CN217640039U

CN217640039U - Temperature controller

Info

Publication number: CN217640039U
Application number: CN202221781034.5U
Authority: CN
Inventors: 马水源; 郑江
Original assignee: Jiangsu Wozhiyuan Power Technology Co ltd
Current assignee: Jiangsu Wozhiyuan Power Technology Co ltd
Priority date: 2022-07-11
Filing date: 2022-07-11
Publication date: 2022-10-21
Anticipated expiration: 2032-07-11

Abstract

The utility model discloses a temperature controller in the industrial control technical field, include: the temperature signal acquisition module comprises a sensor voltage signal sampling unit, a first-order filter circuit, a signal amplification processing circuit and an A/D sampling circuit which are sequentially connected, and is used for acquiring a temperature signal; the execution module comprises a first PWM output circuit, a voltage driving circuit and a load adjusting circuit, and is used for controlling the load to work; the MCU control module is respectively electrically connected with the acquisition module and the execution module and is used for acquiring the temperature signal acquired by the acquisition module and controlling the execution module to work. The sensor voltage signal that this temperature controller gathered filters interference signal after first order filtering, sends to MCU after passing through AD sampling circuit again to promote temperature signal's collection precision, rethread PWM output circuit more accurate control load work.

Description

Temperature controller

Technical Field

The utility model relates to an industrial control technical field, in particular to temperature controller.

Background

In recent years, with the development of productivity, the demand for temperature control accuracy is increasing, and the technology of temperature control is rapidly developed. The traditional temperature controller mostly consists of a relay, but the service life of a relay contact is limited, the fault rate is high, and the stability is poor. The current temperature controller is mostly determined by manual experience and field debugging, but due to the lack of temperature acquisition precision, the control output is unstable and is easily interfered by the outside, so that the current temperature controller cannot accurately control the temperature regulation.

SUMMERY OF THE UTILITY MODEL

This application has solved the unable accurate problem that the control adjusted the temperature of temperature controller among the prior art through providing a temperature controller, has improved temperature controller's control accuracy.

The embodiment of the application provides a temperature controller, includes:

the temperature signal acquisition device comprises an acquisition module, a temperature signal acquisition module and a temperature signal processing module, wherein the acquisition module comprises a sensor voltage signal sampling unit, a first-order filter circuit, a signal amplification processing circuit and an A/D sampling circuit which are sequentially connected, and the acquisition module is used for acquiring a temperature signal;

the execution module comprises a first PWM output circuit, a voltage driving circuit and a load adjusting circuit, and is used for controlling the load to work;

the MCU control module is respectively electrically connected with the acquisition module and the execution module and is used for acquiring the temperature signal acquired by the acquisition module and controlling the execution module to work.

The beneficial effects of the above embodiment are as follows: the sensor voltage signal that this temperature controller gathered is after first order filter circuit filtering interference signal, send to MCU after through AD sampling circuit again, specific temperature value is obtained by MCU calculation processing, so the collection precision of temperature signal has been promoted, again by MCU self-tuning PID algorithm calculation, and send adjustable PWM signal, through PWM output circuit, the more accurate control load work of voltage drive circuit, make the load steady operation in setting for the temperature value scope, abundant output mode, be applicable to various temperature control occasions, so temperature measurement is accurate, control output is accurate.

On the basis of the above embodiments, the present application can be further improved, specifically as follows:

in one embodiment of the application, the temperature controller further comprises a temperature transmission output module, the temperature transmission output module comprises a second PWM output circuit, a voltage stabilizing filter circuit, an operational amplifier circuit, a V/I conversion circuit and a constant current reverse protection circuit, the temperature transmission output module is electrically connected with the MCU control module, and the temperature transmission output module is used for converting the temperature signal and transmitting the temperature signal to an upper computer. The temperature transmitting and outputting module transmits the temperature data to the upper computer in a 4-20ma electric signal mode so that the upper computer can display and adjust the temperature data, and the temperature data can be accurately transmitted.

In one of the embodiments of this application, temperature controller still includes communication transmission module, communication transmission module includes isolation circuit, modbus communication circuit, thing networking pass through the unit, communication transmission module with MCU control module electricity is connected, and with external computer communication connection, communication transmission module is used for MCU control module with carry out data transmission between the external computer. The MCU transmits data such as the temperature signal value and the self-setting parameter to an external computer through the communication transmission module, so that the external computer can conveniently perform real-time analysis and monitoring according to the received temperature signal value and the self parameter value of the temperature controller, and meanwhile, the external computer can also issue an instruction to control the MCU control module through the communication transmission module.

In one embodiment of the present application, the temperature controller further includes a display module, the display module includes a nixie tube section driving circuit, a nixie tube position selecting circuit and a display nixie tube, the display module is electrically connected with the MCU control module, and the display module is controlled by the MCU control module and displays temperature information. The accurate control and adjustment of the MCU enable a display interface to be clear and clear, and a human-computer interaction interface is friendly and harmonious.

In one embodiment of the present application, the MCU control module is a single chip microcomputer.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

1. the temperature controller improves the acquisition precision of the temperature signal, and the execution module accurately controls the load to work, so that the control precision of the temperature controller is improved;

2. the temperature transmitting and outputting module of the temperature controller can accurately transmit temperature data to an upper computer in the form of electric signals through circuits such as voltage-stabilizing filtering, operational amplification, V/I conversion, constant current and reverse protection and the like;

3. the MCU control module in the temperature controller can transmit the temperature signal value and the self-tuning parameter data to an external computer through the communication transmission module, so that the external computer can conveniently carry out real-time analysis and monitoring according to the received temperature signal value and the self parameter value of the temperature controller, and meanwhile, the external computer can also send an instruction to control the MCU control module through the communication transmission module.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

FIG. 1 is a block diagram of a temperature controller according to an embodiment;

FIG. 2 is a block diagram of the structure of an acquisition module in an embodiment;

FIG. 3 is a block diagram showing the structure of an execution module in the embodiment;

FIG. 4 is a block diagram showing the structure of a temperature transmitter output module according to the embodiment;

FIG. 5 is a block diagram of a communication transmission module according to an embodiment;

fig. 6 is a block diagram of a display module in the embodiment.

Detailed Description

The invention will be further elucidated with reference to the embodiments which are intended to be illustrative only and are not intended to limit the scope of the invention, which modifications may be made by a person skilled in the art after reading the present invention, which modifications may fall within the scope of the invention as defined in the claims appended hereto.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "vertical" and "outer peripheral surface" are used to indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship that the product of the present invention is usually placed when in use, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element to be referred must have a specific position, be constructed in a specific orientation, and be operated, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the term "vertical" or the like does not imply that the components are required to be absolutely horizontal or overhanging, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In the description of the present invention, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the various embodiments or examples and features of the various embodiments or examples described herein can be combined and combined by those skilled in the art without conflicting aspects.

The embodiment of the application provides a temperature controller, has solved the problem that temperature controller can't accurate control adjusts the temperature among the prior art, has improved temperature controller's control accuracy.

In order to solve the above problems, the technical solution in the embodiment of the present application has the following general idea:

example (b):

as shown in fig. 1 to 6, a temperature controller includes: the device comprises an MCU control module, an acquisition module, an execution module, a temperature transmitting and outputting module, a communication transmission module and a display module.

The acquisition module comprises a sensor voltage signal sampling unit, a first-order filter circuit, a signal amplification processing circuit and an A/D sampling circuit which are sequentially and electrically connected, the sensor voltage signal sampling unit is connected with an external temperature sensor, the A/D sampling circuit is electrically connected with the MCU control module, and the acquisition module is used for acquiring temperature signals;

the execution module comprises a first PWM output circuit, a voltage driving circuit and a load adjusting circuit which are sequentially and electrically connected, the first PWM output circuit is electrically connected with the MCU control module, the load adjusting circuit is connected with an external load, and the execution module is used for regulating and controlling the load to work;

the temperature transmitting output module comprises a second PWM output circuit, a voltage stabilizing filter circuit, an operational amplifier circuit, a V/I conversion circuit and a constant current reverse protection circuit which are sequentially and electrically connected, the second PWM output circuit is electrically connected with the MCU control module, the constant current reverse protection circuit is electrically connected with an external upper computer, and the temperature transmitting output module is used for converting temperature signals and transmitting the temperature signals to the upper computer;

the communication transmission module comprises an isolation circuit, a Modbus communication circuit and an Internet of things transparent transmission unit which are sequentially and electrically connected, the isolation circuit is electrically connected with the MCU control module, the Internet of things transparent transmission unit is in communication connection with an external computer, and the communication transmission module is used for data transmission between the MCU control module and the external computer;

the display module comprises a nixie tube section driving circuit, a nixie tube position selection circuit and a display nixie tube which are sequentially and electrically connected, the nixie tube section driving circuit is electrically connected with the MCU control module, and the display module is controlled by the MCU control module and displays temperature information;

the MCU control module is respectively and electrically connected with the acquisition module, the execution module, the temperature transmitting and outputting module, the communication transmission module and the display module, and is used for acquiring temperature signals acquired by the acquisition module, controlling the execution module to work by adopting a self-tuning PID algorithm and controlling the display module to realize high-precision display by adopting a high-performance filtering algorithm.

Optionally, the MCU control module is a single chip microcomputer.

The technical scheme in the embodiment of the application at least has the following technical effects or advantages:

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. A temperature controller, comprising:

2. The temperature controller according to claim 1, wherein: the temperature transmitting and outputting module comprises a second PWM output circuit, a voltage stabilizing filter circuit, an operational amplifier circuit, a V/I conversion circuit and a constant current reverse protection circuit, is electrically connected with the MCU control module and is used for converting the temperature signal and sending the temperature signal to an upper computer.

3. The temperature controller according to claim 2, wherein: still include communication transmission module, communication transmission module includes that isolating circuit, modbus communication circuit, thing networking pass the unit thoroughly, communication transmission module with MCU control module electricity is connected, and with outside computer communication connection, communication transmission module is used for MCU control module with carry out data transmission between the outside computer.

4. The temperature controller according to claim 3, wherein: the display module comprises a nixie tube section driving circuit, a nixie tube position selecting circuit and a display nixie tube, the display module is electrically connected with the MCU control module, and the display module is controlled by the MCU control module and displays temperature information.

5. The temperature controller according to claim 1, wherein: the MCU control module is a singlechip.