CN217577342U

CN217577342U - Sucking disc type silicon wafer taking mechanism

Info

Publication number: CN217577342U
Application number: CN202221772160.4U
Authority: CN
Inventors: 许玉雷
Original assignee: Jinan Jingbo Electronics Co ltd
Current assignee: Jinan Jingbo Electronics Co ltd
Priority date: 2022-07-11
Filing date: 2022-07-11
Publication date: 2022-10-14
Anticipated expiration: 2032-07-11

Abstract

The utility model discloses a silicon chip mechanism is got to sucking disc formula belongs to silicon chip production technical field, include: the bottom of the mounting rack is provided with a suction assembly; the suction assembly comprises two hydraulic rods and a support plate, the two hydraulic rods are symmetrically arranged at the bottom of the mounting frame, the support plate is arranged at the bottom of the hydraulic rods, two support rods are symmetrically arranged at the top of the support plate, a support shell connected to the bottom of the mounting frame is movably sleeved at the top of each support rod, a linear guide motor is arranged at the bottom of the inner side of the mounting frame, a connecting plate is arranged at the output end of the linear guide motor, a servo motor is arranged at the bottom of the connecting plate, the output end of the servo motor is connected with a mounting plate, and a vacuum pump and a sucker are respectively arranged at the top and the bottom of the mounting plate. The suction cup type silicon wafer taking mechanism has the advantages that the process of sucking and moving the silicon wafer is more stable, and dust on the surface of the silicon wafer can be sucked away in time.

Description

Sucking disc type silicon wafer taking mechanism

Technical Field

The utility model belongs to the technical field of the silicon chip production, especially, silicon chip mechanism is got to sucking disc formula.

Background

The silicon wafer is used as the most important raw material in the semiconductor industry, a plurality of working procedures are needed in the production of the silicon wafer, a plurality of devices are correspondingly needed to be matched, and one of the sucker type silicon wafer taking mechanisms is a device capable of sucking and conveying the silicon wafer.

For example, the Chinese utility model with the application number of CN201020132271.X comprises a frame, a lifting device arranged on the frame, a movable sucking disc device and a silicon wafer conveying device; an upper bedplate and a lower bedplate are arranged on the frame; the lifting devices are arranged on the lower bedplate, and the left lifting device and the right lifting device are respectively used for lifting the silicon wafers which are stacked together according to a specified distance; the movable sucker device is arranged on the upper bedplate, corresponds to the lifting device and is used for sucking the silicon wafers on the lifting device left and right alternately and placing the silicon wafers on the silicon wafer conveying device alternately; the silicon wafer conveying device is arranged on the lower bedplate, is arranged between the left lifting device and the right lifting device and is used for conveying the silicon wafer sucked by the movable sucker device out. The utility model has simple, ingenious and reasonable structure; the automation degree and the wafer taking efficiency are high, and the output silicon wafers can be ensured to be equal in interval, consistent in direction and orderly in arrangement; the silicon wafer damage rate is low.

However, the prior device has the following problems: the processes of sucking and moving the silicon wafer are not stable enough.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip mechanism is got to sucking disc formula to solve the problem that proposes in the background art.

The technical scheme is as follows: a suction cup type silicon wafer taking mechanism comprises:

the bottom of the mounting rack is provided with a suction assembly;

absorb the subassembly and include that the symmetry is installed at two hydraulic stems of mounting bracket bottom and install the backup pad in the hydraulic stem bottom, two bracing pieces are installed to the top symmetry of backup pad, the top movable sleeve of bracing piece is equipped with the support housing of connection in the mounting bracket bottom, linear guide motor is installed to the inboard bottom of mounting bracket, and linear guide motor's output installs the connecting plate, servo motor is installed to the bottom of connecting plate, servo motor's output is connected with the mounting panel, vacuum pump and sucking disc are installed respectively to the top and the bottom of mounting panel, inhale grey subassembly still to install in the bottom of connecting plate.

In a further embodiment, the dust suction assembly comprises a mounting shell mounted at the bottom of the connecting plate and a suction fan nested and mounted on the mounting shell close to one side wall of the suction cup, and the bottom of the mounting shell is connected with a collection bag.

In a further embodiment, an exhaust fan is installed on the outer wall of one side, away from the suction disc, of the installation shell, and a dustproof net is connected to the inner wall of one side, close to the exhaust fan, of the installation shell.

In a further embodiment, the bottom of the collection bag is connected to a drain pipe, and the drain pipe is fitted with a control valve.

In a further embodiment, the supporting rod is a chromium-plated iron cylindrical structure, and a limiting piece for preventing the supporting rod from falling off the supporting shell is mounted at the top of the supporting rod.

In a further embodiment, the storage box is installed at the center of the top of the installation frame, and the top of the storage box is connected with the cover plate through a hinge.

The utility model discloses a technological effect and advantage: according to the suction cup type silicon wafer taking mechanism, the mounting rack is driven by the two hydraulic rods to move downwards so as to move the suction cup to the top of a silicon wafer for sucking, the mounting rack is limited in the moving process through the relative movement of the four support rods in the support shell, the moving process of the mounting rack is more stable, if the silicon wafer is heavier, the suction cup can be turned over by one hundred eighty degrees through the servo motor so as to support and convey the silicon wafer, and the silicon wafer sucking and moving processes are more stable;

during the process of sucking the silicon wafer, dust on the surface of the silicon wafer is sucked into the mounting shell by the suction fan in cooperation with the exhaust fan and falls into the collecting bag, the dust can be uniformly taken out by opening the discharge pipe at the bottom of the collecting bag, and the dust on the surface of the silicon wafer can be sucked away in time;

the suction cup type silicon wafer taking mechanism has the advantages that the process of sucking and moving the silicon wafer is more stable, and dust on the surface of the silicon wafer can be sucked away in time.

Drawings

FIG. 1 is a schematic view of the present invention;

fig. 2 is a schematic structural view of the connection plate and the related structure of the present invention;

fig. 3 is a cross-sectional view of the ash suction assembly of fig. 2 in the direction a-a according to the present invention.

In the figure: 1. a mounting frame; 2. a suction assembly; 3. a dust suction assembly; 4. a hydraulic rod; 5. a support plate; 6. a support bar; 7. a support housing; 8. a connecting plate; 9. a servo motor; 10. mounting a plate; 11. a vacuum pump; 12. a suction cup; 13. installing a shell; 14. a suction fan; 15. a collection bag; 16. a discharge pipe; 17. an exhaust fan; 18. a dust screen; 19. a storage box.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.

In order to solve the problem, the utility model provides a silicon chip mechanism is got to sucking disc formula as shown in fig. 1 to 3, include: the mounting frame comprises a mounting frame 1, wherein a storage box 19 is installed in the center of the top of the mounting frame 1 through a plurality of screws, the top of the storage box 19 is connected with a cover plate through a hinge, spare parts can be stored through the storage box 19 so as to be maintained and replaced, a suction assembly 2 is installed at the bottom of the mounting frame 1, the suction assembly 2 comprises two hydraulic rods 4 symmetrically installed at the bottom of the mounting frame 1, a supporting plate 5 is installed at the bottom of each hydraulic rod 4 through a bolt, two supporting rods 6 are symmetrically installed at the top of each supporting plate 5 through threads, a supporting shell 7 is movably sleeved at the top of each supporting rod 6, and the supporting shell 7 is connected to the bottom of the mounting frame 1 through a bolt;

the bracing piece 6 is the cylindrical structure of chrome plating iron system, make the relative slip of bracing piece 6 more smooth and easy, and the top of bracing piece 6 installs the locating part that prevents to deviate from support housing 7, linear guide motor (not shown in the figure) is installed to the inboard bottom of mounting bracket 1, and linear guide motor's output installs connecting plate 8, servo motor 9 is installed to the bottom of connecting plate 8, servo motor 9's output is connected with mounting panel 10, vacuum pump 11 and sucking disc 12 are installed respectively to the top and the bottom of mounting panel 10, vacuum pump 11 is responsible for drawing the silicon chip to sucking disc 12 evacuation.

In order to suck dust on the surface of a silicon wafer in time, as shown in fig. 2 and fig. 3, a dust sucking assembly 3 is further installed at the bottom of the connecting plate 8, the dust sucking assembly 3 comprises an installation shell 13 installed at the bottom of the connecting plate 8 through a plurality of bolts, a suction fan 14 is installed at one side wall, close to the suction cup 12, of the installation shell 13 in a nested mode, a collection bag 15 is adhered to the bottom of the installation shell 13, a discharge pipe 16 is communicated with the bottom of the collection bag 15, a control valve is installed on the discharge pipe 16, collected dust can be discharged through the discharge pipe 16 by opening the control valve, an exhaust fan 17 is installed on the outer wall, far away from the suction cup 12, of the installation shell 13 through an installation seat, the dust can be sufficiently sucked into the inner side of the installation shell 13 by matching with the suction fan 14, and a dust screen 18 is connected to the inner wall, close to the exhaust fan 17, so that dust entering into the exhaust fan 17 is avoided.

The working principle is that the sucker type silicon wafer taking mechanism is connected with an external power supply, the two hydraulic rods 4 drive the mounting frame 1 to move downwards to move the sucker 12 to the top of a silicon wafer, then the sucker 12 is vacuumized through the vacuum pump 11 to be sucked, the mounting frame 1 is limited in relative movement in the supporting shell 7 through the four support rods 6 in the moving process, so that the mounting frame 1 is more stable in moving process, if the silicon wafer is heavier, the sucker can be overturned by one hundred and eighty degrees through the servo motor 9 to lift the silicon wafer, then the silicon wafer is conveyed to a designated position through the linear guide rail motor and then driven to be placed under the mounting frame 1 again to put down the silicon wafer, if the silicon wafer is overturned by one hundred and eighty degrees, the sucker 12 is controlled to overturn by one hundred and eighty degrees before the mounting frame 1 is driven to descend again, and the process of sucking and moving the silicon wafer is more stable;

during the process of sucking the silicon wafers, dust on the surfaces of the silicon wafers is sucked into the mounting shell 13 by the suction fan 14 in cooperation with the exhaust fan 17 and falls into the collection bag 15, and the dust can be uniformly taken out by opening the control valve of the discharge pipe 16 at the bottom of the collection bag 15.

It is noted that, herein, relational terms such as one and two are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the same.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A suction cup type silicon wafer taking mechanism comprises:

the device comprises a mounting rack (1), wherein a suction assembly (2) is mounted at the bottom of the mounting rack (1);

the method is characterized in that: absorb subassembly (2) including the symmetry install two hydraulic stems (4) in mounting bracket (1) bottom and install backup pad (5) in hydraulic stem (4) bottom, two bracing pieces (6) are installed to the top symmetry of backup pad (5), the top movable sleeve of bracing piece (6) is equipped with support housing (7) of connection in mounting bracket (1) bottom, the linear guide motor is installed to the inboard bottom of mounting bracket (1), and the output of linear guide motor installs connecting plate (8), servo motor (9) are installed to the bottom of connecting plate (8), the output of servo motor (9) is connected with mounting panel (10), vacuum pump (11) and sucking disc (12) are installed respectively to the top and the bottom of mounting panel (10), the bottom of connecting plate (8) is still installed and is inhaled grey subassembly (3).

2. The suction cup type silicon wafer taking mechanism as claimed in claim 1, wherein: inhale grey subassembly (3) including install installation casing (13) and nested aspiration fan (14) of installing in installation casing (13) and being close to sucking disc (12) a lateral wall at connecting plate (8) bottom, the bottom of installation casing (13) is connected with collection bag (15).

3. The suction cup type silicon wafer taking mechanism as claimed in claim 2, characterized in that: an exhaust fan (17) is installed on the outer wall of one side, away from the suction disc (12), of the installation shell (13), and a dust screen (18) is connected to the inner wall of one side, close to the exhaust fan (17), of the installation shell (13).

4. The suction cup type silicon wafer taking mechanism as claimed in claim 2, wherein: the bottom of the collecting bag (15) is communicated with a discharge pipe (16), and the discharge pipe (16) is provided with a control valve.

5. The suction cup type silicon wafer taking mechanism as claimed in claim 1, wherein: the bracing piece (6) are the cylindrical structure of chrome-plated iron system, and the top of bracing piece (6) is installed and is prevented deviating from the locating part that supports casing (7).

6. The suction cup type silicon wafer taking mechanism as claimed in claim 1, wherein: the top center of the mounting rack (1) is provided with a storage box (19), and the top of the storage box (19) is connected with a cover plate through a hinge.