CN210325859U - Display panel mother board and display panel - Google Patents
Display panel mother board and display panel Download PDFInfo
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- CN210325859U CN210325859U CN201921446313.4U CN201921446313U CN210325859U CN 210325859 U CN210325859 U CN 210325859U CN 201921446313 U CN201921446313 U CN 201921446313U CN 210325859 U CN210325859 U CN 210325859U
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Abstract
The embodiment of the utility model discloses display panel motherboard. The display panel mother board includes: a first protective film; a display panel layer; is positioned at one side of the first protective film; the display panel mother board comprises a plurality of panel areas which are arranged in an array; at least part of the edge of the display panel layer of each panel area is provided with a hollow pattern, and the first protective film is not in contact with the display panel layer in the area where the hollow pattern is located. The embodiment of the utility model provides a display panel motherboard can eliminate the adhesive force between fretwork pattern place region and the first protection film, increases first protection film and display panel layer separation trend, reduces the in-process of getting rid of first protection film, and the display panel layer is rolled up, the risk of peeling off.
Description
Technical Field
The embodiment of the utility model provides a relate to OLED display panel preparation field, especially relate to a display panel mother board and display panel.
Background
In the prior art, after a glass substrate is stripped by laser, an Organic Light-Emitting Diode (OLED) display screen needs to be attached with a lower protective film, and after laser cutting, the lower protective film is adhered by using an adhesive tape or a roller, so that the lower protective film is torn off.
Because the laser cutting is utilized, the hot melting is generated, the adhesion between the lower protective Film and the flexible substrate (Polyimide, abbreviated as PI) layer of the Polyimide material is increased, or the lower protective Film and the PI layer are relatively displaced during the laser cutting, the protective Film is torn off by utilizing an adhesive tape or a roller, the PI layer is easily torn off along with the lower protective Film, the panel (panel) is rolled up, and the upper protective Film and the Thin Film Encapsulation layer (TFE) are separated, so that the risk of bubbles generated during the peeling and attaching is increased.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a display panel mother board, the solution is getting rid of the in-process of first protective layer, and the problem that the display panel functional layer takes place to curl up, peel off.
To achieve the above object, an embodiment of the present invention provides a display panel mother board, including:
a first protective film;
a display panel layer; the first protective film is positioned on one side of the first protective film; the display panel motherboard comprises a plurality of panel areas which are arranged in an array; at least part of the edge of the display panel layer of each panel area is provided with a hollow pattern;
the first protective film is not in contact with the display panel layer in the area where the hollow pattern is located.
Optionally, the display panel layer comprises a flexible substrate and a display panel functional layer located on a side of the flexible substrate facing away from the first protective film;
the display panel functional layer includes:
the driving circuit layer is positioned on one side, away from the first protective film, of the flexible substrate;
the organic light-emitting element layer is positioned on one side, away from the flexible substrate, of the driving circuit layer;
the packaging layer is positioned on one side, away from the driving circuit layer, of the organic light-emitting element layer;
the second protective film is positioned on one side, away from the organic light-emitting element layer, of the packaging layer;
at least part of the edge of the flexible substrate of each panel area is provided with a first hollow pattern;
at least part of the edge of the driving circuit layer of each panel area is provided with a second hollow pattern;
the organic light-emitting element layer and the encapsulation layer of each panel region are positioned in the flexible substrate in a vertical projection of the flexible substrate;
in the direction perpendicular to the flexible substrate, the second hollow pattern and the first hollow pattern are at least partially overlapped.
Optionally, the panel area comprises a display area and a non-display area surrounding the display area;
the non-display area comprises a terminal setting area; at least part of the edge of the terminal setting area far away from the display area is provided with a hollow pattern.
Optionally, the terminal setting region includes a binding region and a testing region;
the edge of the binding area and/or the testing area is provided with a hollow pattern.
Optionally, the hollow pattern does not overlap with the circuit pattern of the panel region.
Optionally, the size of the hollow pattern ranges from 0.5mm by 0.5mm to 5mm by 5 mm.
Optionally, the shape of the hollow pattern includes any one of a square shape, a triangular shape and an L shape, and a combined figure thereof;
the edge of the hollow pattern is at least one of a straight line, an arc and a sawtooth shape.
In a second aspect, the embodiment of the present invention further provides a display panel, which is formed by cutting the mother board of the display panel as described in the first aspect.
Optionally, the display panel in the area where the hollow pattern is located is bent and arranged on a backlight surface of the display panel.
Optionally, the display panel includes a notch structure, and the hollow pattern is located at the notch structure.
The embodiment of the utility model provides a display panel motherboard, every display panel layer part edge sets up hollow out pattern, and is exemplary, and this hollow out pattern can be to every display panel layer part edge sculpture, or laser beam processing. Through setting up the fretwork pattern, reach in the fretwork pattern region, the effect of first protection film and display panel layer contactless to eliminate the adhesion on first protection film and display panel layer in the fretwork pattern region, increase the separation trend on first protection film and display panel layer, when reducing and get rid of first protection film, the risk that the display panel layer was rolled up, was peeled off.
Drawings
Fig. 1 is a cross-sectional view of a motherboard structure of a display panel according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of another display panel mother board structure according to an embodiment of the present invention.
Fig. 3 is a top view of a panel area structure of a motherboard of a display panel according to an embodiment of the present invention.
Fig. 4 is a top view of a panel region structure of a mother board of a display panel after a terminal setting region of a bent portion provided by an embodiment of the present invention.
Fig. 5 is a top view of a panel area structure of a mother board of a display panel after cutting off hollow patterns according to an embodiment of the present invention.
Fig. 6 is a schematic view of a square hollow pattern provided by an embodiment of the present invention.
Fig. 7 is a schematic view of a triangular hollow pattern provided by an embodiment of the present invention.
Fig. 8 is a schematic view of an L-shaped hollow pattern provided by an embodiment of the present invention.
Fig. 9 is a schematic view of a hollow pattern with an arc-shaped edge according to an embodiment of the present invention.
Fig. 10 is a schematic view of a hollow pattern with a sawtooth-shaped edge according to an embodiment of the present invention.
Detailed Description
In order to make the technical problem solved, the technical solution adopted and the technical effect achieved by the embodiments of the present invention clearer, the technical solution of the present invention is further described below by referring to the accompanying drawings and by means of specific embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present invention are shown in the drawings. Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently or simultaneously. In addition, the order of the operations may be re-arranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, and the like.
Fig. 1 is a cross-sectional view of a display panel motherboard structure provided in an embodiment of the present invention, as shown in fig. 1, the display panel motherboard includes:
a first protective film 1, a display panel layer 20, the display panel layer 20 being located on one side of the first protective film 1; the display panel mother board comprises a plurality of panel areas 10 arranged in an array; at least partial edge of the display panel layer 20 of each panel area 10 is provided with a hollow pattern 7; the first protective film 1 is not in contact with the display panel layer 20 in the area where the hollow pattern 7 is located.
The embodiment of the utility model provides an in, set up hollow out pattern 7 through at least some edges at display panel layer 20, in the region that sets up hollow out pattern 7, first protection film 1 and display panel layer 20 contactless. The adhesion between the area where the hollow pattern 7 is arranged and the first protection film 1 is eliminated, the separation tendency of the first protection film 7 and the display panel layer 20 is increased, and the risk of the display panel layer rolling up and peeling off when the first protection film is removed is reduced.
Fig. 2 is a cross-sectional view of another display panel mother board structure provided in an embodiment of the present invention, as shown in fig. 2, the display panel layer 20 includes: a flexible substrate 2 and a display panel functional layer 30 located on the side of the flexible substrate 2 facing away from the first protective film 1.
The display panel functional layer 30 includes: the driving circuit layer 3 is positioned on one side, away from the first protective film 1, of the flexible substrate 2;
the organic light-emitting element layer 4 is positioned on one side, away from the flexible substrate 2, of the driving circuit layer 3;
the packaging layer 5 is positioned on one side, away from the driving circuit layer 3, of the organic light-emitting element layer 4;
a second protective film 6 positioned on the side of the encapsulation layer 5 away from the organic light-emitting element layer 4;
at least partial edge of the flexible substrate 2 of each panel area 10 is provided with a first hollow pattern 71;
at least part of the edge of the driving circuit layer 3 of each panel area 10 is provided with a second hollow pattern 72;
the organic light emitting element layer 4 and the encapsulation layer 5 of each panel region 10 are located within the flexible substrate 2 in a vertical projection of the flexible substrate 2;
in the direction perpendicular to the flexible substrate 2, the second hollow pattern 72 and the first hollow pattern 71 at least partially overlap.
The areas of the organic light emitting element layer 4 and the encapsulation layer 5 are generally smaller than the area of the driving circuit layer 3 or smaller than the area of the flexible substrate 2, that is, the vertical projection of the organic light emitting element layer 4 and the encapsulation layer 5 of each panel region 10 on the flexible substrate 2 is located within the flexible substrate 2. Therefore, the hollow design of the edges of the organic light-emitting element layer 4 and the encapsulation layer 5 is not required. In the present embodiment, the flexible substrate 2 and the driving circuit layer 3 are patterned in a direction perpendicular to the flexible substrate 2, so that the second hollow-out pattern 72 of the driving circuit layer 3 and the first hollow-out pattern 71 of the flexible substrate 2 are at least partially overlapped, and the first protection film 1 is exposed, that is, at least a part of the edge of the first protection film 1 of each panel region is not in contact with the display panel layer 20, thereby increasing the tendency of separating the display panel layer 20 from the first protection film 1.
Fig. 3 is a top view of a panel area structure of a mother board of a display panel according to an embodiment of the present invention, as shown in fig. 3, the panel area includes a display area 40 and a non-display area 50 surrounding the display area 40; fig. 3 exemplarily shows the non-display area 50 only at one side of the display area 40.
The non-display area 50 includes a terminal setting area 60; at least part of the edge of the terminal installation region 60 away from the display region 40 is provided with a hollow pattern 7.
The display area 40 is an area where an image appears when the panel works, the non-display area 50 includes a terminal setting area 60, the hollow pattern 7 is arranged in the terminal setting area 60, routing of a circuit is not affected, and functions of the display panel are not affected, and in subsequent processing, as shown in fig. 4, the terminal setting area 60 can be bent at the back of the display area 40, or as shown in fig. 5, the area where the hollow pattern 7 is located is cut off, and the appearance tidiness of the display panel is not affected.
With continued reference to fig. 3, as shown in fig. 3, optionally, terminal placement area 60 includes a bonding area 70 and a test area 80;
the edges of the bonding area 70 and/or the test area 80 are provided with a cut-out pattern 7.
Optionally, the hollow pattern 7 does not overlap with the circuit pattern of the panel region 10.
The non-display area 50 has a plurality of circuit patterns, such as traces, electrostatic discharge circuits, multi-path selection circuits, etc., and the hollow pattern 7 is not overlapped with the circuit patterns, so as to effectively avoid the damage to the circuits of the display panel and the influence on the functions of the display panel during the patterning process.
Optionally, the size of the hollow pattern 7 ranges from 0.5mm by 0.5mm to 5mm by 5 mm.
The size range of the hollow patterns 7 is 0.5mm by 0.5mm to 5mm by 5mm, and on the premise of effectively saving the space of the display panel, it is ensured that the display panel layer 20 is not curled or even peeled due to the adhesion between the first protective film 1 and the flexible substrate 2 in the process of tearing off the first protective film 1.
Fig. 6-10 are schematic diagrams illustrating the shapes of the hollow-out patterns according to an embodiment of the present invention, and the shapes of the hollow-out patterns 7 include any one of a square shape (see fig. 6), a triangular shape (see fig. 7), and an L-shape (see fig. 8), and a combination thereof.
Alternatively, the edges of the cut-out pattern 7 may be at least one of straight (fig. 6-8), curved (fig. 9), and zigzag (fig. 10).
For example, in fig. 3, the hollow pattern 7 is a square, the shape of the hollow pattern 7 is set to include any one of a square shape, a triangular shape and an L shape, and the edge of the hollow pattern 7 is at least one of a straight line, an arc shape and a zigzag shape, so that the application range of the hollow pattern 7 is enriched, and for different display panels, the patterns with different shapes are adopted, so that the functions of the display panel are not affected, and the neat and beautiful appearance of the display panel is ensured.
The embodiment exemplarily provides a display panel mother board and a preparation process of a display panel.
First, a display panel layer is formed on a glass substrate, and then the glass substrate is peeled off by laser. The laser can pass through the glass substrate but can not pass through the flexible substrate in the display panel layer, and the energy of the laser breaks the connecting bond between the flexible substrate and the glass substrate, so that the glass substrate is removed. The first protective film is adhered to the position where the glass substrate is removed, and the display panel mother board is formed as a protective layer for preventing foreign matter impurities such as dust particles from adhering to the flexible substrate. And then cutting the display panel mother board into a plurality of display panels by laser cutting, and cutting the second protective film and the packaging layer in the display panel layer to expose the terminal setting area. And then, attaching a second protective film on the adsorption carrying platform, wherein the first protective film is far away from the adsorption carrying platform, and fixing the display panel through vacuum on the adsorption carrying platform. The first protection film is peeled off using a tape or a roller in a direction of a diagonal line of the first protection film.
The embodiment of the utility model provides a do not have the change to above-mentioned processing procedure, only at the in-process on display panel layer, at least partial edge on the display panel layer in every panel district sets up hollow out pattern, for example can be after the flexible substrate that forms the display panel layer at least partial edge to the flexible substrate in every panel district sculpture or laser beam processing, can also be after the flexible substrate that forms the display panel layer and drive circuit layer at least partial edge to the flexible substrate in every panel district and drive circuit layer sculpture or laser beam processing.
Because the flexible substrate and the driving circuit layer are subjected to patterning processing, the adhesion force of the patterning processing area and the first protection film is eliminated, and the condition that the flexible substrate and the driving circuit layer are rolled up when the first protection film is torn off is avoided.
The embodiment of the utility model provides a still provide a display panel, adopt as above the cutting of display panel motherboard forms.
Alternatively, as shown in fig. 4, the display panel in the area where the hollow pattern 7 is located may be bent and disposed on the backlight surface of the display panel.
The display panel in the hollow pattern 7 area can be bent to be arranged on the backlight surface of the display panel, so that the function of the display panel is not influenced, and the appearance of the display panel can be ensured to be clean.
Optionally, as shown in fig. 5, the display panel includes a notch structure, and the hollow pattern 7 is located at the notch structure, that is, the display panel in the area where the hollow pattern 7 is located is cut off, so as to avoid affecting the appearance of the display panel.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. A display panel motherboard, comprising:
a first protective film;
a display panel layer; the first protective film is positioned on one side of the first protective film; the display panel motherboard comprises a plurality of panel areas which are arranged in an array; at least part of the edge of the display panel layer of each panel area is provided with a hollow pattern;
the first protective film is not in contact with the display panel layer in the area where the hollow pattern is located.
2. The display panel motherboard according to claim 1, wherein the display panel layer comprises a flexible substrate and a display panel functional layer on a side of the flexible substrate facing away from the first protective film;
the display panel functional layer includes:
the driving circuit layer is positioned on one side, away from the first protective film, of the flexible substrate;
the organic light-emitting element layer is positioned on one side, away from the flexible substrate, of the driving circuit layer;
the packaging layer is positioned on one side, away from the driving circuit layer, of the organic light-emitting element layer;
the second protective film is positioned on one side, away from the organic light-emitting element layer, of the packaging layer;
at least part of the edge of the flexible substrate of each panel area is provided with a first hollow pattern;
at least part of the edge of the driving circuit layer of each panel area is provided with a second hollow pattern;
the organic light-emitting element layer and the encapsulation layer of each panel region are positioned in the flexible substrate in a vertical projection of the flexible substrate;
in the direction perpendicular to the flexible substrate, the second hollow pattern and the first hollow pattern are at least partially overlapped.
3. The display panel mother board according to claim 1, wherein the panel region includes a display region and a non-display region surrounding the display region;
the non-display area comprises a terminal setting area; at least part of the edge of the terminal setting area far away from the display area is provided with a hollow pattern.
4. The display panel motherboard according to claim 3, wherein the terminal setting region includes a bonding region and a test region;
the edge of the binding area and/or the testing area is provided with a hollow pattern.
5. The display panel mother board according to claim 3, wherein the hollow pattern does not overlap with the circuit pattern of the panel region.
6. The display panel mother board according to claim 1, wherein the size range of the hollow pattern is 0.5mm by 0.5mm to 5mm by 5 mm.
7. The display panel mother board according to claim 1, wherein the shape of the hollow pattern includes any one of a square shape, a triangular shape, and an L-shape, and a combination thereof;
the edge of the hollow pattern is at least one of a straight line, an arc and a sawtooth shape.
8. A display panel formed by cutting the mother substrate for a display panel according to any one of claims 1 to 7.
9. The display panel according to claim 8, wherein the display panel in the area of the hollow pattern is bent and disposed on a backlight surface of the display panel.
10. The display panel according to claim 8, wherein the display panel comprises a notch structure, and the hollow pattern is located at the notch structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921446313.4U CN210325859U (en) | 2019-09-02 | 2019-09-02 | Display panel mother board and display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921446313.4U CN210325859U (en) | 2019-09-02 | 2019-09-02 | Display panel mother board and display panel |
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| CN210325859U true CN210325859U (en) | 2020-04-14 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130617A (en) * | 2021-04-21 | 2021-07-16 | 京东方科技集团股份有限公司 | Display substrate, display mother board and display device |
| CN114665043A (en) * | 2022-03-22 | 2022-06-24 | 合肥维信诺科技有限公司 | Display panel and manufacturing method thereof |
| CN114822254A (en) * | 2022-04-26 | 2022-07-29 | 昆山国显光电有限公司 | Module and manufacturing method thereof |
| CN115542613A (en) * | 2022-11-29 | 2022-12-30 | 观洲微电子(上海)有限公司 | Manufacturing process of TFT display module with AMOLED as backlight source |
| WO2023108772A1 (en) * | 2021-12-16 | 2023-06-22 | 深圳市华星光电半导体显示技术有限公司 | Display panel motherboard and manufacturing method for display panel |
-
2019
- 2019-09-02 CN CN201921446313.4U patent/CN210325859U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113130617A (en) * | 2021-04-21 | 2021-07-16 | 京东方科技集团股份有限公司 | Display substrate, display mother board and display device |
| WO2023108772A1 (en) * | 2021-12-16 | 2023-06-22 | 深圳市华星光电半导体显示技术有限公司 | Display panel motherboard and manufacturing method for display panel |
| CN114665043A (en) * | 2022-03-22 | 2022-06-24 | 合肥维信诺科技有限公司 | Display panel and manufacturing method thereof |
| CN114822254A (en) * | 2022-04-26 | 2022-07-29 | 昆山国显光电有限公司 | Module and manufacturing method thereof |
| CN114822254B (en) * | 2022-04-26 | 2023-11-21 | 昆山国显光电有限公司 | Module and manufacturing method thereof |
| CN115542613A (en) * | 2022-11-29 | 2022-12-30 | 观洲微电子(上海)有限公司 | Manufacturing process of TFT display module with AMOLED as backlight source |
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Address after: 201506 No. nine, No. 1568 engineering road, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201506 No. nine, No. 1568 engineering road, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |
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