CN217718497U - Variable-condition MCU power consumption testing system - Google Patents

Abstract

The utility model relates to a test equipment technical field for chip manufacturing, concretely relates to variable-condition MCU power consumption test system, which comprises an upper computer, a main control MCU, a DPS module and a temperature control box, wherein the upper computer is connected with the main control MCU through a USART; the DAC of the main control MCU outputs an output voltage VDD to the DPS module, and the ADC of the main control MCU collects the current measured by the DPS module; the output voltage VDD range of the DPS module is 0 to 5V, and the power is supplied to the MCU to be tested; the master control MCU is connected with the MCU to be tested through an SWD interface, and the MCU to be tested is located in the temperature control box. The utility model has the advantages that: the power consumption test of the general MCU under different conditions and different modes is realized. The device can integrate the complex working conditions of the MCU, and the upper computer selects different working conditions and modes to measure the corresponding chip power consumption. The scheme ensures the integrity of the test and reduces the complexity and the operation difficulty of the test.

Description

Variable-condition MCU power consumption testing system

Technical Field

The utility model relates to a test equipment technical field for the chip manufacture, concretely relates to changeable MCU consumption test system of condition.

Background

In the application scene of the MCU (microcontroller), more and more applications need to consider the power consumption control of the MCU; the power consumption test of the MCU usually needs to be performed under different conditions, such as different voltages, different frequencies, different temperatures, and different operating modes. At present, the power consumption test under different conditions is mainly verified and tested through manual observation after manual configuration, which causes that a great deal of time is spent on verification and testing, and the integrity of verification and testing cannot be guaranteed.

Therefore, a power consumption testing system for an MCU with variable conditions is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to solve above-mentioned problem, in order to solve the consumption test problem of MCU under various complex conditions such as temperature and voltage promptly, the utility model describes a changeable MCU consumption test system of condition, it includes host computer, master control MCU, DPS module and temperature control box, wherein:

the upper computer is connected with the main control MCU through a USART;

the DAC of the main control MCU outputs an output voltage VDD to the DPS module, and the ADC of the main control MCU collects the current measured by the DPS module;

the DPS module outputs a voltage VDD in a range of 0 to 5V and supplies power to the MCU to be tested;

the master control MCU is connected with the MCU to be tested through an SWD interface, and the MCU to be tested is located in the temperature control box.

Further, the temperature range of the temperature control box is-40 ℃ to +150 ℃.

Further, the temperature control box includes the box, heats unit, refrigerating unit, temperature sensor, controller and heat preservation, wherein:

the refrigerating unit, the heating unit and the temperature sensor are all positioned in the box body and are respectively used for cooling, heating and measuring the temperature in the box body;

the control end of the refrigerating unit, the control end of the heating unit and the signal output end of the temperature sensor are in signal connection with the controller;

the heat-insulating layer is coated outside the box body.

Further, the box includes case body and case lid, wherein:

an accommodating cavity for accommodating the MCU to be tested and an opening communicated with the accommodating cavity are formed in the box body;

the box cover can be covered on the opening in an opening and closing manner;

the heat-insulating layer comprises a first heat-insulating layer coated outside the box body and a second heat-insulating layer coated outside the box cover.

Further, the refrigeration unit includes condenser, compressor, evaporimeter, capillary and the drier-filter that connects gradually and form the return circuit through the refrigerant pipeline, wherein:

the evaporator is positioned in the box body;

the compressor, the condenser, the capillary tube and the dry filter are all located outside the tank body.

Furthermore, the heating unit is an electric heating wire, and the electric heating wire is uniformly arranged in the accommodating cavity.

The utility model has the advantages that:

the power consumption test of the general MCU under different conditions and different modes is realized. The device can integrate the complex working conditions of the MCU, and the upper computer selects different working conditions and modes to measure the corresponding chip power consumption. The scheme ensures the integrity of the test and reduces the complexity and the operation difficulty of the test.

Drawings

FIG. 1 is a schematic block diagram of the MCU power consumption test with variable conditions of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of a temperature control box.

In the figure:

100. an upper computer;

200. a main control MCU;

300. a DPS module;

400. a temperature control box; 410. a box body; 411. a box body; 412. a box cover; 420. a heating unit; 430. a refrigeration unit; 431. a condenser; 432. a compressor; 433. an evaporator; 434. a capillary tube; 435. drying the filter; 436. a refrigerant pipeline; 440. a temperature sensor; 450. a heat-insulating layer; 451. a first insulating layer; 452. a second insulating layer;

500. and MCU to be tested.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.

In order to test MCU consumption under each condition more fast effectively, the utility model provides a changeable MCU consumption test system of condition, see fig. 1, it includes host computer 100, master control MCU200, DPS module 300 and temperature control box 400, wherein:

the upper computer is connected with the main control MCU through a USART;

the DAC of the main control MCU outputs an output voltage VDD to the DPS module, and the ADC of the main control MCU collects the current measured by the DPS module;

the DPS module outputs a voltage VDD in a range of 0 to 5V and supplies power to the MCU to be tested;

the master control MCU is connected with the MCU to be tested through an SWD interface, and the MCU to be tested is positioned in the temperature control box.

The upper computer is connected with a main control MCU500 (also called a main control IC) through USART; a DAC (digital-to-analog converter) carried by the main control MCU outputs an output voltage VDD (voltage source) to a DPS (Distributed Power System) module, and an ADC carried by the main control MCU collects current measured by the DPS module; the DPS module outputs a voltage VDD in a range of 0 to 5V, and provides VDD power for the MCU to be tested; the master control MCU is connected with the MCU to be tested through an SWD interface, programs with different frequencies (such as 72MHz and 48 MHz) and different operation modes (such as Sleep mode, stop mode and Standby mode) can be selected to be downloaded into the MCU to be tested, the MCU to be tested can be selected to operate in an RAM or a FLASH, and an internal crystal oscillator or an external crystal oscillator can also be selected; the MCU to be tested is arranged in a high-low temperature test box with accurately controllable temperature, and the temperature range is minus 40 ℃ to plus 150 ℃.

When the MCU test system works, the upper computer sends a USART instruction to the main control MCU, and the instruction comprises information of the MCU to be tested such as crystal oscillator type, running voltage, running frequency and running mode; after receiving the USART instruction, the master control MCU outputs corresponding voltage to the DPS module, the DPS module provides the running voltage VDD of the MCU to be tested, then downloads a correspondingly configured program into the MCU to be tested through the SWD interface according to configuration information, and controls the MCU to be tested to start running from the RAM or the FLASH; the temperature control box can accurately set the temperature to be tested; and at the moment, the required conditions are set, the master control MCU acquires the measuring voltage output by the DPS module through the ADC and converts the measuring voltage into corresponding current, and the power consumption of the MCU to be measured can be calculated and reported to the upper computer through the USART.

In addition, the temperature range of the temperature control box is-40 ℃ to +150 ℃. So that the temperature can be adjusted in a wider temperature range and the temperature condition of the test is ensured.

It should be further noted that, referring to fig. 2, the temperature-controlled box includes a box body 410, a heating unit 420, a cooling unit 430, a temperature sensor 440, a controller, and an insulating layer 450, wherein:

the refrigerating unit, the heating unit and the temperature sensor are all positioned in the box body and are respectively used for cooling, heating and measuring the temperature in the box body;

the control end of the refrigerating unit, the control end of the heating unit and the signal output end of the temperature sensor are in signal connection with the controller;

the heat-insulating layer is coated outside the box body. After the controller receives the temperature instruction, comparing the actual temperature in the accommodating cavity detected by the temperature detection unit, when the actual temperature is higher than the temperature corresponding to the temperature instruction, it is indicated that the accommodating cavity needs to be cooled, and at the moment, the controller drives the refrigeration unit to work, so that the accommodating cavity is cooled until the actual temperature detected by the temperature detection unit is within a certain range (such as +/-1 ℃) of the temperature corresponding to the temperature instruction, and the refrigeration unit is stopped; when the detected actual temperature is lower than the temperature corresponding to the temperature instruction, the heating unit works until the temperature in the accommodating cavity is heated to a certain range of the temperature corresponding to the temperature instruction, and the heating unit stops. From the above, the temperature detection unit detects in real time, and when the temperature exceeds the actual temperature to be controlled, the heating unit or the refrigerating unit works to respectively execute temperature rise or temperature reduction to complete dynamic adjustment.

In addition, the case includes a case body 411 and a case cover 412, wherein:

an accommodating cavity for accommodating the MCU to be tested and an opening communicated with the accommodating cavity are formed in the box body;

the box cover can be covered on the opening in an opening and closing manner (such as a rotating shaft manner, a push-pull manner, a thread screwing manner and the like);

the insulating layer comprises a first insulating layer 451 wrapping the box body and a second insulating layer 452 wrapping the box cover. The first heat-insulating layer and the second heat-insulating layer can be made of foam or aerogel with good heat-insulating property and the like.

As will be appreciated by those skilled in the art, the refrigeration unit may adopt a refrigeration mode of a refrigerator, and includes a condenser 431, a compressor 432, an evaporator 433, a capillary tube 434 and a dry filter 435, which are connected in sequence by a refrigerant pipe 436 to form a loop, wherein:

the evaporator is positioned in the box body;

the compressor, the condenser, the capillary tube and the dry filter are all located outside the tank body. The temperature reduction at the evaporator position, namely the temperature reduction in the accommodating cavity, is realized through the refrigerant in the refrigerant pipeline. The control end of the compressor is in signal connection with the controller.

And finally, the heating unit is an electric heating wire which is uniformly arranged in the accommodating cavity. Is used for ensuring that all positions in the accommodating cavity can be heated basically and synchronously.

It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicating the directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, unless otherwise explicitly stated or limited in the description of the present invention, the terms "mounted," "connected" and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The terms "comprises," "comprising," or any other similar term are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus.

So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims (6)

1. The utility model provides a changeable MCU power consumption test system of condition which characterized in that, includes host computer, master control MCU, DPS module and temperature control box, wherein:

the upper computer is connected with the main control MCU through a USART;

the DAC of the main control MCU outputs an output voltage VDD to the DPS module, and the ADC of the main control MCU collects the current measured by the DPS module;

the DPS module outputs a voltage VDD in a range of 0 to 5V and supplies power to the MCU to be tested;

the master control MCU is connected with the MCU to be tested through an SWD interface, and the MCU to be tested is positioned in the temperature control box.

2. The MCU power consumption test system with variable conditions of claim 1, wherein the temperature control box has a temperature range of-40 ℃ to +150 ℃.

3. The MCU power consumption test system that condition is variable of claim 2, characterized in that, temperature control box includes box, heating unit, refrigerating unit, temperature sensor, controller and heat preservation, wherein:

the refrigerating unit, the heating unit and the temperature sensor are all positioned in the box body and are respectively used for cooling, heating and measuring the temperature in the box body;

the control end of the refrigerating unit, the control end of the heating unit and the signal output end of the temperature sensor are in signal connection with the controller;

the heat-insulating layer is coated outside the box body.

4. The MCU power consumption test system that condition is variable of claim 3, characterized in that, the box includes box body and case lid, wherein:

an accommodating cavity for accommodating the MCU to be tested and an opening communicated with the accommodating cavity are formed in the box body;

the box cover can be covered on the opening in an opening and closing manner;

the heat-insulating layer comprises a first heat-insulating layer coated outside the box body and a second heat-insulating layer coated outside the box cover.

5. The MCU power consumption test system that condition is variable of claim 4, wherein the refrigeration unit comprises a condenser, a compressor, an evaporator, a capillary tube and a dry filter that are connected in sequence through refrigerant pipelines and form a loop, wherein:

the evaporator is positioned in the box body;

the compressor, the condenser, the capillary tube and the dry filter are all located outside the tank body.

6. The MCU power consumption test system that can change condition of claim 5, wherein the heating unit is a heating wire, and the heating wire is uniformly arranged in the accommodating cavity.

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