CN217641227U

CN217641227U - Cushion block structure of contact induction type chip mounter

Info

Publication number: CN217641227U
Application number: CN202221210823.3U
Authority: CN
Inventors: 韩松柏; 潘明东; 张国栋; 张中
Original assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Current assignee: Jiangsu Silicon Integrity Semiconductor Technology Co Ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2022-10-21
Anticipated expiration: 2032-05-18

Abstract

The utility model provides a cushion block structure of a contact induction type chip mounter, which comprises a cushion block body and an adsorption component arranged in a groove of the cushion block body, wherein the adsorption component consists of a series of adsorption blocks, and the upper surface of each adsorption block is provided with a contact type force sensor; when the adsorption block is in the original position, the top surface of the adsorption block is flush with the surface of the cushion block body; the contact type force sensor ascends when not contacting the lead frame or the substrate, and adsorbs the lead frame or the substrate after contacting the lead frame or the substrate and descends to the original position. When the lead frame or the substrate is arched, the contact type force sensor on the adsorption block senses that the contact type force sensor is not in contact with the lead frame or the substrate, the motor pushes the adsorption block upwards until the adsorption block is attached to the lead frame or the substrate and adsorbs the lead frame or the substrate, and the adsorption block move downwards, so that all the adsorption blocks can be adsorbed to the frame to return to the original position, the problem of the arching of the lead frame or the substrate is solved, and thinner packaging products can be produced.

Description

Cushion block structure of contact induction type chip mounter

Technical Field

The utility model relates to a chip, concretely relates to cushion.

Background

In the current semiconductor packaging process, the overall frame is thinned and die is stacked. As shown in fig. 1, the conventional lead frame or substrate is composed of two parts, i.e., a base island 110 and a pin 120. In the chip mounting process in the semiconductor packaging process, a chip is mounted on the fixed area base island 110 of the lead frame according to the position requirement of a drawing, and glue needs to be dispensed on the fixed area base island 110 needing to be fixed in advance in the process. Due to the fact that the thickness of the lead frame or the substrate is small, poor dispensing is caused due to the fact that the lead frame or the substrate is prone to arching in the production process, and the problems of product scrapping and lighting alarm of a chip mounter machine are caused. Because the existing configuration limitation is high, a cushion block special for machine station dispensing and chip loading areas is an integral structure with a vacuum hole 210 on the front surface and a corresponding vacuum air inlet hole 310 on the back surface as shown in fig. 2 and 3, and one cushion block corresponds to one packaging form, when a lead frame or a substrate is used for heating a product, the frame cannot be sucked by the cushion block vacuum hole due to heated arching, so that chip position deviation, PR (positive displacement) unidentified and other problems are caused because the frame cannot be sucked by chip loading.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: the utility model discloses an it is not enough to prior art, provide one kind and avoid can't suck the contact induction type chip mounter cushion structure of frame because of frame deformation cushion.

The technical scheme is as follows: the utility model relates to a cushion block structure of a contact induction type chip mounter, which comprises a cushion block body and an adsorption component arranged in a groove of the cushion block body, wherein the adsorption component consists of a series of adsorption blocks, and the upper surface of each adsorption block is provided with a contact type force sensor;

when the adsorption block is in the original position, the top surface of the adsorption block is flush with the surface of the cushion block body; the contact type force sensor ascends when not contacting the lead frame, and adsorbs the lead frame or the substrate and descends to the original position after contacting the lead frame.

Furthermore, every the top surface of adsorbing the piece all is equipped with the vacuum hole of connecting the vacuum board, the lead frame or base plate are adsorbed to the vacuum hole.

Further, the position of the vacuum hole is positioned on the central line of the cushion block body.

Further, adsorb the piece and still include the motor that is located the absorption piece below of being connected with contact type force transducer, the motor is connected and is adsorbed the fixed slider of piece, and control slider goes up and down.

Further, the adsorption blocks are arranged in one or more columns in sequence.

Furthermore, the width of the adsorption block is smaller than 7mm, and the height of the adsorption block is smaller than that of the cushion block body.

Further, the bottom surface of cushion body is equipped with the unable adjustment base who is connected with chip mounter board track, unable adjustment base is the buckle formula.

Has the advantages that: compared with the prior art, the utility model has the advantages of:

1. when the lead frame or the substrate is arched, the contact type force sensor on the adsorption block senses that the contact type force sensor is not in contact with the lead frame or the substrate, the motor pushes the adsorption block upwards until the adsorption block is attached to the lead frame or the substrate and adsorbs the lead frame or the substrate, and the adsorption block move downwards, so that all the adsorption blocks can be adsorbed to the frame to return to the original position, the problem of the arching of the lead frame or the substrate is solved, and thinner packaging products can be produced;

2. the production line operation efficiency can be improved, the problems that the position of a chip is deviated and PR is not known and production cannot be realized due to supply in the process are solved, the machine alarm is reduced, and the UPH of a machine is improved;

3. the method aims at the problem that the lead frame or the substrate is deformed due to multiple times of baking of the QFN/DFN/SOP/SOT framework series and substrate series laminated die products.

Drawings

Fig. 1 is a schematic structural diagram of a conventional lead frame or substrate in the background art;

FIG. 2 is a schematic front view of a prior art spacer;

FIG. 3 is a schematic rear view of a prior art spacer;

FIG. 4 is a schematic view of the cushion block structure of the present invention;

FIG. 5 is a schematic diagram of a stand-alone single adsorbent assembly;

FIG. 6 is a schematic view of a motor under the suction block;

FIG. 7 is a schematic view of the operation of the adsorption assembly in the spacer during operation;

FIG. 8 is a schematic view of the back of the pad body.

Detailed Description

The technical solution of the present invention is described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the embodiments.

As shown in fig. 4, a pad structure of a contact induction type chip mounter includes a pad body and an adsorption component disposed in a groove of the pad body, where the adsorption component is composed of a row of adsorption blocks 420. A contact type force sensor 421 is provided on the upper surface of the suction block 420, and when the dielectric member 421 is deformed by an external force in a predetermined direction, a polarization phenomenon is generated inside the dielectric member.

In addition, as shown in fig. 5, each suction block 420 is provided with a vacuum hole 410 connected to a vacuum machine, and the opening position of the vacuum hole 410 is located on the center line of the pad body. The lead frame or substrate is a rectangular thin metal layer with an area slightly smaller than the pad, and the vacuum holes 410 are used for adsorbing the lead frame or substrate.

As shown in fig. 6, each suction block 420 further includes a motor 430 located below the suction block 420, and the motor 430 is connected to the suction block 420 through a slider 440. When the contact force sensor 421 on the upper surface of the adsorption block 420 contacts the back surface of the frame, the vacuum is released to adsorb the frame, and the motor 430 controls the adsorption block 420 to lift through the slider 440, so as to drive the frame to return to the original position.

During specific work, as shown in fig. 7, a lead frame or a substrate is placed on a cushion block to be heated at an original point a on the surface of the cushion block, during the work process, the frame is partially separated from the adsorption of the cushion block due to the deformation and arching of the frame, the motor 430 controls the sliding block 440 to ascend until the adsorption block 420 is attached to a point B on the back of the frame under the condition that the contact type force sensor 421 on the adsorption block 420 senses that the frame is not attached to the surface of the adsorption block 420, the vacuum C is automatically released, and the motor 430 controls the sliding block 440 to descend and return to the point a after the frame is sucked; each adsorption block 420 acts independently, a plurality of adsorption blocks 420 are combined, and after all the contact type force sensors 421 on all the adsorption blocks 420 return to the position A, the machine platform starts to produce, namely, the frame separated from the cushion block can be reset.

The width of the cushion block is usually 70-75mm, and the height is about 7.5 mm. The width of the adsorption block 420 is less than 7mm, and the height of the adsorption block 420 is less than that of the cushion block. The number of the adsorption blocks 420 is at least 10, and the number is too small, which is not beneficial to adsorbing the suspended frame back to the original position.

Referring to fig. 8, a fixing base 710 connected to a track of a mounter is disposed on a bottom surface of the pad body, and the fixing base 710 is of a snap-in type.

As mentioned above, although the present invention has been shown and described with reference to certain preferred embodiments, it should not be construed as limiting the invention itself. Various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a contact induction type chip mounter cushion structure which characterized in that: the adsorption device comprises a cushion block body and an adsorption component arranged in a groove of the cushion block body, wherein the adsorption component consists of a series of adsorption blocks, and the upper surface of each adsorption block is provided with a contact type force sensor;

when the adsorption block is in the original position, the top surface of the adsorption block is flush with the surface of the cushion block body; the contact type force sensor ascends when not contacting the lead frame or the substrate, and adsorbs the lead frame or the substrate after contacting the lead frame or the substrate and descends to the original position.

2. The pad structure of a contact induction type die bonder as claimed in claim 1, wherein: every the top surface of adsorbing the piece all is equipped with the vacuum hole of connecting the vacuum board, the vacuum hole adsorbs lead frame or base plate.

3. The pad structure of a contact induction type die bonder as claimed in claim 2, wherein: the vacuum hole is positioned on the central line of the cushion block body.

4. The pad structure of a contact induction type die bonder as claimed in claim 1, wherein: the adsorption block further comprises a motor which is connected with the contact type force sensor and located below the adsorption block, the motor is connected with a sliding block fixed on the adsorption block, and the sliding block is controlled to lift.

5. The pad structure of a contact induction type die bonder as claimed in claim 1, wherein: the adsorption blocks are arranged in one or more rows in sequence.

6. The pad structure of a contact induction type die bonder as claimed in claim 1, wherein: the width of the adsorption block is smaller than 7mm, and the height of the adsorption block is smaller than that of the cushion block body.

7. The pad structure of a contact induction type die bonder as claimed in claim 1, wherein: the bottom surface of the cushion block body is provided with a fixed base connected with a machine table track of the chip mounter, and the fixed base is in a clamping buckle type.