CN217604768U - Novel capillary temperature-uniforming plate - Google Patents

Abstract

The utility model discloses a novel capillary temperature-equalizing plate, which comprises a bottom plate, a cover plate, a water condensing plate and a capillary structure, wherein a sealed cavity is enclosed between the cover plate and the bottom plate, and working fluid is filled in the cavity; the capillary structure is arranged in the cavity, and the water condensation plate is arranged in the cavity and attached to the cover plate; the water condensation plate is provided with a water condensation structure. The water condensation structure of the utility model promotes the dispersed water molecules to be rapidly gathered together to form larger water drops, which is beneficial to the absorption of the capillary structure; therefore, the working liquid in the temperature-equalizing plate can be promoted to flow back, and the heat dissipation efficiency of the temperature-equalizing plate is improved.

Description

Novel capillary temperature-uniforming plate

Technical Field

The utility model relates to an electronic component heat dissipation technical field specifically is a novel capillary samming board.

Background

Along with the higher and higher degree of circuit integration, packing density and operating frequency constantly improve for unit volume's electronic component calorific capacity and the energy consumption of single chip increase, and the design of equipment compact structure makes the heat dissipation more difficult again, therefore urgent need solve high-efficient heat dissipation technical problem.

The traditional cooling modes such as air natural convection, air forced convection, liquid natural convection and the like are difficult to meet the requirements of further development in the electronic field; the special heat dissipation modes such as forced convection of liquid and gas/liquid phase change become the selection of the heat dissipation mode in the electronic field at present and in a period of time in the future. The heat pipe type heat dissipation technology has the advantages of high heat transfer performance, excellent isothermal performance, no need of additional power drive and the like, so that the heat pipe type heat dissipation technology is widely applied to heat dissipation of electronic and electrical equipment. However, the heat conduction mode is one-dimensional, and in some applications, the heat conduction capability is limited due to the small heat transfer area and the large contact resistance. Compared with a common heat pipe, the soaking plate has different heat conduction modes, the heat conduction mode is two-dimensional and is a surface heat conduction mode, and the high heat flow density of one or more concentrated point heat sources can be quickly and uniformly distributed to a large plane in an approximately isothermal mode, so that the heat flow density can be quickly reduced; the plane structure can be directly contacted with most of the heat sources (chips) in the electronic field at present, and the overall thermal resistance of the system is reduced. Therefore, the vapor chamber is widely used in the field of electronic heat dissipation.

However, in the thin vapor chamber, the vapor chamber structure having a long heat dissipation area has a relatively high resistance to the coolant flowing back to the heating area, so that the heat dissipation performance of the vapor chamber is affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the shortcomings of the prior art and provide a novel capillary temperature-uniforming plate.

In order to achieve the above object, the utility model provides a following technical scheme:

a novel capillary temperature equalizing plate comprises a bottom plate, a cover plate, a water condensing plate and a capillary structure, wherein a sealed cavity is defined between the cover plate and the bottom plate, and working fluid is filled in the cavity; the capillary structure is arranged in the cavity, and the water condensation plate is arranged in the cavity and attached to the cover plate; the water condensation plate is provided with a water condensation structure.

In a preferred scheme, the water condensation plate further comprises a main plate body, the main plate body is attached to the cover plate, and the water condensation structure is arranged on the main plate body and located on one side close to the capillary structure.

Furthermore, the water condensation structure is provided with a plurality of conical teeth, and the conical teeth are arranged on the main plate body.

Furthermore, the conical teeth are formed by sintering copper powder

In a preferred scheme, the fiber net is laid on the water condensation plate and is positioned on one side close to the capillary structure.

Further, the fiber net comprises a plurality of fiber yarns, the plurality of fiber yarns respectively form a plurality of fiber ropes, and the plurality of fiber ropes are woven into the fiber net.

Furthermore, the fiber filaments are made of copper.

In a preferred embodiment, a plurality of the fiber filaments are arranged side by side and fixed to form the fiber rope.

In a preferred embodiment, a plurality of the fiber filaments are twisted to form the fiber rope.

In a preferred embodiment, a plurality of the fiber filaments are interlaced to form the fiber rope.

Compared with the prior art, the utility model discloses following beneficial effect has:

the bottom plate is an evaporation end, and the cover plate is a condensation end; the bottom plate is attached to the electronic element which generates heat; the working fluid absorbs heat at the evaporation end to evaporate, rises to the condensation end, and exchanges heat with the outside through the water condensation plate and the cover plate; the working solution after heat exchange is gradually condensed into liquid molecules, water molecules are dispersedly adhered to the water condensing plate under the tension action of the liquid, and the dispersed water molecules are promoted to be rapidly gathered together through the water condensing structure to form larger water drops, so that the absorption of the capillary structure is facilitated; therefore, the working liquid in the temperature-equalizing plate can be promoted to flow back, and the heat dissipation efficiency of the temperature-equalizing plate is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is an exploded view of a vapor chamber of the present invention;

FIG. 2 is an exploded view of the middle vapor chamber of the present invention from another perspective;

FIG. 3 is a partial enlarged view of the condensate plate of the present invention;

FIG. 4 is an enlarged view of a portion of a web of the present invention;

FIG. 5 is a schematic view of a fiber rope according to the present invention;

the reference numbers illustrate:

1-a bottom plate;

2-cover plate;

3-a water condensation plate; 31-a main board body; 32-awl teeth;

4-a capillary structure;

5-a fiber web; 51-fiber silk.

Detailed Description

For the purpose of promoting a better understanding of the objects, structures, features, and functions of the invention, reference should now be made to the drawings and detailed description of the invention. It should be noted that the features illustrated in the drawings are not necessarily drawn to scale. Moreover, the described embodiments are only some of the described embodiments of the present invention, and not all of them. All other embodiments, which can be obtained by a person skilled in the art without any inventive work based on the described embodiments of the present invention, belong to the protection scope of the present invention.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", "front", "rear", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

Examples

As shown in fig. 1 and 2, the present embodiment provides a novel capillary temperature equalization plate, which includes a bottom plate 1, a cover plate 2, a water condensation plate 3, and a capillary structure 4, wherein a sealed cavity is defined between the cover plate 2 and the bottom plate 1, and a working fluid is filled in the cavity; the capillary structure 4 is arranged in the cavity, and the water condensation plate 3 is arranged in the cavity and attached to the cover plate 2; the water condensation plate 3 is provided with a water condensation structure.

The bottom plate 1 is an evaporation end, and the cover plate 2 is a condensation end; the bottom plate 1 is attached to a heating electronic element; the working solution absorbs heat at the evaporation end to evaporate, rises to the condensation end, and exchanges heat with the outside through the water condensation plate 3 and the cover plate 2; the working solution after heat exchange is gradually condensed into liquid molecules, the water molecules are dispersedly adhered to the water condensation plate 3 under the tension action of the liquid, and the dispersed water molecules are promoted to be rapidly gathered together through the water condensation structure to form larger water drops, so that the absorption of the capillary structure 4 is facilitated; therefore, the working liquid in the temperature-equalizing plate can be promoted to flow back, and the heat dissipation efficiency of the temperature-equalizing plate is improved.

As shown in fig. 1, in the present embodiment, the cover plate 2 is a flat plate; the middle part of the bottom plate 1 is sunken to form a concave platform and a flange outside the concave platform, and the edges of the flange and the cover plate 2 are mutually attached and hermetically connected, so that the cavity is formed between the cover plate 2 and the bottom plate 1; the flange is provided with a liquid injection interface which is communicated with the cavity, and a liquid injection pipe (not shown) is positioned in the liquid injection interface and is hermetically connected with the liquid injection interface; vacuumizing and depressurizing the cavity, and injecting the working fluid (not shown) into the cavity through the liquid injection pipe (not shown), wherein the working fluid (not shown) is water.

As shown in fig. 1, in the present embodiment, the capillary structure 4 includes a plurality of sintered copper powder 41 and a plurality of supporting pillars 42, the supporting pillars 42 are arranged in the chamber, and one end of each supporting pillar is connected to the base plate 1, and the other end of each supporting pillar is connected to the fiber web 5; the supporting column 42 is provided with a through hole which penetrates through the supporting column from top to bottom, and the sintered copper powder 41 is filled in the through hole.

As shown in fig. 2 and 3, in the present embodiment, the water condensation plate 3 includes a main plate body 31 and a water condensation structure, the main plate body 31 is a thin sheet made of copper, has the same shape as the cross section of the chamber, and is attached to the cover plate 2, and the water condensation structure is disposed on the main plate body 31 and is located at a side close to the capillary structure 4; the water condensation structure is a plurality of conical teeth 32, the conical teeth 32 are arranged on the main plate body 31, and the arrangement mode can be a matrix or a plurality of circular ring arrays. The condensed working fluid is converged towards the cusp of the cone 32 under the action of gravity to form larger water drops, so that the capillary structure 4 can absorb the working fluid to promote the backflow of the working fluid.

Furthermore, the conical teeth are formed by sintering copper powder.

In a preferred embodiment, as shown in fig. 1, the temperature equalization plate further comprises a fiber web 5, said fiber web 5 being laid on said water condensation plate 3 and located on the side close to said capillary structure 4. The fiber net 5 is used for absorbing the working fluid condensed into water drops on the water condensation plate 3, so that the working fluid can be better absorbed by the capillary structure 4, and the backflow of the working fluid can be further promoted.

As shown in fig. 1, in this embodiment, the fiber web 5 is provided with a plurality of through holes corresponding to the supporting columns 42 and the sintered copper powder 41, and each of the supporting columns 42 and each of the sintered copper powder 41 pass through the through holes to connect the water condensation plate 3 and the base plate 1.

As shown in FIGS. 4 and 5, the fiber web 5 further includes a plurality of fiber filaments 51, wherein the fiber filaments 51 are made of copper and have a diameter of 0.03 (tolerance: +/-0.02) mm. The plurality of filaments 51 respectively form a plurality of fiber ropes, and the plurality of fiber ropes are woven into the fiber web 5 by ninety degrees. Other embodiments may use other angles of weave. The fiber rope formed by the plurality of fiber filaments 51 has strong capillary suction force, and is beneficial to absorbing water molecules from the water condensation plate 3 and transmitting the water molecules to the capillary structure 4 through the meshes so as to promote the backflow of the working fluid.

As shown in fig. 5, in the present embodiment, a plurality of fiber filaments 51 are twisted to form the fiber rope. In other embodiments, a plurality of the fiber filaments 51 are arranged side by side and fixed to form the fiber rope or a plurality of the fiber filaments 51 are woven in a staggered manner to form the fiber rope.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A novel capillary temperature equalizing plate is characterized by comprising a bottom plate, a cover plate, a water condensing plate and a capillary structure, wherein a sealed cavity is defined between the cover plate and the bottom plate, and working liquid is filled in the cavity; the capillary structure is arranged in the cavity, and the water condensation plate is arranged in the cavity and attached to the cover plate; the water condensation plate is provided with a water condensation structure.

2. The novel capillary vapor chamber of claim 1, wherein said condensation plate further comprises a main plate attached to said cover plate, said condensation structure being disposed on said main plate and on a side adjacent to said capillary structure.

3. The novel capillary vapor chamber as claimed in claim 2, wherein the water-condensing structure is a plurality of conical teeth, and the conical teeth are arranged on the main plate body.

4. The novel capillary thermal equalizer plate of claim 3, wherein said tapered teeth are sintered from copper powder.

5. The novel capillary vapor-distribution plate of claim 1, further comprising a fibrous web, said fibrous web being laid on said wicking plate and being positioned adjacent to said capillary structure.

6. A novel capillary thermal equalization plate as claimed in claim 5, wherein said fiber web comprises a plurality of filaments, each of said plurality of filaments forming a plurality of strands, said plurality of strands being woven into said fiber web.

7. The novel capillary vapor chamber of claim 6, wherein said filaments are copper.

8. The novel capillary vapor chamber of claim 6, wherein a plurality of said filaments are juxtaposed and secured as said fiber strands.

9. The novel capillary vapor chamber of claim 6, wherein a plurality of said filaments are twisted into said fiber rope.

10. The novel capillary vapor chamber of claim 6, wherein a plurality of said filaments are interlaced to form said fiber strand.

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