CN217678220U

CN217678220U - Dehumidifying cabinet

Info

Publication number: CN217678220U
Application number: CN202220808515.4U
Authority: CN
Inventors: 闫磊; 田云; 王佑喜; 曲兆森; 尹洪磊
Original assignee: Qingdao Haier Washing Electric Appliance Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Washing Electric Appliance Co Ltd; Haier Smart Home Co Ltd
Priority date: 2022-04-08
Filing date: 2022-04-08
Publication date: 2022-10-28
Anticipated expiration: 2032-04-08

Abstract

The utility model relates to a dehydrating unit technical field specifically provides a dehumidification cabinet, aims at solving the dehumidification drying efficiency of current dehumidification cabinet low, the noise is big and be difficult to treat the problem that the drying object circulates the dehumidification. Mesh for this reason, the utility model discloses a dehumidification cabinet includes the casing and sets up chamber, semiconductor refrigeration piece and the air duct system that holds in the casing, and the semiconductor refrigeration piece sets up in air duct system, and the two sides of semiconductor refrigeration piece are connected with first fin and second fin respectively, and air duct system with hold the chamber and be linked together to air duct system can form closed loop with holding the chamber, is provided with the fan in the closed loop, and the fan can drive the air and flow at closed loop inner loop. The utility model can effectively condense the water vapor in the air through the arrangement of the first radiating fin and the second radiating fin so as to achieve the dehumidifying and drying effects; the drying efficiency of dehumidification cabinet can further be promoted through the setting of fan.

Description

Dehumidifying cabinet

Technical Field

The utility model relates to a dehydrating unit technical field specifically provides a dehumidification cabinet.

Background

The dehumidification cabinet can carry out the dehumidification stoving with placing clothing or shoes in it, it receives liking of people deeply as household articles, shoes that people wore every day can lead to the humidity along with human heat or sweat volume, if not carry out the dehumidification stoving in time, can go mildy and produce the peculiar smell, influence people's house ambient air quality, can also lead to breeding of bacterium when serious and make people produce beriberi or other health problems, the dehumidification cabinet can be under the condition of guaranteeing not to damage shoes, reach the effect of dehumidification stoving, avoid going mildy and produce the peculiar smell. But current dehumidification cabinet generally adopts the PTC heating plate to carry out direct drying and dehumidification, and this kind of mode is difficult to condensation steam, and drying efficiency is low, leads to treating in the dehumidification cabinet that the dehumidification thing dehumidification is not thorough, can go mildy and give off the peculiar smell, perhaps current dehumidification cabinet adopts heat pump equipment to promote the dehumidification drying efficiency who dehumidifies the cabinet, but the noise that this kind of mode produced is big, brings not good experience for the user, and current dehumidification cabinet is difficult to treat the thing of drying and carries out circulation dehumidification. To sum up, the dehumidification drying efficiency low noise of current dehumidification cabinet is big and is difficult to treat the drying object and circulate the dehumidification, influences user experience.

Accordingly, there is a need in the art for a new dehumidification cabinet that addresses the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving above-mentioned technical problem, promptly, solve dehumidification drying efficiency low, the noise of current dehumidification cabinet and be difficult to treat the problem that the drying object circulates the dehumidification.

The utility model provides a dehumidification cabinet, dehumidification cabinet includes the casing and sets up chamber, semiconductor refrigeration piece and the air duct system that holds in the casing, the semiconductor refrigeration piece sets up in the air duct system, the two sides of semiconductor refrigeration piece are connected with first fin and second fin respectively, the air duct system with it is linked together to hold the chamber, and the air duct system with it can form closed loop to hold the chamber, be provided with the fan in the closed loop, the fan can the driving air be in closed loop inner loop flows.

In the preferable technical scheme of the dehumidification cabinet, the semiconductor refrigeration sheet and the first cooling sheet are connected through a first refrigerant pipe; the semiconductor refrigeration fin and the second cooling fin are connected through a second refrigerant pipe.

In a preferred technical solution of the above dehumidification cabinet, both ends of the first refrigerant pipe are connected to the semiconductor cooling fins, and a part of the first refrigerant pipe is embedded inside the first cooling fins; both ends of the second refrigerant pipe are connected with the semiconductor refrigeration sheet, and part of the second refrigerant pipe is embedded into the second cooling fin.

In the preferred technical scheme of above-mentioned dehumidification cabinet, the air duct system is including the first wind channel, second wind channel, third wind channel, fourth wind channel and the fifth wind channel that set gradually, first wind channel with the fifth wind channel is vertical setting, the second wind channel with the fourth wind channel is the level setting and highly different, the third wind channel is the slope setting in order to connect the second wind channel with the fourth wind channel, the air duct system passes through first wind channel with the fifth wind channel with it is linked together to hold the chamber, first fin setting is in the second wind channel, the second fin setting is in the fourth wind channel.

In a preferred technical solution of the above dehumidification cabinet, a position of the fourth air duct is higher than a position of the second air duct.

In a preferred technical solution of the above-mentioned dehumidification cabinet, the fan is disposed at a connection of the fourth air duct and the fifth air duct.

In the preferable technical scheme of the dehumidification cabinet, a first part of the semiconductor refrigeration piece is embedded in the inner wall of the second air duct close to one side of the containing cavity, and a second part of the semiconductor refrigeration piece is embedded in the inner wall of the fourth air duct far from one side of the containing cavity.

In a preferred embodiment of the above-mentioned dehumidification cabinet, the dehumidification cabinet further comprises a recovery box configured to recover condensed water generated by the first heat sink.

In the preferable technical scheme of the dehumidification cabinet, the recovery box is connected with the shell, a connecting hole is formed in the shell, and a cavity of the recovery box is communicated with the air duct system through the connecting hole.

In the above-mentioned dehumidification cabinet's preferred technical scheme, the dehumidification cabinet still includes the supporter, the supporter sets up hold the intracavity.

Under the condition that adopts above-mentioned technical scheme, the utility model discloses a dehumidification cabinet includes the casing and sets up chamber, semiconductor refrigeration piece and the air duct system that holds in the casing, the semiconductor refrigeration piece sets up in the air duct system, the two sides of semiconductor refrigeration piece are connected with first fin and second fin respectively, the air duct system with hold the chamber and be linked together, and the air duct system with it can form closed loop to hold the chamber, be provided with the fan in the closed loop, the fan can drive the air and be in closed loop inner loop flows. The utility model can condense the water vapor in the air to achieve the effect of dehumidification and drying through the arrangement of the first radiating fin and the second radiating fin; the drying efficiency of the dehumidification cabinet can be further improved through the arrangement of the fan; through the closed loop and the arrangement of the fan, the to-be-dried objects in the containing cavity can be subjected to circulating dehumidification.

Drawings

Preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view of the internal structure of the dehumidifying cabinet of the present invention;

fig. 2 is a schematic structural diagram of the semiconductor refrigeration sheet of the present invention;

reference numerals:

1. a housing; 11. an accommodating chamber; 12. a base; 13. connecting holes; 2. an air duct system; 21. a first air duct; 22. a second air duct; 23. a third air duct; 24. a fourth air duct; 25. a fifth air duct; 3. a semiconductor refrigeration sheet; 31. a first heat sink; 32. a second heat sink; 33. a first refrigerant pipe; 34. a second refrigerant pipe; 4. a fan; 5. a rack; 6. and (6) recovering the box.

Detailed Description

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention. And can be adjusted as needed by those skilled in the art to suit particular applications.

It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "rear", "inner", "far away", "close", etc. are based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, e.g. as a fixed connection or a detachable connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring first to fig. 1, fig. 1 is a schematic diagram of an internal structure of a dehumidification cabinet according to the present invention. As shown in fig. 1, the utility model provides a dehumidification cabinet, dehumidification cabinet include casing 1 and set up hold chamber 11, semiconductor refrigeration piece 3 and duct system 2 in casing 1, and semiconductor refrigeration piece 3 sets up in duct system 2, and the two sides of semiconductor refrigeration piece 3 are connected with first fin 31 and second fin 32 respectively, and duct system 2 with hold chamber 11 and be linked together to duct system 2 can form closed loop with holding chamber 11, be provided with fan 4 in the closed loop, fan 4 can the driving air be in closed loop inner loop flows. It should be noted that the present invention does not limit the specific structure of the housing 1, as long as it can be set to accommodate the cavity 11, the semiconductor refrigeration plate 3 and the air duct system 2, and those skilled in the art can set the configuration by themselves according to the actual use requirement.

Based on above-mentioned structure setting, put the article of waiting to dry in holding chamber 11, fan 4 makes the air at air duct system 2 with hold chamber 11 inner loop flow, the refrigeration face of semiconductor refrigeration piece 3 is connected to first fin 31, the heating face of semiconductor refrigeration piece is connected to second fin 32, first fin 31 refrigerates, second fin 32 heats after-heating air, utilize fan 4 to blow hot-air to the article of waiting to dry who holds in chamber 11, hot-air is treated the article of drying and is dehumidified, later moist air backward flow is to air duct system 2 in, vapor in the air meets the condensation and becomes water when passing through first fin 31, reach the effect of dehumidification, later air after the dehumidification is heated through second fin 32 again, with this realization air inner loop, promote dehumidification effect.

Further, as a preferred setting mode, the air duct system 2 includes a first air duct 21, a second air duct 22, a third air duct 23, a fourth air duct 24 and a fifth air duct 25, which are sequentially arranged, the first air duct 21 and the fifth air duct 25 are vertically arranged, the second air duct 22 and the fourth air duct 24 are horizontally arranged and have different heights, the third air duct 23 is obliquely arranged to connect the second air duct 22 and the fourth air duct 24, the air duct system 2 is communicated with the accommodating cavity 11 through the first air duct 21 and the fifth air duct 25, the first heat sink 31 is arranged in the second air duct, and the second heat sink 32 is arranged in the fourth air duct 24. Specifically, the direction shown in fig. 1 is taken as a reference direction, the first air duct 21 is arranged on the inner wall of the left side of the housing 1 and is vertically arranged, the communication port at the upper end of the first air duct 21 is communicated with the left side of the accommodating cavity 11 at a lower position, the lower end of the first air duct 21 is connected with the second air duct 22, the second air duct 22 is vertically arranged with the first air duct 21 and extends rightward, the third air duct 23 is communicated with the second air duct 22, the third air duct 23 is extended rightward at a certain inclination angle, the fourth air duct 24 is communicated with the third air duct 23, the fourth air duct 24 is parallel to the second air duct 22, the fourth air duct 24 extends rightward, the fifth air duct 25 is communicated with the fourth air duct 24 and is perpendicular to the fifth air duct 24, the fifth air duct 25 extends upward, the communication port at the upper end of the fifth air duct 25 is communicated with the right side of the accommodating cavity 11 at an upper position, and the air duct system 2 and the accommodating cavity 11 can form the closed loop based on the above-mentioned structure.

It should be noted that the present invention does not limit the specific structure and the specific installation position of the air duct system 2, for example, the air duct system 2 only includes one air duct, the air duct is installed in the upper inner wall of the housing 1, and the left and right sides of the air duct are both communicated with the accommodating cavity 11; the air duct system 2 may be a pipeline-shaped structure disposed in the accommodating cavity 11, the pipeline-shaped structure and the accommodating cavity 11 may form a closed loop, and a technician may set the structure according to actual conditions.

Referring to fig. 2, fig. 2 is a schematic structural diagram of the semiconductor cooling plate according to the present invention. As shown in fig. 2, a first portion of the semiconductor chilling plate 3 is embedded in the inner wall of the second air duct 22 close to the accommodating chamber 11, and a second portion of the semiconductor chilling plate 3 is embedded in the inner wall of the fourth air duct 24 far from the accommodating chamber 11. Specifically, with the direction shown in fig. 2 as a reference direction, the right portion of the semiconductor refrigeration sheet 3 is embedded in the inner wall of the housing 1 above the second air duct 22, the left portion of the semiconductor refrigeration sheet 3 is embedded in the inner wall of the housing 1 below the fourth air duct 24, the middle portion of the semiconductor refrigeration sheet 3 is embedded in the inner wall of the housing 1 behind the third air duct 23, and the third air duct 23 is arranged to avoid the semiconductor refrigeration sheet 3 and to connect the second air duct 22 and the fourth air duct 24.

It should be noted that the utility model discloses do not make any restriction to the concrete position that sets up of semiconductor refrigeration piece 3, for example, use the direction shown in fig. 2 as the benchmark direction, the up end in second wind channel 22 is higher than the lower terminal surface in fourth wind channel 24, the left side part of the up end of semiconductor refrigeration piece 3 and the up end in second wind channel 22 link to each other, the right side part of the lower terminal surface of semiconductor refrigeration piece 3 and the lower terminal surface in fourth wind channel 24 link to each other, at this moment, the mid portion of semiconductor refrigeration piece 3 is located third wind channel 23, the technical staff can set for by oneself according to actual conditions.

Further, in the preferred embodiment, the position of the fourth air duct 24 is higher than the position of the second air duct 22, so that the first heat sink 31 and the second heat sink 32 are connected to the cooling surface and the heating surface of the semiconductor cooling plate 3, respectively, and since the air flows from the first air duct 21 to the fifth air duct 25, the position of the fourth air duct 24 is higher than the position of the second air duct 22, the air flows from the second air duct 22 to the fourth air duct 24 through the third air duct 23.

It should be noted that, the utility model discloses do not make any restriction to the height of the specific position that sets up in second wind channel 22 and fourth wind channel 24, for example, when first fin 31 and semiconductor refrigeration piece 3's the face of heating link to each other, second fin 32 and semiconductor refrigeration piece 3's the face of refrigerating link to each other, the position that sets up of second wind channel 22 is higher than the position height that sets up of fourth wind channel 24, the air flow direction is flowing to first wind channel 21 in proper order from fifth wind channel 25 this moment, technical personnel in the art can set for according to actual conditions by oneself.

Further, in the present preferred embodiment, the semiconductor chilling plates 3 and the first cooling fins 31 are connected by the first refrigerant pipe 33; the semiconductor cooling fins 3 and the second cooling fins 32 are connected by second refrigerant pipes 34. The first refrigerant pipe 33 and the second refrigerant pipe 34 are filled with refrigerant, so that the heat transfer rate of the first cooling fin 31, the second cooling fin 32 and the semiconductor cooling fin 3 is increased, and the dehumidification and drying efficiency of the dehumidification cabinet is improved.

Preferably, both ends of the first refrigerant pipe 33 are connected to the semiconductor chilling plates 3, and a portion of the first refrigerant pipe 33 is embedded inside the first cooling fin 31; both ends of the second refrigerant pipe 34 are connected to the semiconductor chilling plates 3, and a portion of the second refrigerant pipe 34 is embedded inside the second heat radiating fin 32. Specifically, with the direction shown in fig. 2 as a reference direction, the first refrigerant pipe 33 includes a first pipe (not shown), a second pipe (not shown), and a third pipe (not shown) that are sequentially communicated with each other, so that the first refrigerant pipe 33 is a U-shaped pipe, the second pipe is entirely embedded in the first heat sink 31, and both ends of the second pipe are connected to the semiconductor chilling plates 3 through the first pipe and the third pipe, respectively; the structure of the second refrigerant tube 34 and the connection with the second fin 32 are the same as those of the first refrigerant tube 33, and thus, the description thereof is omitted. Based on the above structural arrangement, the heat transfer between the semiconductor chilling plate 3 and the first and second

heat dissipation plates

31 and 32 can be further improved.

It should be noted that the present invention does not limit the connection manner between the first refrigerant pipe 33 and the first heat sink 31 and the connection manner between the second refrigerant pipe 34 and the second heat sink 32, and the connection manners may be the same or different, and the first refrigerant pipe 33 is taken as an example, and the second pipe may be connected to the surface of the first heat sink 31; in a possible embodiment, the first refrigerant pipe 33 and the second refrigerant pipe 34 are connected to each other, so that the heat transfer efficiency can be further improved, and the person skilled in the art can set the heat transfer efficiency according to actual situations.

Referring next to fig. 1, as shown in fig. 1, the fan 4 is disposed at the junction of the fourth air duct 24 and the fifth air duct 25. Of course, this is only a preferred arrangement, and the present invention does not set any limit to the specific arrangement position and the specific number of the fans 4, for example, the number of the fans 4 is two, one is set at the communication port of the first air duct 21 and the accommodating chamber 11, which helps the air in the accommodating chamber 11 to enter the first air duct 21 for circulation, and the other is set at the communication port of the fifth air duct 25 and the accommodating chamber 11; the setting position of the fan 4 can meet the requirement of realizing the air circulation flow in the closed loop, and the technical personnel in the field can set the setting position according to the actual situation.

Further, in the present preferred embodiment, the dehumidifying cabinet further includes a recovery box 6, and the recovery box 6 is provided to be able to recover the condensed water generated by the first heat radiating fins 31. Specifically, with the direction shown in fig. 1 as a reference direction, the dehumidification cabinet further comprises a base 12, the base 12 is disposed below the casing 1, the recovery box 6 is disposed in the base 12, the recovery box 6 is connected to the casing 1, a connection hole 13 is disposed on the casing 1, and a cavity of the recovery box 6 is communicated with the air duct system 2 through the connection hole 13.

It should be noted that the present invention does not limit the specific setting position of the recovery box 6, for example, the recovery box 6 is disposed below the first heat sink 31, and a water tank structure (not shown in the figure) is disposed in the base 12, the recovery box 6 discharges the condensed water into the water tank structure through the connection hole 13, and a person skilled in the art can set the setting according to actual conditions.

Further, the dehumidification cabinet still includes supporter 5, and supporter 5 sets up in holding chamber 11, and supporter 5 is owing to place the article of waiting to dry, and supporter 5's setting can make the bottom of waiting to dry the article also can be by fast drying, and then promotes drying efficiency.

It should be noted that the utility model discloses do not do any restriction to waiting to dry article, can dry shoes, also can dry the clothing, the user can decide by oneself.

Dehumidification cabinet can realize circulation dehumidification when promoting dehumidification drying efficiency to can retrieve the comdenstion water that the dehumidification in-process produced, promote user experience and feel.

So far, the technical solution of the present invention has been described with reference to the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, a person skilled in the art can make equivalent changes or substitutions to the related technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. The utility model provides a dehumidification cabinet, its characterized in that, the dehumidification cabinet includes the casing and sets up chamber, semiconductor refrigeration piece and the air duct system that holds in the casing, the semiconductor refrigeration piece sets up in the air duct system, the two sides of semiconductor refrigeration piece are connected with first fin and second fin respectively, the air duct system with hold the chamber and be linked together, and the air duct system with hold the chamber and can form closed loop, be provided with the fan in the closed loop, the fan can drive air and be in closed loop inner loop circulation flows.

2. The dehumidification cabinet of claim 1, wherein the semiconductor chilling plate and the first heat sink are connected by a first refrigerant tube; the semiconductor refrigeration piece and the second cooling piece are connected through a second refrigerant pipe.

3. The dehumidification cabinet according to claim 2, wherein both ends of the first refrigerant pipe are connected to the semiconductor cooling fin, and a portion of the first refrigerant pipe is embedded inside the first cooling fin; both ends of the second refrigerant pipe are connected with the semiconductor refrigeration sheet, and part of the second refrigerant pipe is embedded into the second cooling fin.

4. The dehumidification cabinet according to claim 3, wherein the air duct system comprises a first air duct, a second air duct, a third air duct, a fourth air duct and a fifth air duct, which are sequentially arranged, the first air duct and the fifth air duct are vertically arranged, the second air duct and the fourth air duct are horizontally arranged and have different heights, the third air duct is obliquely arranged to connect the second air duct and the fourth air duct, the air duct system is communicated with the accommodating cavity through the first air duct and the fifth air duct, the first cooling fins are arranged in the second air duct, and the second cooling fins are arranged in the fourth air duct.

5. The dehumidification cabinet according to claim 4, wherein the fourth air duct is disposed at a position higher than that of the second air duct.

6. The dehumidification cabinet of claim 5, wherein the fan is disposed at a junction of the fourth air duct and the fifth air duct.

7. The dehumidification cabinet according to claim 6, wherein a first portion of the semiconductor refrigeration sheet is embedded in an inner wall of the second air duct on a side close to the accommodating cavity, and a second portion of the semiconductor refrigeration sheet is embedded in an inner wall of the fourth air duct on a side far from the accommodating cavity.

8. A dehumidifying cabinet according to any one of claims 1 to 7 further comprising a recovery box provided so as to be able to recover condensed water produced by the first heat dissipating fin.

9. The dehumidification cabinet according to claim 8, wherein the recycling box is connected to the housing, the housing is provided with a connection hole, and a cavity of the recycling box is communicated with the air duct system through the connection hole.

10. A dehumidifying cabinet according to any one of claims 1 to 7 further comprising a shelf disposed within the accommodating chamber.