CN217587734U - Optical member driving device, camera device, and electronic apparatus - Google Patents
Optical member driving device, camera device, and electronic apparatus Download PDFInfo
- Publication number
- CN217587734U CN217587734U CN202221870121.8U CN202221870121U CN217587734U CN 217587734 U CN217587734 U CN 217587734U CN 202221870121 U CN202221870121 U CN 202221870121U CN 217587734 U CN217587734 U CN 217587734U
- Authority
- CN
- China
- Prior art keywords
- pad
- wiring layer
- optical component
- driving device
- component driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides an optical component drive arrangement, camera device and electronic equipment that the pad of flexible printed circuit board is difficult to peel off because of the heat that produces during the welding. An FPC (74) of an optical component driving device (1) has a 1 st wiring layer (710), a 2 nd wiring layer (720), and an insulating layer (730). A1 st wiring layer (710) is provided on the surface. The 2 nd wiring layer (720) is provided on the back surface side of the 1 st wiring layer (710) at a distance from the 1 st wiring layer (710). An insulating layer (730) separates the 1 st wiring layer (710) from the 2 nd wiring layer (720). The 1 st wiring layer (710) has a 1 st pad (711), and the 2 nd wiring layer (720) has a 2 nd pad (721) at a position facing the 1 st pad (711). Furthermore, the 1 st pad (711) and the 2 nd pad (721) are connected by at least 2 through holes (731) formed by metal. A1 st pad (711) provided in the 1 st wiring layer (710) is a bonding surface.
Description
Technical Field
The utility model relates to an use in optical component drive arrangement, camera device and electronic equipment of electronic equipment such as smart mobile phone.
Background
Documents of the prior art
Patent document
Patent document 1: china utility model authorization announcement No. 207020434
However, the FPC described above causes the pads to be easily peeled off by heat generated during soldering, and this causes a reduction in the manufacturing yield of the optical component driving device.
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical component driving device, a camera device, and an electronic apparatus in which a pad of a flexible printed circuit board is less likely to be peeled off by heat generated during soldering.
Means for solving the problems
In order to solve the above problem, an optical component driving device according to a preferred aspect of the present invention includes: a fixed part; a movable portion that supports an optical component and is movable relative to the fixed portion; and a flexible printed circuit board provided on at least one of the fixed part and the movable part, the flexible printed circuit board including: the 1 st wiring layer is arranged on the surface; a 2 nd wiring layer provided on the back surface side of the 1 st wiring layer at a distance from the 1 st wiring layer; and an insulating layer which separates the 1 st wiring layer and the 2 nd wiring layer, wherein the 1 st wiring layer has a 1 st pad for soldering, the 2 nd wiring layer has a 2 nd pad at a position facing the 1 st pad, and the 1 st pad and the 2 nd pad are connected by at least 2 through holes made of metal.
In this embodiment, the 2 nd pad and the 1 st pad may have substantially the same size.
The 1 st land may have a rectangular shape, and 2 through holes may be arranged along a longitudinal direction of the rectangular shape of the 1 st land.
The 2 nd wiring layer may have a 2 nd ' pad provided on the back surface thereof for use in soldering, the 1 st wiring layer may have a 1 st ' pad at a position facing the 2 nd ' pad, and the 2 nd ' pad and the 1 st ' pad may be connected by at least 2 through holes formed of a metal.
A camera device according to another preferred embodiment of the present invention includes the above-described optical component driving device.
An electronic device according to another preferred embodiment of the present invention includes the above-described camera device.
An optical component driving device according to a preferred embodiment of the present invention includes: a fixed part; a movable portion that supports an optical component and is movable relative to the fixed portion; and a flexible printed circuit board provided on at least one of the fixed portion or the movable portion. The flexible printed circuit board includes: the 1 st wiring layer is arranged on the surface; a 2 nd wiring layer provided on the back surface side of the 1 st wiring layer at a distance from the 1 st wiring layer; and an insulating layer which separates the 1 st wiring layer from the 2 nd wiring layer. The 1 st wiring layer has a 1 st pad used for bonding, the 2 nd wiring layer has a 2 nd pad at a position facing the 1 st pad, and the 1 st pad and the 2 nd pad are connected by at least 2 through holes formed of a metal. Therefore, according to the present invention, the movement of the 2 nd pad connected with the 1 st pad via the through hole is prevented by the insulating layer located between the 1 st pad and the 2 nd pad, and thus the 1 st pad cannot be separated from the insulating layer. In addition, since 2 through holes are provided, the effect can be exhibited in a particularly wide range as compared with the case where 1 through hole is provided. Therefore, the peeling of the pad due to heat at the time of soldering can be prevented.
Drawings
Fig. 1 is a front view of a smartphone 101 mounted with a camera device 100, and the camera device 100 includes an optical component driving device 1 including an FPC74 according to an embodiment of the present invention.
Fig. 2 is a perspective view of the optical component driving device 1 of fig. 1.
Fig. 3 is an exploded perspective view of the optical component driving device 1 of fig. 2.
Fig. 4 is a front view of the 1 st wiring layer 710 in the vicinity of the connection portion 74c of the FPC74 of fig. 3 as viewed from the + X side.
Fig. 5 is a front view of the 2 nd wiring layer 720 near the connection portion 74c of the FPC74 of fig. 3 viewed from the + X side.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in fig. 1, a camera apparatus 100 including an optical component driving apparatus 1 is housed in a case of a smartphone 101. The optical component driving device 1 includes an FPC74 as one embodiment of the present invention.
The camera apparatus 100 includes: a lens body 5 as an optical member, an image sensor 12 that converts light incident via the lens body 5 into an image signal, and an optical member driving device 1 that holds the lens body 5 and the image sensor 12 and drives the lens body 5.
In the drawings of the present application, an XYZ rectangular coordinate system is shown, which is composed of a Z axis parallel to the optical axis of the lens body 5, and X and Y axes orthogonal to each other and to the Z axis.
The optical component driving device 1 includes: the mobile terminal includes a fixed portion 2 fixed to a housing of the smartphone 101, a movable portion 3 movable in the Z-axis direction relative to the fixed portion 2, and a support portion 10 supporting the movable portion 3.
As shown in fig. 3, the fixing portion 2 includes: the housing 11, the frame 30, the base 40, the magnet 71, the FPC74, and the position detection sensor 75. The cover 11 and the base 40 are combined to form a housing, and the movable portion 3 is housed therein. The frame 30 is fixed to the front end portion inside the housing 11, and the front end face of the magnet 71 is fixed to the frame 30. The FPC74 to which the position detection sensor 75 is fixed to the base 40.
The movable unit 3 includes a lens support 9, a coil 73, and a position detection magnet 76. The lens support 9 has a through hole 95 at the center as a mounting portion for mounting the lens body 5, and the lens body 5 is accommodated and held in the through hole 95. The coil 73 is wound around the lens support 9, and the position detection magnet 76 is fixed thereto. The coil 73 is opposed to the magnet 71 with a slight gap therebetween, and generates a driving force of the movable portion 3.
The support portion 10 has a front plate spring 50 and a rear plate spring 60. The movable portion 3 is connected to the frame 30 and the base 40 as the fixed portion 2 via a front plate spring 50 and a rear plate spring 60 as the support portion 10.
The FPC74 is provided along the inner wall surface of the + X side of the housing 11, and a connection portion 74c is provided at the lower end portion. The surface on the + X side of the FPC74 is a front surface 74a, and the surface on the-X side is a rear surface 74b. The back surface 74b of the connecting portion 74c is fixed to the base 40. The surface 74a of the connecting portion 74c is exposed to the outside and electrically connected to the outside of the optical component driving device 1.
The rear plate spring 60 is electrically connected to the rear surface 74b other than the connection portion 74c. Thus, a current path of FPC74, rear plate spring 61, coil 73, rear plate spring 62, and FPC74 is formed. A position detection sensor 75 is fixed to a rear surface 74b of the FPC74 facing the movable portion 3. A position detection magnet 76 is fixed to the lens support 9 of the movable portion 3 so as to face the position detection sensor 75. The position detection sensor 75 detects the position of the movable portion 3, that is, the position of the lens body 5 in the optical axis direction based on a change in the magnetic field of the position detection magnet 76 accompanying the movement of the movable portion 3, and outputs a signal indicating the position.
When a current flows through the coil 73, a Z-direction electromagnetic force is generated in the coil 73, and the movable portion 3 moves in the Z-direction together with the lens body 5 against the biasing forces of the front-side plate spring 50 and the rear-side plate spring 60, thereby performing focus adjustment.
As shown in fig. 4 and 5, the FPC74 has a 1 st wiring layer 710, a 2 nd wiring layer 720, and an insulating layer 730. The 1 st wiring layer 710 is provided on the surface 74a of the FPC74 and is covered with a cover layer except for a 1 st pad 711 described later. The 2 nd wiring layer 720 is provided on the back surface side of the 1 st wiring layer 710 at a distance from the 1 st wiring layer 710, and is covered with an overcoat layer except for a pad portion including a 2 nd pad 721 to be described later. The insulating layer 730 separates the 1 st wiring layer 710 from the 2 nd wiring layer 720. In the present embodiment, the 2 nd wiring layer 720 is provided on the back surface 74b. The surface 74a faces the outside of the device, and the 1 st wiring layer 710 is electrically connected to the optical component driving device 1. The rear surface 74b faces the inner periphery of the optical component driving device 1, and the 2 nd wiring layer 720 is electrically connected to the position detection sensor 75 and the rear leaf spring 60.
In the connection portion 74c, the 1 st wiring layer 710 and the 2 nd wiring layer 720 have the 1 st pad 711 and the 2 nd pad 721 facing each other with the insulating layer 730 interposed therebetween, respectively. In this embodiment, 6 first pads 711-1 to 711-6 are formed on the front surface 74a of the FPC74 and used for soldering to external wirings. In addition, 6 second pads 721-1 to 721-6 are formed on the back surface 74b of the FPC74. Here, the 1 st pads 711-1 to 711-6 and the 2 nd pads 721-1 to 721-6 sandwich the insulating layer 730 therebetween and correspond to each other, each corresponding pair having almost the same size. Note that, in the case where it is not necessary to distinguish between the pads, a generic name of the 1 st pad 711 or the 2 nd pad 721 is used. The 2 nd land 721 is not soldered, and is not defined as an original land, but is provided corresponding to the 1 st land 711 and has the same shape as the 1 st land 711, and is therefore referred to as a land.
The insulating layer 730 has at least 2 through holes 731 which electrically connect the 1 st pad 711 and the 2 nd pad 721 facing each other. In the example shown in fig. 4 and 5, 2 through holes 731-1a and 731-1b are provided so as to penetrate the insulating layer 730, and the 2 through holes 731-1a and 731-1b electrically connect the 1 st pad 711-1 and the 2 nd pad 721-1 which are opposite to each other. Similarly, 2 through holes 731 connecting the 1 st pad 711 and the 2 nd pad 721 are also provided for each pair from the pair of the 1 st pad 711-2 and the 2 nd pad 721-2 to the pair of the 1 st pad 711-6 and the 2 nd pad 721-6. The inner wall surfaces of the through holes 731 are covered with a metal plating layer that connects the 1 st pad 711 and the 2 nd pad 721 on both sides of the insulating layer 730. Note that, when it is not necessary to distinguish between the through holes, a generic term of the through hole 731 is used.
In the example shown in fig. 4 and 5, 2 through holes 731 are formed in the region near the + Z-side end portions of the 1 st pad 711 and the 2 nd pad 721. However, the 2 through holes 731 may be formed at any position as long as they are in the 1 st pad 711 and 2 nd pad 721 regions. In the illustrated example, the 1 st pad 711 and the 2 nd pad 721 are connected by 2 through holes 731, but the 1 st pad 711 and the 2 nd pad 721 may be connected by 3 or more through holes 731. The 1 st land 711 and the 2 nd land 721 have a rectangular shape elongated in the Z direction, and 2 through holes 731 are arranged along the longitudinal direction of the rectangular shape of the 1 st land 711. The 2 through holes 731 may be provided at both ends of the 1 st pad 711 in the longitudinal direction of the rectangle.
In the 1 st wiring layer 710 of the FPC74 shown in fig. 4, wirings extend from the 1 st pads 711-1, 711-3, 711-5 to other places, and the corresponding 2 nd pads 721-1, 721-3, 721-5 exist independently. That is, the 2 nd pads 721-1, 721-3, 721-5 are so-called dummy pads. In addition, the 2 nd pads 721-2, 721-4, 721-6 corresponding to the 1 st pads 711-2, 711-4, 711-6 are not necessary if they are only a wiring function, but are provided in order to prevent the peeling of the 1 st pads 711-1, 711-3, 711-5.
As described above, the FPC74 of the present embodiment includes the 1 st wiring layer 710, the 2 nd wiring layer 720, and the insulating layer 730. The 1 st wiring layer 710 is disposed on the surface. The 2 nd wiring layer 720 is provided on the back surface side of the 1 st wiring layer 710 with a distance from the 1 st wiring layer 710. The insulating layer 730 separates the 1 st wiring layer 710 from the 2 nd wiring layer 720. The 1 st wiring layer 710 has a 1 st pad 711, and the 2 nd wiring layer 720 has a 2 nd pad 721 at a position opposite to the 1 st pad 711. Also, the 1 st pad 711 and the 2 nd pad 721 are connected by at least 2 via holes 731 formed of metal. The 1 st pad 711 provided in the 1 st wiring layer 710 is a bonding surface. Therefore, when the wiring outside the optical component driving device 1 is connected to the 1 st pad 711 by soldering, it is possible to prevent the pads from being peeled off by heat at the time of soldering. That is, the movement of the 2 nd pad 721 connected to the 1 st pad 711 via the via 731 is blocked by the insulating layer 730 between the 1 st pad 711 and the 2 nd pad 721, and thus the 1 st pad 711 cannot be separated from the insulating layer 730. Since 2 through holes 731 are provided, the effect can be exhibited in a particularly wide range as compared with the case where 1 through hole is provided. Therefore, the peeling of the pad due to heat at the time of soldering can be prevented.
As described above, the position detection sensor 75 and the back plate spring 60 are electrically connected to each other. The connection structure at this time is the same as the connection portion 74c. The 2 nd wiring layer 720 has a 2 nd' pad provided on the back surface 74b and used for soldering. The 1 st wiring layer 710 has a 1 st 'pad at a position opposed to the 2 nd' pad. The 2 'th and 1' th pads are connected by at least 2 vias 731 formed of metal. The position detection sensor 75 and the rear leaf spring 60 are soldered to the 2' nd land.
In addition, in the present embodiment, the present invention is applied to the FPC having the 1 st wiring layer 710 and the 2 nd wiring layer 720 in two layers, but the present invention can also be applied to an FPC having 3 or more layers including other wiring layers in addition to the 1 st wiring layer 710 and the 2 nd wiring layer 720. In this case, the 3 rd wiring layer may be provided between the 1 st wiring layer 710 and the 2 nd wiring layer 720, or may be provided on the back surface side of the 2 nd wiring layer 720. In addition, a 3 rd pad may be provided in the 3 rd wiring layer, and the 1 st pad 711, the 2 nd pad 721, and the 3 rd pad may be connected by a via.
In the present embodiment, the FPC74 is disposed at the fixing portion of the optical component driving device 1 having the lens body 5 as the optical component, but may be disposed in an optical component driving device having the image sensor 12 as the optical component and driving the image sensor 12, for example. In this case, the FPC can connect the image sensor 12 with the outside of the optical component driving device.
Description of the symbols:
1 \ 8230, an optical component driving device; 2\8230afixed part; 3 \ 8230and a movable part; 5 \ 8230and a lens body; 9' \ 8230and a lens support; 10 \ 8230and a support part; 11 8230a housing; 12\8230; image sensor; 30 \ 8230and a frame body; 40, 8230a base; 95 \ 8230a through hole; 50 8230and a front side plate spring; 60 \ 8230and a rear side plate spring; 71 \ 8230and a magnet; 73, 8230a coil; 74\8230andFPC; 74 a\8230asurface; 74b 8230and back; 74c 8230a connecting part; 710 8230a 1 st wiring layer; 720 \ 8230and 2 nd wiring layer; 730, 8230a dielectric layer; 711. 711-1 to 711-6 \ 8230a 1 st welding disc; 721. 721-1-721-6 \8230a2 nd welding pad; 731-1 a-731-6 a, 731-1 b-731-6 b \8230andthrough hole; 75 \ 8230and a position detection sensor; 76 \ 8230a magnet for position detection; 100 \ 8230a camera device; 101 \ 8230and a smart phone.
Claims (6)
1. An optical component driving device is characterized by comprising:
a fixed part;
a movable portion that supports an optical component and is movable relative to the fixed portion; and
a flexible printed board provided on at least one of the fixed part and the movable part,
the flexible printed circuit board includes:
the 1 st wiring layer is arranged on the surface;
a 2 nd wiring layer provided on a back surface side of the 1 st wiring layer at a distance from the 1 st wiring layer; and
an insulating layer that separates the 1 st wiring layer from the 2 nd wiring layer,
the 1 st wiring layer has a 1 st pad for use in soldering,
the 2 nd wiring layer has a 2 nd pad at a position opposed to the 1 st pad,
the 1 st pad and the 2 nd pad are connected by at least 2 vias formed of metal.
2. Optical component driving apparatus according to claim 1,
the 2 nd pad is almost the same size as the 1 st pad.
3. Optical component driving apparatus according to claim 1,
the 1 st pad is rectangular in shape,
the 2 through holes are arranged along the long side direction of the rectangle of the 1 st bonding pad.
4. Optical component driving device according to claim 1,
the 2 nd wiring layer has a 2 nd' pad provided on the back surface and used for bonding,
the 1 st wiring layer has a 1 st 'pad at a position opposite to the 2 nd' pad,
the 2 nd 'pad and the 1 st' pad are connected by at least 2 of the vias formed of metal.
5. A camera device, characterized in that,
an optical component driving device according to claim 1.
6. An electronic device, characterized in that it comprises a display,
having a camera arrangement as claimed in claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221870121.8U CN217587734U (en) | 2022-07-08 | 2022-07-08 | Optical member driving device, camera device, and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221870121.8U CN217587734U (en) | 2022-07-08 | 2022-07-08 | Optical member driving device, camera device, and electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217587734U true CN217587734U (en) | 2022-10-14 |
Family
ID=83535624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221870121.8U Active CN217587734U (en) | 2022-07-08 | 2022-07-08 | Optical member driving device, camera device, and electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217587734U (en) |
-
2022
- 2022-07-08 CN CN202221870121.8U patent/CN217587734U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7645981B2 (en) | Image pickup device mounting structure for saving space in an optical device | |
| CN112154645B (en) | Camera module and optical device comprising same | |
| CN107957616B (en) | Optical element driving module | |
| EP3817355B1 (en) | Camera module and optical device including same | |
| US20230023813A1 (en) | Sensor driving apparatus | |
| JP2011035458A (en) | Camera module | |
| CN111565276A (en) | Camera module and electronic equipment | |
| US11877392B2 (en) | Flexible wiring board, module, and electronic device | |
| KR100696429B1 (en) | Placement of a camera module in a portable device | |
| CN217587734U (en) | Optical member driving device, camera device, and electronic apparatus | |
| GB2569036A (en) | Assembly of shape memory alloy actuators | |
| CN113840060B (en) | Camera module and electronic equipment | |
| CN114554074A (en) | Driving structure for optical actuator and corresponding camera module | |
| CN113168074A (en) | Lens driving device, camera module, and camera mounting device | |
| CN216930117U (en) | Photosensitive module, image pickup device and electronic equipment | |
| US11147155B2 (en) | Electronic apparatus equipped with flexible boards | |
| CN117676335A (en) | Anti-shake mechanism, camera module and electronic equipment | |
| JP2005072736A (en) | Image pickup unit and image pickup apparatus | |
| CN217643862U (en) | Connection structure of flexible spring circuit board and base, shooting assembly and electronic equipment | |
| US11647266B2 (en) | Electronic apparatus capable of reducing electromagnetic field noise | |
| EP2309829A1 (en) | Multilayer circuit board | |
| CN220493065U (en) | Ultra-miniaturized camera module | |
| CN215344793U (en) | Camera module and electronic equipment | |
| CN216721450U (en) | Sensor assembly moving device, combination thereof and camera module | |
| JP2005268967A (en) | Imaging module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |