CN217587483U - Wafer-level diode chip testing machine - Google Patents
Wafer-level diode chip testing machine Download PDFInfo
- Publication number
- CN217587483U CN217587483U CN202220811934.3U CN202220811934U CN217587483U CN 217587483 U CN217587483 U CN 217587483U CN 202220811934 U CN202220811934 U CN 202220811934U CN 217587483 U CN217587483 U CN 217587483U
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- China
- Prior art keywords
- wafer
- diode
- diode chip
- testing machine
- chip testing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 claims description 10
- 230000002950 deficient Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a wafer level diode wafer test machine relates to diode technical field, including the testboard, the one end of testboard is equipped with places the case, the middle part of testboard is equipped with the conveyer belt, one side of conveyer belt is equipped with control panel, the other end of conveyer belt has been seted up and has been detected the groove, the inside both sides of detecting the groove are equipped with the wiring board, the one end of testboard is equipped with the carousel, the top both ends fixedly connected with dead lever of testboard, the bottom fixedly connected with mounting panel of dead lever, the spout has been seted up to the inside of mounting panel, the inside sliding connection of spout has the telescopic link, the top fixedly connected with push rod motor of telescopic link. The utility model discloses carry out automatic clamp to emitting diode and get unloading, improve work efficiency, carry out the circulation through the diode fixture block on the conveyer belt and remove, test the diode.
Description
Technical Field
The utility model relates to a diode technical field especially relates to a wafer level diode chip test machine.
Background
A diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.). It has one-way conducting performance, that is, when positive voltage is applied to the anode and cathode of the diode, the diode is conducted. When a reverse voltage is applied to the anode and the cathode, the diode is turned off. Therefore, turning on and off the diode corresponds to turning on and off the switch.
Diodes are one of the earliest semiconductor devices and are widely used. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, so that various functions such as rectification of alternating current, detection of modulation signals, amplitude limiting, clamping, voltage stabilization of power supply voltage and the like can be realized.
SUMMERY OF THE UTILITY MODEL
The utility model provides a pair of wafer level diode chip test machine has solved the low problem of work efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a wafer-level diode chip testing machine comprises a testing table, wherein a placing box is arranged at one end of the testing table, a conveying belt is arranged in the middle of the testing table, a control panel is arranged on one side of the conveying belt, a detection groove is formed in the other end of the conveying belt, wiring boards are arranged on two sides of the interior of the detection groove, a rotary table is arranged at one end of the testing table, fixing rods are fixedly connected to two ends of the top of the testing table, a mounting plate is fixedly connected to the bottom of each fixing rod, a sliding groove is formed in the mounting plate, a telescopic rod is slidably connected to the interior of the sliding groove, and a push rod motor is fixedly connected to the top of the telescopic rod;
preferably, the bottom of the telescopic rod is rotatably connected with a clamping jaw, and a clamping jaw block is rotatably connected inside the clamping jaw through a shaft;
preferably, a placing groove is formed in the top of the rotary table, a finished product collecting box and a defective product collecting box are placed in the placing groove, and the top of the rotary table is rotatably connected through a driving motor;
preferably, a pressure sensor is arranged inside the placing groove, the pressure sensor is arranged at the bottom of the finished product collecting box, and the model of the pressure sensor is PT124G-210;
preferably, the two ends of the interior of the conveyor belt are rotatably connected with rolling shafts, one ends of the rolling shafts are rotatably connected with the driving motor, diode clamping blocks are arranged on the surface of the conveyor belt, and slotted holes are formed in one sides of the diode clamping blocks.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the clamping jaw block is rotatably connected inside the clamping jaw through the shaft, so that the clamping jaw can move better, the diode can be conveniently grabbed, and the stability is improved; by arranging the finished product collecting box and the defective product collecting box, diode detection is classified and placed, and defective products are convenient to recycle;
2. when the pressure sensor reaches a specified value, the turntable is controlled to rotate, and the collecting box is replaced; be equipped with the diode fixture block through the surface of conveyer belt, carry out better material loading work, prevent that the diode from dropping, also can carry out better ejection of compact work.
Drawings
Fig. 1 is a schematic diagram of an overall front view structure of a wafer-level diode chip tester according to the present invention;
fig. 2 is a schematic top view of a wafer level diode chip tester according to the present invention;
fig. 3 is an enlarged schematic structural view of a conveyor belt of a wafer level diode chip tester according to the present invention;
fig. 4 is an enlarged schematic view of a clamping jaw of a wafer-level diode chip testing machine according to the present invention;
fig. 5 is an enlarged schematic structural view of a finished product collecting box of the wafer level diode chip testing machine according to the present invention.
In the figure: 1. a test bench; 2. a conveyor belt; 3. a detection tank; 4. placing a box; 5. fixing the rod; 6. mounting a plate; 7. a telescopic rod; 8. a finished product collecting box; 9. a turntable; 10. a defective product collection box; 11. a control panel; 12. a roller; 13. a diode clamping block; 14. a push rod motor; 15. a clamping jaw; 16. a pressure sensor; 17. and (6) placing a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-5, an embodiment provided by the scheme is a wafer-level diode chip testing machine, which comprises a test board 1, wherein a placing box 4 is arranged at one end of the test board 1, a conveyor belt 2 is arranged in the middle of the test board 1, a control panel 11 is arranged at one side of the conveyor belt 2, a detection groove 3 is formed in the other end of the conveyor belt 2, patch boards are arranged on two sides of the interior of the detection groove 3, a turntable 9 is arranged at one end of the test board 1, fixing rods 5 are fixedly connected to two ends of the top of the test board 1, a mounting plate 6 is fixedly connected to the bottom of each fixing rod 5, a sliding groove is formed in the mounting plate 6, a telescopic rod 7 is slidably connected to the inside of the sliding groove, and a push rod motor 14 is fixedly connected to the top of the telescopic rod 7;
in the embodiment, the bottom of the telescopic rod 7 is rotatably connected with the clamping jaw 15, the inside of the clamping jaw 15 is rotatably connected with the clamping jaw block through a shaft, and the inside of the clamping jaw 15 is rotatably connected with the clamping jaw block through a shaft, so that the movement can be better performed, the diode can be conveniently grabbed, and the stability is improved;
in the embodiment, the top of the turntable 9 is provided with the placing groove 17, the finished product collecting box 8 and the defective product collecting box 10 are placed inside the placing groove 17, the top of the turntable 9 is rotatably connected through the driving motor, diode detection is placed in a classified mode through the arrangement of the finished product collecting box 8 and the defective product collecting box 10, and defective products are conveniently recovered;
in the embodiment, the pressure sensor 16 is arranged in the placing groove 17, the pressure sensor 16 is arranged at the bottom of the finished product collecting box 8, the model of the pressure sensor 16 is PT124G-210, and when the pressure sensor 16 reaches a specified value, the rotating disc 9 is controlled to rotate to replace the collecting box;
in this embodiment, the inside both ends of conveyer belt 2 are rotated and are connected with roller bearing 12, and the one end of roller bearing 12 is rotated with driving motor and is connected, and the surface of conveyer belt 2 is equipped with diode fixture block 13, and one side of diode fixture block 13 is equipped with the slotted hole, is equipped with diode fixture block 13 through the surface of conveyer belt 2, carries out better material loading work, prevents that the diode from dropping, also can carry out better ejection of compact work.
Principle of operation, at first, press from both sides through clamping jaw 15 and get the inside diode of placing case 4, clamping jaw 15 is inside to have the clamping jaw piece through axle swivelling joint, can be better move about, conveniently snatch the diode, improve the steadiness ability, later slide in mounting panel 6 is inside, place the diode and carry out position restriction through diode fixture block 13 on conveyer belt 2, later slide the diode in detecting groove 3, press from both sides through clamping jaw 15 after the test and get it categorised putting into finished product collecting box 8 and substandard product collecting box 10 with it, detect the diode and carry out categorised the placing, conveniently carry out the recovery of substandard product, the inside of standing groove 17 is equipped with pressure sensor 16, when reacing appointed numerical value, control carousel 9 rotates, change the collecting box.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A wafer-level diode chip testing machine comprises a test board (1) and is characterized in that a containing box (4) is arranged at one end of the test board (1), a conveying belt (2) is arranged in the middle of the test board (1), a control panel (11) is arranged on one side of the conveying belt (2), a detection groove (3) is formed in the other end of the conveying belt (2), patch boards are arranged on two sides of the interior of the detection groove (3), a turntable (9) is arranged at one end of the test board (1), fixing rods (5) are fixedly connected to two ends of the top of the test board (1), a mounting plate (6) is fixedly connected to the bottom of each fixing rod (5), a sliding groove is formed in the mounting plate (6), a telescopic rod (7) is slidably connected to the inside of the sliding groove, and a push rod motor (14) is fixedly connected to the top of the telescopic rod (7).
2. The wafer-level diode chip testing machine as claimed in claim 1, wherein a clamping jaw (15) is rotatably connected to the bottom of the telescopic rod (7), and a clamping jaw block is rotatably connected to the inside of the clamping jaw (15) through a shaft.
3. The wafer-level diode chip testing machine as claimed in claim 1, wherein a placing groove (17) is formed in the top of the turntable (9), the finished product collecting box (8) and the defective product collecting box (10) are placed inside the placing groove (17), and the top of the turntable (9) is rotatably connected through a driving motor.
4. The wafer level diode chip testing machine as claimed in claim 3, wherein a pressure sensor (16) is arranged inside the placing groove (17), the pressure sensor (16) is arranged at the bottom of the finished product collecting box (8), and the model of the pressure sensor (16) is PT124G-210.
5. The wafer-level diode chip testing machine as claimed in claim 1, wherein two ends of the inside of the conveyor belt (2) are rotatably connected with rollers (12), one end of each roller (12) is rotatably connected with a driving motor, a diode clamping block (13) is arranged on the surface of the conveyor belt (2), and a slotted hole is formed in one side of each diode clamping block (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220811934.3U CN217587483U (en) | 2022-04-11 | 2022-04-11 | Wafer-level diode chip testing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220811934.3U CN217587483U (en) | 2022-04-11 | 2022-04-11 | Wafer-level diode chip testing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217587483U true CN217587483U (en) | 2022-10-14 |
Family
ID=83542250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220811934.3U Expired - Fee Related CN217587483U (en) | 2022-04-11 | 2022-04-11 | Wafer-level diode chip testing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217587483U (en) |
-
2022
- 2022-04-11 CN CN202220811934.3U patent/CN217587483U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221014 |