mode, the second wiring region (4) comprises a plurality of second conductive holes (6) which are used for being connected with pins of a BTB connector in a corresponding mode, the jumper wire region (3) comprises a chip pin mapping region (7) and a plurality of BTB pin mapping regions (8), the chip pin mapping region (7) comprises a plurality of first bonding pads (9), the number of the BTB pin mapping regions (8) is the same as that of the first bonding pads (9), the first bonding pads (9) correspond to the bonding pads of the BTB pin mapping regions (8) one by one, the first conductive holes (9) correspond to the first conductive holes (5), the second conductive holes (10) are electrically connected with the second conductive holes (10) in a one-by one-to-by one mode.

2. The test fixture for detecting the performance of the fingerprint identification module set according to claim 1, wherein: a plurality of first bonding pads (9) in the chip pin mapping area (7) are uniformly distributed in sequence along the vertical direction, each BTB pin mapping area (8) and the corresponding first bonding pad (9) are located on the same horizontal direction, and a plurality of second bonding pads (10) in the BTB pin mapping area (8) are uniformly distributed in sequence along the horizontal direction.

3. The testing fixture for detecting the performance of the fingerprint identification module according to claim 1, wherein: a plurality of first bonding pads (9) in the chip pin mapping area (7) are evenly distributed along the horizontal direction in sequence, the BTB pin mapping area (8) and the corresponding first bonding pads (9) are located on the same vertical direction, and a plurality of second bonding pads (10) in the BTB pin mapping area (8) are evenly distributed along the vertical direction in sequence.

4. The testing fixture for detecting the performance of the fingerprint identification module according to claim 2 or claim 3, wherein: the first wiring area (2) further comprises a first naming zone (11) for naming each first conductive via (5), the first naming zone (11) comprising a name naming each first conductive via (5), the jumper area (3) comprising a second naming zone (12) for naming each first pad (9), the second naming zone (12) comprising a name naming each first pad (9), the named name of each first pad (9) being the same as the named name naming the corresponding first conductive via (5), the second wiring area (4) further comprises a third naming zone (13) for naming each second conductive via (6), the third naming zone (13) comprising a name naming each second conductive via (6), the jumper area (3) further comprises a fourth naming zone (14) for naming each column of second pads (10), the fourth naming zone (14) comprising the named names of the second columns of second pads (10), the named zones (14) comprising the named names naming each column of second pads (10), the named zones (6) comprising the named names naming the same second columns of second conductive vias (6).

5. The testing fixture for detecting the performance of the fingerprint identification module according to claim 1, wherein: the pins of the fingerprint identification chip are inserted into the corresponding first conductive holes (5) through the pin headers.

6. The testing fixture for detecting the performance of the fingerprint identification module according to claim 1, wherein: the pins of the BTB connector are inserted into the corresponding second conductive holes (6) through the pin header.

7. The test fixture for detecting the performance of the fingerprint identification module set according to claim 1, wherein: and the pins of the BTB connector are welded with the corresponding second conductive holes (6).

8. The testing fixture for detecting the performance of the fingerprint identification module according to claim 1, 2 or 3, wherein: and the first bonding pad (9) and the second bonding pad (10) are provided with electrifying holes.