CN217637844U - Semiconductor device encapsulation gas tightness leak hunting testing arrangement - Google Patents
Semiconductor device encapsulation gas tightness leak hunting testing arrangement Download PDFInfo
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- CN217637844U CN217637844U CN202221472845.7U CN202221472845U CN217637844U CN 217637844 U CN217637844 U CN 217637844U CN 202221472845 U CN202221472845 U CN 202221472845U CN 217637844 U CN217637844 U CN 217637844U
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Abstract
The utility model discloses a leak detection testing device for the packaging airtightness of a semiconductor device, which comprises a helium source, a testing cavity, a helium mass spectrometer leak detector, a first valve, a second valve and a third valve; the test cavity is used for loading a workpiece to be tested; one end of the first valve is used for being connected with an air outlet of a helium source, and the other end of the first valve is connected with an air inlet of the test cavity; one end of the second valve is connected with the air outlet of the testing cavity, and the other end of the second valve is used for being connected with the air inlet of the vacuumizing mechanism; one end of the third valve is used for being connected with an exhaust port of a workpiece to be tested, which is arranged in the test cavity, and the other end of the third valve is connected with an air inlet of the helium mass spectrometer leak detector. The design that the exhaust port of the workpiece to be detected is connected with the air inlet of the helium mass spectrometer leak detector is adopted, so that the leak rate of the workpiece to be detected can be directly detected after the vacuumizing process and the helium filling process, the leak detection testing process flow is simplified, the leak detection testing efficiency is improved, and the method is more suitable for leak detection testing of metal packaging airtightness of the infrared thermal imaging sensor.
Description
Technical Field
The utility model relates to a semiconductor vacuum packaging trade technical field, in particular to semiconductor device encapsulates gas tightness leak hunting testing arrangement.
Background
Two packaging modes are mainly used for the infrared thermal imaging sensor, wherein one packaging mode is ceramic packaging, and the other packaging mode is metal packaging. After the metal packaging tube shell and the optical lens are welded, the welding airtightness is measured through air exhaust of the metal packaging exhaust port, and the subsequent step process and the subsequent processing can be carried out.
In the method for testing the metal packaging airtightness of the infrared thermal imaging sensor, no special detection device equipment manufacturer exists in the current market, and each packaging factory needs to design and set up a detection system device to cooperate with the He mass spectrometer leak detector to measure the welding airtightness. The method comprises the steps of placing a workpiece into a cavity with a certain volume for sealing, vacuumizing the sealed container to the level of 2Kpa, stopping the vacuum pumping, injecting He (helium) with a certain pressure, taking out the workpiece after a certain time, cleaning He molecules on the surface of the workpiece, and placing the workpiece into an He mass spectrum detector for detecting the leak rate.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a semiconductor device encapsulation gas tightness leak hunting testing arrangement, through the design that the gas vent that will pack into the work piece that is surveyed in the test chamber is connected with the air inlet of helium mass spectrometer leak detector, so that after evacuation process and filling helium process, accessible helium mass spectrometer leak detector directly detects the leak rate to being surveyed the work piece, need not to take out the clearance and put into the detection leak rate in the He mass spectrometer detection instrument by being surveyed the work piece again, thereby simplify and be surveyed work piece gas tightness leak hunting test process flow, improve and be surveyed work piece gas tightness leak hunting efficiency of testing, make this scheme be applicable to the leak hunting test of infrared thermal imaging sensor metal package gas tightness more.
In order to achieve the above object, the utility model provides a following technical scheme:
a kind of semiconductor device encapsulates the leak hunting testing arrangement of the gas tightness, including helium source, test cavity, helium mass spectrometer leak detector, first valve, second valve and third valve;
the test cavity is used for loading a workpiece to be tested;
one end of the first valve is used for being connected with an air outlet of the helium source, and the other end of the first valve is connected with an air inlet of the test cavity; one end of the second valve is connected with the air outlet of the test cavity, and the other end of the second valve is used for being connected with the air inlet of the vacuumizing mechanism; and one end of the third valve is used for being connected with an exhaust port of the workpiece to be tested, which is arranged in the testing cavity, and the other end of the third valve is connected with an air inlet of the helium mass spectrometer leak detector.
Preferably, the test cavity is provided with a through hole which is used for being matched with an exhaust hole of the tested workpiece in a sealing manner;
and one end of the third valve is used for being connected with an air outlet of the tested workpiece which penetrates out of the test cavity penetrating port.
Preferably, the device further comprises a transfer pipe and a fourth valve;
the helium mass spectrometer leak detector is provided with the vacuumizing mechanism;
one end of the second valve is connected with the air outlet of the test cavity, and the other end of the second valve is connected with the first rotating port of the transfer pipe; one end of the third valve is used for being connected with an exhaust port of the tested workpiece arranged in the test cavity, and the other end of the third valve is connected with a second adapter of the transit pipe; one end of the fourth valve is connected with a third adapter of the transfer pipe, and the other end of the fourth valve is connected with an air inlet of the helium mass spectrometer leak detector.
Preferably, the number of the second adapter ports of the transit tube is multiple;
the test cavity can be used for accommodating a plurality of workpieces to be tested;
the number of the third valves is multiple, one end of each third valve is used for being connected with the exhaust ports of the multiple tested workpieces loaded in the test cavity in a one-to-one correspondence mode, and the other end of each third valve is connected with the second adapter ports of the transit pipe in a one-to-one correspondence mode.
Preferably, the device further comprises a purging device and a fifth valve;
one end of the fifth valve is connected with the air outlet of the purging device, and the other end of the fifth valve is connected with the fourth adapter of the transit pipe.
Preferably, the system also comprises a control center;
the first valve, the second valve, the third valve, the fourth valve and the fifth valve comprise electromagnetic valves and are all in communication connection with the control center; and the helium mass spectrometer leak detector and the purging device are both in communication connection with the control center.
Preferably, the device also comprises a barometer;
and the joint of the barometer is connected with the air port of the test cavity.
According to the above technical scheme, the utility model provides a semiconductor device encapsulation gas tightness leak hunting testing arrangement, through the design that the gas vent that will pack into in the test cavity by the work piece is connected with the air inlet of helium mass spectrometer leak detector, so that after evacuation process and filling into the helium process, accessible helium mass spectrometer leak detector directly detects the leak rate to by the work piece, need not to take out the clearance and put into the detection leak rate in the He mass spectrometer detector by the work piece again, thereby simplify by work piece gas tightness leak hunting test process flow, improve by work piece gas tightness leak hunting test efficiency, make this scheme be applicable to the leak hunting test of infrared thermal imaging sensor metal encapsulation gas tightness more.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a leak detection testing apparatus for leak tightness of a semiconductor device package according to an embodiment of the present invention;
fig. 2 is a flowchart of the leak detection testing apparatus for the airtightness of the semiconductor device package according to the embodiment of the present invention.
The device comprises a helium source 1, a workpiece to be detected 2, a transfer pipe 3, a helium mass spectrometer leak detector 4, a barometer 5, a test cavity 6, a purging device 7, a first valve 8, a second valve 9, a third valve 10, a fourth valve 11 and a fifth valve 12.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The embodiment of the utility model provides a semiconductor device encapsulation gas tightness leak hunting testing arrangement, as shown in fig. 1, including helium source 1, test cavity 6, helium mass spectrometer leak detector 4, first valve 8, second valve 9 and third valve 10;
the test cavity 6 is used for loading the workpiece 2 to be tested;
one end of the first valve 8 is used for being connected with an air outlet of the helium source 1, and the other end of the first valve is connected with an air inlet of the test cavity 6; one end of the second valve 9 is connected with the air outlet of the testing cavity 6, and the other end of the second valve is used for being connected with the air inlet of the vacuumizing mechanism; one end of the third valve 10 is connected to an exhaust port (leak exhaust port) of the workpiece 2 to be tested loaded in the test chamber 6, and the other end is connected to an inlet port of the helium mass spectrometer leak detector 4.
It should be noted that the test chamber 6 is a sealed test chamber, can bear helium gas with a certain pressure, and is provided with an air inlet, an air outlet and a penetration outlet. The testing cavity 6 is a sealed cavity with an upper die and a lower die, and is used for loading the tested workpiece 2 when opened, and an exhaust port of the tested workpiece 2 penetrates out of the cavity through a penetrating port of the testing cavity 6. In addition, the workpiece 2 to be measured can be an infrared thermal imaging sensor, after the TEC, the getter and the infrared sensor are arranged in the metal tube shell and then welded and fused with the optical lens, the whole workpiece is arranged in the test cavity 6, and the leakage exhaust port of the infrared thermal imaging sensor is connected with one end of the third valve 10. In addition, in order to facilitate understanding of the working principle of the apparatus, the following description is provided for the working flow after the workpiece 2 is loaded into the testing chamber 6:
firstly, closing a first valve 8 and a third valve 10, opening a second valve 9 and starting a vacuumizing mechanism, vacuumizing a test cavity 6 (namely a vacuumizing process), and closing the second valve 9 and the vacuumizing mechanism after the pressure in the test cavity 6 reaches 2 Kpa; then, opening the first valve 8 to fill helium into the test cavity 6, and closing the first valve 8 when the pressure in the test cavity 6 reaches 0.2Mpa (namely, the procedure of filling helium); and then, opening the third valve 10 and starting the helium mass spectrometer leak detector 4 for detecting the leak rate value of the workpiece 2 to be detected (namely, the detection process of the helium mass spectrometer leak detector 4).
From foretell technical scheme, the embodiment of the utility model provides a semiconductor device encapsulation gas tightness leak hunting testing arrangement, the design of being connected through the gas vent that will pack into the work piece that is surveyed in the test chamber and the air inlet of helium mass spectrometer leak detector, so that after evacuation process and filling helium process, accessible helium mass spectrometer leak detector directly detects the leak rate to being surveyed the work piece, need not to take out the clearance and put into He mass spectrometer leak rate in the clearance again by being surveyed the work piece, thereby simplify and be surveyed work piece gas tightness leak hunting test process flow, improve and be surveyed work piece gas tightness leak hunting efficiency of testing, make this scheme be applicable to the leak hunting test of infrared thermal imaging sensor metal package gas tightness more.
In the scheme, as shown in fig. 1, the test cavity 6 is provided with a through hole for sealing and matching with the exhaust hole of the workpiece 2 to be tested;
one end of the third valve 10 is used for connecting with an exhaust port of the workpiece 2 to be tested which passes out of the through-hole of the testing chamber 6. The scheme is designed so that the exhaust port of the workpiece 2 to be tested which is arranged in the testing cavity 6 is connected with one end of the third valve 10, and meanwhile, the workpiece 2 to be tested is convenient to mount and dismount in the testing cavity 6. Further, one end of the third valve 10 is provided with a joint mechanism for connecting an exhaust port of the workpiece 2 to be measured. The joint mechanism comprises a clamping sleeve and a joint flange, wherein the first end of the clamping sleeve is used for clamping an exhaust port of the measured workpiece 2, the second end of the clamping sleeve is connected with the first end of the joint flange through a bolt, and the second end of the joint flange is connected with one end of the third valve 10.
Specifically, as shown in fig. 1, the apparatus for testing leak detection of hermeticity of semiconductor device package according to an embodiment of the present invention further includes a transfer pipe 3 and a fourth valve 11;
the helium mass spectrometer leak detector 4 is provided with a vacuumizing mechanism;
one end of the second valve 9 is connected with the air outlet of the testing cavity 6, and the other end is connected with the first transfer port of the transfer pipe 3; one end of the third valve 10 is used for being connected with an exhaust port of the tested workpiece 2 loaded in the testing cavity 6, and the other end of the third valve is connected with a second adapter port of the transit pipe 3; one end of a fourth valve 11 is connected with a third adapter port of the transfer tube 3, and the other end of the fourth valve is connected with an air inlet of the helium mass spectrometer leak detector 4. The design is such that the vacuumizing mechanism of the helium mass spectrometer leak detector 4 is shared by the vacuumizing of the test cavity 6, and an additional vacuumizing mechanism is not required to be added, so that the structure of the device is more simplified, and the cost is lower. Meanwhile, the scheme ensures that the vacuumizing process and the detection process can be performed separately and are not influenced mutually by arranging the transit pipe 3. In addition, as shown in fig. 2, after the helium gas filling process is completed, the third valve 10 and the fourth valve 11 are opened and the helium mass spectrometer leak detector 4 is started, and when the pressure between the helium mass spectrometer leak detector 4 and the transfer pipe 3 reaches 1500Pa-10Pa, the maintenance time is 2min, and then the helium mass spectrometer leak detector 4 displays that the leak rate value is the air tightness leak rate value of the workpiece 2 to be detected (namely, the air tightness leak rate value of the metal package of the infrared thermal imaging sensor); wherein the standard extremum is set to 5 × 10-9Pa.m 3 And/s, if the leakage rate value is higher than the standard extreme value, the helium mass spectrometer leak detector 4 gives an alarm to remind and records the leakage rate value.
Further, as shown in fig. 1, the number of the second adapter ports of the intermediate transfer pipe 3 is plural;
the test cavity 6 can be used for accommodating a plurality of workpieces 2 to be tested;
the number of the third valves 10 is multiple, one end of each of the multiple third valves 10 is used for being connected with the exhaust ports of the multiple measured workpieces 2 loaded in the test cavity 6 in a one-to-one correspondence manner, and the other end of each of the multiple third valves 10 is connected with the multiple second adapter ports of the transfer tube 3 in a one-to-one correspondence manner. The scheme is designed in such a way, so that a plurality of workpieces 2 to be tested can be tested simultaneously, and the test efficiency of the device is improved. Of course, when the air tightness of one of the tested workpieces 2 is leaked, the third valve 10 can be closed one by one to locate a poor tested workpiece 2.
Furthermore, when helium is filled into the test cavity 6, if the tested workpiece 2 with poor air tightness exists, the helium can be leaked to pollute the inner surface wall of the leakage detection pipeline. In order to eliminate the influence caused by helium leakage; correspondingly, as shown in fig. 1, the apparatus for testing leak detection of encapsulation airtightness of a semiconductor device provided by the embodiment of the present invention further includes a purging device 7 and a fifth valve 12;
one end of the fifth valve 12 is connected with the air outlet of the purging device 7, and the other end is connected with the fourth switching port of the transit pipe 3. As shown in fig. 2, the present embodiment performs the purging and cleaning operation before the vacuum-pumping process. This scheme design so to sweep the He molecule on clean leak hunting pipeline inner wall surface through sweeping device 7, reduce the interior residual He molecule of leak hunting pipeline, thereby help improving the detection precision of this device.
In order to further optimize the technical scheme, the device for testing the leak detection of the packaging airtightness of the semiconductor device provided by the embodiment of the utility model also comprises a control center;
the first valve 8, the second valve 9, the third valve 10, the fourth valve 11 and the fifth valve 12 comprise electromagnetic valves and are in communication connection with the control center; and the helium mass spectrometer leak detector 4 and the purging device 7 are both in communication connection with a control center. That is to say, this scheme is through the use of each solenoid valve, helium mass spectrometer leak detector 4 and purge device 7 cooperation control center to realize the automatic leak hunting test of the workpiece 2 gas tightness under test.
In this solution, as shown in fig. 1, the device for testing leak detection of encapsulation airtightness of a semiconductor device provided in an embodiment of the present invention further includes a barometer 5;
the joint of the barometer 5 is connected with the air port of the test cavity 6. Namely, the scheme is that the pressure gauge 5 is used for conveniently displaying the pressure value of the test cavity 6 in the processes of vacuumizing and helium filling.
In the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The device for testing the encapsulation airtightness leakage detection of the semiconductor device is characterized by comprising a helium source (1), a testing cavity (6), a helium mass spectrometer leak detector (4), a first valve (8), a second valve (9) and a third valve (10);
the test cavity (6) is used for accommodating a workpiece (2) to be tested;
one end of the first valve (8) is used for being connected with an air outlet of the helium source (1), and the other end of the first valve is connected with an air inlet of the test cavity (6); one end of the second valve (9) is connected with an air outlet of the testing cavity (6), and the other end of the second valve is connected with an air inlet of the vacuumizing mechanism; one end of the third valve (10) is used for being connected with an exhaust port of the workpiece to be tested (2) which is arranged in the testing cavity (6), and the other end of the third valve is connected with an air inlet of the helium mass spectrometer leak detector (4).
2. The semiconductor device package airtightness leak detection testing apparatus according to claim 1, wherein the test cavity (6) is provided with a through-outlet for sealing fit with an exhaust port of the workpiece (2) to be tested;
one end of the third valve (10) is used for being connected with an exhaust port of the workpiece (2) to be tested which penetrates out of the test cavity (6) through hole.
3. The semiconductor device package airtightness leak detection testing apparatus according to claim 1, further comprising a transit tube (3) and a fourth valve (11);
the helium mass spectrometer leak detector (4) is provided with the vacuumizing mechanism;
one end of the second valve (9) is connected with an air outlet of the testing cavity (6), and the other end of the second valve is connected with a first rotating port of the transit pipe (3); one end of the third valve (10) is used for being connected with an air outlet of the tested workpiece (2) which is arranged in the testing cavity (6), and the other end of the third valve is connected with a second adapter of the transit pipe (3); one end of the fourth valve (11) is connected with a third adapter port of the transit pipe (3), and the other end of the fourth valve is connected with an air inlet of the helium mass spectrometer leak detector (4).
4. The semiconductor device package airtightness leak detection testing apparatus according to claim 3, wherein the number of the second transfer ports of the intermediate transfer pipe (3) is plural;
the test cavity (6) can be used for accommodating a plurality of workpieces to be tested (2);
the number of the third valves (10) is multiple, one end of each of the third valves (10) is used for being correspondingly connected with the exhaust ports of the tested workpieces (2) which are arranged in the test cavity (6) in a one-to-one mode, and the other end of each of the third valves is correspondingly connected with the second adapter ports of the transfer pipe (3) in a one-to-one mode.
5. The semiconductor device package hermetic leak detection test apparatus according to claim 3, further comprising a purge device (7) and a fifth valve (12);
one end of the fifth valve (12) is connected with the air outlet of the purging device (7), and the other end of the fifth valve is connected with the fourth adapter of the transit pipe (3).
6. The semiconductor device package airtightness leak detection testing apparatus according to claim 5, further comprising a control center;
the first valve (8), the second valve (9), the third valve (10), the fourth valve (11) and the fifth valve (12) comprise electromagnetic valves and are all in communication connection with the control center; and the helium mass spectrometer leak detector (4) and the purging device (7) are in communication connection with the control center.
7. The semiconductor device package hermeticity leak detection test apparatus according to claim 1, further comprising a barometer (5);
and the joint of the barometer (5) is connected with the air port of the test cavity (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221472845.7U CN217637844U (en) | 2022-06-14 | 2022-06-14 | Semiconductor device encapsulation gas tightness leak hunting testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221472845.7U CN217637844U (en) | 2022-06-14 | 2022-06-14 | Semiconductor device encapsulation gas tightness leak hunting testing arrangement |
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| CN217637844U true CN217637844U (en) | 2022-10-21 |
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| CN202221472845.7U Active CN217637844U (en) | 2022-06-14 | 2022-06-14 | Semiconductor device encapsulation gas tightness leak hunting testing arrangement |
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| CN (1) | CN217637844U (en) |
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- 2022-06-14 CN CN202221472845.7U patent/CN217637844U/en active Active
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