CN217695324U - Refrigerating system of cooling suit - Google Patents

Abstract

The utility model discloses a refrigeration system of cooling clothes, which comprises a radiator, a semiconductor refrigeration piece, a cold guide head and a liquid circulation power device, wherein the hot end surface of the semiconductor refrigeration piece is attached to the radiator, and the cold end surface is attached to the cold guide head; the liquid circulation power device comprises a circulating pump, and the cold guide head and the circulating pump are mutually communicated through a refrigeration channel; or the liquid circulation power device comprises a circulating pump and a storage part, the storage part is used for storing liquid media, the circulating pump is arranged outside the storage part, and the storage part, the cold conducting head and the circulating pump are communicated with each other through a refrigeration channel; or, liquid circulation power device includes immersible pump and storage piece, and the immersible pump sets up in the inside of storing the piece, stores the piece and leads cold head and pass through refrigeration passageway intercommunication each other. The refrigerating system of cooling clothes that this scheme provided is favorable to guaranteeing that the circulation of liquid medium is smooth and easy, can effectively avoid the cold volume that semiconductor refrigeration piece produced to scatter and disappear, guarantees that cold volume obtains effective transmission.

Description

Refrigerating system of cooling clothes

Technical Field

The utility model relates to a cooling suit technical field especially relates to a refrigerating system of cooling suit.

Background

In terms of the relationship between the ambient temperature and the thermal balance of the human body, a living environment of 35 ℃ or higher and a production environment of 32 ℃ or higher are generally regarded as high-temperature environments. Under high temperature environment, the physiological functions of human body, especially the functions of thermoregulation, water and salt metabolism, blood circulation, etc. are all changed abnormally. For example, a large amount of perspiration can put a heavy cardiovascular burden. If the high temperature exceeds the tolerance of the human body, the attention is affected slightly, the working efficiency is reduced, heatstroke can be caused seriously, sudden death of people can be caused more seriously, the personal safety of workers is harmed, and unnecessary economic loss is caused.

For outdoor air-conditioning-free environments, especially for people who work continuously in high-temperature environments, such as policemen who perform duty on standing posts in summer hot weather, workers on construction sites working in burning sun, or maintainers who perform related maintenance work at high altitude outdoors, various discomforts caused by high temperature are often overcome to work continuously for a period of time. When the clothes work at high temperature, a person can sweat, sweat is transferred to the surface of the clothes through diffusion and transmission, and partial heat is taken away through sweat evaporation.

In order to solve the above problems, cooling air-conditioning clothes for realizing human body temperature regulation appear in the prior art. The refrigerating main machine of the existing cooling air-conditioning clothes is generally designed in a miniaturized mode in order to achieve the portability and portability of the cooling air-conditioning clothes, the miniaturized refrigerating main machine often lacks consideration of loss of liquid media, and the liquid media possibly carry out micro-permeation or micro-evaporation through pipelines, so that the capacity of circulating liquid media in the refrigerating main body is reduced, circulation is not smooth, and cold transmission is affected.

In addition, because the cooling air-conditioning suit is generally worn on a human body directly, in order to avoid the problem that the weight of the cooling air-conditioning suit is too heavy, which increases the wearing burden of a user, the electrical input power of the refrigeration host machine cannot be designed to be too large, and how to improve the refrigeration effect under the limited electrical input power is the problem to be solved by the existing cooling air-conditioning suit. In cooling air-conditioning clothes in the market, the heat preservation consideration of the cold quantity is neglected by the structure of a refrigeration host machine, and the generated cold quantity is easily dissipated in the surrounding environment, so that the cold quantity is not beneficial to being effectively transferred.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a refrigerating system of a cooling suit, which is beneficial to ensuring the smooth circulation of a liquid medium by adding a liquid circulation power device; in addition, the heat preservation treatment is carried out on the refrigerating system, which is beneficial to avoiding the dissipation of the cold energy generated by the semiconductor refrigerating sheet and ensuring the effective transmission of the cold energy so as to overcome the defects in the prior art.

To achieve the purpose, the utility model adopts the following technical proposal:

a refrigerating system of a cooling garment comprises a radiator, a semiconductor refrigerating sheet, a cold conducting head and a liquid circulation power device, wherein the semiconductor refrigerating sheet comprises a hot end face and a cold end face, the hot end face is attached to the radiator, the cold end face is attached to the cold conducting head, and the cold conducting head is used for containing a liquid medium;

the liquid circulation power device comprises a circulating pump, and the cold conducting head and the circulating pump are communicated with each other through a refrigeration channel; or the liquid circulation power device comprises a circulation pump and a storage part, the storage part is used for storing liquid media, the circulation pump is arranged outside the storage part, and the storage part, the cold conducting head and the circulation pump are communicated with each other through a refrigeration channel; or the liquid circulation power device comprises a submersible pump and a storage part, the submersible pump is arranged in the storage part, and the storage part and the cold guide head are communicated with each other through a refrigeration channel;

the refrigeration system also comprises a first heat preservation piece, and the first heat preservation piece is arranged outside the cold guide head; an avoiding position is formed in the first heat insulation piece and used for installing the semiconductor refrigeration piece.

Furthermore, the refrigeration system also comprises a second heat preservation piece, and the second heat preservation piece is arranged outside the storage piece;

the outer surface of the refrigeration channel is coated with a heat preservation outer layer.

Further, the storage member is any one of a storage box made of a hard material and a storage bag made of a soft material.

Furthermore, the radiator is provided with a plurality of temperature equalizing pipes, the plurality of temperature equalizing pipes are embedded in the surface of the radiator, which is attached to the hot end face of the semiconductor chilling plate, and a heat-conducting medium is contained in the temperature equalizing pipes.

Furthermore, the radiator is provided with a plurality of temperature equalizing pipes which are integrally formed inside the radiator, and heat-conducting media are contained inside the temperature equalizing pipes.

Furthermore, the radiator is provided with a heat dissipation plate and heat dissipation fins, the heat dissipation fins are provided with a plurality of blocks, and the heat dissipation fins are arranged on the surface, far away from the semiconductor refrigeration piece, of the heat dissipation plate at intervals.

Furthermore, the inside of the cold conducting head is provided with a containing cavity for containing a liquid medium, the outside of the cold conducting head is provided with a first interface and a second interface, the first refrigerating channel is communicated with the containing cavity through the first interface, and the other refrigerating channel is communicated with the containing cavity through the second interface.

Furthermore, the refrigeration channel comprises a heat exchange section, the heat exchange section is embedded in the cold conducting head in a stacking mode, and the heat conductivity coefficient of the cold conducting head is larger than that of the heat exchange section.

Furthermore, the semiconductor refrigeration piece comprises a plurality of P-N electric couple pair crystal grains, the P-N electric couple pair crystal grains are arranged in an array, and the working voltage of the P-N electric couple pair crystal grains is 0.07-0.09V.

Furthermore, the refrigeration system further comprises a heat dissipation fan, and the heat dissipation fan is installed on the surface, far away from the semiconductor refrigeration sheet, of the heat radiator.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

1. considering that the liquid medium in the refrigerating channel may be subjected to micro-permeation or micro-evaporation through the pipeline in the long-term circulating work, the capacity of the circulating liquid medium in the refrigerating system is reduced, circulation is not smooth, and cold transmission is affected. Therefore, the refrigeration system is provided with the liquid circulation power device for ensuring the smooth flowing of the liquid medium, and three embodiments are provided, so that the volume of the refrigeration system can be reduced on the premise of ensuring the smooth circulation, and the refrigeration system is convenient to carry and use.

2. The temperature equalizing pipe containing the heat-conducting medium is arranged on the radiator, so that local heat received by the radiator from the semiconductor refrigerating sheet can be diffused to the whole radiator quickly, the integral temperature equalization of the radiator is realized, the defects of low heat transfer coefficient and high transmission thermal resistance caused by the conventional radiator are overcome, the problem of high hot end heat flux density of the semiconductor refrigerating sheet is effectively solved, heat can be transmitted to the periphery quickly under a heat concentration state, the hot end temperature of the semiconductor refrigerating sheet attached to the radiator is reduced, the cold production capacity and the refrigerating coefficient of the semiconductor refrigerating sheet are improved, the efficient production of cold required by a cooling garment is realized, and the use requirements of users are met conveniently.

3. Be provided with first heat preservation piece in the outside of leading the cold head with the cold end direct contact of semiconductor refrigeration piece, can be used to prevent invalid scattering and disappearing of cold volume. The first heat preservation piece is provided with a avoidance position for mounting the semiconductor refrigeration piece, so that the semiconductor refrigeration piece can be prevented from displacing in the moving process of the refrigeration system, and the normal operation of the refrigeration system is ensured; in addition, the cold quantity generated by the cold end of the semiconductor refrigerating piece is transmitted to the cold guide head to the maximum extent, and the cold quantity is prevented from being dissipated from a gap between the semiconductor refrigerating piece and the cold guide head.

Drawings

Fig. 1 is a schematic structural view of a first embodiment of a refrigeration system of a cooling suit of the present invention.

Fig. 2 is a schematic structural view of a second embodiment of the refrigeration system of the cooling suit of the present invention.

Fig. 3 is a schematic structural view of a third embodiment of the refrigeration system of the cooling suit of the present invention.

Fig. 4 is a schematic structural diagram of a heat sink in an embodiment of a refrigeration system of a cooling suit of the present invention.

Fig. 5 is a cross-sectional view of a heat sink in another embodiment of a refrigeration system of a cooling garment of the present invention.

Fig. 6 is a schematic diagram of crystal grain arrangement of semiconductor refrigeration sheets in the refrigeration system of the cooling suit of the present invention.

Wherein: the heat-insulating device comprises a radiator 121, a temperature equalizing pipe 1211, a heat dissipation plate 1212, heat dissipation fins 1213, a semiconductor refrigeration sheet 122, a cold conducting head 123, a first interface 1231, a second interface 1232, a liquid circulation power device, a circulation pump 1241, a submersible pump 1242, a first heat-insulating piece 125, a heat-insulating shell 1251, a heat-insulating plate 1252, a storage piece 126, a first heat-insulating shell 1271, a second heat-insulating shell 1272, a liquid feeding cover 128 and a heat-dissipating fan 129.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The technical scheme provides a refrigerating system of a cooling garment, which comprises a radiator 121, a semiconductor refrigerating sheet 122, a cold conducting head 123 and a liquid circulation power device, wherein the semiconductor refrigerating sheet 122 comprises a hot end surface and a cold end surface, the hot end surface is attached to the radiator 121, the cold end surface is attached to the cold conducting head 123, and the cold conducting head 123 is used for accommodating a liquid medium;

the liquid circulation power device comprises a circulation pump 1241, and the cold conduction head 123 and the circulation pump 1241 are communicated with each other through a refrigeration channel; or, the liquid circulation power device includes a circulation pump 1241 and a storage part 126, the storage part 126 is used for storing liquid medium, the circulation pump 1241 is disposed outside the storage part 126, and the storage part 126, the cold conducting head 123 and the circulation pump 1241 are communicated with each other through a refrigeration channel; alternatively, the liquid circulation power device comprises a submersible pump 1242 and a storage part 126, the submersible pump 1242 is arranged inside the storage part 126, and the storage part 126 and the cold conducting head 123 are communicated with each other through a refrigeration channel;

the refrigeration system further comprises a first heat preservation member 125, wherein the first heat preservation member 125 is arranged outside the cold conducting head 123; the first heat preservation member 125 is provided with an avoiding position for installing the semiconductor refrigeration piece 122.

The refrigerating system of the cooling suit, as shown in fig. 1-6, adopts a semiconductor refrigerating mode to cool the liquid medium of the cooling suit. The semiconductor refrigeration plate 122 is made by using the peltier effect, which is a phenomenon that when direct current passes through a galvanic couple consisting of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration sheet 122 is made of two semiconductor materials to form a hot end and a cold end, and the cold end continuously absorbs heat to realize refrigeration; the hot junction is continuously exothermic, and this technical scheme has saved complicated mechanical refrigeration structure with semiconductor refrigeration piece 122 as the refrigerating plant of cooling accent clothes, can effectively simplify refrigerating system's overall structure and compression refrigerating system's whole volume, is convenient for realize the silence refrigeration, and safe and reliable, convenient and practical, low in manufacturing cost, application scope is wide. Further, the cold end of the semiconductor refrigeration piece 122 is provided with a cold end face, the hot end of the semiconductor refrigeration piece 122 is provided with a hot end face, the cold end face is attached to the cold guide head 123, and the hot end face is attached to the radiator 121, so that the direct and effective conduction of heat and cold is facilitated, and the refrigeration effect of the refrigeration system is convenient to promote.

In consideration of long-term circulation work of the liquid medium, the liquid medium in the refrigeration channel may be subjected to micro-permeation or micro-evaporation through a pipeline (a silicone tube, a rubber tube, and the like), so that the capacity of the circulating liquid medium in the refrigeration system is reduced, circulation is not smooth, and cold transmission is affected. Therefore, the scheme also provides a liquid circulation power device for ensuring the smooth flow of the liquid medium in the refrigerating system.

Specifically, in the first embodiment of the present disclosure, as shown in fig. 1, the liquid circulation power device includes a circulation pump 1241, the cold guide head 123 and the circulation pump 1241 are communicated with each other through the refrigeration passage, and the circulation pump 1241 provides power for flowing the liquid medium, thereby ensuring smooth circulation. In the second embodiment of the present technical solution, as shown in fig. 2, the liquid circulation power device includes a circulation pump 1241 and a storage component 126, and in addition to adding the circulation power provided by the circulation pump 1241 to the liquid medium, the storage component 126 is also added to store the liquid medium, so as to supplement the liquid medium in the refrigeration channel in time, ensure that the refrigeration channel is in a saturated state at any time, and further ensure that the circulation is performed smoothly. In the third embodiment of the present technical solution, as shown in fig. 3, the submersible pump 1242 that can be disposed inside the storage member 126 is used to replace the circulating pump 1241 disposed outside the storage member 126, so that the volume of the refrigeration system can be reduced on the premise of ensuring smooth circulation, and the refrigeration system is convenient to carry about and use.

In addition, the carrier for realizing cold quantity transmission in the scheme is a liquid medium; preferably water, without limitation; therefore, in order to reduce the ineffective dissipation of the cooling capacity and further ensure that the cooling capacity of the semiconductor refrigeration piece 122 is effectively transmitted, the scheme is further provided with a first heat preservation piece 125 outside the cold guide head 123 which is directly contacted with the cold end of the semiconductor refrigeration piece 122, as shown in fig. 1 and 2, for preventing the ineffective dissipation of the cooling capacity. Further, the first heat preservation member 125 is provided with an avoidance position for installing the semiconductor refrigeration piece 122, so that the semiconductor refrigeration piece 122 can be prevented from displacing in the moving process of the refrigeration system, and the normal operation of the refrigeration system is ensured; in addition, the cold energy generated by the cold end of the semiconductor refrigeration piece 122 is transmitted to the cold guide head 123 to the maximum extent, and the cold energy is prevented from being dissipated from a gap between the semiconductor refrigeration piece 122 and the cold guide head 123.

Preferably, first heat preservation 125 includes demountable installation's heat preservation shell 1251 and heated board 1252, the inside of heat preservation shell 1251 is provided with and is used for the installation lead the first mounting groove of cold head 123, heated board 1252's face has been seted up avoid the position.

In an embodiment of the present disclosure, the first thermal insulation member 125 includes a thermal insulation shell 1251 and a thermal insulation plate 1252, which are detachably mounted, so as to facilitate mounting and dismounting of the semiconductor chilling plate 122 and the cold conducting head 123.

Furthermore, the refrigeration system further includes a second thermal insulation member, which is disposed outside the storage member 126;

the outer surface of the refrigeration channel is coated with a heat preservation outer layer.

In the scheme, a second heat preservation part is arranged outside the storage part 126, as shown in fig. 2, and is used for further preventing invalid dissipation of cold. In order to further prevent the loss of cold energy, the scheme is characterized in that a heat-insulating outer layer (not shown in the figure) is further coated on the outer surface of the refrigerating channel, and the heat-insulating outer layer can be made of cloth with a heat-insulating effect or can be formed by foaming the existing foaming material.

Preferably, the second thermal insulation member includes a first thermal insulation housing 1271 and a second thermal insulation housing 1272 having the same structure, the first thermal insulation housing 1271 and the second thermal insulation housing 1272 together define a second mounting groove for mounting the storage member 126, and the first thermal insulation housing 1271 is detachably connected to the second thermal insulation housing 1272.

In another embodiment of the present disclosure, the second thermal insulation member includes a first thermal insulation housing 1271 and a second thermal insulation housing 1272 having the same structure, and the first thermal insulation housing 1271 and the second thermal insulation housing 1272 jointly enclose a second installation groove for installing the storage member 126, so as to facilitate production and assembly.

Further, the storage member 126 is any one of a storage box made of a hard material and a storage bag made of a soft material.

It should be noted that the storage member 126 in this embodiment may be a storage box made of a hard material such as metal, etc., or may be a storage bag made of a soft material such as rubber, plastic, etc., and is not limited herein.

When using the storage bag of making by soft materials, can be through the shape that changes the storage bag and with the air escape in the refrigeration passageway, guarantee to refrigerate only liquid medium in the passageway and circulate, be favorable to guaranteeing that liquid medium's the flow is unobstructed, and the second keeps warm and can also play the guard action to the storage bag to effectively promote refrigerating system's life.

4, the heat sink 121 is further provided with a plurality of temperature equalization tubes 1211, the plurality of temperature equalization tubes 1211 are embedded in a plate surface of the heat sink 121, which is attached to the hot end surface of the semiconductor chilling plate 122, and a heat conducting medium is contained in the temperature equalization tubes 1211.

According to the semiconductor refrigeration theory, the refrigerating capacity Qc of the semiconductor refrigerator 1 is:

Qc＝N(αp-αn)ITc-K(Th-Tc)-0.5I2Ri，

wherein, N, α P, α N, I, K, th, tc, and Ri are the number of P-N couple pairs of the semiconductor chilling plate 122, P-type material seebeck coefficient, N-type material seebeck coefficient, operating current, refrigerator thermal conductance, hot end temperature, cold end temperature, and internal resistance of the semiconductor chilling plate 122, respectively, the chilling coefficient (or called conversion efficiency) is cop = Qc/Pi, and Pi is the electrical input power of the semiconductor chilling plate 122, so it can be seen that the chilling capacity and chilling efficiency of the semiconductor chilling plate 122 are both related to the hot end temperature Th of the semiconductor chilling plate 122, and when other parameters are relatively fixed, the smaller Th, i.e., the lower the hot end temperature of the semiconductor chilling plate 122, the larger the chilling capacity Qc and cop are, the better the chilling effect is. Therefore, one of the solutions to increase the cooling capacity of the cooling system is to lower the hot end temperature Th of the semiconductor cooling plate 122.

Therefore, the present solution is based on the above principle, the temperature equalizing tube 1211 containing the heat conducting medium is disposed on the heat sink 121, which is beneficial to quickly diffuse the local heat received by the heat sink 121 from the semiconductor chilling plate 122 to the whole heat sink 121, so as to equalize the temperature of the whole heat sink 121, overcome the defects of low heat transfer coefficient and large transmission thermal resistance caused by the existing heat sink, effectively solve the problem of large hot end heat flux density of the semiconductor chilling plate 122, and quickly transmit the heat to the periphery in a heat concentration state, thereby reducing the hot end temperature Th of the semiconductor chilling plate 122 attached to the heat sink 121, improving the cold production capacity and the refrigeration coefficient of the semiconductor chilling plate 122, realizing the efficient production of the cold capacity of the refrigeration system, and facilitating the meeting the use requirements of users.

The heat transfer medium in this embodiment may be any one of freon refrigerant, alcohol liquid (e.g., R22, R23, R410A, and R134), liquid carbon dioxide, ethanol, and propanol, but is not limited thereto.

In an embodiment of the present technical solution, a plurality of temperature equalizing tubes 1211 are embedded in the heat sink 121 on a plate surface that is attached to the hot end surface of the semiconductor chilling plate 122, as shown in fig. 4, when the hot end of the semiconductor chilling plate 122 is transferred to the heat sink 121, the heat is firstly transferred to the temperature equalizing tubes 1211, and the heat conducting medium in the temperature equalizing tubes 1211 is beneficial to transferring and dissipating the local heat received by the heat conducting medium to the whole heat sink 121, so that the heat sink 121 achieves temperature equalization.

It should be noted that the number, shape and distribution position of the temperature equalizing tubes 1211 in this embodiment may be set according to actual requirements, and are not limited herein.

Furthermore, the heat sink 121 is provided with a plurality of temperature equalizing tubes 1211, the plurality of temperature equalizing tubes 1211 are integrally formed inside the heat sink 121, and a heat conducting medium is accommodated inside the temperature equalizing tubes 1211.

In another embodiment of the present invention, the plurality of temperature equalizing tubes 1211 are integrally formed inside the heat dissipating plate 1212, as shown in fig. 5, when the hot end of the semiconductor cooling fin 122 is transmitted to the heat sink 121, the heat conducting medium in the temperature equalizing tube 1211 inside the heat sink 121 is beneficial to transmitting and dissipating the local heat received by the heat sink 121 to the whole heat sink 121, and the heat sink 121 can also realize temperature equalization.

It should be noted that, the number, shape and distribution position of the temperature equalizing tubes 1211 in this embodiment may be set according to actual requirements, and are not limited herein.

Furthermore, the heat sink 121 is provided with a heat dissipation plate 1212 and a plurality of heat dissipation fins 1213, the plurality of heat dissipation fins 1213 are arranged at intervals on the surface of the heat dissipation plate 1212, which is away from the semiconductor chilling plate 122.

The heat sink 121 in this embodiment may adopt a combination of a heat dissipating plate 1212 and heat dissipating fins 1213 having fin heat exchanging function, and a plurality of heat dissipating fins 1213 are installed at intervals on the heat dissipating plate 1212 to form a through flow channel to guide air, thereby facilitating to increase the contact area between air and the heat sink 121, and accelerating the heat exchange between the surrounding environment and the heat sink 121, thereby realizing the heat dissipation of the hot end of the semiconductor cooling fins 122.

Furthermore, the inside of the cold conducting head 123 is provided with an accommodating cavity for accommodating a liquid medium, the outside of the cold conducting head 123 is provided with a first interface 1231 and a second interface 1232, one of the refrigeration channels is communicated with the accommodating cavity through the first interface 1231, and the other of the refrigeration channels is communicated with the accommodating cavity through the second interface 1232.

In an embodiment of the present technical solution, the cold conducting head 123 adopts a structure with an accommodating cavity therein, which is beneficial for direct contact between the cold conducting head 123 and the liquid medium, thereby realizing rapid transfer of cold energy to the liquid medium, and facilitating rapid heat exchange between the liquid medium and the cold end of the semiconductor chilling plate 122.

Furthermore, the refrigeration channel comprises heat exchange sections, the heat exchange sections are embedded in the cold conduction head 123 in a stacked manner, and the heat conductivity coefficient of the cold conduction head 123 is greater than that of the heat exchange sections.

In another embodiment of the present disclosure, the cold guiding head 123 adopts a structure (not shown) with a built-in cooling channel, so that the cooling energy is firstly transmitted from the cold end of the semiconductor cooling fin 122 to the cold guiding head 123, then transmitted from the cold guiding head 123 to the heat exchanging section, and finally transmitted from the heat exchanging section to the liquid medium. The cold conducting head 123 with the built-in refrigeration channel can effectively increase the contact area of the liquid medium and the cold quantity, and is convenient for enhancing the cold conducting effect.

Further, the heat conductivity coefficient of the cold guide head 123 is greater than that of the heat exchange section, so that cold can be rapidly transmitted from the cold end of the semiconductor refrigeration piece 122 to the cold guide head 123, and the cold transmission efficiency of the cold end of the semiconductor refrigeration piece 122 can be conveniently improved. It should be noted that the cold conducting head 123 in the present embodiment may be made of a metal material such as aluminum, copper, etc., and is not limited herein.

Specifically, the heat exchange section is made of a metal material, metal pipelines with high thermal conductivity coefficients such as copper and silver can be selected, and the copper pipelines are preferably selected to reduce the cost; the shape of the heat exchange section may be S-shaped or circular in a stacked arrangement, but is not limited to the above shape, and the shape of the heat exchange section may be set to enlarge the contact area between the heat exchange section and the cold guide head 123, thereby enhancing the cold guide effect.

Furthermore, the semiconductor refrigeration plate 122 includes a plurality of P-N electric couple pair grains, and the P-N electric couple pair grains are arranged in an array, and the operating voltage of the P-N electric couple pair grains is 0.07-0.09V.

Aiming at the characteristics of large conduction thermal resistance and small heat dissipation power of the existing radiator, in order to improve the refrigeration efficiency, the semiconductor refrigeration sheet 122 of the scheme adopts multiple P-N couple crystal grains which are arranged in an array manner, as shown in fig. 6, so that the heat flow density is reduced in a large area. And the working voltage of each pair of P-N electric couple crystal grains is preferably 0.07-0.09V, which is beneficial to improving the working efficiency of the semiconductor refrigerating sheet 122.

It should be noted that, the semiconductor refrigeration pieces 122 in this scheme may also be provided with a plurality of, and the cold ends of a plurality of semiconductor refrigeration pieces 122 are attached to the cold guide head 122, which is more favorable for enhancing the refrigeration effect of the refrigeration system.

Furthermore, the refrigeration system further includes a heat dissipation fan 129, and the heat dissipation fan 129 is installed in the heat sink 121 away from the plate surface of the semiconductor cooling plate 122.

In a preferred embodiment of the present technical solution, the refrigeration system further includes a heat dissipation fan 129, and the heat dissipation fan 129 is arranged to effectively accelerate air flow, so as to improve the heat dissipation efficiency of the semiconductor cooling fins 122; the heat dissipation fan 129 in this embodiment may be an axial flow fan or a vortex fan, and is not limited herein.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the directions or positional relationships indicated by the directional terms such as "front, back, upper, lower, left, right", "horizontal, vertical, horizontal" and "top, bottom", etc. are usually based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, and in the case of not making a contrary explanation, these directional terms do not indicate and imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore, should not be construed as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

For ease of description, spatially relative terms such as "over 8230 \ 8230;,"' over 8230;, \8230; upper surface "," above ", etc. may be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary terms "at 8230; \8230; 'above" may include both orientations "at 8230; \8230;' above 8230; 'at 8230;' below 8230;" above ". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and is not to be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. A refrigerating system of cooling clothes which is characterized in that: the refrigeration device comprises a radiator, a semiconductor refrigeration piece, a cold guide head and a liquid circulation power device, wherein the semiconductor refrigeration piece comprises a hot end surface and a cold end surface, the hot end surface is attached to the radiator, the cold end surface is attached to the cold guide head, and the cold guide head is used for accommodating a liquid medium;

the liquid circulation power device comprises a circulating pump, and the cold conducting head and the circulating pump are communicated with each other through a refrigeration channel; or the liquid circulation power device comprises a circulating pump and a storage part, the storage part is used for storing liquid media, the circulating pump is arranged outside the storage part, and the storage part, the cold conduction head and the circulating pump are communicated with each other through a refrigeration channel; or the liquid circulation power device comprises a submersible pump and a storage part, the submersible pump is arranged in the storage part, and the storage part and the cold guide head are communicated with each other through a refrigeration channel;

the refrigeration system also comprises a first heat-insulating piece, and the first heat-insulating piece is arranged outside the cold guide head; the first heat preservation piece is provided with a dodging position, and the dodging position is used for installing the semiconductor refrigeration piece.

2. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the storage part is arranged in the storage part, and the storage part is arranged in the storage part;

the outer surface of the refrigeration channel is coated with a heat preservation outer layer.

3. A refrigeration system for a cooling garment as claimed in claim 2, wherein: the storage piece is any one of a storage box or a storage bag, the storage box is made of hard materials, and the storage bag is made of soft materials.

4. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the radiator is provided with a plurality of temperature equalizing pipes, the temperature equalizing pipes are embedded in the radiator and the surface of the semiconductor refrigerating sheet, which is attached to the hot end face of the semiconductor refrigerating sheet, and heat conducting media are contained in the temperature equalizing pipes.

5. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the radiator is equipped with many samming pipes, many samming pipe integrated into one piece in the inside of radiator, just heat-conducting medium has been held in the inside of samming pipe.

6. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the radiator is provided with a heat dissipation plate and a plurality of heat dissipation fins, and the heat dissipation fins are arranged on the heat dissipation plate at intervals and far away from the plate surface of the semiconductor refrigeration piece.

7. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the refrigeration device is characterized in that a containing cavity for containing a liquid medium is formed in the cold conducting head, a first interface and a second interface are arranged outside the cold conducting head, one refrigeration channel is communicated with the containing cavity through the first interface, and the other refrigeration channel is communicated with the containing cavity through the second interface.

8. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the refrigeration channel comprises heat exchange sections, the heat exchange sections are embedded in the cold conduction head in a stacked mode, and the heat conductivity coefficient of the cold conduction head is larger than that of the heat exchange sections.

9. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the semiconductor refrigeration sheet comprises a plurality of P-N electric couple pair crystal grains, the P-N electric couple pair crystal grains are arranged in an array, and the working voltage of the P-N electric couple pair crystal grains is 0.07-0.09V.

10. A refrigeration system for a cooling garment as claimed in claim 1, wherein: the refrigerating system further comprises a heat radiation fan, and the heat radiation fan is installed on the surface, far away from the semiconductor refrigerating sheet, of the radiator.

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