CN217655240U

CN217655240U - Crystal grain testing device

Info

Publication number: CN217655240U
Application number: CN202221326501.5U
Authority: CN
Inventors: 邱月; 马银芳; 粘为进; 王鑫鑫
Original assignee: Wuxi Meike Microelectronics Technology Co ltd
Current assignee: Wuxi Meike Microelectronics Technology Co ltd
Priority date: 2022-05-30
Filing date: 2022-05-30
Publication date: 2022-10-25
Anticipated expiration: 2032-05-30

Abstract

The embodiment of the application provides a crystal grain testing device, which is characterized in that a crystal grain bearing component is arranged for placing a crystal grain to be tested so as to limit the position of the crystal grain to be tested, and a probe bearing component capable of moving in the limiting direction is arranged for installing a testing probe. Therefore, in the test process, the contact between the test probe and the to-be-tested crystal grain signal contact can be conveniently realized through the relative motion between the probe bearing component and the crystal grain bearing component, so that the test efficiency of a single cut crystal grain is effectively improved.

Description

Crystal grain testing device

Technical Field

The application relates to the technical field of display equipment manufacturing, in particular to a grain testing device.

Background

In the manufacturing process of the display device, in order to ensure the quality of the subsequent product, it is necessary to perform a test after completing the fabrication of the semiconductor die (die). In some testing methods, generally, before the wafer (wafer) is diced, a probe (probe) machine is used to perform an automatic overall inspection on a plurality of dies (die) on the wafer, and the dies that fail the inspection are marked and eliminated after dicing. However, some detection errors of the probe machine may cause some normal dies to be falsely marked as fail, or some dies marked as fail may be damaged during the cutting process. Therefore, in some scenarios, the dice need to be tested again, but the pads or bonding contacts used for transmitting signals on the dice are usually small, and alignment difficulty between the test probes and the die pads or bonding contacts is large, so that test speed is affected, and production efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned deficiencies in the prior art, the present application provides a die testing apparatus, comprising:

the crystal grain bearing assembly comprises a crystal grain positioning workpiece, and the crystal grain positioning workpiece comprises a bearing cavity for placing a single crystal grain to be tested;

the probe bearing assembly comprises a probe installation part and a first supporting part, the probe installation part is used for arranging a test probe, the probe installation part is movably connected with the first supporting part, and the probe installation part can move in the vertical direction along the first supporting part so as to drive the test probe arranged on the probe installation part to be close to or far away from a crystal grain to be tested placed on the crystal grain positioning workpiece;

at least one of the probe bearing component or the crystal grain bearing component further comprises a position adjusting component, and the position adjusting component is used for adjusting the relative position of the probe installation part and the crystal grain positioning workpiece in the horizontal direction so as to change the relative position of the test probe installed on the probe installation part and a crystal grain to be tested placed on the crystal grain positioning workpiece in the horizontal direction.

In a possible implementation manner, the die carrier assembly further includes a second support portion, the die positioning workpiece is movably connected to the second support portion, and the die positioning workpiece can tilt and rotate relative to the second support portion.

In one possible implementation manner, the die carrier assembly further includes a plurality of mobile locking mechanisms, and the plurality of mobile locking mechanisms are respectively used for limiting the movement of the probe installation part or the die positioning workpiece.

In a possible implementation manner, a limiting block is further arranged on the first supporting part and used for limiting the moving distance of the probe installation part towards the crystal grain positioning workpiece.

In a possible realization mode, the unilateral size of the bearing cavity is 0.02 mm-0.03 mm larger than the size of the crystal grain to be tested.

In a possible implementation manner, the die testing apparatus includes a plurality of different probe cards and a plurality of different die positioning workpieces, where different probe cards include a plurality of test probes with different pitches or different arrangement manners, and different die positioning workpieces include the carrying cavities with different sizes.

In a possible implementation manner, the die testing apparatus further includes a data providing component, the data providing component is electrically connected to the probe mounting portion, and the data providing component is configured to provide a test electrical signal to at least a portion of the test probes mounted on the probe mounting portion.

In a possible implementation manner, the die testing apparatus further includes an image acquisition device, the image acquisition device is disposed toward the die positioning workpiece, and the image acquisition device is configured to acquire a working state image of a die to be tested placed on the die positioning workpiece.

In a possible implementation manner, the die testing apparatus further includes an electrical signal detection component, the electrical signal detection component is electrically connected to the probe mounting portion, and the electrical signal detection component is configured to detect a current or voltage value of the wafer to be tested through at least a part of the test probes on the probe mounting portion.

In a possible implementation manner, the die testing apparatus further includes a moving driving component, and the moving driving component is configured to drive the probe mounting portion to move along the first supporting portion under a controlled state.

Compared with the prior art, the method has the following beneficial effects:

according to the crystal grain testing device provided by the embodiment of the application, the crystal grain bearing component is used for placing the crystal grains to be tested so as to limit the positions of the crystal grains to be tested, and the probe bearing component capable of moving in the limited direction is used for installing the testing probes. Therefore, in the testing process, the contact between the testing probe and the signal contact of the crystal grain to be tested can be conveniently realized through the relative movement between the probe bearing component and the crystal grain bearing component, so that the testing efficiency of the single crystal grain after cutting is effectively improved.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a die testing apparatus according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a die carrier assembly according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a probe mounting assembly provided in an embodiment of the present application;

fig. 4 is a circuit block diagram of a die testing apparatus according to an embodiment of the present application.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience of describing the present application and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, fig. 1 is a schematic diagram of a die testing apparatus according to the present embodiment, which may include a die carrier assembly 100 and a probe carrier assembly 200.

Referring to fig. 2, the die carrier assembly 100 may include a die positioning workpiece 110, wherein the die positioning workpiece 110 includes a carrier cavity for placing a single die 800 to be tested. Optionally, the carrying cavity may be a groove with an upward opening, and the shape of the opening may relatively conform to the shape of the die 800 to be tested, and after the die 800 to be tested is placed in the carrying cavity, the lateral wall of the carrying cavity may limit horizontal movement of the die 800 to be tested, so as to ensure that the position of the die 800 to be tested is kept stable during the contact between the test probe and the die 800 to be tested and during the subsequent testing process.

Referring to fig. 3, the probe carrier assembly 200 includes a probe mounting portion 210 and a first supporting portion 220. The probe mounting part 210 is used to set a test probe, for example, to mount a probe card 900 having a plurality of test probes. The probe mounting part 210 is movably connected to the first supporting part 220, and the probe mounting part 210 can move along the first supporting part 220 in the vertical direction to drive a testing probe mounted on the probe mounting part 210 to be close to or far away from a to-be-tested crystal grain 800 of the crystal grain positioning workpiece 110. For example, the first support part 220 may include a guide rail extending in a vertical direction, and the probe mounting part 210 may be movably mounted to the guide rail and may move up and down in a Z-axis direction of fig. 1 along the guide rail.

At least one of the probe carrier assembly 200 or the die carrier assembly 100 further includes a position adjustment assembly for adjusting a relative position of the probe mounting portion 210 and the die positioning workpiece 110 in a horizontal direction, so as to change a relative position of the test probe mounted on the probe mounting portion 210 and a die 800 to be tested placed on the die positioning workpiece 110 in the horizontal direction.

Since the relative positions of the pads or bonding contacts of the dies 800 to be tested may be different for different models, in the testing process, the relative positions of the probe mounting part 210 and the die positioning workpiece 110 in the horizontal direction need to be adjusted first, for example, at least one of the probe mounting part 210 and the die positioning workpiece 110 may be moved along the X-axis direction and the Y-axis direction shown in fig. 1, so that the testing probe mounted on the probe mounting part 210 is located directly above the pad or bonding contact of the die 800 to be tested. Then, the position of the probe mounting portion 210 in the vertical direction is adjusted, so that the test probe approaches the die 800 to be tested until the test probe electrically contacts with the pad or bonding contact of the die 800 to be tested.

Based on the above design, in the die testing apparatus provided in this embodiment, the die carrier assembly 100 is configured to place the die 800 to be tested to define the position of the die 800 to be tested, and the probe carrier assembly 200 movable in a defined direction is configured to mount the test probe. In this way, in the testing process, the contact between the testing probe and the signal contact of the die to be tested can be conveniently realized through the relative movement between the probe bearing component 200 and the die bearing component 100, so that the testing efficiency of a single die after cutting is effectively improved.

In some possible implementations, referring to fig. 2 again, the die carrier assembly 100 may further include a second supporting portion 120, the die positioning component 110 is movably connected to the second supporting portion 120, and the die positioning component 110 can tilt and rotate relative to the second supporting portion 120.

In one possible implementation, a position adjustment component may be provided only in the die carrier assembly 100. That is, the movement of the probe mounting part 210 in the Z-axis direction is restricted, and the movement of the die positioning workpiece 110 in the X-axis and Y-axis directions is restricted, so that the same part can be prevented from moving in an excessive number of directions, and the movement stability of each part can be improved. For example, referring to fig. 2 again, the position adjusting assembly may be disposed on the second supporting portion 120, the position adjusting assembly may include a plurality of position adjusting knobs 121, and the relative positions of the die-positioning workpiece 110 and the second supporting portion 120 in the horizontal direction may be changed by adjusting the position adjusting knobs 121, so as to adjust the relative positions of the probe mounting portions 210 and the die-positioning workpiece 110 in the horizontal direction. Further, one of the position adjusting knobs 121 may also be used to adjust the relative tilt angle of the die-positioning workpiece 110 and the second supporting portion 120.

In one possible implementation, the die-positioning component 110 can also move up and down relative to the second support 120 in the Z-axis direction shown in fig. 1.

In the testing process, it is necessary to make the testing probe effectively electrically contact with the pad or bonding contact of the die 800 to be tested, but the testing probe is generally thin and easily damaged, and it is necessary to control the moving distance and moving force when moving the probe mounting portion 210 toward the die positioning workpiece 110. Therefore, in a possible implementation manner, the die testing apparatus further includes a moving driving component for driving the probe mounting part 210 to move along the first supporting part 220 under a controlled state. Therefore, the contact force between the test probe and the to-be-tested crystal grain 800 can be accurately controlled by setting the moving distance, the moving speed or the moving time of the driving component, and the test probe is prevented from being damaged.

In one possible implementation manner, the die testing apparatus further includes a plurality of mobile locking mechanisms, and the plurality of mobile locking mechanisms are respectively used for limiting the movement of the probe mounting portion 210 or the die positioning workpiece 110. In one example, the die carrier assembly 100 may be provided with a first locking mechanism, where the first locking mechanism is configured to limit movement of the probe mounting portion 210 in the Z-axis direction shown in fig. 1, for example, when the first locking mechanism is in an unlocked state, the probe mounting portion 210 is allowed to move relative to the first supporting portion 220, and when the first locking mechanism is in a locked state, the probe mounting portion 210 may be configured to fix the first supporting portion 220 relative to the current position; the die carrier assembly 100 may be provided with a second locking mechanism, a third locking mechanism and a fourth locking mechanism, the second locking mechanism is configured to limit movement of the die positioning workpiece 110 in the X direction shown in fig. 1, the third locking mechanism is configured to limit movement of the die positioning workpiece 110 in the Y axis direction shown in fig. 1, and the fourth locking mechanism is configured to limit tilting of the die positioning workpiece 110 relative to a horizontal plane.

In a possible implementation manner, a limiting block is further disposed on the first supporting portion 220, and the limiting block is used for limiting a moving distance of the probe installation portion 210 towards the die positioning workpiece 110. In this way, it is avoided that the probe mounting portion 210 is too close to the die-positioning workpiece 110 in the event of an operation error, which may cause damage to the pad or bonding contact to be tested by the test probe.

In one possible implementation, referring to fig. 1 again, the first supporting portion 220 and the first supporting portion 220 may be disposed on an optical platform.

In a possible implementation manner, the unilateral size of the bearing cavity is 0.02mm to 0.03mm larger than the size of the crystal grain 800 to be tested. Therefore, the crystal grains can be taken and placed smoothly, and the influence on repeated positioning precision caused by overlarge gaps is avoided.

In a possible implementation manner, the die testing apparatus includes a plurality of different probe cards 900 and a plurality of different die positioning workpieces 110, the different probe cards 900 include a plurality of test probes with different pitches or different arrangement manners, and the different die positioning workpieces 110 include the carrying cavities with different sizes. Different probe cards 900 can be detachably mounted on the probe mounting portion 210, and different die positioning workpieces 110 can be detachably mounted on the second supporting portion 120, for example, by using detachable connection methods such as screw connection and clamping connection. Thus, when testing the dies 800 to be tested of different models, the probe card 900 with corresponding size can be selected to be mounted on the probe mounting portion 210, and the die positioning workpiece 110 with corresponding size can be selected to be used for placing the dies 800 to be tested.

In one possible implementation manner, referring to fig. 4, the die testing apparatus further includes a data providing component 300, the data providing component 300 is electrically connected to the probe mounting portion 210, and the data providing component 300 is configured to provide a testing electrical signal to at least a portion of the testing probes mounted on the probe mounting portion 210. For example, the probe mounting portion 210 may be provided with a plurality of signal contacts, wherein some of the signal contacts are electrically connected to the data providing assembly 300. When the probe card 900 is mounted on the probe mounting portion 210, the test probes on the probe card 900 are respectively in electrical contact with the plurality of signal contacts, so that the data providing apparatus can provide test electrical signals to the test probes, and the test probes can transmit the test electrical signals to the die 800 to be tested for testing.

In a possible implementation manner, the test electrical signal provided by the data providing apparatus may include a pre-imported test image signal, where the test image signal is used to enable the die 800 to be tested to display a set working state image. The die testing device further comprises an image acquisition device, wherein the image acquisition device is arranged towards the die positioning workpiece 110 and is used for acquiring working state images of a die 800 to be tested, which is placed on the die positioning workpiece 110. For example, the image acquisition device may be an industrial camera with more than 1800 ten thousand pixels, and after acquiring the working state image of the die 800 to be tested, the image acquisition device may display the working state image through a display device and perform manual detection and judgment, or transmit the acquired working state image to other data processing devices to perform automatic judgment, so as to determine whether the die 800 to be tested has a fault.

In a possible implementation manner, the test electrical signal provided by the data providing apparatus may include a working current and voltage provided to the die 800 to be tested, please refer to fig. 4 again, the die testing apparatus further includes an electrical signal detecting component 400, the electrical signal detecting component 400 is electrically connected to the probe mounting portion 210, and the electrical signal detecting component 400 is configured to detect a current or voltage value of the wafer to be tested through at least a portion of the test probes on the probe mounting portion 210. For example, the electrical signal detection component 400 can determine whether the die 800 to be tested has a fault by detecting a current or voltage value of the die 800 to be tested in an operating state.

In summary, the die testing apparatus provided in the embodiment of the present application defines a position of a die to be tested by disposing a die carrying assembly for placing the die to be tested, and disposes a probe carrying assembly movable in a defined direction for mounting a test probe. Therefore, in the testing process, the contact between the testing probe and the signal contact of the crystal grain to be tested can be conveniently realized through the relative movement between the probe bearing component and the crystal grain bearing component, so that the testing efficiency of the single crystal grain after cutting is effectively improved.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The apparatus embodiments described above are merely illustrative, and for example, the flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

In addition, functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

The above description is only for various embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A die testing apparatus, comprising:

2. The die testing apparatus of claim 1, wherein the die carrier assembly further comprises a second support, the die positioning piece being movably connected to the second support, the die positioning piece being tiltable relative to the second support.

3. The die testing apparatus of claim 2, wherein the die carrier assembly further comprises a plurality of moving deadlocking mechanisms for restricting movement of the probe mounting portion or the die positioning workpiece, respectively.

4. The die testing device of claim 1, wherein the first supporting portion is further provided with a limiting block for limiting a distance that the probe mounting portion moves toward the die positioning workpiece.

5. The die testing apparatus of claim 1, wherein the unilateral dimension of the load-bearing cavity is 0.02mm to 0.03mm larger than the dimension of the die to be tested.

6. The die testing apparatus of claim 1, wherein the die testing apparatus comprises a plurality of different probe cards and a plurality of different die positioning workpieces, wherein different probe cards comprise a plurality of test probes with different pitches or different arrangements, and different die positioning workpieces comprise different sized carrier cavities.

7. The die testing device of claim 1, further comprising a data providing component electrically connected to the probe mounting portion, the data providing component for providing test electrical signals to at least a portion of the test probes mounted on the probe mounting portion.

8. The die testing device of claim 7, further comprising an image capturing device disposed toward the die-positioning workpiece, the image capturing device being configured to capture an operating state image of a die to be tested placed on the die-positioning workpiece.

9. The die testing device as claimed in claim 7, further comprising an electrical signal detection component electrically connected to the probe mounting portion, the electrical signal detection component being configured to detect a current or voltage value of a wafer to be tested through at least a portion of the test probes on the probe mounting portion.

10. The die testing apparatus of claim 1, further comprising a movement drive assembly for driving the probe mounting portion to move along the first support portion under a controlled condition.