CN217690119U - Quantum computer heat abstractor, quantum system and quantum computer of observing and controling - Google Patents
Quantum computer heat abstractor, quantum system and quantum computer of observing and controling Download PDFInfo
- Publication number
- CN217690119U CN217690119U CN202221655811.1U CN202221655811U CN217690119U CN 217690119 U CN217690119 U CN 217690119U CN 202221655811 U CN202221655811 U CN 202221655811U CN 217690119 U CN217690119 U CN 217690119U
- Authority
- CN
- China
- Prior art keywords
- quantum
- heat
- heat dissipation
- connecting piece
- wire accommodating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses quantum computer heat abstractor, quantum system and quantum computer of observing and controling, quantum computer heat abstractor includes: a first heat sink, a connector, and a second heat sink; a plurality of first wire accommodating holes are formed in the first radiating piece in the direction parallel to the connecting piece, and a first quantum measurement and control line passes through the first wire accommodating holes; the connector is positioned below the first heat dissipation element and used for connecting the first heat dissipation element and the second heat dissipation element; the second heat dissipation part is located below the connecting piece, a plurality of second accommodating wire holes are formed in the second heat dissipation part in a direction parallel to the connecting piece, and the first quantum measurement and control circuit penetrates through the second accommodating wire holes and penetrates out of the first accommodating wire holes. The quantum computer heat abstractor that this application provided can let circuit and refrigeration dish carry out abundant heat exchange, provides its required extremely low temperature environment for the quantum chip to improve the precision that the qubit was controlled and was read.
Description
Technical Field
The application belongs to the field of quantum computing, particularly relates to the field of quantum measurement and control systems, and particularly relates to a quantum computer heat dissipation device, a quantum measurement and control system and a quantum computer.
Background
The quantum computation is a novel computation mode for regulating and controlling basic information units to perform computation according to the quantum mechanics law. The basic information unit of the classical calculation is a classical bit, the basic information unit of the quantum calculation is a qubit, the classical bit can only be in one state, namely 0 or 1, and based on the superposition principle of quantum mechanical states, the state of the qubit can be in a superposition state with multiple possibilities, so that the computational efficiency of the quantum calculation far exceeds that of the classical calculation.
In a quantum computer, a quantum chip can exert excellent performance only under the work of extremely low temperature, and if the working environment temperature of the quantum chip is too high, the evolution of the quantum state of the quantum chip is very difficult to control, so that the problems of quantum bit control, reading precision deviation and the like can be caused. In the existing quantum computer, a signal source is positioned outside a dilution refrigerator, and various quantum measurement and control signals generated by the signal source penetrate through the dilution refrigerator through a signal transmission line and are connected with a quantum chip, so that the quantum computing process is realized. In the prior art, the signal transmission line directly passes through the refrigeration disk of the dilution refrigerator, and the contact area of the signal transmission line and the refrigeration disk is very small, so that the signal transmission line and the refrigeration disk of the dilution refrigerator cannot perform sufficient heat exchange, heat generated by the signal transmission line is dissipated to a working area of the quantum chip, the temperature of the working environment of the quantum chip is increased, and the working performance of the quantum chip is influenced. With the expansion of quantum bit number in a quantum computer in the future, more lines for transmitting signals need to be added to regulate and control the quantum chip, and heat generated by the lines damages a very low temperature working environment required by the working of the quantum chip, so that the precision of quantum bit control and reading is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a quantum heat abstractor, quantum system and quantum computer of observing and controling is observed and controled to solve not enough among the prior art, it can make the quantum observe and control the circuit and carry out abundant heat exchange with the refrigeration dish, avoid the quantum to observe and control the heat dissipation that the circuit produced to quantum chip department, provide its required extremely low temperature environment for quantum chip, furthest reduces the influence of thermal noise to quantum chip, thereby improve the precision that quantum bit was controlled and was read, effectively improve the fidelity of bit.
In order to achieve the above object, in a first aspect, the present invention provides a quantum computer heat sink, located inside the dilution refrigerator, and connected with the refrigeration tray of the dilution refrigerator, which is characterized in that, including: a first heat sink, a connector, and a second heat sink;
a plurality of first wire accommodating holes are formed in the first radiating piece in the direction parallel to the connecting piece, and a first quantum measurement and control line passes through the first wire accommodating holes;
the connector is positioned below the first heat dissipation element and used for connecting the first heat dissipation element and the second heat dissipation element;
the second heat dissipation part is located below the connecting piece, a plurality of second containing wire holes are formed in the direction, parallel to the connecting piece, of the second heat dissipation part, and the first quantum measurement and control circuit penetrates through the second containing wire holes and penetrates out of the first containing wire holes.
Optionally, the first heat dissipation element includes a first heat dissipation element and a first mounting body;
the first heat radiator is positioned above the connecting piece and is fixedly connected with the connecting piece, and one surface of the first heat radiator, which is far away from the connecting piece, is provided with a plurality of first wire accommodating grooves;
the first installation body is located above the first radiator and fixedly connected with the first radiator, and the first installation body and the first wire accommodating groove on the first radiator form the first wire accommodating hole.
Optionally, one surface of the first heat sink, which is close to the connecting piece, is provided with a plurality of third line accommodating grooves, the connecting piece and the third line accommodating grooves on the first heat sink form third line accommodating holes, and the third line accommodating holes allow the first quantum measurement and control line to pass through.
Optionally, the second heat dissipation element includes a second heat dissipation element and a plurality of second mounting elements;
the second heat radiation body is positioned below the connecting piece and is fixedly connected with the connecting piece, and a plurality of second wire accommodating grooves are formed in the second heat radiation body;
the second installation body is located on one side close to the second wire accommodating groove and fixedly connected with the second radiator, and the second installation body and the second wire accommodating groove on the second radiator form the second wire accommodating hole.
Optionally, the number of the second heat dissipation elements is multiple.
Optionally, at least two third heat dissipation elements are further included;
at least two the third heat dissipation piece is located respectively the both sides of first heat dissipation piece, and with connecting piece fixed connection, the third heat dissipation piece is in the perpendicular to a plurality of fourth line containing grooves have been seted up in the direction of connecting piece, fourth line containing groove supplies the second quantum to observe and control the circuit and pass.
Optionally, a fourth heat dissipation member is further included;
the fourth heat dissipation part is located the top of third heat dissipation part, and with third heat dissipation part fixed connection, the fourth heat dissipation part is in a parallel with a plurality of fourth appearance line holes have been seted up in the direction of connecting piece, the fourth supplies to hold the line hole first quantum is observed and controled the circuit and is passed.
Optionally, the fourth heat sink includes a fourth heat sink and a plurality of fourth mounting bodies;
the fourth heat radiating body is positioned above the third heat radiating piece and is fixedly connected with the third heat radiating piece, and a plurality of fifth wire accommodating grooves are formed in the fourth heat radiating body;
the fourth mounting body is positioned on one side close to the fifth wire accommodating groove and is fixedly connected with the fourth heat radiating body, and the fourth mounting body and the fifth wire accommodating groove on the fourth heat radiating body form the fourth wire accommodating hole.
A second aspect, the utility model provides a quantum measurement and control system, include the utility model discloses the first aspect provides quantum computer heat abstractor.
The third aspect of the present invention provides a quantum computer, including the second aspect of the present invention provides a quantum measurement and control system and a quantum chip.
Compared with the prior art, the quantum computer heat abstractor that this application provided is located inside dilution refrigerator refrigeration dish, and is connected with dilution refrigerator's refrigeration dish, includes: a first heat sink, a connector, and a second heat sink; a plurality of first wire accommodating holes are formed in the first radiating piece in a direction parallel to the connecting piece, and a first quantum measurement and control line passes through the first wire accommodating holes; the connector is positioned below the first heat dissipation element and used for connecting the first heat dissipation element and the second heat dissipation element; the second heat dissipation part is located below the connecting piece, a plurality of second containing wire holes are formed in the direction, parallel to the connecting piece, of the second heat dissipation part, and the first quantum measurement and control circuit penetrates through the second containing wire holes and penetrates out of the first containing wire holes. The application provides a quantum computer heat abstractor is through setting up first radiating piece and second radiating piece, and set up a plurality of first appearance line holes that supply first quantum to observe and control the circuit and pass on first radiating piece and set up the second appearance line hole that supplies the first quantum that wears out from first appearance line hole and observe and control the circuit and pass on the second radiating piece, increase the area of first quantum and observe and control the circuit and contact with quantum computer heat abstractor, make the heat that the circuit produced can be through abundant transmission to the refrigeration dish of quantum computer heat abstractor, thereby carry out abundant heat exchange process, the heat loss that avoids the circuit to produce is to quantum chip department, provide its required extreme low temperature environment for quantum chip, furthest reduces the influence of thermal noise to quantum chip, thereby improve the precision that quantum bit was controlled and was read, effectively improve the fidelity of bit.
The quantum measurement and control system and the quantum computer adopt the quantum computer heat dissipation device, and therefore have the same beneficial effects as the quantum computer heat dissipation device.
Drawings
Fig. 1 is a schematic structural diagram of a quantum computer heat dissipation device according to an embodiment of the present disclosure;
fig. 2 is an exploded view of a quantum computer heat dissipation device according to an embodiment of the present disclosure;
fig. 3 is a schematic partial structural diagram of a quantum computer heat dissipation device according to an embodiment of the present disclosure;
fig. 4 is an exploded schematic view of a second heat dissipation element of a quantum computer heat dissipation device according to an embodiment of the present application;
fig. 5 is an exploded view of a fourth heat dissipation component of a quantum computer heat dissipation device according to an embodiment of the present disclosure.
Description of reference numerals:
1-a first heat sink; 11-a first wire holding hole; 12-a first heat sink; 121-a first wire accommodating groove; 122-a second wire-receiving slot; 13-a first mounting body;
2-a connector; 21-a fifth wire holding hole;
3-a second heat sink; 31-a second wire holding hole; 32-a second heat sink; 321-a second wire accommodating groove; 33-a second mounting body;
4-a third heat sink; 41-a fourth wire accommodating groove;
5-a fourth heat sink; 51-a fourth wire holding hole; 52-a fourth heat sink; 521-a fifth wire accommodating groove; 53-fourth mount.
Detailed Description
The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
The following detailed description is merely illustrative and is not intended to limit the embodiments and/or the application or uses of the embodiments. Furthermore, there is no intention to be bound by any expressed or implied information presented in the preceding "background" or "application summary" sections or "detailed description" sections.
To further clarify the objects, aspects and advantages of embodiments of the present application, one or more embodiments are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of one or more embodiments. It may be evident, however, that one or more embodiments may be practiced without these specific details in various instances, and that the various embodiments are incorporated by reference into each other without departing from the scope of the present disclosure.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In a quantum computer, a quantum chip can exert excellent performance only under the working of extremely low temperature, and if the working environment temperature of the quantum chip is too high, the evolution of the quantum state of the quantum chip is very difficult to control. In the existing quantum computer, a signal source is positioned outside a dilution refrigerator, and various quantum measurement and control signals generated by the signal source penetrate through the dilution refrigerator through a signal transmission line and are connected with a quantum chip, so that the quantum computing process is realized. In prior art, signal transmission line directly passes from the refrigeration dish of dilution refrigerator, and signal transmission line is very little with the area of contact of refrigeration dish, consequently, signal transmission line can't carry out abundant heat exchange with the refrigeration dish of dilution refrigerator to cause the heat loss that signal transmission line produced to quantum chip's workspace, cause the temperature of quantum chip operational environment department to rise, thereby influence quantum chip's working property. With the expansion of quantum bit number in a quantum computer in the future, more lines for transmitting signals need to be added to regulate and control the quantum chip, and heat generated by the lines damages a very low temperature working environment required by the working of the quantum chip, so that the precision of quantum bit control and reading is influenced.
In view of this, the embodiment of the present application provides a quantum computer heat dissipation apparatus, which can perform sufficient heat exchange between a quantum measurement and control circuit and a refrigeration disk, prevent heat generated by the quantum measurement and control circuit from dissipating to a quantum chip, provide a very low temperature environment required by the quantum chip, and reduce the influence of thermal noise on the quantum chip to the maximum extent, thereby improving the precision of quantum bit manipulation and reading and effectively improving the fidelity of bits.
Referring to fig. 1 and 2, the quantum computer heat sink device provided in the present application is located inside a dilution refrigerator, and is connected to a refrigeration disk of the dilution refrigerator, and includes: a first heat sink 1, a connector 2, and a second heat sink 3. A plurality of first line holes 11 of holding are seted up to first radiating piece 1 in the direction that is on a parallel with connecting piece 2, and first line hole 11 of holding supplies a quantum to observe and control the circuit and pass.
The setting of first radiating piece 1 can play and observe and control the circuit for a quantum and carry out radiating effect, and is specific, and a plurality of first appearance line holes 11 have been seted up to first radiating piece 1 in the direction that is on a parallel with connecting piece 2, and first quantum observes and controls the circuit and wears out from first appearance line hole 11. It should be noted that the opening direction of the first wire accommodating hole 11 is parallel to the connecting element 2, and such an arrangement can utilize the heat dissipation effect of the first heat dissipation element 1 to the maximum extent, so that the first quantum measurement and control circuit is in contact with the first heat dissipation element 1 as much as possible, thereby achieving the best heat dissipation effect.
The connector 2 is located below the first heat sink 1, and is used to connect the first heat sink 1 and the second heat sink 3. The arrangement of the connector 2 provides a stable connection of the first heat dissipation element 1 and the second heat dissipation element 3. As a limited embodiment, through holes are formed at corresponding positions of the first heat dissipating member 1, the connector 2, and the second heat dissipating member 3, and the first heat dissipating member 1, the connector 2, and the second heat dissipating member 3 are fixedly connected by passing screws or bolts through the through holes. In some other embodiments, the first heat dissipation element 1, the connector 2, and the second heat dissipation element 3 may also be fixedly connected by gluing or the like, which may be selected according to actual situations and is not specifically limited herein.
As a preferred embodiment, the direction of the second wire accommodating hole 31 formed in the second heat radiating element 3 is consistent with the direction of the first wire accommodating hole 11 formed in the first heat radiating element 1, and when the first quantum measurement and control circuit is installed, the circuit is simpler and more compact to build, the working efficiency is improved, and the situations that the first quantum measurement and control circuit is installed in a messy manner can be avoided.
Different from prior art, the quantum chip heat abstractor that this application embodiment provided is located dilution refrigerator inside, and with dilution refrigerator's refrigeration dish fixed connection, includes: a first heat sink 1, a connector 2, and a second heat sink 3; the first heat radiating element 1 is provided with a plurality of first wire accommodating holes 11 in the direction parallel to the connecting element 2, and the first wire accommodating holes 11 are used for a first quantum measurement and control circuit to pass through; the connecting piece 2 is positioned below the first heat dissipation piece 1 and used for connecting the first heat dissipation piece 1 and the second heat dissipation piece 3; second heat dissipation member 3 is located the below of connecting piece 2, and second heat dissipation member 3 has seted up a plurality of second in the direction that is on a parallel with connecting piece 2 and has held line hole 31, and the second holds line hole 31 and supplies the first quantum of wearing out from first appearance line hole 11 to observe and control the circuit and pass. The application provides a quantum computer heat abstractor is through setting up first radiating piece 1 and second radiating piece 3, and set up a plurality of first quanta of confession and observe and control the first appearance line hole 11 that the circuit passed and set up the second appearance line hole 31 that the first quanta that supplies to wear out from first appearance line hole 11 observed and control the circuit and pass on second radiating piece 3, increase the area that first quanta observed and control the circuit and quantum computer heat abstractor contacted, make the heat that the circuit produced can be through the abundant transmission of quantum computer heat abstractor to the refrigeration dish, thereby carry out abundant heat exchange process, avoid the heat loss that the circuit produced to quantum chip department, provide its required extremely low temperature environment for the quantum chip, furthest reduces the influence of thermal noise to the quantum chip, thereby improve the precision that quantum bit was controlled and was read, effectively improve the fidelity of bit.
As shown in fig. 1 and 3, in the embodiment of the present application, the first heat sink 1 includes a first heat sink 12 and a first mounting body 13; the first heat radiation body 12 is positioned above the connecting piece 2 and is fixedly connected with the connecting piece 2, and one surface of the first heat radiation body 12, which is far away from the connecting piece 2, is provided with a plurality of first wire accommodating grooves 121; the first installation body 13 is located above the first heat sink 12 and is fixedly connected to the first heat sink 12, and the first installation body 13 and the first wire accommodating slot 121 on the first heat sink 12 form a first wire accommodating hole 11.
The first heat dissipation element 1 comprises a first heat dissipation element 12 and a first installation body 13, and one surface, far away from the connecting element 2, of the first heat dissipation element 12 is provided with a plurality of first wire accommodating grooves 121. In actual installation or dismantlement in-process, place first quantum observing and controlling the circuit in the first wire containing groove 121 that corresponds, cover first installed part 13 again, can realize the installation of first quantum observing and controlling the circuit, it is more simple and convenient to operate.
It should be noted that, in the installation among the first installation body 13, the first heat dissipation body 12 and the connection member 2, through holes are formed in corresponding positions on the first installation body 13, the first heat dissipation body 12 and the connection member 2, and through the through holes, screws or bolts are passed through to realize the fixed connection of the first installation body 13, the first heat dissipation body 12 and the connection member 2. In some other embodiments, the first mounting body 13, the first heat sink 12 and the connecting element 2 may also be fixedly connected by gluing or the like, and may be selected according to actual situations, which is not specifically limited herein.
In order to dissipate heat of more first quantum measurement and control lines, a plurality of third line accommodating grooves 122 are formed in one surface, close to the connecting piece 2, of the first heat dissipation body 12, third line accommodating holes are formed in the connecting piece 2 and the third line accommodating grooves 122 in the first heat dissipation body 12, and the first quantum measurement and control lines penetrate through the third line accommodating holes. One side of the first heat sink 12 close to the connecting part 2 is provided with a plurality of third line accommodating grooves 122, so that the space on the first heat sink 12 can be fully utilized, more first quantum measurement and control lines can be cooled, and meanwhile, conditions are provided for the expansion of the bit number of the quantum chip.
As shown in fig. 1 and 4, in the embodiment of the present application, the second heat dissipation element 3 includes a second heat dissipation body 32 and a plurality of second mounting bodies 33; the second heat dissipation body 32 is located below the connecting piece 2 and is fixedly connected with the connecting piece 2, and a plurality of second wire accommodating grooves 321 are formed in the second heat dissipation body 32; the second mounting body 33 is located at a side close to the second wire accommodating groove 321 and is fixedly connected with the second heat radiator 32, and the second mounting body 33 and the second wire accommodating groove 321 on the second heat radiator 32 form the second wire accommodating hole 31.
The second heat dissipation member 3 includes a second heat dissipation member 32 and a plurality of second mounting bodies 33, and the second heat dissipation member 32 is provided with a plurality of second wire receiving slots 321. It should be noted that, in order to perform heat dissipation processing on as many first quantum measurement and control lines as possible, second line accommodating grooves 321 are formed in a plurality of surfaces of the second heat radiator 32, and correspondingly, second installation bodies 32 are arranged on one sides close to the second line accommodating grooves 321, so as to form second line accommodating holes 31 through which the first quantum measurement and control lines pass.
In the embodiment of this application, in order to strengthen the inseparable degree of installation of second installation body 33 to first quantum observing and controlling circuit, prevent that first quantum observing and controlling circuit from appearing not hard up phenomenon, multirow through-hole has been seted up on second installation body 33, it is corresponding, multirow through-hole also is seted up to corresponding position on second radiator 32, run through these through-holes through screw or bolt with this realization second installation body 33 and the fixed connection between the second radiator 32, thereby realize the installation to first quantum observing and controlling circuit. Wherein, as a preferred embodiment, multirow through-hole equidistant setting to this further strengthens the fixed effect to first quantum observing and controlling circuit. In some other embodiments, the second mounting body 33 and the second heat radiating body 32 may also be fixedly connected by gluing or the like, which may be selected according to actual situations and is not limited herein.
In order to further utilize the space of the connecting piece 2, the number of the second radiating pieces 3 is multiple, so that more first quantum measurement and control circuits can be subjected to radiating treatment.
Referring to fig. 1 and 3 again, the quantum computer heat dissipation device provided in the present application further includes at least two third heat dissipation elements 4; at least two third radiating pieces 4 are respectively located the both sides of first radiating piece 1, and with connecting piece 2 fixed connection, and a plurality of fourth line containing grooves 41 have been seted up to third radiating piece 4 in the direction of perpendicular to connecting piece 2, and fourth line containing groove 41 supplies the second quantum to observe and control the circuit and pass.
The at least two third heat dissipation elements 4 are respectively located at two sides of the first heat dissipation element 1, so that the space of the connecting element 2 can be more fully utilized. Meanwhile, it is worth to be noted that the plurality of fourth wire accommodating grooves 41 formed in the third heat dissipating element 4 in the direction perpendicular to the connecting element 2 can accommodate a plurality of second quantum measurement and control circuits to pass through, so that the integration level is further improved.
Meanwhile, a fifth wire accommodating hole 21 is formed in the connecting piece 2 corresponding to the fourth wire accommodating groove 41, a second quantum measurement and control line penetrating out of the fourth wire accommodating groove 41 penetrates out of the fifth wire accommodating hole 21 formed in the connecting piece 2, and then is connected with a quantum chip, so that the line building process of the second quantum measurement and control line is achieved.
Referring to fig. 1 and 5, the quantum computer heat sink device provided in the present application further includes a fourth heat sink 5; the fourth heat dissipation part 5 is located above the third heat dissipation part 4 and is fixedly connected with the third heat dissipation part 4, the fourth heat dissipation part 5 is provided with a plurality of fourth wire accommodating holes 51 in the direction parallel to the connecting part 2, and the fourth wire accommodating holes 51 are used for the first quantum measurement and control circuit to pass through.
The fourth heat dissipation part 5 can dissipate more first quantum measurement and control lines, and provides conditions for the expansion of the bit number of the quantum chip. And fourth heat dissipation spare 5 can dismantle and connect in third heat dissipation spare 4, can choose for use according to the actual demand when quantum computer circuit was built, uses more nimble.
Specifically, the fourth heat sink 5 includes a fourth heat sink 52 and a plurality of fourth mounting bodies 53; the fourth heat dissipation body 52 is positioned above the third heat dissipation member 4 and is fixedly connected with the third heat dissipation member 4, and a plurality of fifth wire accommodating grooves 521 are formed in the fourth heat dissipation body 52; the fourth installation body 53 is located at a side close to the fifth wire accommodating groove 521 and is fixedly connected to the fourth heat sink 52, and the fourth installation body 53 and the fifth wire accommodating groove 521 on the fourth heat sink 52 form a fourth wire accommodating hole 51.
The fourth heat sink 5 includes a fourth heat sink 52 and a plurality of fourth mounting bodies 53, and the fourth heat sink 52 is provided with a plurality of fifth wire receiving slots 521. It should be noted that, in order to perform heat dissipation processing on as many first quantum measurement and control lines as possible, fifth line accommodating grooves 521 are formed in a plurality of surfaces of the fourth heat dissipating body 52, and correspondingly, fourth mounting bodies 53 are disposed on one sides close to the fifth line accommodating grooves 521, so as to form fourth line accommodating holes 51 through which the first quantum measurement and control lines pass.
The fourth mounting body 53 and the fourth heat sink 52 can be mounted by forming a through hole in the fourth mounting body 53, forming a through hole in the fourth heat sink 52 at a corresponding position, and fixing the fourth mounting body 53 and the fourth heat sink 52 by inserting a screw or a bolt through the through holes. In some other embodiments, the fourth mounting body 53 and the fourth heat dissipation body 52 may also be fixedly connected by gluing or the like, which may be selected according to actual situations and is not limited herein.
After the fourth mounting body 53 and the fourth heat sink 52 are fixedly mounted, the fourth heat sink 5, the third heat sink 4 and the connector 2 are fixedly connected by forming through holes on the fourth heat sink 52 on the fourth heat sink 5, forming through holes on the third heat sink 4 and the connector 2 at corresponding positions, and penetrating through the through holes by screws or bolts to fixedly connect the fourth heat sink 5, the third heat sink 4 and the connector 2. In some other embodiments, the fourth heat dissipation element 5, the third heat dissipation element 4 and the connection element 2 may also be fixedly connected by gluing or the like, which may be selected according to actual situations and is not specifically limited herein.
To sum up, the utility model provides a quantum chip heat abstractor is located the inside of dilution refrigerator, and is connected with the refrigeration dish of dilution refrigerator, include: a first heat sink 1, a connector 2, and a second heat sink 3; the first heat radiating element 1 is provided with a plurality of first wire accommodating holes 11 in the direction parallel to the connecting element 2, and the first wire accommodating holes 11 are used for a first quantum measurement and control circuit to pass through; the connecting piece 2 is positioned below the first heat radiating piece 1 and is used for connecting the first heat radiating piece 1 and the second heat radiating piece 3; second heat sink 3 is located the below of connecting piece 2, and a plurality of seconds have been seted up in second heat sink 3 in the direction that is on a parallel with connecting piece 2 and have held line hole 31, and the second holds line hole 31 and supplies the first quantum that wears out from first holding line hole 11 to observe and control the circuit and pass. The application provides a quantum computer heat abstractor is through setting up first radiating piece 1 and second radiating piece 3, and set up a plurality of first appearance line holes 11 that supply first quantum to observe and control the circuit and pass on first radiating piece 1 and set up the second appearance line hole 31 that supplies the first quantum of wearing out from first appearance line hole 11 and observe and control the circuit and pass on second radiating piece 3, increase the area of first quantum and observe and control the circuit and contact with quantum computer heat abstractor, make the heat that the circuit produced can be through the abundant transmission of quantum computer heat abstractor to the refrigeration dish, thereby carry out abundant heat exchange process, avoid the heat loss that the circuit produced to quantum chip department, provide its required extremely low temperature operational environment for the quantum chip, furthest reduces the influence of thermal noise to the quantum chip, thereby improve the precision that quantum bit was controlled and was read, effectively improve the fidelity of bit.
The quantum system of observing and controling that this application provided, the quantum chip heat abstractor who adopts this application to provide, consequently possess equally make the quantum observe and control the circuit and carry out abundant heat exchange with the refrigeration dish, the heat loss of avoiding the quantum to observe and control the circuit production is to quantum chip department, provide its required extremely low temperature operational environment for quantum chip, furthest reduces the influence of thermal noise to quantum chip, thereby improve the precision that the qubit was controlled and was read, effectively improve the beneficial effect of the fidelity of bit.
The quantum computer that this application provided, the quantum system of observing and controling that adopts this application to put forward, consequently also possess equally and make the quantum observe and control the circuit and carry out abundant heat exchange with the refrigeration dish, avoid the quantum to observe and control the heat loss that the circuit produced to quantum chip department, provide its required extremely low temperature operational environment for quantum chip, furthest reduces the influence of thermal noise to quantum chip, thereby improve the precision that quantum bit was controlled and was read, effectively improve the beneficial effect of the fidelity of bit.
The present invention has been described in detail with reference to the embodiments shown in the drawings, and it is therefore intended that the present invention not be limited to the exact forms and details shown and described, but that various changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a quantum computer heat abstractor, is located dilution refrigerator inside, and is connected with dilution refrigerator's refrigeration dish, its characterized in that includes: a first heat sink, a connector, and a second heat sink;
a plurality of first wire accommodating holes are formed in the first radiating piece in a direction parallel to the connecting piece, and a first quantum measurement and control line passes through the first wire accommodating holes;
the connecting piece is positioned below the first heat dissipation piece and used for connecting the first heat dissipation piece and the second heat dissipation piece;
the second heat dissipation part is located below the connecting piece, a plurality of second line accommodating holes are formed in the direction parallel to the connecting piece, and the first quantum measurement and control circuit penetrating through the first line accommodating holes penetrates through the second line accommodating holes.
2. The quantum computer heat dissipation device of claim 1, wherein the first heat dissipation member comprises a first heat dissipation body and a first mounting body;
the first heat radiator is positioned above the connecting piece and is fixedly connected with the connecting piece, and one surface of the first heat radiator, which is far away from the connecting piece, is provided with a plurality of first wire accommodating grooves;
the first installation body is located above the first heat radiator and fixedly connected with the first heat radiator, and the first installation body and the first wire accommodating groove on the first heat radiator form the first wire accommodating hole.
3. The quantum computer heat dissipation device of claim 2, wherein a plurality of third line accommodating slots are formed in one surface of the first heat dissipation body, which is close to the connecting piece, the connecting piece and the third line accommodating slots on the first heat dissipation body form third line accommodating holes, and the third line accommodating holes are used for the first quantum measurement and control line to pass through.
4. The quantum computer heat dissipation device of claim 1, wherein the second heat dissipation member comprises a second heat dissipation body and a plurality of second mounting bodies;
the second heat radiation body is positioned below the connecting piece and is fixedly connected with the connecting piece, and a plurality of second wire accommodating grooves are formed in the second heat radiation body;
the second installation body is located on one side close to the second wire accommodating groove and fixedly connected with the second heat radiation body, and the second installation body and the second wire accommodating groove on the second heat radiation body form the second wire accommodating hole.
5. The quantum computer heat sink of claim 1, wherein the second heat sink is plural in number.
6. The quantum computer heat sink of claim 1, further comprising at least two third heat sinks;
at least two the third radiating piece is located respectively the both sides of first radiating piece, and with connecting piece fixed connection, the third radiating piece is in the perpendicular to a plurality of fourth line holding grooves have been seted up in the direction of connecting piece, fourth line holding groove supplies the second quantum to observe and control the circuit and pass.
7. The quantum computer heat sink of claim 6, further comprising a fourth heat sink;
the fourth heat dissipation part is located above the third heat dissipation part and fixedly connected with the third heat dissipation part, a plurality of fourth wire accommodating holes are formed in the direction parallel to the connecting part of the fourth heat dissipation part, and the fourth wire accommodating holes supply the first quantum measurement and control circuit to penetrate through.
8. The quantum computer heat sink of claim 7, wherein the fourth heat sink comprises a fourth heat sink and a plurality of fourth mounts;
the fourth heat radiating body is positioned above the third heat radiating piece and is fixedly connected with the third heat radiating piece, and a plurality of fifth wire accommodating grooves are formed in the fourth heat radiating body;
the fourth mounting body is positioned on one side close to the fifth wire accommodating groove and is fixedly connected with the fourth heat radiating body, and the fourth mounting body and the fifth wire accommodating groove on the fourth heat radiating body form the fourth wire accommodating hole.
9. A quantum measurement and control system comprising the quantum computer heat sink of any one of claims 1-8.
10. A quantum computer comprising a quantum chip and the quantum measurement and control system of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221655811.1U CN217690119U (en) | 2022-06-29 | 2022-06-29 | Quantum computer heat abstractor, quantum system and quantum computer of observing and controling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221655811.1U CN217690119U (en) | 2022-06-29 | 2022-06-29 | Quantum computer heat abstractor, quantum system and quantum computer of observing and controling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217690119U true CN217690119U (en) | 2022-10-28 |
Family
ID=83713233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221655811.1U Active CN217690119U (en) | 2022-06-29 | 2022-06-29 | Quantum computer heat abstractor, quantum system and quantum computer of observing and controling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217690119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116259595A (en) * | 2023-05-16 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
-
2022
- 2022-06-29 CN CN202221655811.1U patent/CN217690119U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116259595A (en) * | 2023-05-16 | 2023-06-13 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
| CN116259595B (en) * | 2023-05-16 | 2023-07-04 | 中诚华隆计算机技术有限公司 | Superconducting quantum computing device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN217690119U (en) | Quantum computer heat abstractor, quantum system and quantum computer of observing and controling | |
| US5181167A (en) | Stacking heatpipe for three dimensional electronic packaging | |
| US9456527B2 (en) | Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly | |
| CN201146658Y (en) | Radiating device for bare element slot | |
| US20080163631A1 (en) | Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold plates | |
| US7295437B2 (en) | Heat dissipation device for multiple heat-generating components | |
| US7420808B2 (en) | Liquid-based cooling system for cooling a multi-component electronics system | |
| US8817469B2 (en) | Heat transfer using a durable low-friction interface | |
| US20170027073A1 (en) | Electronic apparatus | |
| US10042400B2 (en) | Method and system for removing heat from multiple controllers on a circuit board | |
| US20160291652A1 (en) | Refrigerated electronic board for supercomputers and process for producing the same | |
| US10524348B1 (en) | Liquid cooling device | |
| US20150212556A1 (en) | Multi-component shared cooling system | |
| GB2442864A (en) | Hybrid heat exchanger | |
| TWI707628B (en) | Heat dissipation device | |
| US11497145B2 (en) | Server rack and data center including a hybrid-cooled server | |
| US20160262290A1 (en) | Heat sink-based single-board computer holder assembly | |
| US10175731B2 (en) | Shared cooling for thermally connected components in electronic devices | |
| NZ337556A (en) | Cooling electronic component using conductive block with embedded heat pipes | |
| US20150049430A1 (en) | Electronic device | |
| TWM588273U (en) | Machine case structure with matrix guide groove heat dissipation design | |
| CN209911910U (en) | Elastic locking structure of heat radiation module | |
| WO2023043520A1 (en) | Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retention | |
| JPS63289999A (en) | Mounting structure for information processor | |
| CN207731920U (en) | Memory body heat-sink unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |