CN217618445U - Laser cutting device for ceramic circuit board - Google Patents
Laser cutting device for ceramic circuit board Download PDFInfo
- Publication number
- CN217618445U CN217618445U CN202221017827.XU CN202221017827U CN217618445U CN 217618445 U CN217618445 U CN 217618445U CN 202221017827 U CN202221017827 U CN 202221017827U CN 217618445 U CN217618445 U CN 217618445U
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- China
- Prior art keywords
- guide rail
- station
- circuit board
- laser cutting
- longitudinal guide
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Abstract
The utility model discloses a laser cutting device for ceramic circuit board, include: a table top (1); a left longitudinal rail (2); a left station (3) which is in sliding fit on the left longitudinal guide rail; a right longitudinal guide rail (4); a right station (5) which is in sliding fit on the right longitudinal guide rail; the transverse guide rail (6) is vertically distributed with the left longitudinal guide rail and the right longitudinal guide rail at intervals; and the laser cutting machine is in sliding fit with the transverse guide rail and is used for cutting the ceramic circuit boards borne on the left station and the right station. The beneficial effects of the utility model are that change the mode that the circuit board removed to carry out cutting one by one in the past, let the circuit board motionless, laser cutting machine removes, guarantees the stability of circuit board gesture to with two stations about the station falls into, can alternate use, improve cutting efficiency.
Description
Technical Field
The utility model relates to a ceramic circuit board makes technical field, especially relates to a laser cutting device for ceramic circuit board.
Background
With the development of material technology, ceramic substrates are increasingly used in scientific research applications and industrial applications because of their excellent physicochemical properties. Either precision microelectronics, or heavy industries such as aeronautics and astronautics, or daily necessities of common people, almost all fields have the figure of the ceramic substrate. However, the ceramic substrate has a compact structure and a certain brittleness, and although the ceramic substrate can be processed by a common mechanical mode, the stress exists in the processing process, and particularly, the ceramic substrate is easy to crack when being used for a ceramic wafer with a thin thickness. This makes the processing of ceramic substrates a difficult point for widespread use. Laser, as a flexible processing method, has demonstrated remarkable capabilities in the ceramic substrate processing technology.
Chinese utility model patent publication No. CN210147260U discloses a circuit board laser cutting machine, which comprises a frame, a conveying group for conveying flexible circuit boards, and a laser cutting group erected on the frame, wherein the conveying group is installed below the laser cutting group on the frame; the conveying group comprises a discharging roller, a feeding roller and a conveying rail which are sequentially arranged along the conveying direction, a working position is arranged at the output end of the conveying rail, and the laser cutting group can cut and form the flexible circuit board on the working position. The flexible circuit board is conveyed by a feeding roller in a clamping mode, but the posture of the circuit board is difficult to ensure to be unchanged in the conveying process, and if the posture of the circuit board is changed before laser cutting, processing inferior-quality products can be generated.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem be the gesture stability of the unable circuit board of assurance of current circuit board laser cutting machine, provide a laser cutting device for ceramic circuit board for this.
The technical scheme of the utility model is that: a laser cutting device for ceramic circuit board includes: a table top; a left longitudinal rail; a left station in sliding engagement on the left longitudinal guide rail; a right longitudinal rail; the right station is in sliding fit with the right longitudinal guide rail; the transverse guide rails are vertically distributed with the left longitudinal guide rail and the right longitudinal guide rail at intervals; and the laser cutting machine is in sliding fit with the transverse guide rail and is used for cutting the ceramic circuit boards borne on the left station and the right station.
In the scheme, the left station and the right station are transversely distributed bearing platforms.
In the scheme, the bearing platform is provided with a limiting block for limiting the ceramic circuit board.
In the scheme, the left longitudinal guide rail and the right longitudinal guide rail drive the left station and the right station to move through the cylinder.
In the scheme, the laser cutting machine comprises a stand column and a laser head, wherein the stand column is in transmission connection with the transverse guide rail through a roller chain.
The beneficial effects of the utility model are that: the mode that the former circuit board removes and cuts one by one is changed, lets the circuit board motionless, and laser cutting machine removes, guarantees the stability of circuit board gesture to divide into about the station two stations, can alternate use, improve cutting efficiency.
Drawings
FIG. 1 is a schematic view of the present invention;
in the figure: 1. the laser welding machine comprises a table top, 2 parts of a left longitudinal guide rail, 3 parts of a left station, 4 parts of a right longitudinal guide rail, 5 parts of a right station, 6 parts of a transverse guide rail, 7 parts of a limiting block, 8 parts of an upright column, 9 parts of a laser head, 10 parts of a roller chain, 11 parts of a circuit board.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
As shown in fig. 1, the utility model comprises a table-board 1; a left longitudinal rail 2; the left station 3 is in sliding fit with the left longitudinal guide rail; a right longitudinal guide rail 4; a right station 5, which is in sliding fit on the right longitudinal guide rail; the transverse guide rails 6 are vertically distributed with the left longitudinal guide rail and the right longitudinal guide rail at intervals; and the laser cutting machine is in sliding fit with the transverse guide rail and is used for cutting the ceramic circuit boards borne on the left station and the right station.
The laser head can be a coaxial vision laser system and comprises a field lens, a galvanometer, a coaxial module, a laser emitting tube and a camera, wherein after the camera detects a circuit board, laser can rotate and cut around a plane.
The above-mentioned "longitudinal" and "transverse" are, with respect to the table top, the left longitudinal guide rail and the right longitudinal guide rail are distributed in parallel at intervals and are respectively used for bearing a left station and a right station, the left station is specifically a transversely distributed bearing platform, the bearing platform can bear one or more circuit boards 11 to be processed, the bearing platform can be slidably connected with the corresponding longitudinal guide rail through a slider, and the slider is connected with a power source, such as a piston rod of an air cylinder, on the longitudinal guide rail to drive the bearing platform to slide on the corresponding guide rail. The sliding mode of the load-bearing platform can be either automatic or manual. The laser cutter moves back and forth along the length direction of the transverse guide rail. The laser cutting machine comprises a stand column 8 and a laser head 9, wherein the stand column is in transmission connection with a transverse guide rail through a roller chain 10, and the laser head is over against a circuit board on the bearing platform.
As the utility model discloses a preferred example, last being equipped with of load-bearing platform is put on the stopper for the spacing stopper 7 of ceramic circuit board, and the stopper can have been seted up and has been adsorbed the hole, utilizes the negative pressure to adsorb fixed circuit board.
The utility model discloses a use method as follows: the circuit board to be processed is placed on the left station and the right station, each circuit board is fixed through a limiting block, the left station and the right station move to the lower side of a laser head along a left longitudinal guide rail and a right longitudinal guide rail, a driving mechanism of the transverse guide rail drives a stand column of a laser cutting machine to move along the transverse guide rail through a roller chain, the circuit board of the right station is processed firstly, then the circuit board of the left station is processed, after the circuit board of the right station is processed, the right station returns to the initial position to replace the circuit board, and then returns to the processing position, at the moment, the circuit board of the left station is processed, the stand column returns to the initial position, the circuit board of the right station is processed again, the initial position is returned to the left station, the circuit board is replaced, and the operation is repeated.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (5)
1. A laser cutting device for ceramic circuit board, characterized by: the method comprises the following steps: a table top (1); a left longitudinal rail (2); a left station (3) which is in sliding fit on the left longitudinal guide rail; a right longitudinal guide rail (4); a right station (5) which is in sliding fit on the right longitudinal guide rail; the transverse guide rail (6) is vertically distributed with the left longitudinal guide rail and the right longitudinal guide rail at intervals; and the laser cutting machine is in sliding fit with the transverse guide rail and is used for cutting the ceramic circuit boards borne on the left station and the right station.
2. The laser cutting apparatus for ceramic wiring boards as claimed in claim 1, wherein: the left station and the right station are transversely distributed bearing platforms.
3. The laser cutting device for ceramic wiring boards as claimed in claim 2, wherein: and the bearing platform is provided with a limiting block (7) for limiting the ceramic circuit board.
4. The laser cutting apparatus for ceramic wiring boards as claimed in claim 1, wherein: and the left longitudinal guide rail and the right longitudinal guide rail drive the left station and the right station to move through the cylinder.
5. The laser cutting apparatus for ceramic wiring boards as claimed in claim 1, wherein: the laser cutting machine comprises a stand column (8) and a laser head (9), wherein the stand column is in transmission connection with a transverse guide rail through a roller chain (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221017827.XU CN217618445U (en) | 2022-04-29 | 2022-04-29 | Laser cutting device for ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221017827.XU CN217618445U (en) | 2022-04-29 | 2022-04-29 | Laser cutting device for ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217618445U true CN217618445U (en) | 2022-10-21 |
Family
ID=83650876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221017827.XU Active CN217618445U (en) | 2022-04-29 | 2022-04-29 | Laser cutting device for ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217618445U (en) |
-
2022
- 2022-04-29 CN CN202221017827.XU patent/CN217618445U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 244000 No. 3129, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee after: Guoci Saichuang Electric (Tongling) Co.,Ltd. Address before: 244000 No. 3129, Tianmenshan North Road, Tongling Economic and Technological Development Zone, Anhui Province Patentee before: SAICHUANG ELECTRIC (TONGLING) Co.,Ltd. |