CN217485421U - Wafer alignment arm and wafer alignment device - Google Patents

Abstract

The utility model provides a wafer aligning arm and a wafer aligning device; the wafer alignment arm comprises a lifting body and an adjusting piece; the lifting body can move along a set lifting direction to be lifted or lowered, and a guide inclined plane is arranged on the lifting body; the adjusting piece is arranged on the lifting body and can move relative to the lifting body, the adjusting piece comprises an adjusting part, the adjusting piece is configured to be the adjusting part, when the adjusting piece rises along with the lifting body, the adjusting piece moves to enable the adjusting part to be far away from the guide inclined plane, when the adjusting piece falls along with the lifting body, the adjusting piece resets to enable the adjusting part to be close to the guide inclined plane so as to push the edge of the wafer to the guide inclined plane. The wafer alignment device comprises at least three wafer alignment arms. The utility model discloses in can promote the wafer to guide on the inclined plane through aiming at the arm, keep the effective centering of wafer, do benefit to and reduce broken piece and the fragmentation phenomenon of wafer, reduce the fragmentation rate of wafer to positioning accuracy has been improved.

Description

Wafer alignment arm and wafer alignment device

Technical Field

The utility model relates to a wafer alignment technical field, in particular to wafer alignment arm and wafer alignment device.

Background

The wafer alignment is a necessary process of chip processing, the existing wafer alignment device is usually realized by three clamps which are arranged in a triangular manner, each clamp is lifted along with a lifting device and is used for receiving a wafer conveyed by a mechanical arm, wherein one side of the radial inner end of each clamp is provided with a chamfer, when the edge of the wafer is placed on the chamfer, the inclined surface of the chamfer guides the wafer to slide downwards so as to be automatically centered, and a notch detection device is further arranged for determining the position posture of the wafer;

in the above structure, the coverage offset of the chamfer is small, once the edge of the wafer radially outward exceeds the coverage of the chamfer, one side of the wafer may be supported on the fixture, and at this time, the wafer is in an inclined posture, and at this time, if the notch of the wafer is just not shifted in the circumferential direction, the position of the notch of the wafer may still be detected to be qualified, in other words, there may be a case that the posture of the wafer is inclined but the posture of the position of the wafer is determined to be correct, and then the wafer may fall off or be broken.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer alignment arm and wafer alignment device, this alignment arm and be provided with this alignment arm's alignment device can form radial drive to the wafer, in order to keep wafer border position to be located and lead the inclined plane, and then slide to the inclined plane bottom through leading the inclined plane guide wafer, keep the effective centering of wafer, and improved the wafer gesture and taken place the skew and the wafer position is confirmed to be the exact misjudgement condition, do benefit to and reduce wafer broken piece and fragmentation phenomenon, reduce the fragmentation rate of wafer, and positioning accuracy has been improved.

In order to solve the problem of misjudgment risks possibly occurring in the existing wafer contra-rotating process, the invention provides a wafer alignment arm and a wafer alignment device, wherein the alignment arm and the alignment device provided with the alignment arm can drive a wafer in a radial direction to keep the edge position of the wafer on a guide inclined plane, so that the wafer is guided to slide to the bottom of the inclined plane through the guide inclined plane, effective centering of the wafer is kept, the misjudgment condition that the posture of the wafer deviates and the position of the wafer is determined to be correct is improved, the phenomena of wafer breakage and chipping are reduced, the chipping rate of the wafer is reduced, and the positioning accuracy is improved.

In the wafer alignment arm in this embodiment, the problem of misjudgment risk that may occur in the existing wafer counter-rotating process includes:

a lifting body and an adjusting piece;

the lifting body can move along a set lifting direction to be lifted or lowered, and a guide inclined plane is arranged on the lifting body;

the regulating part set up in on the lifting body and can be relative the lifting body motion, the regulating part includes the regulating part, the regulating part is configured as, the regulating part along with when the lifting body rises, the regulating part is relative the lifting body motion makes the regulating part keep away from lead the inclined plane, the regulating part along with when the lifting body reduces, the regulating part is relative the lifting body motion resets and makes the regulating part is close to lead the inclined plane to push away the wafer edge to on leading the inclined plane.

Optionally, the wafer alignment arm further includes a driving member, and the driving member is configured such that when the adjusting member is lifted with the lifting body, the driving member drives the adjusting member to move relative to the lifting body, so that the adjusting portion moves in a direction away from the guiding inclined surface.

Optionally, the adjusting member is rotatably disposed on the lifting body around a first axis, and a swinging end of the adjusting member serves as the adjusting portion.

Optionally, the driving part includes a stopper, and when the adjusting part rises along with the lifting body, the adjusting part contacts with the stopper and the stopper forces the adjusting part to move relative to the lifting body, so that the adjusting part moves in a direction away from the guiding inclined plane.

Optionally, the wafer aligning arm further includes a reset member, and the reset member is disposed on the lifting body and is used for providing a reset force required by the adjusting member when the adjusting member resets.

Optionally, the regulating part includes the swing arm and sets up the stop part in the swing arm, the swing arm rotationally sets up on the lifting body around first axis, a swing end of swing arm is regarded as the regulating part, the regulating part is along when the lifting body rises, the stop part by the dog blocks, just the dog forces stop part and swing arm swing, so that the regulating part is to keeping away from lead the direction motion on inclined plane.

Optionally, a through groove is formed in the lifting body in a direction perpendicular to the first axis, and a portion of the adjusting member passing through the first axis is rotatably mounted in the through groove around the first axis.

Optionally, the direction of the first axis is perpendicular to the lifting direction of the lifting body.

Optionally, the reset member includes an elastic member, and the elastic member is configured to provide an elastic reset force required for resetting the adjusting member with respect to the other swinging end of the adjusting portion.

Optionally, the wafer aligning arm further includes an angle limiting member, and the angle limiting member is disposed on the lifting body and used for limiting a swing angle of the adjusting member.

Optionally, the angle limiting part includes a travel limiting rod and a travel stop, the travel limiting rod is arranged on the adjusting part and one of the components of the lifting body, a sliding hole for the travel limiting rod to pass is formed in the other one of the components of the adjusting part and the lifting body, the travel stop is connected to the travel limiting rod, the travel limiting rod is located on the travel stop and connected with the travel stop, a sliding stroke is formed between the components, and the travel limiting rod is opposite to the sliding hole and slides in the sliding stroke.

Optionally, the elastic member is sleeved on the travel limiting rod, and two ends of the elastic member respectively abut against between the two components, or abut against the travel stop and the component adjacent to the travel stop.

The invention also provides a wafer alignment device, which comprises at least three wafer alignment arms, wherein each wafer alignment arm is circumferentially arranged by taking the second axis as the center.

Optionally, the guiding inclined plane is obliquely arranged towards the second axis, and a lower position of the guiding inclined plane is located on an inner side of a radial direction where the guiding inclined plane inclines.

Optionally, the adjusting portion is located at the outer side of the radial direction where the inclined guide surface is located along the inclination direction of the inclined guide surface, and when the adjusting portion is far away from the inclined guide surface, the adjusting portion moves outwards along the radial direction where the inclined guide surface is located.

In summary, in the wafer alignment arm and the wafer alignment apparatus provided in the present invention, the wafer alignment arm includes a lifting body and an adjusting member; the lifting body is provided with a guide inclined plane; the regulating part set up in on the lifting body and can be relative the lifting body motion, the regulating part includes the regulating part, the regulating part is configured as, the regulating part along with when the lifting body rises, the regulating part motion makes the regulating part keep away from lead the inclined plane, the regulating part along with when the lifting body reduces, the regulating part resets and makes the regulating part is close to lead the inclined plane to push away the wafer edge to lead on the inclined plane.

According to the arrangement, when the lifting body is lifted, the adjusting part is far away from the guide inclined plane, so that the space is released conveniently, the wafer is placed in the corresponding space conveniently, when the lifting body is lowered, the adjusting part is close to the guide inclined plane, the radial driving is formed on the wafer, the wafer is pushed to keep the edge position of the wafer on the guide inclined plane, the edge of the wafer slides to the bottom of the inclined plane through the guide inclined plane, the effective centering of the wafer is kept, the misjudgment condition that the posture of the wafer deviates and the position of the wafer is determined to be correct is improved, the phenomena of wafer chipping and breakage are reduced, the wafer breakage rate is reduced, and the positioning precision is improved;

in addition, based on the adjusting part swinging structure, the linkage of the lifting motion of the lifting body and the swinging motion of the adjusting part is realized through the simple matching of the blocking part and the stop block, so that not only the lifting motion of the lifting body and each motion state of the swinging motion of the adjusting part are accurately matched, but also an electric driving mechanism for driving the adjusting part can be reduced, the structure of the alignment arm is favorably simplified, and the control program of the movement of the alignment arm is also simplified;

the utility model also facilitates the control of the swing angle of the adjusting part through the design of the angle stroke, thereby avoiding the blocking phenomenon caused by the interference of other mechanical parts of the adjusting part on the one hand, avoiding the impact of other mechanical parts of the adjusting part on the other hand, and controlling the opening amplitude of the adjusting part, thereby realizing the purpose of adjusting the area formed by the alignment device for bearing the wafer;

the wafer alignment device provided with the wafer alignment arms can form effective support for the wafers through the matching of the plurality of circumferentially distributed wafer alignment arms; and the adjusting piece of each wafer alignment arm can be radially opened at the initial stage of placing the wafer to release the placing space of the wafer, and after the wafer is placed, the adjusting piece of each wafer alignment arm can push the wafer in a plurality of radial directions, so that the edge position of the wafer is positioned on the guide inclined plane and slides to the supporting plane along the guide inclined plane, effective centering of the wafer is kept, the phenomena of wafer breaking and chipping are favorably reduced, the breaking rate of the wafer is reduced, and the positioning precision is improved.

Drawings

FIG. 1 is a schematic view of a conventional clamp according to an embodiment of the present invention;

fig. 2 is a schematic view of an initial state structure of a wafer alignment arm according to an embodiment of the present invention;

fig. 3 is a schematic structural view of a state after the lifting body of the wafer alignment arm according to the embodiment of the present invention is lifted;

fig. 4 is a structural diagram illustrating a state in which the adjusting member pushes the wafer after the lifting body of the wafer alignment arm of the embodiment of the present invention descends;

fig. 5 is a structural diagram illustrating a state after a wafer slides along a guide slope after a lifting body of a wafer alignment arm of the embodiment of the present invention is lowered;

fig. 6 is a schematic structural view of an adjusting member according to an embodiment of the present invention;

fig. 7 is a schematic structural view of the lifting body according to the embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of FIG. 7;

fig. 9 is a schematic structural diagram of a wafer alignment apparatus according to an embodiment of the present invention;

wherein the reference numbers are as follows:

10-a lifting body; 11-a lead bevel; 12-a through slot; 13-a sliding hole; 14-upper step surface;

20-an adjustment member; 21-an adjustment section; 22-a swing arm; 22 a-an oblique arm; 22 b-upper swing arm; 22 c-lower swing arm;

22 d-notch; 23-Barrier section

30-a drive member; 31-a stopper; 32-vertical arm

40-a reset piece; 41-elastic member

50-an angle limiter; 51-a travel limit rod; 52-travel stop

60-a wafer;

70-a clamp;

81-a first axis; 82-second axis; 83-third axis.

Detailed Description

The wafer alignment apparatus of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.

As used in this application, the singular forms "a", "an" and "the" include plural referents, the term "or" is generally employed in a sense including "and/or," the terms "a", "an" and "the" are generally employed in a sense including "at least one", the terms "at least two" and "two or more" are generally employed in a sense including "two or more", and moreover, the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or imply that there is a number of technical features being indicated. Thus, features defined as "first", "second", "third" may explicitly or implicitly include one or at least two of the features. Furthermore, as used in the present application, the terms "mounted," "connected," and "disposed" on another element should be construed broadly, and generally only mean that there is a connection, coupling, engagement, or transmission relationship between the two elements, and that there may be a direct connection, coupling, engagement, or transmission between the two elements, or there may be an indirect connection, coupling, engagement, or transmission between the two elements, and should not be construed as indicating or implying any spatial relationship between the two elements, i.e., one element may be located in any orientation, such as inside, outside, above, below, or to one side of the other element, unless the content clearly indicates otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art. Moreover, directional terminology, such as above, below, up, down, upward, downward, left, right, etc., is used with respect to the exemplary embodiments as they are shown in the figures, with the upward or upward direction being toward the top of the corresponding figure and the downward or downward direction being toward the bottom of the corresponding figure.

The conventional wafer alignment device is usually implemented by three clamps arranged in a triangular manner, each clamp is lifted along with a lifting device to receive a wafer conveyed by a mechanical arm, please refer to fig. 1, in fig. 1, for clearly showing the structure of the corresponding clamp, only one of the clamps is taken as an example for explanation, wherein one side of the radial inner end of each clamp is provided with a chamfer, when the edge of the wafer is placed on the chamfer, the wafer is guided to slide downwards and automatically center by the inclined plane of the chamfer, in order to determine the position and posture of the wafer, a notch detection device is further provided, and when the wafer slides downwards and centers along the inclined plane of the chamfer and the position of the notch is detected to be qualified, the position and posture of the wafer is considered to be correct;

referring to fig. 1, the coverage offset of the chamfer is smaller, and the coverage range is as range a in fig. 1; in the existing structure, the coverage range is generally 1.5mm, once the edge of the wafer radially outward exceeds the coverage range of the chamfer, one edge of the wafer may be supported on the jig to form an inclined structure, and at this time, if the notch of the wafer just does not deviate in the circumferential direction, the position of the notch of the wafer may still be detected to be qualified, in other words, there may be a situation that the posture of the wafer is inclined but the posture of the position of the wafer is determined to be correct, and then the wafer may drop from the jig or be broken in a subsequent process due to the inclination of the wafer.

In order to solve the problem of misjudgment risk possibly occurring in the existing wafer contra-rotating process, the embodiment provides a wafer alignment arm and a wafer alignment device, wherein the alignment arm and the alignment device provided with the alignment arm can radially drive a wafer to keep the edge position of the wafer on a guide inclined plane, so that the wafer is guided to slide to the bottom of the inclined plane through the guide inclined plane, effective centering of the wafer is kept, the misjudgment condition that the posture of the wafer deviates and the position of the wafer is determined to be correct is improved, the phenomena of wafer breakage and chipping are reduced, the chipping rate of the wafer is reduced, and the positioning accuracy is improved.

The wafer alignment arm in the embodiment is used for solving the problem of misjudgment risk possibly occurring in the conventional wafer contrarotating process;

the wafer alignment arm includes a lifting body 10 and an adjusting member 20;

the lifting body 10 can move along a set lifting direction to be lifted or lowered, and a guide inclined plane 11 is arranged on the lifting body;

the set lifting direction is generally the vertical direction in fig. 2, and at this time, when the lifting body 10 is lifted vertically upwards, the lifting body moves to a side close to the robot arm to receive the wafer conveyed by the robot arm; when the wafer conveyed by the robot arm is not located right above the lifting body 10, for example, located obliquely above the lifting body, the set lifting direction is correspondingly obliquely upward, and the lifting direction is set according to the relative position relationship with the robot arm, so that the wafer moves toward the side close to the robot arm along the lifting direction as a lifting direction, and the wafer moves away from the side away from the robot arm along the lifting direction as a lowering direction;

the adjusting member 20 is disposed on the lifting body 10 and is movable relative to the lifting body 10, the adjusting member 20 includes an adjusting portion 21, the adjusting member 20 is configured such that when the adjusting member 20 is lifted along with the lifting body 10, the adjusting member 20 moves relative to the lifting body 10 to make the adjusting portion 21 away from the guiding inclined surface 11, and when the adjusting member 20 is lowered along with the lifting body 10, the adjusting member 20 moves relative to the lifting body 10 to reset such that the adjusting portion 21 approaches the guiding inclined surface 11, so as to push the edge of the wafer 60 onto the guiding inclined surface 11.

Referring to fig. 2 to 5, in the process of transporting a wafer by the robot arm, the lifting body 10 is lifted for receiving the wafer, and there are various lifting manners of the lifting body 10, for example, a manner of matching a motor drive with a screw nut pair, a manner of directly driving by a linear motor, or a manner of driving by hydraulic or pneumatic or other known linear driving manners, the lifting body 10 should be installed on a rack in a lifting manner, and the following driving member 30 is fixedly installed on a corresponding rack;

the motion mode of the adjusting part 20 can be swing, linear motion and the like; for example, when the adjusting member 20 moves in a linear motion manner, the adjusting member 20 may move linearly in a horizontal direction in the left-right direction in fig. 2, an initial position of the adjusting member 20 is located at the left side of the guiding inclined plane 11, when the adjusting member 20 rises with the lifting body 10, the adjusting member 20 moves leftwards and moves leftwards away from the guiding inclined plane 11, when the adjusting member 20 falls with the lifting body 10, the adjusting member 20 moves rightwards and moves rightwards close to the guiding inclined plane 11, a certain position on the adjusting member 20 is used as an adjusting portion 21, and when the adjusting member approaches the guiding inclined plane 11, the adjusting portion is used for pushing an edge of the wafer to push an edge of the wafer 60 onto the guiding inclined plane 11, and the edge of the wafer 60 slides along the guiding inclined plane 11 to the bottom of the inclined plane; when the adjusting member 20 is lifted along with the lifting body 10, the adjusting member 20 moves leftwards relative to the lifting body 10, and when the adjusting member 20 is lowered along with the lifting body 10, the adjusting member 20 moves rightwards relative to the lifting body 10, that is, the moving direction of the adjusting member 20 needs to correspond to the lifting direction of the lifting body 10, so that the moving directions of the adjusting member 20 and the lifting body are matched through respective driving structures, for example, through the matching of a motor for driving the lifting body 10 to lift and a motor for driving the adjusting member 20 to move leftwards and rightwards; in addition, the corresponding relationship between the operation direction of the adjusting part 20 and the lifting direction of the lifting body 10 can also be realized in a mechanical linkage manner, so that only one set of driving equipment is needed to drive the lifting body 10 to lift, and in the lifting process of the lifting body 10, the lifting body 10 forms a linkage relationship with the adjusting part 20 through a mechanical linkage structure, so that the operation direction of the adjusting part 20 is automatically matched with the lifting direction of the lifting body 10;

in another embodiment of the linear movement of the adjusting member 20, still referring to fig. 2, the adjusting member 20 can move in the vertical direction of fig. 2, the initial position of the adjusting member 20 is located above the inclined guiding surface 11, when the adjusting piece 20 rises along with the lifting body 10, the adjusting piece 20 moves upwards along with the lifting body 10 and is far away from the guide slope 11 upwards, when the adjusting piece 20 is lowered along with the lifting body 10, the adjusting piece 20 moves downwards relative to the lifting body 10 and is close to the guide slope 11 downwards, a position on the adjusting member 20 is used as the adjusting portion 21, for example, a wedge-shaped surface is provided on the adjusting member 20 as the adjusting portion 21, when the adjusting member 20 approaches the inclined guide surface 11, the edge of the wafer 60 is pushed by the wedge surface, to push the edge of the wafer 60 onto the guiding bevel 11 and make the edge of the wafer 60 slide along the guiding bevel 11 to the bottom of the bevel;

in another embodiment, the adjusting member 20 can swing around the first axis 81 in fig. 2, when the adjusting portion 21 in fig. 2 swings left and right, the adjusting portion 21 swings left and moves left away from the inclined guiding surface 11, and the adjusting portion 21 swings right and moves right close to the inclined guiding surface 11;

in another embodiment, the adjusting member 20 can swing around the vertical axis in fig. 2, and in this case, the adjusting portion 21 in fig. 2 also swings left and right, when the adjusting portion 21 swings left, it moves left away from the inclined guide surface 11, and when the adjusting portion 21 swings right, it moves right close to the inclined guide surface 11; of course, the adjusting member 20 may have other movement forms, which are not described in detail herein;

this alignment arm can be in when the lifting body 10 risees, regulating part 21 keeps away from lead inclined plane 11, does benefit to the release space this moment, is convenient for the wafer to be placed in the space that corresponds, and when the lifting body 10 reduced, regulating part 21 was close to lead inclined plane 11, forms radial drive to the wafer, promotes the wafer and lies in on leading inclined plane 11 with keeping wafer edge position, and then makes the wafer edge slide to the inclined plane bottom through leading inclined plane 11 guide, keeps the effective centering of wafer, and has improved the wafer gesture and has taken place the skew and the wafer position is confirmed as the correct misjudgement condition, does benefit to reducing the wafer and breaks the piece phenomenon, reduces the fragmentation rate of wafer to positioning accuracy has been improved.

Further, the wafer alignment arm further includes a driving member 30, and the driving member 30 is configured such that when the adjusting member 20 is lifted with the lifting body 10, the driving member 30 drives the adjusting member 20 to move relative to the lifting body 10, so that the adjusting portion 21 moves away from the guiding inclined surface 11.

The driving member 30 may be a power source for providing power for the movement of the adjusting member 20, for example, the driving member 30 may be a motor for adaptively driving the corresponding movement of the adjusting member 20 according to the movement of the lifting body 10, or the driving member 30 may also be a mechanical linkage structure for realizing the corresponding relationship between the moving direction of the adjusting member 20 and the lifting direction of the lifting body 10, at this time, only one set of power source is needed for driving the lifting of the lifting body 10, and in the lifting process of the lifting body 10, the lifting movement of the lifting body 10 forms a linkage relationship with the adjusting member 20 through the mechanical linkage structure, so that the moving direction of the adjusting member 20 is automatically matched with the lifting direction of the lifting body 10.

Further, the adjusting member 20 is rotatably disposed on the lifting body 10 around a first axis, and a swing end of the adjusting member 20 serves as the adjusting portion 21.

Referring to fig. 2, the first axis 81 is perpendicular to the paper surface of fig. 2, and at this time, the upper end of the adjusting member 20 as the adjusting portion 21 can swing left and right, and the adjusting member 20 is set to swing structure, so that the adjusting member 20 and the lifting body 10 form a linkage form, and the actions of the lifting body 10 and the adjusting member 20 can be matched by a simple mechanical linkage structure, so that the purpose of synchronous actions of the lifting body 10 and the adjusting member 20 can be realized only by configuring a set of power source for the lifting body 10; an additional electric driving mechanism is not needed, so that the interference of other programs to the original equipment program is avoided;

in addition, the first axis 81 is not limited to the corresponding position and direction in fig. 2, the first axis 81 may also be the vertical direction in fig. 2, and the first axis 81 is the vertical direction in fig. 2, which has already been discussed and is not repeated here, and the embodiment where the first axis 81 is the other direction in fig. 2 is similar to the above case and is not repeated here.

Further, the driving member 30 includes a stopper 31, when the adjusting member 20 is lifted with the lifting body 10, the adjusting member 20 contacts the stopper 31 and the stopper forces the adjusting member 20 to move relative to the lifting body 10, so that the adjusting portion 21 moves away from the guiding slope 11.

The stopper 31 is disposed relatively still, where relatively still refers to being relatively still with the ground or being still with the housing of the wafer alignment apparatus, when the adjusting member 20 is lifted or lowered along with the lifting body 10, the stopper 31 remains still, and there are various ways in which the adjusting member 20 contacts with the stopper 31, for example, referring to fig. 2, when the adjusting member 20 is in a swing structure, the stopper 31 blocks on the blocking portion 23 and forces the adjusting member 20 to rotate counterclockwise, so that the adjusting portion 21 swings leftward away from the guiding inclined surface 11; when the adjusting part 20 is in a linear motion structure, the contact surface of the stopper 31 and the adjusting part 20 can be in a wedge-shaped surface matching mode, the adjusting part 20 is forced to move linearly after the wedge-shaped surface is contacted, and through the arrangement of the structure, the purpose of matching the actions of the lifting body 10 and the adjusting part 20 can be realized only by configuring a set of power source for the lifting body 10 to drive the lifting body 10 to move up and down; and an additional electric driving mechanism is not needed, so that the interference of other programs to the original equipment program is avoided.

Further, the wafer alignment arm further includes a reset member 40, and the reset member 40 is disposed on the lifting body 10 and is used for providing a reset force required by the reset of the adjusting member 20.

Reset piece 40 can be for electrical ization actuating mechanism, and according to required operating mode drive regulating part 20 backswing and then realize reseing, and is more preferable, and reset piece 40 can be the spring, and the spring provides the elastic force that makes its backswing that resets for regulating part 20 one end, and perhaps the torsional spring also can be preferred to the elastic component, provides the elastic moment that makes its gyration reset for the pivot of regulating part 20 through the torsional spring.

Further, the adjusting member 20 includes a swing arm 22 and a blocking portion 23 disposed on the swing arm, the swing arm 22 is rotatably disposed on the lifting body 10 around the first axis, a swing end of the swing arm 22 serves as the adjusting portion 21, when the adjusting member 20 rises along with the lifting body 10, the blocking portion 23 is blocked by the stopper 31, and the stopper 31 forces the blocking portion 23 and the swing arm 22 to swing, so that the adjusting portion 21 moves in a direction away from the inclined guide surface 11.

Referring to fig. 1, the driving member 30 is a mirror-inverted L-shaped structure, wherein a vertical arm 32 of the driving member 30 is used for being mounted on a frame or a housing of the wafer alignment apparatus, a horizontal arm of the driving member 30 is used as a stopper 31, the stopper 23 extends leftward and is located right below the stopper 31, when the adjusting member 20 is lifted along with the lifting body 10, the stopper 23 moves upward to be stopped by contacting with the stopper 31, and when the stopper 23 continues to move upward along with the adjusting member 20, the stopper 31 presses the stopper 23 to force the swing arm 22 to swing counterclockwise; the stop block and the blocking piece are arranged on the basis of the swing structure of the adjusting piece 20, and based on the swing structure of the adjusting piece 20, the linkage of the lifting motion of the lifting body 10 and the swing motion of the adjusting piece 20 is realized through the simple matching of the stop block part 23 and the stop block, so that the lifting motion of the lifting body 10 is accurately matched with each motion state of the swing motion of the adjusting piece 20, an electric driving mechanism for driving the adjusting piece 20 can be reduced, the structure of the alignment arm is simplified, and the control program of the movement of the alignment arm is simplified.

Further, a through groove 12 is formed in the lifting body 10 along a direction perpendicular to the first axis, and a portion of the adjusting member 20 passing through the first axis is rotatably mounted in the through groove 12 around the first axis.

The vertical is not to be understood in a narrow sense as an absolute vertical relationship, but is to be understood as the opening direction of the through slot is perpendicular to the direction of the first axis and allows an error of a set angle, the set angle is usually 0-10 degrees, and the specific value of the set angle is determined according to the required use condition;

referring to fig. 2 and 6, a through groove is formed in the left-right direction of the lifting body 10, the adjusting member 20 is rotatably fitted in the through groove 12 through a rotating shaft, and the through groove 12 may be a U-shaped through groove, a rectangular through groove or a through groove with other shapes; the first axis is actually referred to herein as the central axis of the rotating shaft, the rotating shaft can be rotatably installed in the through groove 12 along the axis of the rotating shaft, and then the adjusting member 20 is in transmission fit with the rotating shaft, or the rotating shaft can be fixedly installed in the through groove, and then the adjusting member 20 is in rotation fit with the rotating shaft; as shown in fig. 2, in the initial state of the adjusting member 20, and as shown in fig. 7, the swing arm 22 includes a lower inclined arm 22a inclined downward to the right, an upper swing arm 22b connected to the upper end of the inclined arm 22a and extending vertically upward, and a lower swing arm 22c connected to the lower end of the inclined arm 22a and extending vertically downward, wherein a notch 22d is provided on the right side of the upper swing arm 22b, and an adjusting portion 21 extending upward into an elongated structure is formed on the left side of the notch, and a blocking portion 23 is located at the upper end of the inclined arm 22a and extends horizontally;

referring to fig. 7 and 8, the upper end of the lifting body 10 has a step structure, the step surface of the step structure is set as an inclined surface to form a guiding inclined surface 11, and the through groove 12 passes through the upper step surface 13 of the upper end of the lifting body 10 upward, so that when the adjusting portion 21 swings to the position shown in fig. 2, the adjusting portion 21 is attached to the side wall 12a of the through groove 12, and the adjusting portion 21 has a pushing surface for contacting with the edge of the wafer, as shown in fig. 6, the right side wall of the adjusting portion 21 is a pushing surface, and in an initial state, the pushing surface is just aligned with the upper edge of the guiding inclined surface 11; through the setting of logical groove, do benefit to the compact structure nature that improves whole alignment arm.

Further, the direction of the first axis is perpendicular to the lifting direction of the lifting body 10.

The vertical is not to be understood in a narrow sense as an absolute vertical relationship, and it is understood that the lifting direction of the lifting body 10 is perpendicular to the direction of the first axis and is allowed to have a set angle error, the set angle is usually 0-10 degrees, and the specific value of the set angle is determined according to the required use condition;

referring to fig. 2, the direction perpendicular to the lifting direction has a plurality of directions, such as the direction of the first axis 81, or the left-right direction, in this embodiment, the first axis 81 in fig. 2 is selected as the rotation axis of the adjusting member 20, so that the swinging direction of the adjusting member 20 is adapted to the radial direction of the wafer, so that the adjusting portion 21 of the adjusting member 20 can swing in the radial direction to directly push the wafer in the radial direction; of course, if the first axis 81 is located in the left-right direction in fig. 2, the end of the adjusting member 20 is set to swing up and down, and the wafer can still be pushed by the wedge surface.

Further, the reset member 40 includes an elastic member 41 for providing an elastic reset force required for resetting the adjusting member 20 with respect to the other swinging end of the adjusting portion 21.

The elastic member 41 may be a cylindrical coil spring, a disc spring, a wave spring or other known elastic structure, the elastic member 41 may be connected between one end of the adjusting portion 21 and the lifting body 10 to provide the adjusting portion 21 with an elastic force for returning to swing, or the elastic member may also be a torsion spring, and the torsion spring provides an elastic moment for returning to swing for the rotating shaft of the adjusting member 20; the elastic force of the elastic piece provides the reset force required by reset, so that the adjusting part 21 has an elastic buffer function when resetting, and the rigid collision between the adjusting part 21 and other parts is avoided.

Further, the wafer alignment arm further includes an angle limiting member 50, and the angle limiting member 50 is disposed on the lifting body 10 for limiting the swing angle of the adjusting member 20.

The angle limiting member 50 may be composed of two stoppers, two stoppers are disposed on two sides of one end of the adjusting member 20 in the swing direction, so as to limit the swing angle of the end, or an angle limiting structure of other known structures may be adopted, so as to facilitate control of the swing angle of the adjusting member 20 by controlling the angle stroke, thereby avoiding the jamming phenomenon caused by interference of other mechanical components of the adjusting member 20, on the other hand avoiding the impact of other mechanical components of the adjusting member 20, and also controlling the opening range of the adjusting portion 21, so as to achieve the purpose of adjusting the wafer receiving region formed by the alignment device.

Further, the angle limiting member 50 includes a stroke limiting rod 51 and a stroke stop 52, the stroke limiting rod 51 is disposed on one of the adjusting member 20 and the lifting body 10, the other of the adjusting member 20 and the lifting body 10 is provided with a sliding hole 13 for the stroke limiting rod to pass through, the stroke stop 52 is connected to the stroke limiting rod 51, a sliding stroke is formed between the stroke stop 52 and the component connected thereto on the stroke limiting rod 51, and the stroke limiting rod 51 slides in the sliding stroke relative to the sliding hole; still further, the elastic element 41 is sleeved on the travel limit rod 51, and two ends of the elastic element 41 respectively abut between the two components, or respectively abut on the travel stop 52 and the component adjacent to the travel stop 52.

Referring to fig. 2, a cylindrical rod of the stroke limiting rod 51, a right end of the stroke limiting rod 51 may be fixedly connected to the lower swing arm 22c by a thread locking manner, the stroke limiting rod 51 is further sleeved in the sliding hole 13 and adaptively slides in the sliding hole 13 along with the swing of the stroke limiting rod 51, because the stroke limiting rod 51 actually has a partial motion of a vertical motion during the sliding process, the sliding hole 13 is adaptively set to be a vertical strip-shaped hole, the stroke stopper 52 may be formed by a nut or a pin shaft and is used for blocking the left side of the sliding hole 13 and preventing the left end of the stroke limiting rod 51 from sliding out of the sliding hole 13, the elastic member is a cylindrical coil spring and is sleeved on the stroke limiting rod 51, and two ends of the cylindrical coil spring respectively abut against the stroke stopper 52 and the left side surface of the lifting body 10; when the adjusting piece 20 is lowered along with the lifting body 10, the blocking portion 23 is downward far away from the stop block 31, and at the moment, the compression elastic force of the elastic piece drives the adjusting piece 20 to rotate clockwise and reset.

A wafer alignment device comprises at least three wafer alignment arms, and each wafer alignment arm is circumferentially arranged by taking a second axis 82 as a center.

Referring to fig. 5 and 9, the second axis 82 is actually a central axis after the wafer is centered, and three wafer alignment arms are disposed on the second axis, and are circumferentially arranged in an array, so that the three wafer alignment arms can effectively support the wafer; more wafer alignment arms can be arranged according to the required use condition;

further, the inclined guide surface 11 is arranged obliquely towards the second axis 82, and the lower position of the inclined guide surface 11 is located at the inner side of the radial direction where the inclined direction is located; still further, the adjusting portion 21 is located at the outer side of the radial direction where the inclined guide surface 11 is located along the inclined direction thereof, and when the adjusting portion 21 is far away from the inclined guide surface 11, the adjusting portion 21 moves outwards along the radial direction where the inclined guide surface 11 is located.

The radial direction is inward and points to the running of the central point of the radial direction, and the radial direction is outward and points to the running of the central point along the radial direction; the third axis 83 actually corresponds to a straight line corresponding to a certain radial direction, please refer to fig. 9, the direction corresponding to the third axis 83 is a certain radial direction, the inclined guide surface 11 is inclined along the direction of the third axis 83, wherein a plane formed by the second axis 82 and the third axis 83 is a swing plane, and the swing arm 22 of the adjusting portion 21 swings in the swing plane; referring to fig. 2 and 9, the adjusting portion 21 is disposed in such a manner as to move radially outward away from the wafer, so as to release the space for placing the wafer.

Referring to fig. 2 to 5, the specific motion principle of the wafer alignment apparatus is as follows:

as shown in fig. 2 in the initial state, when the state is converted from fig. 2 to fig. 3, the corresponding adjusting member 20 moves upward along with the lifting body 10, at this time, the blocking portion 23 is blocked by the stopper 31, the adjusting member 2020 is driven to rotate counterclockwise, so as to form the state shown in fig. 3, the adjusting portion 21 of the adjusting member 20 moves radially outward to be in an outward open state, so as to expand the accommodating area of the wafer, and at this time, the wafer is placed at the upper ends of the three lifting bodies 10; as shown in fig. 4, when the adjusting member 20 moves downward relative to the lifting body 10, and the travel limiting rod 51 slides rightward relative to the sliding hole 13, the elastic member is compressed, when the adjusting member 20 is lowered along with the lifting body 10, the blocking portion 23 moves downward away from the stopper 31, and the elastic force of the elastic member drives the adjusting member 20 to rotate clockwise to reset, and the adjusting portion 21 pushes the wafer radially inward, so that the edge of the wafer is located on the guiding inclined surface 11, and referring to fig. 5, the edge of the wafer slides along the guiding inclined surface 11 to the bottom of the guiding inclined surface 11, and passes through the plane or support connected to the bottom of the guiding inclined surface 11, so as to achieve the purpose of centering the wafer.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any changes and modifications made by those skilled in the art according to the above disclosure are all within the scope of the appended claims.

Claims (15)

1. A wafer alignment arm, comprising:

comprises a lifting body and an adjusting piece;

the lifting body can move along a set lifting direction to be lifted or lowered, and a guide inclined plane is arranged on the lifting body;

the adjusting piece is arranged on the lifting body and can move relative to the lifting body, the adjusting piece comprises an adjusting portion, the adjusting piece is configured to be the adjusting portion, when the adjusting piece rises along with the lifting body, the adjusting piece moves relative to the lifting body to enable the adjusting portion to be far away from the guide inclined surface, when the adjusting piece falls along with the lifting body, the adjusting piece resets relative to the movement of the lifting body to enable the adjusting portion to be close to the guide inclined surface, and therefore the edge of a wafer is pushed onto the guide inclined surface.

2. The wafer alignment arm of claim 1, wherein: the wafer alignment arm further comprises a driving piece, wherein the driving piece is configured to drive the adjusting piece to move relative to the lifting body when the adjusting piece is lifted along with the lifting body, so that the adjusting part moves in a direction away from the guide slope.

3. The wafer alignment arm of claim 2, wherein: the adjusting piece is rotatably arranged on the lifting body around a first axis, and one swinging end of the adjusting piece is used as the adjusting part.

4. The wafer alignment arm of claim 3, wherein: the driving piece comprises a stop block, when the adjusting piece rises along with the lifting body, the adjusting piece is in contact with the stop block, and the stop block forces the adjusting piece to move relative to the lifting body, so that the adjusting part moves in the direction away from the guide slope.

5. The wafer alignment arm of claim 1, wherein: the wafer aligning arm further comprises a reset piece, wherein the reset piece is arranged on the lifting body and used for providing reset force required by the adjusting piece in resetting.

6. The wafer alignment arm of claim 4, wherein: the regulating part includes the swing arm and sets up the stop part in the swing arm, the swing arm rotationally sets up on the body that goes up and down around first axis, a swing end of swing arm is regarded as the regulating part, the regulating part follows when the body that goes up and down rises, the stop part quilt the dog blocks, just the dog forces stop part and swing arm swing, so that the regulating part is to keeping away from lead the direction motion on inclined plane.

7. The wafer alignment arm of claim 3, wherein: a through groove is formed in the lifting body in the direction perpendicular to the first axis, and the part, passing through the first axis, of the adjusting piece can be rotatably arranged in the through groove around the first axis.

8. The wafer alignment arm of claim 3, wherein: the direction of the first axis is perpendicular to the lifting direction of the lifting body.

9. The wafer alignment arm of claim 5, wherein: the reset piece comprises an elastic piece, and the elastic piece is used for providing elastic reset force required by reset for the other swinging end of the adjusting piece relative to the adjusting part.

10. The wafer alignment arm of claim 9, wherein: the wafer aligning arm further comprises an angle limiting piece, and the angle limiting piece is arranged on the lifting body and used for limiting the swinging angle of the adjusting piece.

11. The wafer alignment arm of claim 10, wherein: the angle locating part comprises a stroke limiting rod and a stroke stop, the stroke limiting rod is arranged on the adjusting part and one of the parts of the lifting body, a sliding hole for the stroke limiting rod to pass is formed in the other part of the adjusting part and the lifting body, the stroke stop is connected to the stroke limiting rod, the stroke limiting rod is located on the stroke stop and connected with the stroke stop, a sliding stroke is formed between the parts, and the stroke limiting rod is opposite to the sliding hole and slides in the sliding stroke.

12. The wafer alignment arm of claim 11, wherein: the elastic piece is sleeved on the stroke limiting rod, and two ends of the elastic piece respectively abut against between the two parts or abut against the stroke stop block and the part adjacent to the stroke stop block.

13. A wafer alignment apparatus, comprising: comprising at least three wafer alignment arms as claimed in any of claims 1 to 12, each of said wafer alignment arms being circumferentially arranged about a second axis.

14. The wafer alignment device of claim 13, wherein: the guide inclined plane is obliquely arranged towards the second axis, and the lower position of the guide inclined plane is positioned on the inner side of the radial direction of the inclined direction.

15. The wafer alignment device of claim 14, wherein: the adjusting portion is located on the outer side of the radial direction where the inclined direction of the guide inclined plane is located, and when the adjusting portion is far away from the guide inclined plane, the adjusting portion moves outwards along the radial direction where the inclined direction of the guide inclined plane is located.

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