CN217522034U - Mini LED conductive circuit - Google Patents
Mini LED conductive circuit Download PDFInfo
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- CN217522034U CN217522034U CN202221176534.6U CN202221176534U CN217522034U CN 217522034 U CN217522034 U CN 217522034U CN 202221176534 U CN202221176534 U CN 202221176534U CN 217522034 U CN217522034 U CN 217522034U
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Abstract
The utility model discloses a Mini LED conductive circuit, a serial communication port, include: a substrate comprising a first surface and an oppositely disposed second surface; the conducting circuit is positioned on the first surface of the substrate; a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuit; the heat dissipation block is electrically connected with the conductive circuit; and the lap joint block is electrically connected with the conductive circuit through the heat dissipation block. The application provides a through the radiating block and make among the Mini LED conductive circuit the conducting wire with overlap joint piece electric connection, the luminescent device heat on the overlap joint piece can be through the radiating block effluvium, can increase radiating area like this, is favorable to the heat dissipation more, the performance of better improvement Mini LED current conducting plate.
Description
Technical Field
The utility model relates to a Mini LED technical field especially relates to a Mini LED conductive circuit.
Background
The Mini LED (sub-millimeter Light Emitting Diode) Display technology is a new Display technology different from the conventional Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) Display. Compared with the latter two, the Mini LED backlight panel has higher color contrast, brightness and color gamut, longer service life and thinner thickness, is a key field for the development of panel industry in recent years, and has wide prospect.
In the prior art, the heat dissipation in the conductive plate of the Mini LED mainly utilizes the whole surface of the metal copper to realize the heat dissipation effect, and when the conductive circuit of the Mini LED is manufactured by adopting the metal mesh structure, the performance of the conductive circuit of the Mini LED is often affected due to poor heat dissipation performance of the lap joint block of the lap joint light emitting device, so a new technical scheme is urgently needed to be provided to solve the problem.
SUMMERY OF THE UTILITY MODEL
In view of the above, there is a need to provide a Mini LED conducting circuit to solve the above technical problems.
The utility model discloses a technical scheme is:
a Mini LED conduction circuit, comprising:
a substrate comprising a first surface and an oppositely disposed second surface;
the conducting circuit is positioned on the first surface of the substrate; a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuit;
the heat dissipation block is electrically connected with the conductive circuit;
and the lap joint block is electrically connected with the conductive circuit through the heat dissipation block.
In one embodiment, the heat dissipation block is a raised structure and is made of a conductive material; or, the first surface of the substrate is provided with a groove, and the groove is internally provided with a conductive material to form the heat dissipation block.
In one embodiment, the heat dissipation block is composed of a grid-shaped protruding structure; alternatively, the heat dissipation block is composed of grid-shaped grooves.
In one embodiment, the width of the heat dissipation block is greater than the width of the conductive circuit; or the width of the heat dissipation block is not less than that of the lapping block.
In one embodiment, a grid-shaped groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the grid-shaped groove to form the conductive circuit.
In one embodiment, the lapping block is a convex structure and is made of a conductive material; or, the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form the lapping block.
In one embodiment, the lapping blocks are composed of grid-shaped protruding structures; alternatively, the block is formed of a grid-like groove.
In one embodiment, the heat dissipation module further comprises a polymer layer, and the conductive circuit, the heat dissipation block and the bonding block are arranged on one side of the polymer layer, which is far away from the substrate.
In one embodiment, the conductive traces are integrated with the heat dissipation block and the bonding block.
In one embodiment, a light emitting device is disposed on the bonding block, and the light emitting device is electrically connected to the bonding block.
The utility model has the advantages that: the application provides a through the radiating block and make among the Mini LED conductive circuit the conducting wire with overlap joint piece electric connection, the luminescent device heat on the overlap joint piece can be through the radiating block effluvium, can increase radiating area like this, is favorable to the heat dissipation more, improves the performance of Mini LED conductive plate.
Drawings
Fig. 1 is a schematic plane view of a Mini LED conductive circuit of the present invention;
fig. 2 is a schematic diagram of the region enlarged structure of a Mini LED conductive circuit part of the present invention;
fig. 3 is another schematic diagram of the Mini LED conductive circuit according to the present invention, showing a partially enlarged structure;
fig. 4 is a schematic cross-sectional structure diagram of a Mini LED conductive circuit of the present invention;
fig. 5 is another schematic cross-sectional structure diagram of a Mini LED conductive circuit according to the present invention;
fig. 6 is another schematic cross-sectional structure diagram of a Mini LED conductive circuit according to the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A Mini LED conduction circuit, comprising:
a substrate comprising a first surface and an oppositely disposed second surface; the substrate is a hard substrate or a flexible substrate, the hard substrate is glass or other hard materials, the flexible substrate can be a composite substrate, PET, PMMA, PE, PC, glass fiber and other materials, the composite substrate can be PET and glass fiber composite, PC and glass fiber composite and the like, and the substrate has certain toughness, can have a good supporting effect and has good mechanical properties.
The conducting circuit is positioned on the first surface of the substrate; a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuit; the groove can be directly formed on the first surface of the substrate, or a polymer layer is arranged on one side of the first surface of the substrate, a groove is arranged on one side, away from the substrate, of the polymer layer, the depth of the groove is not less than the thickness of the polymer layer, and the conductive circuits are arranged on one side of the first surface of the substrate according to a certain preset route; the conductive circuit can also be a grid-shaped groove structure, and can also be a groove structure to form the conductive circuit; the polymer layer can be a light-cured material or a heat-cured material, such as UV glue; the conductive material may be a metal material such as gold, silver, copper, nickel, or the like, or may be a conductive compound or a conductive organic substance.
The heat dissipation block is electrically connected with the conductive circuit; the heat dissipation block and the conductive circuit can be of an integrated structure, and the conductive circuit and the heat dissipation block can be formed in the modes of stamping, photoetching, ink-jet printing, silk-screen printing and the like; the heat dissipation block is of a convex structure and made of a conductive material, namely the heat dissipation block is convexly arranged on the first surface of the substrate; or, the first surface of the substrate is provided with a groove, and the groove is internally provided with a conductive material to form the heat dissipation block.
The heat dissipation block is composed of a grid-shaped protruding structure; or the heat dissipation block is composed of grid-shaped grooves; thus, the heat dissipation block may be an integral conductive block made of conductive material, and may also have grid-like grooves. The width of the heat dissipation block is larger than that of the conductive circuit; or the width of the heat dissipation block is not less than that of the lap joint block; the width of the radiating block is larger than that of the conducting circuit and is larger than that of the lapping block or equal to that of the lapping block, so that the radiating performance of the radiating block is more excellent.
The lapping block is electrically connected with the conductive circuit through the heat dissipation block; the conductive circuit, the heat dissipation block and the lap joint block form an electric connection structure which can be an integral structure and is prepared and formed by the same process; the lapping block is of a convex structure and is made of a conductive material, and at the moment, the lapping block is convexly arranged on the surface of the substrate; or, the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form the lapping block. The lap joint blocks are formed by latticed convex structures; or the lapping blocks are formed by grid-shaped grooves; thus, the bridging block may be an integral conductive block of conductive material, and may also have grid-like grooves.
In one embodiment, the heat dissipation structure further comprises a polymer layer, wherein the conductive circuit, the heat dissipation block and the overlapping block are arranged on one side of the polymer layer, which is far away from the substrate, a groove can be arranged on one side of the polymer layer, which is far away from the substrate, and a conductive material is arranged in the groove to respectively form the conductive circuit, the heat dissipation block and the overlapping block; of course, the heat dissipation block and/or the lap joint block can also be a raised structure; also, the conductive traces, the heat dissipation bumps, and the bonding bumps may be in a grid-like structure.
In one embodiment, a light emitting device is disposed on the bonding block, and the light emitting device is electrically connected to the bonding block. The light-emitting device is lapped between the two lapping blocks, is electrically connected with the lapping blocks and is then connected with external equipment through the conducting circuit.
Referring to fig. 1, a schematic plan view of a Mini LED conductive circuit 100, the conductive plate 100 includes a plurality of sub conductive circuit regions 101, the sub conductive circuit regions 101 may be arranged according to a certain preset scheme, where the sub conductive circuit regions 101 are provided with light emitting devices, and the light emitting devices may be connected in series or in parallel, or in series and parallel.
Referring to fig. 2 and fig. 3, a Mini LED conductive circuit includes a conductive circuit 20, a heat sink 30 and a bump 40, wherein the conductive circuit 20 is electrically connected to the heat sink 30, and the bump 40 is electrically connected to the heat sink 30, so that the conductive circuit 20, the heat sink 30 and the bump 40 form a conductive path; the width of the heat dissipation block 30 is greater than the width of the conductive trace 20, the heat dissipation block 30 and the conductive trace 20 may be an integral structure, the width of the heat dissipation block 30 is greater than the width of the solder bump 40, the width of the solder bump 40 may be the same as the width of the heat dissipation block 30, as can be seen from fig. 2, when the line widths of the conductive trace 20, the solder bump 40 and the heat dissipation block 30 are compared, the selected directions are not consistent, if the direction perpendicular to the conductive trace 20 is referred to as the width of the heat dissipation block 30 in the unified standard, the direction parallel to the conductive trace 20 is referred to as the length, the width of the solder bump 40 is not greater than the length of the heat dissipation block 30, and the heat dissipation block 30 in fig. 2 is made of a conductive material and has an integral structure; fig. 3 differs from fig. 2 in that the heat slug 31 is composed of a grid, and the area of the heat slug 31 is provided with a hole structure, so that the heat slug 31 is formed into a grid.
Referring to fig. 2 and 4, a Mini LED conductive circuit includes a substrate 10, a polymer layer 11, a conductive circuit 20, a heat sink 30, and a bonding block 40, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the polymer layer 11 is disposed on the first surface of the substrate 10, a groove is disposed on one side of the polymer layer 11 away from the substrate 10, a conductive material is disposed in the groove to form the heat sink 30 and the bonding block 40, the heat sink 30 is electrically connected to the conductive circuit 20, the substrate 10 may be glass or other hard materials, or may be a composite substrate, PET, PMMA, PE, PC, glass fiber, or other materials, and the polymer layer 11 may be a thermosetting adhesive or a light curing adhesive, such as a UV adhesive.
Referring to fig. 2 and 5, another structure of a Mini LED conductive circuit includes a substrate 10, a polymer layer 11, a conductive trace 20, a heat sink 30, and a bump 41, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the polymer layer 11 is disposed on the first surface of the substrate 10, a groove is disposed on a side of the polymer layer 11 away from the substrate 10, a conductive material is disposed in the groove to form the heat sink 30, the bump 41 is protruded on the surface of the polymer layer 11, and the bump 41 is electrically connected to the heat sink 30.
Referring to fig. 3 and 6, another structure of a Mini LED conductive circuit includes a substrate 10, a polymer layer 11, a conductive trace 20, a heat dissipation block 31 and a bonding block 42, where the substrate 10 includes a first surface and an opposite second surface, the polymer layer 11 is provided with the first surface of the substrate 10, one side of the polymer layer 11 away from the substrate 10 is provided with a grid-shaped groove, a conductive material is provided in the groove to form the heat dissipation block 31 and the bonding block 42, the bonding block 42 is electrically connected to the heat dissipation block 31, and at this time, the heat dissipation block 31 and the bonding block 42 are both in a grid structure, and the grid of the heat dissipation block 31 and the bonding block 42 is an integral grid.
The application provides a through the radiating block and make among the Mini LED conductive circuit the conducting wire with overlap joint piece electric connection, the luminescent device heat on the overlap joint piece can be through the radiating block effluvium, can increase radiating area like this, is favorable to the heat dissipation more, improves the performance of Mini LED conductive plate.
In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail with reference to the accompanying drawings. In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the invention. Moreover, the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A Mini LED conduction circuit, comprising:
a substrate comprising a first surface and an oppositely disposed second surface;
the conducting circuit is positioned on the first surface of the substrate; a groove is formed in one side of the first surface of the substrate, and a conductive material is arranged in the groove to form the conductive circuit;
the heat dissipation block is electrically connected with the conductive circuit;
and the lapping block is electrically connected with the conductive circuit through the heat dissipation block.
2. The Mini LED conductive circuit of claim 1, wherein the heat slug is a raised structure comprised of a conductive material; or, the first surface of the substrate is provided with a groove, and the groove is internally provided with a conductive material to form the heat dissipation block.
3. The Mini LED conductive circuit of claim 2, wherein the heat slug is comprised of a grid-like raised structure; alternatively, the heat dissipation block is composed of grid-shaped grooves.
4. The Mini LED conductive circuit of claim 2, wherein the width of the heat slug is greater than the width of the conductive trace; or the width of the heat dissipation block is not less than that of the lapping block.
5. The Mini LED conductive circuit of claim 1, wherein the substrate has a grid-shaped groove on one side of the first surface, the grid-shaped groove having a conductive material therein to form the conductive trace.
6. The Mini LED conductive circuit of claim 1, wherein the bumps are raised structures comprised of conductive material; or, the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form the lapping block.
7. The Mini LED conductive circuit of claim 6, wherein the bumps are comprised of a grid-like raised structure; alternatively, the bridge block is composed of a grid-like groove.
8. The Mini LED conductive circuit as claimed in any one of claims 1 to 7, further comprising a polymer layer, wherein the conductive trace, the heat sink and the bonding pad are disposed on a side of the polymer layer away from the substrate.
9. The Mini LED conductive circuit of claim 1, wherein the conductive traces are integral with the heat slug and the landing slug.
10. The Mini LED conductive circuit of claim 1, wherein the bonding block is provided with a light emitting device, and the light emitting device is electrically connected to the bonding block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221176534.6U CN217522034U (en) | 2022-05-17 | 2022-05-17 | Mini LED conductive circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221176534.6U CN217522034U (en) | 2022-05-17 | 2022-05-17 | Mini LED conductive circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217522034U true CN217522034U (en) | 2022-09-30 |
Family
ID=83390650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221176534.6U Active CN217522034U (en) | 2022-05-17 | 2022-05-17 | Mini LED conductive circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217522034U (en) |
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2022
- 2022-05-17 CN CN202221176534.6U patent/CN217522034U/en active Active
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