CN217535880U

CN217535880U - Support membrane and IC adhesive tape

Info

Publication number: CN217535880U
Application number: CN202122237660.XU
Authority: CN
Inventors: 刘赛
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-10-04
Anticipated expiration: 2031-09-15

Abstract

The application provides a support film and an IC adhesive tape, wherein the support film comprises a first half film and a second half film, the first half film and the second half film respectively comprise a first bonding area bonded with the IC adhesive tape, and at least the first bonding area is configured to be an anti-bonding structure; or the support film is a continuous film layer and comprises a second bonding area bonded with the IC adhesive tape, at least the second bonding area is configured to be an anti-bonding structure, the support film comprises two half films or a continuous film layer, the anti-adhesion structure is arranged in the adhesion area of the two half films or the continuous film layers, so that the adhesion area and the adhesion strength of the support film and the IC adhesive tape are reduced, the support film is easier to tear, and the IC adhesive tape is prevented from floating or wrinkling in the tearing process of the support film.

Description

Support membrane and IC adhesive tape

Technical Field

The application relates to the technical field of electronic display equipment, in particular to a support film and an IC adhesive tape.

Background

In order to improve the radio frequency condition of the whole display screen module and avoid the influence of FPC components and IC on the radio frequency, an IC adhesive tape is arranged above the IC to play a role in shielding, and radio frequency influence is avoided. For the convenience of attachment, a support film is attached to the surface of the IC adhesive tape to support the IC adhesive tape and prevent deformation and wrinkling. The support film needs to be torn off after the equipment is attached, and the IC adhesive tape is lifted by the support film in the tearing off process, so that the IC adhesive tape floats or folds.

Disclosure of Invention

The technical problem that when the support film is torn off, the IC adhesive tape is lifted by the support film to cause floating or wrinkling can be solved at least to a certain extent in the tearing-off process.

Therefore, the support film comprises two half films or a continuous film layer, and the adhesion area and the adhesion strength of the support film and the IC adhesive tape are reduced by arranging the anti-adhesion structure in the adhesion area of the two half films or the continuous film layer, so that the support film is easier to tear off, and the IC adhesive tape is prevented from floating or wrinkling in the tearing process of the support film.

In order to achieve the above purpose, the present application provides a support film for adhering to a surface of an IC tape; the support film comprises a first half film and a second half film, the first half film and the second half film each comprise a first bonding area bonded with the IC tape, and at least the first bonding area is configured as an anti-adhesive structure; alternatively, the support film is a continuous film layer and the support film comprises a second bonding region bonded to the IC tape, and at least the second bonding region is configured as an anti-adhesive structure.

Further, the anti-adhesive structure comprises at least one of: a film structure formed of a viscosity reducing material, a film structure provided with through holes, and a film structure provided with a cutting line.

Further, the first half film and the second half film respectively comprise a first side edge with the side length equal to the first side length of the IC adhesive tape and a group of oppositely arranged second side edges perpendicular to the first side edges.

Further, the first side of the first bonding region is the first side, the first bonding region has a second side disposed along the second side, and the side length of the second side is less than half of the second side length of the IC tape.

Further, when the anti-adhesive structure comprises a film layer structure provided with a cut line, the cut line is parallel to the first edge of the adhesive area and intersects the second edge.

Further, a tearing hand is also included; the tearing handle is bonded on the first bonding area along the first side edge, and the bonding strength of the tearing handle and the first bonding area is larger than that of the first bonding area and the IC adhesive tape.

Further, the width of the tearing hand along the direction of the second edge is smaller than or equal to the length of the second edge.

An IC tape comprises the support film.

Further, the first half-film and the second half-film are bonded to opposite sides of the IC tape.

Further, after the first and second halves are bonded to the IC tape, a projection of the IC tape onto the first half coincides with a first bonding area on the first half, and a projection of the IC tape onto the second half coincides with a first bonding area on the second half.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a top view of a support film according to an embodiment of the present application;

FIG. 2 is a side view of a support membrane according to another embodiment of the present application;

fig. 3 is a first schematic view of a support film anti-sticking structure according to another embodiment of the present disclosure;

fig. 4 is a second schematic view of a support film anti-adhesion structure according to another embodiment of the present disclosure;

fig. 5 is a third schematic view of a support film anti-adhesion structure according to another embodiment of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. On the contrary, the embodiments of the application include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.

Fig. 1 is a schematic structural diagram of a support film according to an embodiment of the present application.

As shown in fig. 1, a support film for bonding to the surface of an IC tape; because the material of the IC adhesive tape 2 is soft, the IC adhesive tape is inconvenient to be directly attached to equipment, the support film is attached to the outer surface of the IC adhesive tape 2, the IC adhesive tape 2 is supported, and the positioning holes can be designed in the support film 1, so that the jig can be conveniently aligned. The support film 1 comprises a first half-film 11 and a second half-film 12, the first half-film 11 and the second half-film 12 each comprise a first bonding area to which the IC tape is bonded, and at least the first bonding area is configured as an anti-adhesive structure; alternatively, the support film 1 is a continuous film layer, and the support film 1 includes a second bonding region bonded to the IC tape, and at least the second bonding region is configured as a de-bonding structure. The shapes of the first bonding region and the second bonding region are not limited, and may be set according to the shapes of the IC tape and the support film so as to satisfy the mutual bonding between the IC tape 2 and the support film 1. Specifically, in the present embodiment, the IC tape 2 and the support film 1 are both rectangular structures, and therefore the first bonding region and the second bonding region are also designed as rectangular regions, so that the IC tape and the support film are attached to each other.

As shown in fig. 2, when the support film 1 includes the first half film 11 and the second half film 12, the first half film 11 and the second half film 12 are only bonded at the edges of the upper and lower sides of the IC tape 2, the bonding area is defined by a first bonding region, the first half film 11 and the second half film 12 are disposed at a distance from the IC tape, the spacing region between the first half film 11 and the second half film 12 is a margin region 3, and the IC tape 2 is exposed at the margin region, so that the bonding area of the support film 1 and the IC tape 2 can be reduced, and the IC tape is torn along the edge of the IC tape, and the IC tape is not easily lifted and folded.

When the support film 1 is a continuous film layer, a specific bonding region may be disposed on the support film 1 to bond with the IC tape, and the rest regions are not bonded, so as to avoid the situation that the support film takes up the IC tape when the whole surface is bonded, where the specific bonding region may be disposed at the edge of the support film or at the middle of the support film 1, and the bonding is performed according to the needs and the bonding support effect, which is not limited herein.

Preferably, the upper side and the lower side of the support film 1 can be provided with second bonding areas, the middle part of the support film is attached to the IC tape but not bonded, so that the whole IC tape is prevented from being taken up in the tearing process, the support film and the IC tape are bonded with each other at the edge part, and the support film is also helpful for supporting the IC tape. The second bonding region is provided with an anti-bonding structure, so that the bonding strength of the support film and the IC adhesive tape is further reduced, and the support film is guaranteed to be torn off smoothly.

The anti-adhesive structure comprises at least one of: the film structure formed by the viscosity reducing material, the film structure provided with the through hole and the film structure provided with the cutting line. The anti-adhesion material can be an UV anti-adhesion film, and can be automatically separated through UV light irradiation, so that the IC adhesive tape cannot be taken up, and the adhesion effect is ensured. It needs to be further explained that the UV anti-adhesive film is a film material coated with glue with reduced viscosity or no viscosity after UV irradiation, after the IC adhesive tape is attached, the support film is irradiated by UV light, so that the UV glue is invalid, the support film is automatically peeled off and falls off, the film material cannot be taken up, and the IC adhesive tape is prevented from floating or wrinkling. Of course, the viscosity reducing material may be other film materials, and the viscosity reducing effect may be achieved, which is not limited in this application.

As shown in fig. 4, the through hole structure is formed by punching a hole on the support film in advance to reduce the bonding area, and the form, number and arrangement of the through holes can be flexibly designed according to the process requirements, so that the bonding area can be reduced without losing the support effect of the support film on the IC tape, which is not limited in the present application.

As shown in fig. 3 and 5, the cutting line structure is a cutting line seam prepared on the support film, and the support film and the IC tape are not bonded at the cutting line, so that the support film can be detackified, and the support film can be easily torn by designing a specific track of the cutting line, and similarly, the form of the cutting line is not particularly limited. Preferably, in this embodiment, decide the line and can be a plurality of interval arrangements's stub structure, a plurality of stubs are evenly spaced to be covered with the bonding region, also can be continuous tortuous long line structure, form two C shape lines of registrating each other, and C shape line extends along the length direction who supports the membrane, specifically, can select as required.

Each of the first half film 11 and the second half film 12 includes a first side having a side length equal to a first side length of the IC tape 2, and a set of oppositely disposed second sides perpendicular to the first side. Specifically, the first half film and the second half film are designed to be equal in length to the IC tape 2, so as to avoid interference with other parts in the screen assembly. The first half film 11 and the second half film 12 are each of a rectangular configuration, and are bonded along the long side edges of the IC tape 2. The first side of the first bonding area is the first side, the first bonding area is provided with a second side arranged along the second side, and the side length of the second side is smaller than half of the second side length of the IC adhesive tape. The first bonding area is also designed to be a rectangular area, the long side of the first bonding area is as long as the support film, the short side of the first bonding area is smaller than one half of the second side of the IC adhesive tape, the rectangular area is convenient for coating bonding paint, and the support film 1 and the IC adhesive tape can be guaranteed to have enough adhesive strength due to the design of the scale proportion of the short side, so that the IC adhesive tape can be well supported.

When the anti-adhesive structure comprises a film layer structure provided with a cut-off line, the cut-off line is parallel to the first edge of the adhesive area, and the second edges intersect. When the anti-sticking structure is a cutting line, the cutting line is fully distributed in the bonding area, the support film and the IC adhesive tape are anti-sticking to the greatest extent, specifically, the density of the cutting line can be flexibly set according to the sizes of the support film and the IC adhesive tape, and the application is not limited to this.

A support film further comprises a tearing hand 4; the tearing handle 4 is bonded on the first bonding area along the first side edge, and the bonding strength of the tearing handle 4 and the first bonding area is greater than that of the first bonding area and the IC adhesive tape. Can tear 4 positions of hand and begin to tear off by 2 minor faces of perpendicular to IC sticky tape like this, can avoid taking place the condition that IC sticky tape 2 took up, be convenient for tear off first half membrane 11 and second half membrane 12, and tear hand and first bonding region's cohesive strength and be greater than first bonding region with the in-process of tearing off the support membrane has also been guaranteed to the cohesive strength of IC sticky tape, tears hand 4 and can not break away from the support membrane, has guaranteed tearing smoothly of support membrane. In other embodiments, the tearing handle and the supporting film can be integrally formed, so that the supporting film can be smoothly torn off.

The width of the tearing hand 4 along the direction of the second edge is less than or equal to the length of the second edge. Therefore, a narrow-edge protruding structure is formed on the side edge of the support membrane 1, and operation of workers is facilitated. Preferably, the width of tearing hand 4 is the same width with bonding region, and tears the hand and be located the outside limit of support membrane bonding region, and direct action is in bonding region when pulling up the hand of tearing, avoids the deformation of support membrane, improves the support membrane and tears except that efficiency.

An IC tape comprises the support film. The effect of the IC tape of this embodiment is the same as that of the support film, and is not described herein again.

The first half-film 11 and the second half-film 12 are bonded to opposite sides of the IC tape 2. Specifically, the first half film 11 and the second half film 12 are bonded to opposite sides of the IC tape 2, reducing the bonding area of the first half film and the second half film to the IC tape, and facilitating the tearing off of the first half film and the second half film.

After the first half-film 11 and the second half-film 12 are bonded to the IC tape 2, the projection of the IC tape 2 onto the first half-film 11 coincides with the first bonding area on the first half-film 11, and the projection of the IC tape 2 onto the second half-film 12 coincides with the first bonding area on the second half-film 12. The first half film 11 and the second half film 12 can support the IC tape 2 in a balanced manner, so that the overall flatness of the IC tape 2 is better, and the IC tape 2 is better attached to equipment.

The IC adhesive tape 2 comprises wave-absorbing materials, conductive cloth and a packaging film which are sequentially stacked. Specifically, attaching conductive cloth to the upper surface of the wave-absorbing material, and attaching an encapsulation film to the conductive cloth, in this embodiment, the encapsulation film is a PET film with a thickness of about 10 μm, the conductive cloth is used for external copper leakage point contact conduction to dissipate static electricity, and the encapsulation film is used for encapsulating the wave-absorbing material and the conductive cloth for dust prevention.

It should be noted that, in the description of the present application, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims

1. The support film is characterized by being used for being bonded to the surface of an IC adhesive tape; the support film comprises a first half film and a second half film, the first half film and the second half film each comprise a first bonding area bonded with the IC tape, and at least the first bonding area is configured as an anti-adhesive structure; alternatively, the support film is a continuous film layer and the support film comprises a second bonding region bonded to the IC tape, and at least the second bonding region is configured as a de-bonding structure.

2. The support film of claim 1, wherein the anti-adhesive structure comprises at least one of: the film structure formed by the viscosity reducing material, the film structure provided with the through hole and the film structure provided with the cutting line.

3. The support film of claim 1, wherein the first half film and the second half film each include a first side having an edge length equal to a first edge length of the IC tape, and an oppositely disposed set of second side edges perpendicular to the first side edges.

4. The support film of claim 3, wherein the first side of the first adhesive region is the first side, and the first adhesive region has a second side disposed along the second side, and the second side has a length less than half of a length of the second side of the IC tape.

5. The support film of claim 4, wherein when the de-bonding structure comprises a film layer structure provided with a line of severance parallel to the first edge of the bonded region and intersecting the second edge.

6. The support film of claim 3, further comprising a tear tab; the tearing handle is bonded on the first bonding area along the first side edge, and the bonding strength of the tearing handle and the first bonding area is larger than that of the first bonding area and the IC adhesive tape.

7. The support film of claim 6, wherein the width of the tear tab in the direction of the second edge is less than or equal to the length of the second edge.

8. An IC tape comprising the support film according to any one of claims 1 to 7.

9. The IC tape of claim 8, wherein the first half-film and the second half-film are bonded on opposite sides of the IC tape.

10. The IC tape of claim 8, wherein after the first and second half films are bonded to the IC tape, a projection of the IC tape onto the first half film coincides with a first bonding area on the first half film, and a projection of the IC tape onto the second half film coincides with a first bonding area on the second half film.