CN217587505U - Chip test pressing structure - Google Patents

Abstract

The utility model discloses a chip test compact structure, including last module and lower module, it is located the top position of module down to go up the module, it is provided with sealed protection cotton and location portion to go up between module and the lower module, the upper end four corners position of going up the module is fixed a position the spacing screw, it includes shield cover, first shield cotton, uide pin, first elastic pressing block, second elastic pressing block, third elastic pressing block and pressfitting locating plate to go up the module, first shield cotton is located between shield cover and the pressfitting locating plate. Chip test compact structure, be equipped with module, lower module, go up shield cover and lower shield cover, through carrying out the pressfitting location between last module and the lower module, can make things convenient for more quick chip product to the needs test to fix a position and detect, improve test work's efficiency, the shield cover has fine shielding signal function, can increase the stability ability of test, the precision of test is higher.

Description

Chip test pressing structure

Technical Field

The utility model relates to a chip testing field, in particular to chip testing compact structure.

Background

Chip test compact structure carries out the bearing structure who fixes a position to it when carrying out chip product test, when testing the chip, at first needs fix a position the position of chip, prevents the condition of off tracking from appearing, and along with the continuous development of science and technology, people also are higher and higher to chip test compact structure's manufacturing process requirement.

The existing chip test pressing structure has certain defects when in use, firstly, the chip test pressing structure cannot be positioned at the position of the chip conveniently and quickly, the test efficiency is reduced, people cannot use the chip test pressing structure, in addition, the chip test pressing structure is troublesome when in test, the signal interference condition can occur, the test performance is poor, certain adverse effects are brought to the use process of people, and therefore the chip test pressing structure is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a chip test compact structure carries out the pressfitting location between through last module and the lower module, can make things convenient for more quick chip product to the needs test to fix a position and detect, improves test work's efficiency, and the shield cover has fine shielding signal function, can increase the stability ability of test, and the precision of test is higher, can effectively solve the problem in the background art.

(II) technical scheme

In order to achieve the above purpose, the utility model adopts the following technical scheme: chip test compact structure, including last module and lower module, go up the module and be located the top position of lower module, it is provided with sealed protection cotton and location portion to go up between module and the lower module, the upper end four corners position location of going up the module has spacing screw.

Preferably, the upper module comprises an upper shield cover, a first shield cotton, a guide pin, a first elastic pressing block, a second elastic pressing block, a third elastic pressing block and a press-fit positioning plate, the first shield cotton is located between the upper shield cover and the press-fit positioning plate, and the guide pin, the first elastic pressing block, the second elastic pressing block and the third elastic pressing block are located at the bottom of the press-fit positioning plate.

Preferably, the lower module includes product locating piece, probe block, PCB keysets, second shielding cotton, lower shield cover, direction bush, test probe, signal plug, signal socket and signal interface, the product locating piece is located the inboard of probe block and the centre sets up the direction bush, signal plug and signal socket are located one side position of PCB keysets, the second shielding cotton is located down on the shield cover.

Preferably, the pressing positioning plate is positioned at the position inside the upper shielding case through a guide pin and sealed through first shielding cotton, and the first elastic pressing block, the second elastic pressing block and the third elastic pressing block are positioned at the bottom of the pressing positioning plate to press the product.

Preferably, the product positioning block is positioned on the inner side of the probe block, the top of the product positioning block is used for positioning the product, and the lower shielding case, the PCB adapter plate and the probe block are positioned and assembled.

Preferably, the upper module moves downwards through the push rod, is positioned at the position of the positioning part and the top of the lower module in a pressing mode, and is limited through the limit screw.

(III) advantageous effects

Compared with the prior art, the utility model provides a chip test compact structure possesses following beneficial effect: the chip test pressing structure is provided with an upper module, a lower module, an upper shield cover and a lower shield cover, and is characterized in that the upper module and the lower module are pressed and positioned, a chip product to be tested can be conveniently and quickly positioned and detected, the efficiency of test work is improved, the shield cover has a good signal shielding function, the stability of the test can be improved, the test precision is higher, the chip test pressing structure mainly comprises the upper module and the lower module, the upper module mainly plays a role in pressing and positioning the product and shielding an external signal, the upper shield cover shields the external signal, a first elastic pressing block, a second elastic pressing block and a third elastic pressing block press-fit product are positioned, the lower module mainly plays a role in testing the product and outputting a signal, a product positioning block is used for placing and positioning the product, the upper module and the lower module are separated in an initial state, a push rod drives the upper module to move downwards, a guide pin is inserted into a guide bush to continue to move downwards, the first elastic pressing block, the second elastic pressing block and the third elastic pressing block to move downwards, after the upper module and the lower module are well pressed, the test point on the product and the test probe are contacted, the test product, the chip through a signal plug, a signal socket and a signal socket are output interface, the whole chip test pressing structure is convenient to use, and the chip test structure is simple and the chip test structure.

Drawings

Fig. 1 is the utility model discloses chip test compact structure's overall structure sketch map.

Fig. 2 is the structure schematic diagram of the whole separation state in the chip testing pressing structure of the present invention.

Fig. 3 is a schematic structural diagram of an explosion diagram of the upper module in the chip testing and compressing structure of the present invention.

Fig. 4 is the structure diagram of the lower module explosion diagram in the chip testing and compacting structure of the utility model.

In the figure: 1. an upper shield case; 2. first shielding cotton; 3. a guide pin; 4. a first elastic pressing block; 5. a second elastic pressing block; 6. a third elastic pressing block; 7. a product positioning block; 8. a probe block; 9. a PCB adapter plate; 10. a second shielding cotton; 11. a lower shield case; 12. a guide bush; 13. testing the probe; 14. a signal plug; 15. a signal socket; 16. a signal interface; 17. pressing a positioning plate; 18. an upper module; 19. a positioning part; 20. sealing protective cotton; 21. a lower module; 22. and a limiting screw.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely below with reference to the accompanying drawings and detailed description, but those skilled in the art will understand that the following described embodiments are some, but not all, of the embodiments of the present invention, and are only used for illustrating the present invention, and should not be considered as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. The examples, in which specific conditions are not specified, were carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The first embodiment is as follows:

as shown in fig. 1-4, the chip testing and compressing structure includes an upper module 18 and a lower module 21, the upper module 18 is located above the lower module 21, a sealing protective cotton 20 and a positioning portion 19 are disposed between the upper module 18 and the lower module 21, and a limit screw 22 is positioned at four corners of the upper end of the upper module 18.

Further, the upper module 18 includes an upper shielding case 1, a first shielding cotton 2, a guide pin 3, a first elastic pressing block 4, a second elastic pressing block 5, a third elastic pressing block 6 and a pressing positioning plate 17, the first shielding cotton 2 is located between the upper shielding case 1 and the pressing positioning plate 17, and the guide pin 3, the first elastic pressing block 4, the second elastic pressing block 5 and the third elastic pressing block 6 are located at the bottom of the pressing positioning plate 17.

Furthermore, the pressing positioning plate 17 is positioned at the position inside the upper shield cover 1 through the guide pin 3 and sealed through the first shield cotton 2, and the first elastic pressing block 4, the second elastic pressing block 5 and the third elastic pressing block 6 are positioned at the bottom of the pressing positioning plate 17 to press the product.

Further, the upper module 18 moves downwards through the push rod to be pressed and positioned at the position of the positioning portion 19 and the top of the lower module 21, and the upper module 18 is limited through the limit screw 22.

Example two:

on the basis of the first embodiment, as shown in fig. 1 to 4, the chip testing and compressing structure includes an upper module 18 and a lower module 21, the upper module 18 is located above the lower module 21, a sealing protection cotton 20 and a positioning portion 19 are disposed between the upper module 18 and the lower module 21, and limit screws 22 are positioned at four corners of the upper end of the upper module 18.

Further, the lower module 21 includes a product positioning block 7, a probe block 8, a PCB adapter plate 9, a second shielding cotton 10, a lower shielding case 11, a guide bushing 12, a test probe 13, a signal plug 14, a signal socket 15 and a signal interface 16, the product positioning block 7 is located on the inner side of the probe block 8, the middle of the product positioning block is provided with the guide bushing 12, the signal plug 14 and the signal socket 15 are located on one side of the PCB adapter plate 9, and the second shielding cotton 10 is located on the lower shielding case 11.

Further, the position of the product positioning block 7 is positioned on the inner side of the probe block 8, the top of the product positioning block 7 is used for positioning a product, and the lower shielding case 11, the PCB adapter plate 9 and the probe block 8 are positioned and assembled.

The working principle is as follows: the utility model discloses a go up shield cover 1, first shielding cotton 2, uide pin 3, first elastic pressing block 4, second elastic pressing block 5, third elastic pressing block 6, product locating piece 7, probe block 8, PCB keysets 9, second shielding cotton 10, lower shield cover 11, guide bush 12, test probe 13, signal plug 14, signal socket 15, signal interface 16, pressfitting locating plate 17, go up module 18, location portion 19, sealed protection cotton 20, lower module 21, spacing screw 22, when using, mainly divide into module 18 and lower module 21, the main effect of going up module 18 is pressfitting product and shielding external signal, go up shield cover 1 shielding external signal, first elastic pressing block 4, second elastic pressing block 5 and the 6 pressfitting product location of third elastic pressing block, the main effect of lower module 21 is test product and signal input output, product locating piece 7 is used for placing and positioning the product, separate from top to bottom of initial state, module 18 downstream on the push rod drive, continue downstream in guide bush 12 in the uide pin, elastic pressing block 4 of first shielding cotton, second elastic pressing block 4 and signal input output, the test signal output of second elastic pressing block 21, test signal plug 18 and the last module 16, test signal output after the pressfitting of second elastic pressing block 13, the test probe plug 16, the test signal output of the module 18.

It is noted that, herein, relational terms such as first and second (a, b, etc.) and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

The foregoing shows and describes the basic principles and principal features of the invention, together with the advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims (6)

1. Chip test compact structure, including last module (18) and lower module (21), its characterized in that: the upper module (18) is located above the lower module (21), sealing protective cotton (20) and a positioning part (19) are arranged between the upper module (18) and the lower module (21), and limiting screws (22) are positioned at four corners of the upper end of the upper module (18).

2. The die test compression structure of claim 1, wherein: the upper module (18) comprises an upper shielding case (1), first shielding cotton (2), a guide pin (3), a first elastic pressing block (4), a second elastic pressing block (5), a third elastic pressing block (6) and a pressing positioning plate (17), the first shielding cotton (2) is located between the upper shielding case (1) and the pressing positioning plate (17), and the guide pin (3), the first elastic pressing block (4), the second elastic pressing block (5) and the third elastic pressing block (6) are located at the bottom of the pressing positioning plate (17).

3. The die test pressing structure according to claim 1, wherein: lower module (21) include product locating piece (7), probe block (8), PCB keysets (9), second shielding cotton (10), shield cover (11), direction bush (12), test probe (13), signal plug (14), signal socket (15) and signal interface (16) down, product locating piece (7) are located inboard and the centre of probe block (8) and set up direction bush (12), signal plug (14) and signal socket (15) are located one side position of PCB keysets (9), second shielding cotton (10) are located shield cover (11) down.

4. The die test pressing structure according to claim 2, wherein: the pressing positioning plate (17) is positioned at the position inside the upper shielding case (1) through the guide pin (3) and sealed through the first shielding cotton (2), and the first elastic pressing block (4), the second elastic pressing block (5) and the third elastic pressing block (6) are positioned at the bottom of the pressing positioning plate (17) to press the product.

5. The die test compression structure of claim 3, wherein: the position location of product locating piece (7) is inboard at probe piece (8), and the top of product locating piece (7) is fixed a position the product, location equipment between shield cover (11), PCB keysets (9), probe piece (8) down.

6. The die test pressing structure according to claim 1, wherein: the upper module (18) moves downwards through the push rod, is pressed and positioned at the position of the positioning part (19) and the top of the lower module (21), and the upper module (18) is limited through a limiting screw (22).

Images