CN217607193U - Laser bar array packaging structure - Google Patents
Laser bar array packaging structure Download PDFInfo
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- CN217607193U CN217607193U CN202221609350.4U CN202221609350U CN217607193U CN 217607193 U CN217607193 U CN 217607193U CN 202221609350 U CN202221609350 U CN 202221609350U CN 217607193 U CN217607193 U CN 217607193U
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Abstract
The utility model relates to a laser instrument bar array packaging structure, include: the heat dissipation heat sink comprises a heat dissipation heat sink and a laser bar array, wherein the laser bar array is fixedly connected with the upper surface of the heat dissipation heat sink; the laser bar array comprises a plurality of bar sub-modules, the bar sub-modules form an array structure of 1 × N, N is more than or equal to 2, and adjacent bar sub-modules are fixedly connected; the bar sub-module comprises a gold-plated electrode, a chip and an insulating base, wherein the gold-plated electrode is located on the upper surface of the insulating base and fixedly connected with the insulating base, the chip is located on the side surface of the gold-plated electrode and fixedly connected with the gold-plated electrode, and the insulating base is fixedly connected with the upper surface of the heat dissipation heat sink. The utility model discloses a laser instrument bar array packaging structure adopts the mode of encapsulating a plurality of bar sub-modules on the heat sink is dispelled the heat, has effectively released the stress in the packaging process, has reduced the chip because of the stress risk of drawing apart, has increased the performance stability of product in long-term use.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor laser, concretely relates to laser bar array packaging structure.
Background
The semiconductor laser has the advantages of small volume, light weight and long service life, and thus is widely applied to medical and beauty, military, scientific research, communication and other fields.
With the increasing demand of the application field on the peak power of the laser and the increasing demand on the laser package, the prior art commonly uses the all-hard solder (Au 80Sn 20) or the soft solder (In). The full hard solder (Au 80Sn 20) has low production efficiency because the chip needs to repeat the high-temperature sintering furnace process (generally 350 ℃) for 2-3 times, and has ultrahigh production cost and maintenance cost because the chip, the heat conduction material and the insulating material are integrally welded and the requirements on the material and the processing are also high; the soft solder (In) is easy to oxidize and generate electrothermal migration under the condition of large current, thereby greatly influencing the reliability of the laser.
SUMMERY OF THE UTILITY MODEL
In order to solve the above-mentioned problem that exists among the prior art, the utility model provides a laser instrument bar array packaging structure. The to-be-solved technical problem of the utility model is realized through following technical scheme:
the utility model provides a laser instrument bar array packaging structure, include: a heat sink and an array of laser bars, wherein,
the laser bar array is fixedly connected with the upper surface of the heat dissipation heat sink;
the laser bar array comprises a plurality of bar sub-modules, the bar sub-modules form an array structure of 1 × N, N is more than or equal to 2, and adjacent bar sub-modules are fixedly connected;
the bar sub-module comprises a gold-plated electrode, a chip and an insulating base, wherein the gold-plated electrode is located on the upper surface of the insulating base and fixedly connected with the insulating base, the chip is located on the side surface of the gold-plated electrode and fixedly connected with the gold-plated electrode, and the insulating base is fixedly connected with the upper surface of the heat dissipation heat sink.
In an embodiment of the present invention, the laser bar array package structure further includes two edge insulators, and both of the edge insulators are fixedly connected to the upper surface of the heat sink;
the two edge insulators are located at two ends of the bar array of the laser and are fixedly connected with the insulating bases of the adjacent bar sub-modules.
In an embodiment of the present invention, the laser bar array package structure further includes two conductive components, and the two conductive components are located on the upper surface of the corresponding edge insulator and are fixedly connected to the edge insulator;
one end of the conductive member is fixedly connected to the gold-plated electrode of the bar sub-module adjacent thereto.
In an embodiment of the present invention, the two side surfaces of the heat sink are provided with a groove structure.
In one embodiment of the invention, the electrically conductive member comprises a first electrically conductive portion and a second electrically conductive portion connected, wherein,
a first end of the first conductive part is fixedly connected with the corresponding gold-plated electrode of the bar sub-module, and a second end of the first conductive part is vertically connected with the second conductive part;
the second conductive parts are positioned in the corresponding groove structures.
In an embodiment of the present invention, the laser bar array package structure further includes two double-sided copper-clad members, the double-sided copper-clad members are disposed in the groove structure, and are located between the conductive member and the edge insulator.
In one embodiment of the present invention, the gold-plated electrode is welded to the insulating base by a brazing material.
In one embodiment of the present invention, the chip is soldered to the gold-plated electrode through a brazing material.
In an embodiment of the present invention, the bar sub-modules are welded by an alloy solder.
In an embodiment of the present invention, the insulating base is welded to the heat sink through an alloy solder.
Compared with the prior art, the beneficial effects of the utility model reside in that:
1. the utility model discloses a laser instrument bar array packaging structure adopts the mode of encapsulating a plurality of bar sub-modules on the heat sink is dispelled the heat, has effectively released the stress in the packaging process, has reduced the chip because of the stress risk of drawing apart, and the light speed quality is superior to the great array of encapsulation stress.
2. The utility model discloses a laser instrument bar array package structure, gilding electrode and insulator foot pass through the brazing material welding, have avoided gilding electrode and insulator foot dislocation phenomenon in the manufacturing process, have promoted the stability of encapsulation, through the welding of alloy solder between the adjacent bar strip submodule piece, increase the stability of product in long-term use.
3. The utility model discloses a laser instrument bar array packaging structure through the electrode integrated design, has reduced array package half the face of weld, has effectively promoted the stability of encapsulation.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are specifically illustrated below, and the detailed description is given in conjunction with the accompanying drawings.
Drawings
Fig. 1 is a schematic diagram of a laser bar array package structure according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating a connection between a gold-plated electrode and an insulating base according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a bar strip sub-module provided by an embodiment of the present invention.
Icon: 100-heat sink for heat dissipation; a 200-bar sub-module; 201-gold plated electrodes; 202-chip; 203-an insulating base; 300-an insulating base; 400-a conductive member; 500-double-sided copper-clad part.
Detailed Description
In order to further explain the technical means and effects of the present invention adopted to achieve the objectives of the present invention, the following detailed description will be made in conjunction with the accompanying drawings and the detailed description of the embodiments according to the present invention.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention to achieve the predetermined objects can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are only for reference and description and are not intended to limit the technical solution of the present invention.
Example one
Referring to fig. 1-3, fig. 1 is a schematic diagram of a laser bar array package structure according to an embodiment of the present invention; fig. 2 is a schematic view illustrating a connection between a gold-plated electrode and an insulating base according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a bar sub-module provided by an embodiment of the present invention.
The laser bar array package structure of this embodiment includes: the heat sink comprises a heat dissipation heat sink 100 and a laser bar array, wherein the laser bar array is fixedly connected with the upper surface of the heat dissipation heat sink 100. Specifically, the laser bar array comprises a plurality of bar sub-modules 200, the bar sub-modules 200 form an array structure of 1 × N, N is greater than or equal to 2, and adjacent bar sub-modules 200 are fixedly connected.
In the embodiment, a mode of packaging a plurality of bar sub-modules on the heat dissipation heat sink is adopted, so that the stress in the packaging process is effectively released, the risk of tension fracture of the chip due to the stress is reduced, and the light speed quality is superior to that of an array with larger packaging stress.
Specifically, the bar sub-module 200 includes a gold-plated electrode 201, a chip 202 and an insulating base 203, wherein the gold-plated electrode 201 is located on an upper surface of the insulating base 203 and is fixedly connected to the insulating base 203, the chip 202 is located on a side surface of the gold-plated electrode 201 and is fixedly connected to the gold-plated electrode 201, and the insulating base 203 is fixedly connected to an upper surface of the heat sink 100.
Specifically, the gold-plated electrode 201 is welded to the insulating base 203 through a brazing material, in this embodiment, the insulating base 203 is a ceramic sheet made of a high thermal conductivity double-sided gold-plated ceramic material, and specifically, a mechanical jig designed in a matching manner may be used to press the gold-plated electrode, the brazing material, and the bottom ceramic sheet together and place them in a high-temperature reflow soldering process for soldering, where the soldering maximum temperature is 350 ℃.
Further, in the present embodiment, the chip 202 is soldered to the gold-plated electrode 201 by a brazing material. Specifically, a mechanical jig with a matched design can be adopted to press the gold-plated electrode, the brazing material and the chip which are welded with the insulating base together, and the gold-plated electrode, the brazing material and the chip are placed in high-temperature reflow soldering for welding, wherein the highest welding temperature is 350 ℃.
The bar array packaging structure of the laser can reduce the welding surface of half of array packaging through the integrated design of the electrodes, and effectively improves the packaging stability.
Further, the adjacent bar sub-modules 200 are soldered by alloy solder, and the insulating base 203 is soldered with the heat sink 100 by alloy solder.
In this embodiment, the alloy solder is indium-lead alloy, and optionally, the sintered bar sub-modules are combined into an array by using a specially designed mechanical jig, and are soldered by using the alloy solder (indium-lead alloy) and the oxygen-free copper heat sink, wherein the soldering temperature is 200 ℃.
According to the bar array packaging structure of the laser, the gold-plated electrode and the insulating base are welded through the brazing material, the phenomenon that the gold-plated electrode and the insulating base are staggered in the manufacturing process is avoided, the packaging stability is improved, and the adjacent bar sub-modules are welded through the alloy solder, so that the performance stability of the product in the long-term use process is improved.
Further, the laser bar array package structure further includes two edge insulators 300, where both edge insulators 300 are fixedly connected to the upper surface of the heat sink 100; two edge insulators 300 are located at both ends of the laser bar array, and are both fixedly connected to the insulating bases 203 of the bar sub-modules 200 adjacent thereto.
Further, the laser bar array package structure further includes two conductive components 400, and the two conductive components 400 are located on the upper surface of the corresponding edge insulator 300 and are fixedly connected with the edge insulator; one end of the conductive member 400 is fixedly connected to the gold-plated electrode 201 of the bar sub-module 200 adjacent thereto.
In this embodiment, two side surfaces of the heat sink 100 are provided with a groove structure. Specifically, the conductive part 400 includes a first conductive part and a second conductive part connected, wherein a first end of the first conductive part is fixedly connected with the gold-plated electrode 201 of the corresponding bar sub-module 200, and a second end is vertically connected with the second conductive part; the second conductive parts are positioned in the corresponding groove structures.
Further, the laser bar array package structure further includes two double-sided copper-clad members 500, the double-sided copper-clad members 500 are disposed in the corresponding groove structures and located between the conductive member 400 and the edge insulator 300, and in this embodiment, the double-sided copper-clad members 500 serve as insulating supports.
Further, describing a specific packaging process of the laser bar array package structure of the present embodiment, first, an insulating base 203 of a high thermal conductivity double-sided gold-plated ceramic material and a gold-plated electrode 201 are soldered to form a first module by hard solder (as shown in fig. 2), wherein a hard solder layer is disposed on the insulating base 203, and the gold-plated electrode 201 is fixed to the insulating base 203 by the hard solder layer.
Secondly, the first module, the hard solder and the chip 202 are pressed by a matched jig, the bar sub-module 200 is manufactured by welding the hard solder, the hard solder layer is arranged on the gold-plated electrode 201, and the chip 202 is fixed on the gold-plated electrode 201 through the hard solder layer.
Then, the bar sub-module 200 is placed on the upper surface of the heat sink 100 in a horizontal array structure of 1 × n, n ≧ 2 using a special packaging jig, each adjacent bar sub-module 200 and the upper surfaces of the bar sub-module 200 and the heat sink 100 are welded using an alloy solder (indium-lead alloy), and then the edge insulator 300, the double-sided copper-clad member 500, and the conductive member 400 are placed to complete the packaging.
In this embodiment, each bar sub-module belongs to an independent unit, which can avoid the problem that stress caused by the integral sintering of the laser bar array cannot be effectively released, thereby causing the phenomenon of chip cracking, and moreover, the bar sub-modules can be tested and screened in the preparation process, so that the screening of failed chips is removed, the failure risk of the laser bar array is reduced, the packaging qualification rate is improved, and the packaging cost is reduced.
Similarly, when in maintenance, the single failed chip can be conveniently replaced by a new bar sub-module, so that the maintenance cost of a customer is reduced. In addition, the gold-plated electrode and the insulating base are welded through a brazing material, the phenomenon that the gold-plated electrode and the insulating base are staggered in the manufacturing process is avoided, the personnel packaging yield and the efficiency are improved, adjacent bar sub-modules are welded through an alloy solder, and the tensile strength of the alloy solder is far greater than that of a conventional soft solder, so that the stability of a product in use can be effectively improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrases "comprising one of \8230;" does not exclude the presence of additional like elements in an article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The directions or positional relationships indicated by "upper", "lower", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments shown and described. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (10)
1. A laser bar array package structure, comprising: a heat sink (100) and an array of laser bars, wherein,
the laser bar array is fixedly connected with the upper surface of the heat dissipation heat sink (100);
the laser bar array comprises a plurality of bar sub-modules (200), the bar sub-modules (200) form an array structure of 1 × N, N is more than or equal to 2, and the adjacent bar sub-modules (200) are fixedly connected;
the bar sub-module (200) comprises a gold-plated electrode (201), a chip (202) and an insulating base (203), wherein the gold-plated electrode (201) is located on the upper surface of the insulating base (203) and fixedly connected with the insulating base (203), the chip (202) is located on the side surface of the gold-plated electrode (201) and fixedly connected with the gold-plated electrode (201), and the insulating base (203) is fixedly connected with the upper surface of the heat sink (100).
2. The laser bar array package structure of claim 1, further comprising two edge insulators (300), wherein both of the edge insulators (300) are fixedly connected with an upper surface of the heat sink (100);
the two edge insulators (300) are located at two ends of the laser bar array and are fixedly connected with the insulation base (203) of the bar sub-module (200) adjacent to the edge insulators.
3. The laser bar array package structure of claim 2, further comprising two conductive components (400), the two conductive components (400) being fixedly connected to the edge insulator (300) and located on an upper surface of the edge insulator;
one end of the conductive member (400) is fixedly connected to the gold-plated electrode (201) of the bar sub-module (200) adjacent thereto.
4. The laser bar array package structure of claim 3, wherein both sides of the heat sink (100) are provided with a groove structure.
5. The laser bar array package structure of claim 4, wherein the electrically conductive component (400) comprises a first electrically conductive portion and a second electrically conductive portion that are connected, wherein,
a first end of the first conductive part is fixedly connected with the gold-plated electrode (201) of the corresponding bar sub-module (200), and a second end of the first conductive part is vertically connected with the second conductive part;
the second conductive parts are positioned in the corresponding groove structures.
6. The laser bar array package structure of claim 4, further comprising two double-sided copper-clad pieces (500), the double-sided copper-clad pieces (500) being disposed within the respective groove structures and between the conductive part (400) and the edge insulator (300).
7. The laser bar array package structure of claim 1, wherein the gold-plated electrode (201) is soldered to the insulating base (203) by a brazing material.
8. The laser bar array package structure of claim 1, wherein the chip (202) is soldered to the gold-plated electrode (201) by a brazing material.
9. The laser bar array package structure of claim 1, wherein adjacent bar sub-modules (200) are soldered to each other by a solder alloy.
10. The laser bar array package structure of claim 1, wherein the insulating base (203) is soldered with the heat sink (100) by a solder alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221609350.4U CN217607193U (en) | 2022-06-24 | 2022-06-24 | Laser bar array packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221609350.4U CN217607193U (en) | 2022-06-24 | 2022-06-24 | Laser bar array packaging structure |
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| Publication Number | Publication Date |
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| CN217607193U true CN217607193U (en) | 2022-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221609350.4U Active CN217607193U (en) | 2022-06-24 | 2022-06-24 | Laser bar array packaging structure |
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