CN217521979U

CN217521979U - Material taking precision clamping device of full-automatic wafer sorting machine

Info

Publication number: CN217521979U
Application number: CN202220913601.1U
Authority: CN
Inventors: 邓朝旭
Original assignee: Shenzhen Zhaoyangguang Te Technology Co ltd
Current assignee: Shenzhen Zhaoyangguang Te Technology Co ltd
Priority date: 2022-04-20
Filing date: 2022-04-20
Publication date: 2022-09-30
Anticipated expiration: 2032-04-20

Abstract

The utility model discloses a material precision clamping device is got to full-automatic wafer sorting machine, concretely relates to wafer processing field, comprises a workbench, one side of workstation is provided with clamping mechanism, clamping mechanism includes slide, mounting bracket, link assembly and is used for pressing from both sides the grip block of tight wafer paster, grip block and slide fixed connection, slide and workstation sliding connection, the expansion end that the slide passes through link assembly and cylinder is connected, and when withdrawing of cylinder control expansion end, the expansion end pulling pivot of cylinder, pivot drive connecting rod three to drive two slides of connecting rod one and connecting rod two controls and be close to the slip on the workstation in opposite directions, make the slide drive the grip block press from both sides tight to the wafer paster on the workstation, be convenient for paste the wafer on wafer sorting machine with the wafer iron sheet, the stability of wafer paster.

Description

Material taking precision clamping device of full-automatic wafer sorting machine

Technical Field

The utility model relates to a wafer processing field, more specifically say, the utility model relates to a material precision clamping device is got to full-automatic wafer sorting machine.

Background

When wafer processing is carried out, often can paste the wafer on an iron sheet, let an iron sheet hold a plurality of wafers, be convenient for to the collection of qualified wafer, especially at the sorting process of wafer, whether the iron sheet is stable on the plummer, influenced the quality of pasting of wafer, but clamping device's on the current wafer sorter centre gripping stability is not enough high yet.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of prior art, the utility model provides a material precision clamping device is got to full-automatic wafer sorting machine, the utility model aims to solve the technical problem that: the clamping stability of the clamping device on the existing wafer sorting machine is not high enough.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a full-automatic wafer sorting machine gets material precision clamping device, includes the workstation, one side of workstation is provided with clamping mechanism, clamping mechanism includes slide, mounting bracket, link assembly and is used for pressing from both sides the grip block of tight wafer paster, grip block and slide fixed connection, slide and workstation sliding connection, the slide is connected through the expansion end of link assembly and cylinder.

Preferably, link assembly includes connecting rod one, connecting rod two, pivot and connecting rod three, fixedly connected with pivot on the activity end of cylinder, it is connected with two connecting rods three to rotate in the pivot, and every connecting rod three is all rotated with the body of rod of the connecting rod two that corresponds and is connected, and the both ends of connecting rod two rotate with slide and mounting bracket respectively and are connected, one side of connecting rod two is provided with connecting rod one, the both ends of connecting rod one rotate with slide and mounting bracket respectively and are connected.

Preferably, a bearing plate is fixedly connected to the lower portion of the cylinder outer shell, and a magnetic adsorption mechanism is arranged on the bearing plate.

Preferably, the magnetic adsorption mechanism comprises a push-pull rod, a first conducting strip, a sleeve and a second conducting strip, the sleeve is fixedly connected with the bearing plate, the second conducting strip is fixedly connected to the inner side of the sleeve, the push-pull rod is connected in the sleeve in a sliding mode, the push-pull rod is fixedly connected with the rotating shaft, the first conducting strip is fixedly connected to the push-pull rod, the first conducting strip and the second conducting strip are both electrically connected with an external power supply, an electromagnet is fixedly connected to the push-pull rod, the electromagnet, the first conducting strip, the second conducting strip and the external power supply form a loop, a sliding groove is formed in the workbench, and the rotating shaft moves in the sliding groove.

Preferably, the sliding plate is fixedly connected with a first rod piece, the first rod piece is elastically connected with a second rod piece, the second rod piece is fixedly connected with a fan, and the fan is electrically connected with external control equipment.

The utility model discloses a technological effect and advantage:

1. when the cylinder controls the movable end to retract, the movable end of the cylinder pulls the rotating shaft, the rotating shaft drives the third connecting rod, so that the first connecting rod and the second connecting rod are driven to control the two sliding plates to oppositely approach to slide on the workbench, the sliding plates drive the clamping plates to clamp the wafer patches on the workbench, and the stability of the wafer patches is facilitated when the wafer sorting machine pastes wafers onto wafer iron sheets.

2. When the free end of the cylinder is controlled to contract, the sliding plates on the two sides can drive the clamping plates to be gradually close to the wafer iron sheet, then the rotating shaft drives the push-pull rod to slide in the sleeve, when the first conducting plate and the second conducting plate are attached, the loop is communicated, and the electromagnet at the upper end of the push-pull rod is electrified to generate magnetism, so that the electromagnet is in the sliding groove, namely, the workbench has magnetic attraction to the wafer iron sheet at the bottom of the wafer iron sheet, and then the free end of the cylinder is controlled by the cylinder to continue to withdraw until the clamping plates can clamp the wafer iron sheet from the two sides.

Drawings

Fig. 1 is the structure diagram of the material-taking precision clamping device of the full-automatic wafer sorting machine of the present invention.

Fig. 2 is a schematic structural view of the push-pull rod of the present invention.

Fig. 3 is a schematic structural view of the interior of the sleeve according to the present invention.

The reference signs are:

1. a work table; 2. a slide plate; 3. a mounting frame; 4. a cylinder; 5. a first connecting rod; 6. a second connecting rod; 7. a clamping plate; 8. a first rod piece; 9. a second rod piece; 10. a fan; 11. an electromagnet; 12. a push-pull rod; 13. a rotating shaft; 14. a first conducting sheet 15 and a sleeve; 16. a second conducting plate; 17. a carrier plate; 18. and a third connecting rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example one

Referring to fig. 1, a precise clamping device for material taking of a full-automatic wafer sorting machine includes a worktable 1: one side of workstation 1 is provided with clamping mechanism, clamping mechanism includes slide 2, mounting bracket 3, link assembly and is used for pressing from both sides the grip block 7 of tight wafer paster,

grip block

7 and 2 fixed connection of slide, slide 2 and 1 sliding connection of workstation, slide 2 is connected through the expansion end of link assembly and cylinder 4.

Link assembly includes connecting rod 5, two 6, pivot 13 of connecting rod and three 18 of connecting rod, fixedly connected with pivot 13 is served in the activity of cylinder 4, it is connected with three 18 of two connecting rods to rotate in the pivot 13, and every three 18 of connecting rod all rotates with the body of rod of two 6 of corresponding connecting rod to be connected, and the both ends of two 6 of connecting rod rotate with slide 2 and mounting bracket 3 respectively to be connected, one side of two 6 of connecting rod is provided with connecting rod 5, the both ends of one 5 of connecting rod rotate with slide 2 and mounting bracket 3 respectively to be connected.

When the cylinder 4 controls the movable end to retract, the movable end of the cylinder 4 pulls the rotating shaft 13, the rotating shaft 13 drives the third connecting rod 18, so that the first connecting rod 5 and the second connecting rod 6 are driven to control the two sliding plates 2 to slide on the workbench 1 in a relatively close manner, the sliding plates 2 drive the clamping plates 7 to clamp the wafer patches on the workbench 1, and the wafer sorting machine is convenient to paste wafers onto wafer iron sheets and the stability of the wafer patches.

Example two

Referring to fig. 1-3, on the basis of the above embodiment, a bearing plate 17 is fixedly connected to the lower portion of the outer shell of the cylinder 4, and a magnetic absorption mechanism is disposed on the bearing plate 17.

The magnetic adsorption mechanism comprises a push-pull rod 12, a first conducting strip 14, a sleeve 15 and a second conducting strip 16, the sleeve 15 is fixedly connected with a bearing plate 17, the inner side of the sleeve 15 is fixedly connected with the second conducting strip 16, the push-pull rod 12 is slidably connected with the sleeve 15, the push-pull rod 12 is fixedly connected with a rotating shaft 13, the first conducting strip 14 is fixedly connected with the push-pull rod 12, the first conducting strip 14 and the second conducting strip 16 are both electrically connected with an external power supply, an electromagnet 11 is fixedly connected with the push-pull rod 12, the electromagnet 11, the first conducting strip 14, the second conducting strip 16 and the external power supply form a loop, a sliding groove is formed in the workbench 1, and the rotating shaft 13 moves in the sliding groove.

When the cylinder 4 controls the free end to contract, the sliding plates 2 at the two sides drive the clamping plates 7 to gradually approach the wafer iron sheet, then the rotating shaft 13 drives the push-pull rod 12 to slide in the sleeve 15, when the first conducting plate 14 is attached to the second conducting plate 16, the loop is communicated, the electromagnet 11 at the upper end of the push-pull rod 12 is electrified to generate magnetism, so that the electromagnet 11 has a magnetic attraction force on the wafer iron sheet from the bottom of the wafer iron sheet, namely the workbench 1, at the bottom of the wafer iron sheet, the cylinder 4 controls the free end of the cylinder 4 to continue withdrawing until the clamping plates 7 can clamp the wafer iron sheet from the two sides, in the process, the first conducting plate 14 and the second conducting plate 16 are always in an attached state, after the wafer iron sheet finishes a bearing task, the cylinder 4 controls the movable end to extend, the clamping plates 7 leave from one side of the wafer iron sheet, then the first conducting plate 14 is separated from the second conducting plate 16, and finally the wafer iron sheet can be taken down and replaced by a new wafer iron sheet, the above-described actions are repeated.

EXAMPLE III

Referring to fig. 1, on the basis of the above embodiment, a first rod 8 is fixedly connected to the sliding plate 2, a second rod 9 is elastically connected to the inside of the first rod 8, a fan 10 is fixedly connected to the second rod 9, and the fan 10 is electrically connected to an external control device. When two slides 2 are close to each other, open external control equipment, make external control equipment control fan 10 breathe in, can absorb the ash on the wafer iron sheet of installing on workstation 1, in order to guarantee the steadiness of follow-up wafer pasting on the wafer iron sheet, when two fans 10 are close to and bump, under the effect of elastic force, member two 9 contracts in member one 8, so both can not hinder slide 2's normal motion, also can let fan 10 last work one end time in order to guarantee that the ash on the wafer iron sheet is clear away totally, external control equipment and fan 10 can utilize bluetooth communication module to set up communication protocol.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," "connecting," and "connecting" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be directly connected, and "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a full-automatic wafer sorting machine gets material precision clamping device, includes workstation (1), its characterized in that: one side of workstation (1) is provided with clamping mechanism, clamping mechanism includes slide (2), mounting bracket (3), link assembly and is used for pressing from both sides grip block (7) of tight wafer paster, grip block (7) and slide (2) fixed connection, slide (2) and workstation (1) sliding connection, slide (2) are connected through the expansion end of link assembly and cylinder (4).

2. The material-taking precision clamping device of the full-automatic wafer sorting machine as claimed in claim 1, wherein: link assembly includes connecting rod one (5), connecting rod two (6), pivot (13) and connecting rod three (18), fixedly connected with pivot (13) are served in the activity of cylinder (4), it is connected with two connecting rod three (18) to rotate in pivot (13), and every connecting rod three (18) is all rotated with the body of rod of the connecting rod two (6) that corresponds and is connected, and the both ends of connecting rod two (6) rotate with slide (2) and mounting bracket (3) respectively and are connected, one side of connecting rod two (6) is provided with connecting rod one (5), the both ends of connecting rod one (5) rotate with slide (2) and mounting bracket (3) respectively and are connected.

3. The material-taking precision clamping device of the full-automatic wafer sorting machine as claimed in claim 1 or 2, wherein: the cylinder (4) is characterized in that a bearing plate (17) is fixedly connected to the lower portion of the outer shell of the cylinder (4), and a magnetic adsorption mechanism is arranged on the bearing plate (17).

4. The material-taking precision clamping device of the full-automatic wafer sorting machine as claimed in claim 3, wherein: the magnetic adsorption mechanism comprises a push-pull rod (12), a first conducting strip (14), a sleeve (15) and a second conducting strip (16), the sleeve (15) is fixedly connected with a bearing plate (17), the inner side of the sleeve (15) is fixedly connected with the second conducting strip (16), the push-pull rod (12) is connected with the sleeve (15) in a sliding mode, the push-pull rod (12) is fixedly connected with a rotating shaft (13), the first conducting strip (14) is fixedly connected onto the push-pull rod (12), the first conducting strip (14) and the second conducting strip (16) are both electrically connected with an external power supply, an electromagnet (11) is fixedly connected onto the push-pull rod (12), the electromagnet (11), the first conducting strip (14), the second conducting strip (16) and the external power supply form a loop, a sliding groove is formed in the workbench (1), and the rotating shaft (13) moves in the sliding groove.

5. The precise material taking clamping device of the full-automatic wafer sorting machine according to claim 4, characterized in that: fixedly connected with member one (8) on slide (2), elastic connection has member two (9) in member one (8), fixedly connected with fan (10) on member two (9), fan (10) and external control equipment electric connection.