CN217693850U - High-efficient heat dissipation circuit board - Google Patents
High-efficient heat dissipation circuit board Download PDFInfo
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- CN217693850U CN217693850U CN202221478133.6U CN202221478133U CN217693850U CN 217693850 U CN217693850 U CN 217693850U CN 202221478133 U CN202221478133 U CN 202221478133U CN 217693850 U CN217693850 U CN 217693850U
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- circuit board
- arc
- movable block
- elongated slot
- heat dissipation
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Abstract
The utility model provides a high-efficient heat dissipation circuit board relates to circuit board technical field, comprising a main body, the fixed orifices has been seted up on the surface of main part, the chip is equipped with to the upper end of main part, the upper end fixedly connected with of main part props the platform, prop the surface of platform and seted up the elongated slot, the sliding surface of elongated slot is connected with the movable block, the arc cardboard is equipped with to the upper end of movable block, the threaded hole is seted up on the surface of arc cardboard, through setting up main part, fixed orifices, chip, prop platform, elongated slot, movable block, arc cardboard, screw hole and butterfly screw, people utilize the elongated slot this moment, can make the movable block remove along the elongated slot, the arc cardboard then moves along with the movable block, and then will smooth out the connecting wire and place on the cushion, and the cushion can improve the protective effect to the connecting wire surface, then remove two arc cardboards to the laminating to use the butterfly screw to fix, thereby make things convenient for people to arrange in order the inboard connecting wire of arc cardboard, do benefit to in fact the use.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a high-efficient heat dissipation circuit board.
Background
The circuit board is important electronic part, is electronic components electrical connection's carrier and supporter, and the circuit board is according to the in-service use condition, and the quantity of external connection line has on its surface has a lot or a little, when being connected these connecting wires with external equipment, makes the connecting wire too mixed and disorderly or twine together very easily, and the people of not being convenient for arrange in order the connecting wire, is unfavorable for in-service use.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a high-efficiency heat dissipation circuit board.
In order to realize the purpose, the utility model adopts the following technical scheme: the utility model provides a high-efficient heat dissipation circuit board, includes the main part, the fixed orifices has been seted up on the surface of main part, the chip is equipped with to the upper end of main part, the upper end fixedly connected with of main part props the platform, prop the surface of platform and seted up the elongated slot, the surperficial sliding connection of elongated slot has the movable block, the arc cardboard is equipped with to the upper end of movable block, the screw hole has been seted up on the surface of arc cardboard, and wherein a set of the inside of screw hole runs through and is provided with the butterfly screw.
In order to improve the stability when the arc cardboard pastes, the utility model discloses the improvement has, wherein is a set of the slide bar is equipped with admittedly on the surface of arc cardboard, another group the slide opening has been seted up on the surface of arc cardboard.
In order to make the movable block slide in the elongated slot, the utility model discloses the improvement has, the fixed surface of arc cardboard installs the cushion, the width of movable block is less than the width of elongated slot.
In order to improve the protection effect to the connecting wire, the utility model discloses the improvement has, the material of cushion includes but not limited to rubber cotton, the foaming is cotton and design cotton.
In order to with heat conduction to the fin on, the utility model discloses the improvement has, the upper end of chip is provided with complementary unit, complementary unit includes the heat conduction silica gel piece, the upper end at the chip is adorned to the heat conduction silica gel piece, the upper end fixedly connected with fin of heat conduction silica gel piece.
In order to dispel the heat to the fin, the utility model discloses the improvement has, the upper end fixed mounting of fin has small-size fan, the shape of fin is the O style of calligraphy.
In order to facilitate people to select different radiating fins, the utility model discloses the improvement has, the material of radiating fin includes but not limited to aluminium and copper.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. the utility model discloses in, in the time of practical use, through setting up the main part, the fixed orifices, a chip, prop the platform, the elongated slot, the movable block, the arc cardboard, screw hole and butterfly screw, people utilize the elongated slot this moment, can make the movable block remove along the elongated slot, the arc cardboard is then along with the movable block motion, smooth out the fingers in the same direction as and place on the cushion with the connecting wire after that, the cushion can improve the protection effect to the connecting wire surface, then remove two arc cardboards to the laminating, and use the butterfly screw to fix, thereby make things convenient for people to arrange in order the inboard connecting wire of arc cardboard, do benefit to in-service use.
2. The utility model discloses in, during the in-service use, through setting up complementary unit, the circuit board is when using, and the chip calorific capacity on its surface is great, uses the heat conduction silica gel piece to dispel the heat to the fin with heat conduction this moment on, dispels the heat to the fin by small-size fan again to improve the radiating effect to the chip.
Drawings
Fig. 1 is a top view of the high-efficiency heat dissipation circuit board of the present invention;
fig. 2 is an enlarged view of a position a in fig. 1 of the high-efficiency heat dissipation circuit board of the present invention;
fig. 3 is a top-down exploded view of the high-efficiency heat dissipation circuit board according to the present invention;
fig. 4 is a side view of the utility model provides a high-efficient heat dissipation circuit board.
Illustration of the drawings:
1. a main body; 2. a fixing hole; 3. a chip; 4. supporting a platform; 5. a long groove; 6. a movable block; 7. an arc-shaped clamping plate; 8. a threaded hole; 9. a butterfly screw; 10. a slide bar; 11. a slide hole; 12. a soft cushion; 13. a heat-conducting silica gel sheet; 14. a heat sink; 15. a small fan.
Detailed Description
In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the present invention is not limited to the limitations of the specific embodiments of the present disclosure.
Example one
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high-efficient heat dissipation circuit board, including main part 1, main part 1's surface has seted up fixed orifices 2, chip 3 is equipped with to main part 1's upper end, main part 1's upper end fixedly connected with props platform 4, through be provided with props platform 4 in main part 1's upper end, improve the support effect to arc cardboard 7, prop the surface of platform 4 and seted up elongated slot 5, the surface sliding connection of elongated slot 5 has movable block 6, seted up elongated slot 5 through setting up the surface of propping platform 4, the surface sliding connection who sets up elongated slot 5 has movable block 6 simultaneously, make things convenient for people to slide movable block 6 along the direction of elongated slot 5, adjust the position of arc cardboard 7 with this, arc cardboard 7 is equipped with to the upper end of movable block 6, arc cardboard 7 is equipped with through setting up the upper end of movable block 6, be convenient for people to arrange in order the connecting wire on the circuit board, threaded hole 8 is seted up on the surface of arc cardboard 7, wherein a set of threaded hole 8 inside runs through and is provided with butterfly screw 9, when two sets of arc cardboard 7 are pasted, with this butterfly screw 7 with this arc cardboard restriction between the fixing the arc cardboard 7.
Referring to fig. 1-4, a slide bar 10 is fixedly mounted on a surface of one of the arc-shaped clamping plates 7, a slide hole 11 is formed on a surface of the other of the arc-shaped clamping plates 7, the slide bar 10 is fixedly mounted on a surface of one of the arc-shaped clamping plates 7, and the slide hole 11 is formed on a surface of the other of the arc-shaped clamping plates 7, during the process of attaching the two sets of arc-shaped clamping plates 7, the slide bar 10 slides into the slide hole 11, so that the stability of the two sets of arc-shaped clamping plates 7 during attaching is improved, a cushion 12 is fixedly mounted on the surface of the arc-shaped clamping plate 7, the cushion 12 is fixedly mounted on the surface of the arc-shaped clamping plate 7, so that the protection effect on the surface of the connecting wire can be improved, the width of the movable block 6 is smaller than that of the elongated slot 5, the movable block 6 slides in the elongated slot 5 by setting the width of the movable block 6 to be smaller than that of the elongated slot 5, the cushion 12 includes, but not limited to rubber cotton, foam cotton and fixed cotton, and different sponge are selected to protect the connecting wire.
Example two
Referring to fig. 3, an auxiliary mechanism is disposed at an upper end of the chip 3, the auxiliary mechanism includes a heat conductive silicone sheet 13, the heat conductive silicone sheet 13 is disposed at an upper end of the chip 3, a heat sink 14 is fixedly connected to an upper end of the heat conductive silicone sheet 13, the heat conductive silicone sheet 13 is disposed at an upper end of the chip 3, the heat sink 14 is fixedly connected to an upper end of the heat conductive silicone sheet 13, the heat generated by the chip 3 can be conducted to the heat sink 14 by the heat conductive silicone sheet 13, a small fan 15 is fixedly disposed at an upper end of the heat sink 14, the heat sink 14 is O-shaped, the small fan 15 is fixedly disposed at an upper end of the heat sink 14, the heat sink 14 can dissipate heat from the heat sink 14, the O-shaped heat sink 14 can increase a contact area between an airflow and the heat sink 14, the heat sink 14 is made of aluminum or copper, and the heat sink 14 is made of aluminum or copper.
The working principle is as follows: through setting up main part 1, fixed orifices 2, chip 3, prop up platform 4, elongated slot 5, movable block 6, arc cardboard 7, screw hole 8 and butterfly screw 9, when people connect the connecting wire on the circuit board with external equipment, smooth out the connecting wire this moment, and place it on the cushion 12 of arc cardboard 7, then people remove arc cardboard 7, in the process that arc cardboard 7 removed, movable block 6 slides in arc cardboard 5 along with the motion of arc cardboard 7, until butterfly screw 9 and the threaded hole 8 on another arc cardboard 7 laminate, slide bar 10 then inserts in the slide opening 11 on another arc cardboard 7 simultaneously, at this moment the connecting wire is tentatively fixed between arc cardboard 7, then twist butterfly screw 9 to the screw hole 8 on another arc cardboard 7, at this moment slide bar 10 slides in slide opening 11, after butterfly screw 9 twists into screw hole 8, two arc cardboard 7 are laminated completely at this moment, thereby restrict the connecting wire between arc cardboard 7, be convenient for people arrange in order the connecting wire, through setting up complementary unit, heat-transfer chip 3 on the circuit board is great, use silicon film 13 to carry out heat dissipation to chip 14 again, thereby improve the radiating effect of small-size heat dissipation fan 14.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may use the above-mentioned technical contents to change or modify the equivalent embodiment into equivalent changes and apply to other fields, but any simple modification, equivalent change and modification made to the above embodiments according to the technical matters of the present invention will still fall within the protection scope of the technical solution of the present invention.
Claims (7)
1. The utility model provides a high-efficient heat dissipation circuit board, includes main part (1), its characterized in that: the improved chip packaging structure is characterized in that a fixing hole (2) is formed in the surface of the main body (1), a chip (3) is mounted at the upper end of the main body (1), a supporting table (4) is fixedly connected to the upper end of the main body (1), an elongated slot (5) is formed in the surface of the supporting table (4), a movable block (6) is connected to the surface of the elongated slot (5) in a sliding mode, an arc-shaped clamping plate (7) is mounted at the upper end of the movable block (6), a threaded hole (8) is formed in the surface of the arc-shaped clamping plate (7), and butterfly screws (9) penetrate through the inner portion of the threaded hole (8) in a set.
2. The efficient heat dissipation circuit board of claim 1, wherein: a sliding rod (10) is fixedly arranged on the surface of one group of arc-shaped clamping plates (7), and a sliding hole (11) is formed in the surface of the other group of arc-shaped clamping plates (7).
3. The circuit board of claim 1, wherein: the surface of the arc-shaped clamping plate (7) is fixedly provided with a cushion (12), and the width of the movable block (6) is smaller than that of the long groove (5).
4. The efficient heat dissipation circuit board of claim 3, wherein: the material of the soft cushion (12) includes but is not limited to rubber cotton, foamed cotton and setting cotton.
5. The circuit board of claim 1, wherein: the upper end of chip (3) is provided with complementary unit, complementary unit includes heat conduction silica gel piece (13), the upper end at chip (3) is adorned to heat conduction silica gel piece (13), the upper end fixedly connected with fin (14) of heat conduction silica gel piece (13).
6. The efficient heat dissipation circuit board of claim 5, wherein: the upper end of the radiating fin (14) is fixedly provided with a small fan (15), and the radiating fin (14) is O-shaped.
7. The efficient heat dissipation circuit board of claim 5, wherein: the material of the heat sink (14) includes, but is not limited to, aluminum and copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221478133.6U CN217693850U (en) | 2022-06-14 | 2022-06-14 | High-efficient heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221478133.6U CN217693850U (en) | 2022-06-14 | 2022-06-14 | High-efficient heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693850U true CN217693850U (en) | 2022-10-28 |
Family
ID=83708984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221478133.6U Active CN217693850U (en) | 2022-06-14 | 2022-06-14 | High-efficient heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693850U (en) |
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2022
- 2022-06-14 CN CN202221478133.6U patent/CN217693850U/en active Active
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