CN217655245U

CN217655245U - Chip testing mounting plate matched with multi-circuit testing plate

Info

Publication number: CN217655245U
Application number: CN202220820436.5U
Authority: CN
Inventors: 季闯
Original assignee: Suzhou Ydm Precision Machinery Co ltd
Current assignee: Suzhou Ydm Precision Machinery Co ltd
Priority date: 2022-04-11
Filing date: 2022-04-11
Publication date: 2022-10-25
Anticipated expiration: 2032-04-11

Abstract

The utility model discloses a chip testing mounting plate matched with a multi-circuit testing plate, which comprises an insulating plate, four groups of 4.0 guide heads, 8.0 guide heads and a cushion block group, wherein the insulating plate is arranged at the bottom end of a butt joint testing plate; the upper surface of the butt-joint test board is provided with a groove, four test mounting grooves are sequentially formed in the groove, and four corners of each test mounting groove are provided with 4.0 guide head grooves; the utility model has the advantages that: the circuit testing boards are inserted into the 4.0 guide heads and the 8.0 guide heads according to the types respectively, so that the testing is carried out, in the process, the insulating boards are installed on the butt-joint testing boards by utilizing the fixing assemblies to play an insulating effect, and the fixing assemblies are sequentially arranged in each station as shown in the third drawing; after the design is adopted, one chip test mounting plate can be matched with a plurality of circuit boards for testing, higher testing efficiency is achieved, and four groups of fixing pad feet 11 are arranged on the periphery of each station, so that the stability of the device in the testing process is guaranteed.

Description

Chip testing mounting plate matched with multi-circuit testing plate

Technical Field

The utility model relates to a chip test mounting panel, in particular to match chip test mounting panel that multicircuit surveyed board.

Background

With the advance of important measures for new capital construction in China, no monopolized ecology exists in the fields of 5G, artificial intelligence, internet of things, industrial Internet and the like. On the contrary, as related industries just start, china and foreign chip design companies face the challenges of adopting a new architecture and constructing a new ecology on the same starting line of an innovative track; at present, the existing chip test mounting plate can only test a single circuit test board, so that the single circuit test mounting plate has low test efficiency and can not meet the existing requirements; therefore, based on the above problems, we have designed a chip test mounting board matched with a multi-circuit test board to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a match chip test mounting panel that test panel was surveyed to many circuits to at present, the current chip test mounting panel that provides in solving above-mentioned background can only survey test panel to monolithic circuit and test, and is comparatively single like this, makes efficiency of software testing lower, the problem of unsatisfied current demand.

In order to achieve the above object, the utility model provides a following technical scheme: a chip test mounting plate matched with a multi-circuit test plate comprises an insulating plate, four groups of 4.0 guide heads, 8.0 guide heads and a cushion block group, wherein the insulating plate is arranged at the bottom end of a butt joint test plate;

the upper surface of butt joint test panel is equipped with the recess, and the inside of recess is equipped with four test mounting grooves in proper order simultaneously, every the four corners department of test mounting groove all is equipped with 4.0 direction head groove, every group 4.0 direction head's quantity is four, the up end both sides middle part of butt joint test panel all is equipped with 8.0 direction head grooves, 8.0 direction head is equipped with two, the insulation board is through the bottom face of fixed subassembly fixed mounting at the butt joint test panel.

Further, fixed subassembly includes fixed pad foot and M3 screw, fixed pad foot all is equipped with a plurality of with the M3 screw, and every two M3 screws of every fixed pad foot are a set of simultaneously, the mounting hole has all been seted up to the both sides of fixed pad foot.

Furthermore, a plurality of clamping grooves are sequentially formed in the insulating plate, and after the insulating plate is fixedly connected with the butt-joint test board through the fixing assembly, the fixing pad feet are clamped in the clamping grooves.

Furthermore, each group of the 4.0 guide head grooves is symmetrically distributed about the center line of the butt test plate, and two of the 8.0 guide head grooves are symmetrically distributed about the center line of the butt test plate.

Furthermore, all be equipped with the pilot hole in butt joint test panel's upper surface four corners department, every pilot hole's aperture is the same simultaneously.

Further, the backing block group is equipped with eight groups, simultaneously respectively through M3 screw fixed mounting in the middle part recess of butt joint test panel, every the equal parallel and level of upper surface of backing block group.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model relates to a match chip test mounting panel of many circuit test boards, through inserting many circuit test boards on 4.0 direction heads, 8.0 direction heads according to the classification respectively, then test, this process, utilize the fixed subassembly to install the insulation board on the butt joint test board, play insulating effect, and arrange the fixed subassembly as figure 3 in each station in proper order; after the design is adopted, one chip test mounting plate can be matched with a plurality of circuit boards for testing, higher testing efficiency is achieved, and four groups of fixing pad feet 11 are arranged on the periphery of each station, so that the stability of the device in the testing process is guaranteed.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the top connection structure of the present invention;

fig. 3 is a schematic view of the connection structure viewed from the bottom of the present invention.

In the figure: 1. a fixing assembly; 11. fixing the pad feet; 12. an M3 screw; 13. mounting holes; 2. an insulating plate; 21. a card slot; 3. butting the test board; 31. 8.0 guide head slot; 32. testing the mounting groove; 33. 4.0 guide head slot; 34. 4.0 a guide head; 35. a cushion block group; 36. 8.0 a guide head; 37. and (7) assembling holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a chip testing mounting board for matching with a multi-circuit testing board, which comprises an insulating board 2, four groups of 4.0 guiding heads 34, 8.0 guiding heads 36 and a cushion group 35, which are arranged at the bottom end of a butt-joint testing board 3;

the upper surface of butt joint test panel 3 is equipped with the recess, the inside of recess is equipped with four test mounting grooves 32 in proper order simultaneously, the four corners department of every test mounting groove 32 all is equipped with 4.0 guide head groove 33, the quantity of 4.0 guide heads 34 of every group is four, the up end both sides middle part of butt joint test panel 3 all is equipped with 8.0 guide head groove 31,8.0 guide head 36 is equipped with two, insulation board 2 is through the bottom face of fixed subassembly 1 fixed mounting at butt joint test panel 3, during the implementation: insert the polylith circuit test board respectively according to the classification on 4.0 direction head 34, 8.0 direction head 36, test so, this process utilizes fixed subassembly 1 to install insulation board 2 on butt joint test board 3, play insulating effect, and arrange fixed subassembly 1 as figure 3 in proper order at every station, after adopting above-mentioned design, can make a chip test mounting panel match the test of polylith circuit board, realize higher efficiency of software testing, and every station disposes four groups of fixed pad feet 11 all around, thereby guarantee that the test process device is steady.

The fixing assembly 1 comprises fixing pad feet 11 and M3 screws 12, a plurality of fixing pad feet 11 and M3 screws 12 are arranged, each fixing pad foot 11 and each two M3 screws 12 form a group, mounting holes 13 are formed in two sides of each fixing pad foot 11, and the mounting holes 13 and the M3 screws 12 are used for mounting and dismounting the insulating plate 2; a plurality of clamping grooves 21 are sequentially arranged on the insulating plate 2, and after the insulating plate 2 is fixedly connected with the butt-joint test plate 3 through the fixing component 1, the fixing pad feet 11 are clamped in the clamping grooves 21; each group of 4.0 guide head slots 33 is symmetrically distributed about the center line of the butt test plate 3, and the two 8.0 guide head slots 31 are symmetrically distributed about the center line of the butt test plate 3; four corners of the upper surface of the butt-joint test plate 3 are provided with assembling holes 37, the aperture of each assembling hole 37 is the same, and the assembling holes 37 are used for installing equipment; the cushion block group 35 is provided with eight groups, and is respectively fixedly installed in a middle groove of the butt-joint test plate 3 through M3 screws 12, and the upper surface of each cushion block group 35 is flush.

Principle of operation

During assembly: a plurality of groups of test installation grooves 32 are formed in the butt test plate 3, 4.0 guide head grooves 33 are formed in the periphery of each test installation groove 32, 8.0 guide head grooves 31 are formed in the opposite positions of the butt test plate 3, and then four groups of 4.0 guide heads 34 and 8.0 guide heads 36 are inserted into the 4.0 guide head grooves 33 and the 8.0 guide head grooves 31 respectively according to requirements;

when in implementation: a plurality of circuit test boards are respectively inserted into the 4.0 guide heads 34 and the 8.0 guide heads 36 according to the types, then the test is carried out, in the process, the insulating board 2 is installed on the butt joint test board 3 by using the fixing component 1 to play an insulating effect, and the fixing component 1 is sequentially arranged at each station as shown in figure 3;

after the design is adopted, one chip test mounting plate can be matched with a plurality of circuit boards for testing, higher testing efficiency is achieved, and four groups of fixing pad feet 11 are arranged on the periphery of each station, so that the stability of the device in the testing process is guaranteed.

In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

Claims

1. A chip test mounting plate matched with a multi-circuit test plate is characterized by comprising an insulating plate (2) arranged at the bottom end of a butt joint test plate (3), four groups of 4.0 guide heads (34), 8.0 guide heads (36) and a cushion block group (35);

the upper surface of butt joint test board (3) is equipped with the recess, and the inside of recess is equipped with four test mounting groove (32) in proper order simultaneously, every the four corners department of test mounting groove (32) all is equipped with 4.0 direction head groove (33), every group the quantity of 4.0 direction head (34) is four, the up end both sides middle part of butt joint test board (3) all is equipped with 8.0 direction head groove (31), 8.0 direction head (36) are equipped with two, insulation board (2) are through fixed subassembly (1) fixed mounting at the bottom face of butt joint test board (3).

2. The chip test mounting board for a multi-circuit test board according to claim 1, wherein: fixed subassembly (1) is including fixed pad foot (11) and M3 screw (12), fixed pad foot (11) all are equipped with a plurality of with M3 screw (12), and every fixed pad foot (11), per two M3 screws (12) are a set of simultaneously, mounting hole (13) have all been seted up to the both sides of fixed pad foot (11).

3. The chip test mounting board for a multi-circuit test board according to claim 1, wherein: the insulation board (2) is sequentially provided with a plurality of clamping grooves (21), and after the insulation board (2) is fixedly connected with the butt joint test board (3) through the fixing component (1), the fixing pad feet (11) are clamped in the clamping grooves (21).

4. The chip test mounting board for a multi-circuit test board according to claim 1, wherein: each group of the 4.0 guide head grooves (33) is symmetrically distributed about the center line of the butt test plate (3), and the two 8.0 guide head grooves (31) are symmetrically distributed about the center line of the butt test plate (3).

5. The chip test mounting board for matching with a multi-circuit test board as set forth in claim 4, wherein: all be equipped with pilot hole (37) in butt joint test plate's (3) upper surface four corners department, every pilot hole (37) aperture is the same simultaneously.

6. The chip test mounting board for a multi-circuit test board according to claim 1, wherein: the cushion block group (35) is provided with eight groups, and is fixedly installed in a groove in the middle of the butt joint test plate (3) through M3 screws (12) respectively, and the upper surfaces of the cushion block groups (35) are flush.